Abstract: An electronic device includes a bottom case, an accommodation unit, an electromagnetic induction module, a heat-dissipating component, an elastic clip, a printed wiring board, and an electronic component. The accommodation unit is disposed on the bottom case. At least one portion of the electromagnetic induction module is disposed in the accommodation unit. The heat-dissipating component is disposed on the bottom case and is separated from the accommodation unit. The elastic clip is partially mounted on the heat-dissipating component. The printed wiring board has a first surface and a second surface, and the first surface faces the accommodation unit. The electronic component includes a main body and pin feet. The pin feet are electrically connected to the printed wiring board, and the main body is clamped between the heat-dissipating component and the elastic clip.

Abstract: An original plate material for a heat-exchanging plate fabricated by press working and a method for fabricating the original plate material are provided. An original plate material for a heat-exchanging plate is a flat plate material made of titanium on the surface of which convex parts and concave parts are formed, and the heat-exchanging plate is fabricated by press working the original plate material. The convex parts and the concave parts are formed in a manner such that the shape parameter defined by (Rz×L/P) is 12 ?m or less, where Rz (?m) denotes the height of the convex parts, L (?m) denotes the width of the concave parts, and P (?m) denotes the pitch between neighboring convex parts.

Abstract: Remote units are mounted in a support structure so that cooling air flow is not impeded by the support structure. The remote units may have RF communications circuitry and other components that generate heat in the provision of wireless services.

Abstract: A heat exchanger includes a flat metal tube that has flat top and bottom surfaces and an inner passage. The surfaces remove heat from a liquid passing through the passage from an inlet and toward an outlet of the heat exchanger. A first plurality of solid metal posts are mounted perpendicularly upon the top surface. Each fin of a first plurality of fins has holes fitted about the first plurality of posts such that the fins are mounted on the posts in vertically-spaced, parallel alignment relative to each other and the top surface. A second plurality of solid metal posts are mounted perpendicularly upon the bottom surface. Each fin of a second plurality of fins has holes fitted about the second plurality of posts such that the fins are mounted on the posts in vertically-spaced, parallel alignment relative to each other and the bottom surface.

Abstract: A heat sink of a metallic shielding structure is provided in this disclosure, which includes a heating module and a cooling module. The heating module includes a heat generating component, a substrate, and a shield housing. The heat generating component is electrically connected to one side surface of the substrate and forms an opening corresponding the substrate. The cooling module includes a body and a working fluid is disposed in the body.

Abstract: Embodiments of the present invention relate to an RRU device and an assembly thereof. The RRU device includes: an enclosure, where the enclosure includes a front-end plate and a back-end plate that are respectively set on two lengthwise ends of the enclosure, multiple parallel spaced heat sinks are set on two widthwise sides of the enclosure and between the front-end plate and the back-end plate, and the front-end plate and the back-end plate extend along a widthwise direction of the enclosure by a length which is greater than a length by which the heat sinks extend; and a joint part set on the enclosure, where the joint part is used to fasten two side-by-side radio remote unit devices together.

Abstract: A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: A heat pipe with a capillary structure that consists of heat conductive capillary grooves in the condenser region that meet with a porous wick in the evaporator section. The embodiments include several structures of the interface at the junction of the porous wick and the capillary grooves. One such interface is a simple butt joint. Others have interlocking shapes on the wick and the grooves such as parts of the wick that fit into or around the grooves.

Abstract: An apparatus comprising a housing, a chassis, and a plurality of heat-generating components. The chassis is biased into contact with a plurality of locations along an inner surface of the housing in response to elastic deformation of the chassis. The chassis includes a plurality of substantially planar surfaces each interposing ones of the plurality of locations. The plurality of heat-generating components are directly coupled to corresponding ones of the plurality of substantially planar surfaces.

Abstract: A heat transfer device is described. In one or more implementations, a device includes a housing that is moveable through a plurality of orientations involving at least two dimensions during usage, a heat-generating device disposed within the housing, and a heat transfer device disposed within the housing. The heat transfer device has a plurality of heat pipes configured to transfer heat using thermal conductivity and phase transition from the heat-generating device, the plurality of heat pipes arranged to provide generally uniform heat transfer from the heat-generating device during movement of the housing through the plurality of orientations.

Abstract: A thermoelectric cooler assembly comprises a cold plate, a first thermoelectric cooler, and a second thermoelectric cooler. The cold plate has a first side and a second side. The first thermoelectric cooler is in thermal communication with the first side of the cold plate, and the second thermoelectric cooler is in thermal communication with the second side of the cold plate. A heat exchanger assembly is also disclosed.

Abstract: A system, including: a subsea pressure vessel; and a passive heat transfer apparatus, wherein the passive heat transfer apparatus penetrates a hull or shell of the subsea pressure vessel.

Abstract: A cooling structure is provided which includes: an evaporation chamber defined by a base plate having a boiling surface, a ceiling plate and a side wall; a plurality of plate-shaped fins arranged in parallel on the boiling surface, defining a plurality of coolant passages in the evaporation chamber, a liquid phase coolant flows through the coolant passages in one direction from one end portion thereof toward another end portion; a liquid return port formed in the side wall facing the one end portion of coolant passages; and a vapor port formed in the ceiling plate facing the other end portion of coolant passages, wherein space is formed between the ceiling plate and an upper end portion of the plurality of plate-shaped fins, the space expanding gradually from a liquid return port side of the side wall toward the vapor port.

Abstract: Cooling systems and vehicles containing cooling systems are disclosed. A cooling system may include an evaporator, a condenser positioned downstream from the evaporator, a pump positioned downstream from the condenser, and a two phase cooler positioned downstream from the pump and in series upstream from the evaporator. The two phase cooler may receive thermal energy from a heat generating device to preheat a working fluid and directs the preheated working fluid to the evaporator.

Abstract: A thermosiphon system includes a condenser and an evaporator fluidically coupled to the condenser by a condensate line. The evaporator includes a housing having an opening to the condensate line, a wick located in the housing, and a flow restrictor located in the housing configured to restrict flow of a working fluid from the condensate line onto a portion of the wick.

Abstract: In some embodiments, a regulated thermal transfer device for a storage container includes: a phase change material unit, the phase change material unit including one or more walls surrounding a phase-change material region, and an aperture in the one or more walls; a heat pipe with a first end positioned within the phase change material unit, and a second end; a thermoelectric unit thermally connected to the second end of the heat pipe; a heat sink connected to the thermoelectric unit, and positioned to radiate heat away from the thermoelectric unit; and an electronic controller operably connected to the thermoelectric unit; wherein the regulated thermal transfer device is of a size and shape to be positioned so that the phase change material unit is within a storage region of a temperature-stabilized storage container, and the thermoelectric unit is positioned adjacent to an external surface of the temperature-stabilized storage container.

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: Exemplary embodiments of the present disclosure are directed to an apparatus including pipes having internal longitudinal walls dividing the pipes into channels, a first and a second connecting part for providing a flow path between the channels of the pipes, a first heat transfer element having a first base plate with a first surface for receiving a heat load from one or more electric components and for transferring the heat load to a fluid, and a second heat transfer element. In order to obtain an efficient apparatus at least one first pipe that is at a location of an electric component is at least partly embedded in the first base plate via a second surface of the first base plate, while the pipes which are not at the location of an electric component are not embedded in the first base plate.

Abstract: A heat-dissipation unit with heat-dissipation microstructure and method of manufacturing the same is disclosed. The heat-dissipation unit with heat-dissipation microstructure includes a main body internally defining a chamber; a wick structure formed on an inner surface of the chamber; and at least a SiO2 nano thin film coated on the wick structure. The SiO2 nano thin film is formed of a plurality of SiO2 nanograins, and is coated on the wick structure of the heat-dissipation unit through the sol-gel process. With the at least one layer of SiO2 nano thin film coated on the wick structure, it is able to upgrade the heat dissipation performance of the heat-dissipation unit.

Abstract: A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.

Abstract: A magneto-caloric effect type heat pump apparatus provides a thermo-magnetic cycle apparatus. A magnetic field modulating device has a rotary permanent magnet. By rotating the permanent magnet, magnetic field applied to a magneto-caloric element is modulated alternatively in a magnetized state and a demagnetized state. A magnetized period, when the magnetic field is applied, is shorter than a demagnetized period, when the magnetic field is removed. Thereby, it is possible to reduce weight of the magnetic field modulating device having the permanent magnet. The magneto-caloric element has a heat exchange portion which varies heat exchanging efficiency depending on flow directions of a heat transport medium. The heat exchanging efficiency in the magnetized period is higher than the heat exchanging efficiency in the demagnetized period. Therefore, it is possible to provide sufficient heat exchanging quantity even in a short magnetized period.

Abstract: An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism.

Abstract: Example methods and apparatus to chill beverages in refrigerators at a faster rate than existing solutions, which use a tank in a refrigerating compartment for chilling, are disclosed. An example refrigerator includes a freezing compartment, a refrigerating compartment, a dispenser, a first tank in the freezing compartment fluidly coupled to a supply, and a second tank in the refrigerating compartment fluidly coupled to the first tank and to the dispenser. The refrigerator may further include a temperature sensor associated with the first tank, and a controller configured to transfer a beverage in its liquid state from the first tank to the second tank when the temperature sensor indicates the temperature of the beverage in its liquid state in the first tank meets a criterion.

Abstract: Vapor condensers and cooling apparatuses facilitating vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel through the thermally conductive base structure.

Abstract: A melt-solidified substance includes melt-solidified portions formed by welding, build-up spray welding, metallizing or fusing. The melt-solidified portions have the alloy composition containing Zr: 0.0005 to 0.05 mass %, P: 0.01 to 0.34 mass %, Cu: the remainder and satisfying the relationship between the contents of P and Zr, [P]/[Zr]=0.3 to 20, and the mean grain size in the macrostructure after melt-solidification is 300 ?m or less. If Fe and/or Ni are contained in the melt-solidified portion as inevitable impurities, the content of Fe or Ni is restricted to be 0.3 mass % or less when either Fe or Ni is contained, and the total content of Fe and Ni is restricted to be 0.4 mass % or less when both Fe and Ni are contained.

Abstract: A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive material to which the multiple heat sources are coupled, preferably at evaporation points that are placed on opposite sides of a fluid reservoir for the liquid phase of the working fluid that feeds the evaporation points via capillary flow through a wicking material.

Abstract: The invention relates to an independent refrigerator unit for an inflight service cart. According to the invention, it comprises an insulated casing part, inside which is a refrigerant chamber for a refrigerant, and a thermal conductor connected to the insulated casing, in which there is a first part and a second part, in which case the first part is in direct thermal contact with the refrigerant chamber and the second part with the external space of the casing.

Abstract: The present invention provides a cooling device for rack-type electronic equipment. The rack-type electronic equipment is provided with electronic circuit devices having different heating quantities inside an enclosure, and the cooling device has multiple heat pipes for cooling the rack-type electronic equipment. A condenser unit is provided on the upper surface of the enclosure, an evaporator is provided on the back surface of the enclosure, and each electronic circuit device having a different heating quantity is cooled by means of the heat pipes.

Abstract: A heat dissipating assembly of a mold includes an angular pin, a heat pipe, and a liquid passage passing through the angular pin. The angular pin defines a receiving chamber therein. The liquid passage passes through a lower portion of the receiving chamber of the angular pin. The heat pipe includes a condensing section, an evaporation section, and a connecting section interconnecting the condensing section and the evaporation section. The evaporation section is embedded in an upper portion of the receiving chamber opposite to the lower portion. The condensing section is located in the lower portion of the receiving chamber. A mold having the heat dissipating assembly is also provided.

Abstract: Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold.

Abstract: A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating state of the module. The guiding structure is provided for guiding the cooling air entering through the inlet and leaving the module through the outlet in an operating state of the module. The module includes a thermosiphon cooler with an evaporator and a condenser for transferring a majority of a heat load to the cooling air in an operating state of the module. The evaporator is tilted with respect to the condenser wherein the condenser is arranged such that a major portion of the cooling air flows through the condenser.

Abstract: A cooling device includes a cooling member including a circulation passage for liquid coolant, and a cooling surface being directly or indirectly made to contact with a recording material being conveyed to cool the recording material. The circulation passage includes multiple passage sections arranged crossing to a conveying direction of the recording material, and a folded passage section to guide the liquid coolant from one of the multiple passage sections to another one of the multiple passage sections while changing a flowing direction of the liquid coolant. The folded passage section is disposed outside of an image forming area of the recording material on the cooling surface of the cooling member.

Abstract: Disclosed is an anti-viral member which can inactivate a virus. Specifically disclosed is an anti-viral member which is characterized by comprising a base material, univalent copper compound microparticles, and inorganic microparticles which are provided for the purpose of retaining the univalent copper compound microparticles on the base material and each of which has a silane monomer bound to the surface thereof via a chemical bond, wherein the inorganic microparticles are bound to one another via chemical bonds formed between the silane monomers provided on the surfaces thereof, and each of the inorganic microparticles is bound to the base material via a chemical bond between the silane monomer and the base material to form spaces in which the univalent copper compound microparticles are to be retained.

Abstract: In some embodiments, a temperature-controlled container for use within a refrigeration device includes: one or more sections of insulation material substantially defining one or more walls of a temperature-controlled container, the temperature-controlled container including an internal region; a thermally-insulated partition dividing the internal region to form a storage region and a phase change material region internal to the container, the thermally-insulated partition including a conduit between the storage region and the phase change material region; a thermal control device within the conduit; an aperture within a section of the insulation material substantially defining the container, the aperture between the phase change material region internal to the container and an external surface of the container; and a unidirectional thermal conductor positioned within the aperture, the unidirectional thermal conductor configured to transmit heat in a direction from the phase change material region to the exter

Abstract: A heat dissipating device includes a heat dissipating fin and a heat pipe. The heat dissipating fin includes a fin body, a through hole and a closed ring-shaped portion, wherein the through hole is formed on the fin body, the closed ring-shaped portion extends from a periphery of the through hole and has a first U-shaped protruding ear, and the first U-shaped protruding ear has a first opening. The heat pipe has a heat dissipating end and a heat absorbing end, wherein the heat dissipating end is opposite to the heat absorbing end and is disposed in the through hole and the closed ring-shaped portion. After punching the closed ring-shaped portion, the first opening of the first U-shaped protruding ear shrinks, such that the closed ring-shaped portion fixes the heat dissipating end in a tight-fitting manner.

Abstract: A heat conveying structure for an electronic device, the heat conveying structure including an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant, a condensing section that has a chamber structure with second fins erected therein, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant, a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section, and a liquid pipe that connects the evaporating section and the condensing section.

Abstract: The disclosure relates to a heat exchanger including an evaporator with a pair of base plates, each base plate having a first surface with channels extending from a manifold at a first end of the evaporator to a manifold at a second end of the evaporator, some of the channels are embedded into the base plate and some of the channels are arranged outside of base plate, a condenser with channels extending from a manifold at a first end of the condenser to a manifold at a second end of the condenser, at least one riser pipe and at least one return pipe.

Abstract: A tree stand includes a housing dimensioned for holding electronic components used in providing electricity in support of decorative lighting for the tree. The tree stand removes heat from the housing without the use moving parts. Floor vents enable cool air to enter the housing; upper vents enable that air, warmed by the electrical components, to escape to the housing and into a heat riser housing as part of a growing, circular heat thermal. The heat follows a spiral ramp in the heat riser housing exiting vents at the top where additional heat is conducted into the tree itself, radiated into the air. Tree legs can be increased in number or replaced with longer legged trees without tools by insertion of the side wall into a slot formed in the legs and then slid around the circular slide wall from the notch where each leg is inserted.

Abstract: A heat transfer apparatus and related methods are provided. The heat transfer apparatus and related methods more precisely distribute fluid flow to meet heat removal needs in single-phase and/or a two-phase heat exchange systems by restricting fluid flow through one or more heat exchanger channels.

Abstract: A heat-dissipating device includes a condenser and an evaporator. The condenser includes a shell and a main capillary wick. The shell has a chamber and a through hole communicating with the chamber. The main capillary wick is disposed in the chamber. The evaporator has an evaporating section, a gas conduit and a liquid conduit. The evaporating section has a gas cavity, and the liquid conduit communicating with the chamber and filling with a liquid. The liquid conduit having a hole communicating with the gas cavity is inserted in the gas conduit and the gas cavity. A stepped area is formed between the liquid conduit and the chamber for gathering the liquid flowing into the liquid conduit.

Abstract: Some embodiments of the invention provide a heat plate system that includes a closed vessel having at least one flexible surface. The flexible surface allows the vessel to come into intimate contact with heat-generating components (e.g., integrated circuits) residing at varying heights above the floor of a module (e.g., an avionics module). In some embodiments, the material may allow the heat plate to expand in response to absorbing heat, so that it may mold itself around the contours of different heat-generating components, increasing the surface area contact between the heat plate and the components, and increasing the heat plate's ability to conduct heat away from the components.

Abstract: A phase change device for controlling temperature within a confined environment, comprising a foam material, a phase change material, the phase change material being absorbed into the foam, and a protective covering encasing the foam material/phase change material. A method for making a phase change device for controlling temperature within a confined environment, comprising providing a phase change material, providing a foam material, absorbing the phase change material into the foam material, and sealing the foam material/phase change material within a protective covering.

Abstract: A solar collector (26) includes: an outer tube (64) of circular cross-section, closed at one of its ends, an absorption layer (52) arranged inside the outer tube (64), for absorbing solar radiation (Rs), and a heat pipe (56) including a hot part (58) laid out inside the outer tube (64), a cold part (60) arranged outside the outer tube (64), and a reservoir (62) containing a heat pipe fluid (63) and extending over the hot part (58) and the cold part (60). The outer tube (64) is hermetically closed around the heat pipe (56) at the other of its ends, a vacuum being formed inside said outer tube (64). For the hot part (58) of the heat pipe (56), the reservoir (62) is applied at least locally against the absorption layer (52).

Abstract: A phase change material (PCM) pack (1) for an air conditioning system comprises phase change material sealed between a first thermally conductive layer (2) forming a first outer surface of the PCM pack and a second thermally conductive layer (2) forming a second outer surface of the PCM pack. At least the first or second outer surface of the PCM pack takes the form of a substantially planar surface having defined therein a plurality of depressions (4) deviating from the planar surface towards the interior of the PCM pack in a direction perpendicular to the planar surface. The depressions improve heat transfer between the pack and an airflow passing over the surface of the PCM pack.

Abstract: A heat pipe structure includes a tubular body and a mesh body. The tubular body has a chamber. The chamber has a first side and a second side. A working fluid is contained in the chamber. The wall faces of the first and second sides are respectively formed with a first channel set and a second channel set. A first contact section and a second contact section are respectively formed at the junctions between the first and second channel sets and the wall faces of the first and second sides. The mesh body is disposed in the chamber and attached to the first and second contact sections. Accordingly, the thickness of the heat pipe is greatly reduced and the manufacturing cost of the heat pipe is lowered.

Abstract: The present invention relates, in part, to heat transfer and refrigerant compositions and methods that include HFC-32; HFO-1234ze and HFC-125.

Abstract: One exemplary embodiment can be a process for cooling a vent stream from a receiver. Generally, the process may include providing a refrigerant including at least one compound contained in the receiver so the refrigerant leaking into the receiver can be compatible with the process.

Abstract: A working medium containing 2-methoxy-1,1,1,3,3,3-hexafluoropropane (HFE-356mmz) as a main component is disclosed. This working medium is a new working medium for a boiling-type cooler, which has a light burden on the environment such as the global warming potential, etc., is slightly flammable or flame retardant, has superior thermal and chemical stabilities, and a good compatibility with heat exchangers formed of various metal materials. This medium for the boiling-type cooler can be preferably used as a working medium for a cooler of a PCU (power control unit) of a car.

Abstract: Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.