Abstract: Semiconductor device assemblies having stacked semiconductor dies and thermal transfer devices that include vapor chambers are disclosed herein. In one embodiment, a semiconductor device assembly includes a first semiconductor die, a second semiconductor die at a base region of the first die, and a thermal transfer device attached to a peripheral region of the first die and extending over the second die. The thermal transfer device includes a conductive structure having an internal cavity and a working fluid at least partially filling the cavity. The conductive structure further includes first and second fluid conversion regions adjacent the cavity. The first fluid conversion region transfers heat from at least the peripheral region of the first die to a volume of the working fluid to vaporize the volume in the cavity, and the second fluid conversion region condenses the volume of the working fluid in the cavity after it has been vaporized.

Abstract: This invention relates to a cooling apparatus comprising a base plate, an evaporator and a condenser. In order to obtain a simple and efficient cooling apparatus the evaporator is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator between a second end and the first end of the evaporator. A compensation chamber extending along a second surface of the evaporator receives first fluid from the condenser such that pores opening up into the second surface of the evaporator are provided with first fluid.

Abstract: A telemetric digital thermometer for use with a fluid transport container having internal and external shells. The telemetric digital thermometer includes a mount having a peripheral flange and a support collar, with the peripheral flange being connectable to the external shell. A temperature sensor sense a temperature of the internal shell. A thermometer insert may include an outer collar engageable with the peripheral flange, and an inner body engageable with the support collar. A GPS module may detect position of the thermometer insert. A wireless transceiver may transmit a signal including temperature data and position data. The thermometer insert and the mount may be collectively sized and structured such that the GPS module and the wireless transceiver are positioned radially outward of the external shell when the thermometer insert is connected to the mount and the mount is connected to the external shell.

Abstract: A phase change cell includes a housing enclosing a phase change chamber that holds a phase change material and a gas pocket. The housing includes a side wall extending between first and second end walls. A capillary is disposed in an interior surface of the side wall. In response to heating of the phase change cell, the capillary is configured to draw the phase change material in a liquid phase towards the periphery of the phase change chamber. A temperature sensor is coupled to the housing in a vicinity of the capillary to measure the phase change temperature. According to another aspect, the housing includes a moveable surface that bounds a portion of the phase change chamber. The phase change temperature of the phase change material changes based on the position of the moveable wall.

Abstract: A heat exchanger includes: a first flow passage where first liquid flows; a second flow passage where second liquid flows; and a heat exchanger main body configured to exchange heat between the first liquid and the second liquid. The heat exchanger main body includes a cross-sectional area adjuster configured to change a flow passage cross-sectional area of at least one of the first flow passage and the second flow passage by thermal deformation. The cross-sectional area adjuster adjusts a value of the flow passage cross-sectional area in a low temperature range to be larger than a value of the flow passage cross-sectional area in a high temperature range.

Abstract: A vapor pipe 103 connects a heat dissipation portion 200 and each of a plurality of heat receiving portions 102. A liquid pipe 104 connects the heat dissipation portion 200 and each of a plurality of the heat receiving portions 102. A bypass pipe 105 connects the vapor pipe 103 and the liquid pipe 104. A valve 106 opens and closes a flow path of the bypass pipe 105. A first connection portion 107 connects the vapor pipe 103 and the bypass pipe 105. A second connection portion 108 connects the liquid pipe 103 and the bypass pipe 105. The first connection portion 107 is disposed at a position higher than that of the second connection portion 108. As a result, refrigerant can be efficiently transported in a short time.

Abstract: A filling pipe for use in high-temperature heat pipe filling operation includes an alkali metal filling unit, metallic pipe fixing unit, hermetic seal cover and stopping net. The alkali metal filling unit has a filling body, a receiving space disposed in the filling body. A feed inlet and a feeding pipe are disposed at the top and bottom of the filling body, respectively. A vacuum-generating component is disposed at the filling body laterally. The metallic pipe fixing unit has a fixing body and a taper opening disposed thereon and adapted to limit the metallic pipe. When the fixing body gets connected to the filling body, the feeding pipe is inserted into metallic pipe. The hermetic seal cover covers separably the feed inlet. The stopping net is movably disposed in the receiving space. Therefore, solid alkali metals are filled into a metallic pipe easily and safely.

Abstract: An electric machine includes a housing having an air inlet opening near a front or rear end of the housing for aspirating air, and an air outlet opening for expelling air. The housing accommodates a stator, and a rotor is mounted in the housing for rotation about an axis of rotation. Mounted on a side of the housing in parallel relation to the axis of rotation is a hood-like attachment to cover the air inlet and outlet openings so that air expelled from the housing through the air outlet opening is fed back to the air inlet opening. Disposed in the stator are pipes for flow of a liquid cooling medium to directly cool the stator during operation. At least some of the pipes project beyond the stator toward the front and rear ends, so that during operation heat is removed by the pipes from air flowing in the housing.

Abstract: A heat dissipation device includes a first casing, a second casing, a thin pump, and a cooling member. The second casing is connected to the first casing to form a first accommodating space and a second accommodating space adjacent to and communicating with the first accommodating space. The thin pump is disposed in the first accommodating space. The cooling member is disposed in the second accommodating space and has a plurality of spacers, and the spacers and the thin pump are disposed on the same plane of the first casing. A portable electronic device having the heat dissipation device is also disclosed.

Abstract: A heat pipe is disclosed in the present invention. The heat pipe includes a first pipe and at least a second pipe. The first pipe is formed with an enclosed space. The second pipe is disposed in the enclosed space. There is no wick structure disposed between the first pipe and the second pipe.

Abstract: Embodiments of the present disclosure relate to a cooler for semiconductor devices. The semiconductor device may be electrically coupleable to a power source. The device may generate heat when the power source supplies power to the device during use of the device. The cooler may be coupled to one or more surfaces of the device. The cooler may include a hydrophilic material to adsorb water from ambient air. During operation of the device, the cooler may cool the device by conduction of heat away from the device to the cooler. The cooler may include water that is evaporated during use of the device to increase cooling capacity of the cooler. The cooler may be recharged with water from humidity in air when the device is not operated or operated at a lower power level. Other embodiments may be described and/or claimed.

Abstract: A heat dissipation device includes a housing and a heat pipe. The heat pipe has an open end, which is inserted into an opening on a top side of the housing, such that a heat pipe chamber of the heat pipe is communicated with a housing chamber of the housing and an extended portion extended from the open end of the heat pipe is pressed against a bottom side of the housing, as well as a heat pipe wick structure of the heat pipe is connected to a housing wick structure of the housing, so as to increase heat transfer effect.

Abstract: A discrete air conditioner controller for controlling a discrete air conditioner unit servicing a building may receive an IR code, in some cases in a raw waveform format, from a handheld remote control that is associated with the discrete air conditioner unit during a programming process. The discrete air conditioner controller may associate the IR code with the discrete air conditioner unit and store the IR code and its association in memory. In some cases, the discrete air conditioner controller may transmit the IR code and its association to a central coordinator, where the IR code may be stored in the memory of the central coordinator. The IR code may be subsequently retrieved from the memory of the central coordinator and transmitted to selected discrete air conditioner controller units for use in controlling appropriate discrete air conditioner units.

Abstract: A building control system includes a central coordinator and one or more discrete air conditioner controllers configured to communicate with one or more discrete air conditioner units servicing the building. In some instances, a discrete air conditioner controller may be configured to transition between a sleep mode and an active mode. The discrete air conditioner controller may also be configured to transmit over a mesh network in the active mode and to not transmit over the mesh network in the sleep mode. The discrete air conditioner controller may be configured to transition between the sleep mode and the active mode according to a schedule dictated by the central coordinator. Alternatively, or in addition, the discrete air conditioner controller may be configured to transition between the sleep and active modes in accordance with a beacon signal received from the central coordinator.

Abstract: A cooling apparatus includes an assembly including an electronic device and a potting material that covers a side portion and an upper portion of the electronic device, the assembly having a conical upper portion, and a cooling plate including a conical hole, into which the upper portion of the assembly is fitted, and a flow path, through which a coolant flows.

Abstract: A heat dissipation device includes a first and a second housing, at least one pipe, and a working fluid. The first and the second housing internally respectively defines a first and a second chamber, in which a first and a second wick structure is respectively formed, and has at least one first and second opening communicated with the first and the second chamber respectively. The pipe has a pipe body, and a first and second extended portion, which respectively has a first and a second open end, and a first and a second through opening, and is inserted into and connected to the first and the second chamber via the first and the second opening respectively. The pipe internally defines a pipe chamber, in which a pipe wick structure is formed. The working fluid is provided in the first and the second, and the pipe chamber.

Abstract: Techniques of managing heat within an electronic device involve providing a vapor chamber in a ring shape within an electronic device. In some implementations, the vapor chamber forms an outer case wall of an enclosure of the electronic device. In further implementations, the vapor chamber has a fill port attached to the inner edge of the vapor chamber. Advantageously, by using a vapor chamber with a ring geometry in an electronic device according to the improved techniques, a form factor of the electronic device (e.g., a laptop, a tablet, etc.) is not affected by the introduction of the vapor chamber as an outer case wall.

Abstract: A liquid cooling system for a server includes a heat pipe and a displacement appendage fluidly coupled to the heat pipe. The displacement appendage includes a displacement element which is compressible under pressure.

Abstract: A vapor chamber structure includes an upper metal casing, a lower metal casing, a partition plate and a working fluid. The lower metal casing is engaged and sealed with the upper metal casing, and a containing chamber is formed between the upper metal casing and the lower metal casing. The partition plate is laid inside the containing chamber and includes a gas channel configured to be facing the upper metal casing. The working fluid is filled in the containing chamber. Therefore, the gas evaporated in the vapor chamber will move along a fixed path to prevent the occurrence of turbulence effectively.

Abstract: A cooling device includes a duct with one opened end and another opened end; a fan disposed inside the duct, the fan being configured to send air present inside the duct in an air-sending direction; a heat sink disposed outside the duct, the heat sink including a base part having an opposed surface opposed to a mouth of the another end of the duct, and heat-sink fins including a plurality of thin plates extending from the opposed surface along the air-sending direction; a heat source in contact with the base part; a heat pipe connected to the heat source or the heat sink; and heat-pipe fins disposed between the fan and the one end of the duct inside the duct, the heat-pipe fins including a plurality of thin plates extending from the heat pipe along the air-sending direction.

Abstract: A wavelength converting member includes a sealed housing which is at least partially light transmissive, a coolant enclosed in the sealed housing, a cooling part provided on a part of an external surface of the sealed housing, and a channel having a plurality of micro-passages allowing a liquid coolant flowing therein. At least a portion of the micro-passages are formed by gaps between particles, and phosphor particles are contained in the particles.

Abstract: Various methods and systems are provided for an electric motor arrangement in a chassis of a battery electric vehicle. In one embodiment, a front chassis for a battery electric vehicle comprises a structural frame including two parallel sidewalls and a first portion of a vehicle articulation joint and an electric motor coupled between and in face-sharing contact with each of the two parallel sidewalls.

Abstract: Pool boiling systems, cooling systems configured to cool one or more heat generating portions of a vehicle, and methods of maintaining a functional orientation of a pool boiling unit are disclosed. A pool boiling system may include the pool boiling unit and a stabilizing unit coupled to the pool boiling unit. The stabilizing unit maintains the pool boiling unit in a functional orientation across a plurality of operating orientations of the pool boiling system.

Abstract: The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.

Abstract: In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Abstract: A cryopump has a simple-to-manufacture frontal baffle plate with improved gas distribution and has a large-area second-stage array plate to capture Type II gases. The cryopump has a first-stage frontal baffle plate having orifices and flaps bent from and attached to the orifices. The cryopump has a second-stage top plate that is larger in area than cooling baffles of the second stage array.

Abstract: An electronic apparatus having a detachable cooling device is disclosed. The electronic apparatus includes a portable information device having a heating body contained therein. The portable information device also includes a heat sink disposed on a bottom surface of the portable information device and thermally connected to the heating body. The detachable cooling device includes a mount surface on which the bottom surface of the portable information device is mounted, a heat-receiving heat sink disposed on the mount surface and thermally connected to the heat sink, and an up-and-down mechanism that moves the heat-receiving heat sink towards the heat sink and causes the heat-receiving heat sink to contact the heat sink when the portable information device is mounted on the mount surface.

Abstract: The invention presents air-conditioning system with chiller that provides, when operated in the cooling mode, cooling hardware for conditioning space and a heat exchanger for cooling and dehumidification of ambient air in supply air stream with cold liquid. In addition, the invention offers a method and design of a heat utilization system. The method incorporates refrigeration cycle with two consecutive expansions, two expansion devices, and a heat exchanger operating as a second condenser. The method can be used for air conditioners and chillers reheating over-chilled for dehumidification indoor and supply air. The method and design allow energy efficient heat utilization with variable amount of utilized heat.

Abstract: A small-sized fluid heating/cooling apparatus for heating or cooling a large amount of gas or liquid at a low cost. Structures where a flow passage for a fluid is formed in a heated or cooled base formed in a plate shape or a column shape, and a fluid which has passed through the narrowed flow passage impinges on a wall of a side face of the base vertically to perform heat exchange are connected in series. Heat exchange is instantaneously performed in a small space and manufacture of a mechanism performing such an operation is easy. A material constituting the flow passage may be a metal or ceramics, and a small-sized fluid heat exchanging apparatus can be manufactured at a low cost.

Abstract: An assembling structure of heat dissipation device includes at least one heat pipe, a first and a second radiating fin assembly. The heat pipe has a heat absorption section, at least one heat releasing section and a curved section between the heat absorption section and the heat releasing section. The heat releasing section is fitted in multiple perforations of the second radiating fin assembly. The curved section is fitted in multiple notches of the first radiating fin assembly. Each notch is defined with an open side and a closed side. The closed side extends along a curved outer side of the curved section and contacts and attaches to the curved outer side of the curved section. Accordingly, the utility ratio of the heat pipe is increased. Also, the heat dissipation area of the heat pipe is increased and the heat dissipation efficiency of the heat dissipation device is enhanced.

Abstract: An electronic module is provided that includes a multilayer circuit board, and an electronic component, and a Peltier heat pump. The electronic component is mounted on a major surface of the multilayer circuit board and is electrically coupled to at least one memory die. The at least one memory die is at least partially embedded within the multilayer circuit board. The Peltier heat pump device has at least one pair of thermoelectric semiconductor members arranged thermally in parallel and electrically in series, and the at least one pair of semiconductor members are at least partially embedded in the circuit board.

Abstract: A condenser for condensing vapor to liquid for cooling a switchgear having a heat generating component inside an enclosure and tubing structure associated with the heat generating component. A working fluid is disposed within an end portion of the tubing structure. The condenser includes a hollow tubular base defining a volume and having first and second opposing opened ends. A plurality of fins extends from a periphery of the base. The fins are in spaced relation and disposed about the entire circumference of the base. A first end cap is coupled to the base so as to close the first opened end. A second end cap is coupled to the base to close the second opened end. The second end cap has port structure constructed and arranged to fluidly communicate the tubing structure with the volume.

Abstract: The present invention discloses a radiator, where the radiator includes a mounting portion used for mounting a heat source, a radiating portion connected with the mounting portion and used for absorbing heat transferred by the mounting portion, the radiating portion is internally provided with multiple radiating pipelines, the radiating pipelines are internally injected with liquid, and the liquid in the radiating pipelines is gasified after absorbing heat on one end where the radiating portion is close to the mounting portion, and in the radiating pipelines, moves from one end where the radiating portion is close to the mounting portion towards one end where the radiating portion is away from the mounting portion. The present invention further discloses a backlight module, and the present invention further discloses a display module. The present invention effectively improves the heat transfer effect, and effectively enhances the radiating effect.

Abstract: A building control system that includes a central coordinator and one or more discrete air conditioner controllers configured to communicate with one or more discrete air conditioner units. The discrete air conditioner controller may include a wireless I/O block for receiving signals in a first signal format from the central coordinator and for transmitting signals to the one or more discrete air conditioner units in a second signal format. In some instances, the discrete air conditioner controller may be configured to wirelessly transmit a signal to at least one discrete air conditioner unit in response to receiving a signal from the central coordinator. This configuration may provide a measure of distributed control of the building control system in a cost effective and efficient manner.

Abstract: In one embodiment, a plate for an evaporative cooler is disclosed. The plate may comprise a wicking material with an exposed surface and a sealed surface opposite the exposed surface. An impermeable barrier may be coupled to the sealed surface. One or more masks may line a portion of the exposed surface, wherein the masks may comprise an impermeable material. In some embodiments, the mask may be a strip of impermeable material and may be coupled to a flat area of the top surface. In further embodiments, the one or more masks may align with a liquid wick path of the wicking material. In further embodiments, the one or more masks may line the edge of perforations that pass at least partially through the plate.

Abstract: An optical transceiver cooling assembly includes stacked cages mounted to a PCB. A heat radiator also is mounted on the PCB. Cooling devices (e.g., heat pipes) are coupled to the heat radiator and at least one of the cages. In some embodiments, the cages may include a divider that extends beyond the cage and is coupled to at least one of the cooling devices outside the cage. In some embodiments, the cooling devices extend into the cage and may be coupled together.

Abstract: An electronic rack includes a housing to contain one or more IT components arranged in a stack, a first rack aisle formed on a first side of the one or more IT components to direct cooler air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the one or more IT components to direct warmer air to the cooling unit downwardly. The electronic rack further includes a cooling unit having one or more cooling units disposed underneath the IT components to receive first liquid from an external chiller system, to exchange heat carried by the warmer air using the first liquid to generate the cooler air, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the external chiller system.

Abstract: A pressure control system within a multi-phase heat transfer immersion cooling tank includes: a differential pressure transducer that measures a differential pressure between a first vapor pressure internal to the immersion cooling tank and a second pressure outside of the immersion cooling tank; and a condenser inflow valve assembly that controls a flow rate of condensation liquid within the condenser located within the immersion tank. The pressure control system also includes a controller coupled to both the differential pressure transducer and the condenser inflow valve assembly having control logic that, in response to the measured differential pressure exceeding a pre-set threshold difference, triggers the condenser inflow valve assembly to increase a flow rate of the condensation fluid in order to reduce an amount of vapor within the immersion tank and bring the measured differential pressure back to below the threshold difference.

Abstract: A planar heat pipe for transferring heat between a higher temperature region and a lower temperature region includes a bottom facesheet, a top facesheet, a vapor-venting arterial wick between the bottom facesheet and the top facesheet and including a high permeability layer and a high capillary pressure layer each having pores such that an average pore hydraulic diameter in the high permeability layer is greater than an average pore diameter in the high capillary pressure layer. The pipe also includes an architected mechanical core structure between the arterial wick and the top facesheet, and a working fluid between the bottom facesheet and the top facesheet. The architected mechanical core structure may have a vapor region, and the vapor-venting arterial wick may have a liquid region.

Abstract: An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes that include a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. The node inlet port and the node outlet port are positioned in an outward facing direction at a rear of the node enclosure and aligned to releasably seal to the respective inlet liquid port and outlet liquid port in the node-receiving slot for fluid transfer through the system of conduits. An air-spring reducer conduit is in fluid communication with the system of conduits and shaped to trap an amount of compressible fluid that compresses during sealing engagement between the node inlet coupling and node outlet coupling and the inlet liquid port and outlet liquid port, respectively.

Abstract: A thermal module includes a first heat transfer member and a second heat transfer member. The first heat transfer member has a first chamber in which a first capillary structure is disposed. The second heat transfer member has a second chamber and a conduction section. A second capillary structure is disposed in the second chamber. The conduction section is received in the first chamber. A third capillary structure is disposed on outer surface of the conduction section. A working fluid is respectively filled in the first and second chambers. The third capillary structure is disposed on the outer surface of the conduction section to enhance the heat transfer effect of the second heat transfer member so as to enhance the heat transfer efficiency of the entire thermal module.

Abstract: A capillary-driven heat transfer device is adapted to extract heat from a heat source and release this heat to a cold source using a two-phase working fluid. The device includes an evaporator having a microporous mass performing capillary pumping of fluid in the liquid phase, a condenser, a reservoir having an inner chamber and an inlet and/or outlet port, a vapor communication circuit, connecting the outlet of the evaporator to the inlet of the condenser, a liquid communication circuit, and a non-return device arranged between the inner chamber of the reservoir and the microporous mass of the evaporator, and arranged to prevent liquid present in the evaporator from moving to the inner chamber of the reservoir.

Abstract: A heating block for use in a water heater for heating water, having a heating block body, in particular made of plastic, for forming a cavity for conducting the water and for receiving at least one heating element. The heating block body includes a first partial shell having a first sub-cavity and a second partial shell having a second sub-cavity. The first and the second partial shells are assembled in a joining region and form between them the cavity from the two sub-cavities. The joining region is not formed, at least partially, in a joining plane and/or the first and the second partial shells are welded together by the supply of heat via a medium, in particular, an essentially abrasion-free and/or vibration-free welding process, and/or the first partial cavity has a greater depth than the second partial cavity or vice versa.

Abstract: Methods and devices for active control for two-phase cooling include a cooling volume that has cavities and active coolant flow controls in the cavities configured to adjust coolant flow through the cavities. A reservoir in fluid communication with the cavities and there is a two-phase coolant in the reservoir and cavities. The two-phase coolant has a phase transition temperature between an ambient temperature and an expected device temperature. A coolant sensor is configured to determine a coolant phase condition in the cavities. A control module is configured to adjust the active coolant flow controls in response to the determined coolant phase condition.

Abstract: Modular electronic system 1 with convection cooling, comprising a plurality of electronic modules 10, 20, 30, that each comprise an air inlet opening 12, 22, 32, an air outlet opening 14, 24, 34 and an air space 11 within the electronic module 10, 20, 30, wherein the air space 11 is in air exchange with the air inlet opening 12, 22, 32 and the air outlet opening 14, 24, 34, wherein at least one of the electronic modules 10, 20, 30 is an electronic module to be cooled 10, one of the electronic modules 10, 20, 30 is a first adjacent electronic module 20, which is adjacent to a first side 16 of the electronic module to be cooled 10 and one of the electronic modules 10, 20, 30 is a second adjacent electronic module 30, which is adjacent to a second side 18 opposite to the first side 16 of the electronic module to be cooled 10, wherein the electronic modules 10, 20, 30 are designed in such a manner that air can enter into the first adjacent electronic module 20, generate an air stream 11 for cooling within the air

Abstract: A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

Abstract: An electronic device includes an outer case defining an internal volume, a circuit board positioned within the internal volume and having a first surface and a second surface, one or more active components mounted on the first surface of the circuit board, and a thermal management system to provide cooling for the active components. The thermal management system includes a first heat spreader in thermal contact with an active component, a second heat spreader in thermal contact with the second surface of the circuit board, thermal carriers coupled to the first and second heat spreaders to remove thermal energy therefrom, and a heat exchanger coupled to the thermal carriers to receive thermal energy therefrom and dissipate the thermal energy, wherein one thermal carrier is routed between the first heat spreader and the heat exchanger and the other thermal carrier is routed between the second heat spreader and the heat exchanger.

Abstract: A supporting structure for vapor chamber includes a first and a second plate member, a supporting member, and a working fluid. The first and the second plate member together define a chamber between them. The supporting member is located in the chamber, and has at least one base portion and a plurality of supporting portions, such that a plurality of passages is formed on the supporting member. The working fluid is filled in the chamber to flow through the passages. With these arrangements, the supporting structure for vapor chamber can overcome the problems of deformation caused by thermal expansion or pressure and uncontrollable bottom flatness as found in the prior art and can be manufactured at reduced labor and time cost while provides upgraded heat transfer efficiency.