Abstract: A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate and second continuity plate comprise a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. The second continuity plate comprises a second continuity plate attachment surface having a third elevated continuity channel. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir.

Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.

Abstract: Various aspects as described herein are directed to a radiative cooling apparatuses and methods for cooling an object. As consistent with one or more embodiments, a radiative cooling apparatus includes an arrangement of a plurality of different material located at different depths along a depth dimension relative to the object. The plurality of different material includes a solar spectrum reflecting portion configured and arranged to suppress light modes, thereby inhibiting coupling of the incoming electromagnetic radiation, of at least some wavelengths in the solar spectrum, to the object at a range of angles of incidence relative to the depth dimension. Further, the plurality of material includes a thermally-emissive arrangement configured and arranged to facilitate, simultaneously with the inhibiting coupling of the incoming electromagnetic radiation, the thermally-generated electromagnetic emissions from the object at the range of angles of incidence and in mid-IR wavelengths.

Abstract: A heat exchanger for cooling a heat-generating component includes first and second plates, each having a core layer of a first metal and an inner clad layer of a lower melting second metal, which is inert to the working fluid contained in a fluid chamber of the heat exchanger. The outer peripheral sealing surfaces of the first and second plates are joined by welding, wherein the weld joint is fluidly isolated from the fluid chamber by a layer of the second metal in an area adjacent to the weld joint. In some embodiments, the heat exchanger includes liquid flow passages and primary and secondary gas flow passages, each secondary passage providing communication between primary gas flow passages. The gas and liquid flow passages may be defined by a wick material having hydrophilic areas and non-wicking areas of reduced thickness. A method of manufacturing is also disclosed.

Abstract: A vapor chamber device is provided. The vapor chamber device includes a heat-generating component, a first metallic layer deposited directly on the heat-generating component, and a second metallic layer deposited so as to contact the first metallic layer at a perimeter. The first and second metallic layers fully enclose an internal void formed therein.

Abstract: A heat pipe including a vapor line having a flow path through which a working fluid vapor flows, wherein the vapor line includes walls opposite to each other across the flow path, and a support post disposed in the flow path and spaced apart from the walls, wherein the walls are made of a plurality of metal layers stacked one over another, and the support post is made of a single seamless member having the same thickness as the walls.

Abstract: Heat transfer systems and methods are disclosed. A heat transfer system includes an electronic enclosure that houses electronic components and includes a volume for a first fluid. A cold plate within the electronic enclosure is configured to contain a second fluid, and the cold plate includes a recess providing access to the second fluid. The heat transfer system also includes a heat transfer device configured to transfer heat from the first fluid to the second fluid. The heat transfer device is a single integrated piece that is situated within the recess wherein a first surface of the heat transfer device is configured to directly interface with the first fluid and a second surface of the heat transfer device is configured to directly interface with the second fluid.

Abstract: Variable temperature analytical instrument components are provided that can include: a conduit configured to extend between two chambers having different pressures; and a first mass about a section of the conduit, wherein the first mass is maintained at a first temperature. Variable temperature analytical instruments are provided that can include: a sample chamber configured to be operably coupled to a heat or cold source via one or more conduits; an interface component configured to engage the one or more conduits with the sample chamber, the interface comprising a conduit configured to extend between two chambers having different pressures; and a first mass about a section of the conduit, wherein the first mass is maintained at a first temperature. Methods for maintaining temperatures within a variable temperature analytical instrument are also provided.

Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.

Abstract: A fluid cooling system for an electronics package having a chassis is disclosed. The system includes an electronics package housed within a chassis, one or more mounting structures attached to the chassis, and a fluid cooling module interfaced with one or more electronics of the electronics package, the fluid cooling module housed within the chassis and mounted to the one or more mounting structures, where circulation of a fluid of the fluid cooling module cools the one or more electronics. A chassis fluid distribution manifold is used to connect with the chassis fluid inlet and outlet and to distribute fluid within the chassis.

Abstract: A method and apparatus for the continuous sublimation of a substance includes cascading a material containing a substance capable of sublimation, such as water, between a plurality of trays vertically stacked within a processing zone provided within a processing chamber. A substantially atmospheric environment is maintained within the processing zone at a temperature whereby the substance sublimes forming a sublimate within the environment. The environment containing the sublimate is contacted with a drying agent such as a desiccant to maintain the environment whereby the substance sublimes at substantially atmospheric pressure and at the controlled temperature.

Abstract: A middle member of heat dissipation device and the heat dissipation device. The middle member includes a middle member main body having a first face, a second face, multiple perforations and a channeled structure assembly. The channeled structure assembly is disposed on the first face or the second face. The perforations are formed through the middle member main body between the first and second faces. The channeled structure assembly and the perforations are arranged in alignment with each other or not in alignment with each other. The middle member and a first plate body and a second plate body are overlapped with each other to form the heat dissipation device. The complex structures disposed on the first and second faces of the middle member main body are able to achieve a stable vapor-liquid circulation effect.

Abstract: A tube heat exchanger extending in a vertical direction, comprising: a first chamber including a lower portion provided with at least one intake inlet for a diphasic fluid including a liquid and a first vapor containing a mist; an upper portion; and a first recovery member passed through by the first vapor and recovering the mist in liquid form, the first vapor next arriving in the upper portion, a central chamber forming liquid films running over the tubes and vaporizing at least partially to produce a second vapor, the tubes being traveled inwardly by a fluid hotter than the diphasic fluid, and a second chamber receiving the first vapor and the second vapor to form a third vapor, and including an outlet for the non-vaporized liquid and an outlet for the third vapor, the first chamber and the second chamber together forming a volume surrounding the central chamber around the vertical direction.

Abstract: A cooling system includes a primary heat sink including a primary top base plate, a primary bottom base plate and a primary fin pack including a plurality of fins, where the primary fin pack is disposed between the primary top base plate and the primary bottom base plate. The cooling system further includes secondary heat sink including a secondary top base plate, a secondary bottom base plate and a secondary fin pack including a plurality of fins, where the secondary fin pack is disposed between the secondary top base plate and the secondary bottom base plate. A heat pipe extends between the primary top base plate and the primary bottom base plate, where the heat pipe further extends from the primary heat sink and couples with the secondary heat sink.

Abstract: A cooling device to be provided is capable of being reduced in size, capable of cooling a heating component uniformly, having high radiating performance, and facilitating implementation of a work in a flat state. A first cooler body includes a first base plate and first blades. The first base plate has a first component mounting surface. A second cooler body includes a second base plate and second blades. The second base plate has a second component mounting surface. With the second cooler body maintained connected to the first cooler body, a rotary mechanism allows the second cooler body to rotate relative to the first cooler body between a state in which the first component mounting surface and the second component mounting surface are pointed to the same direction and a state in which the second blades get into gaps between the first blades without interfering with the first blades.

Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.

Abstract: A cooling device includes: an inner tank configured to store a first coolant which is a liquid; a separation wall that is provided in the inner tank, that faces a side wall portion of the inner tank, that forms an accommodating portion in which an electronic device to be immersed in the first coolant is accommodated, and that forms, at at least part of a periphery of the accommodating portion, a coolant channel through which the first coolant is to flow toward a lower side of the inner tank; an outer tank which is disposed outside the inner tank and through which a second coolant flows; and a heat transfer unit that is provided between the inner tank and the outer tank and that is configured to transfer heat from the first coolant to the second coolant.

Abstract: A laser device includes a first laser medium and a second laser medium that have a first surface and a second surface opposite to the first surface, and receive input of excitation light and seed light from the first surface side to amplify the seed light, a holder that holds the first laser medium and the second laser medium; and a pair of cooling units that cool the first laser medium and the second laser medium according to change in volume of a refrigerant.

Abstract: A heat dissipation device includes a main body and at least one heat conduction member. The main body has a top face. A periphery of the top face has a connection section. One end of the heat conduction member is correspondingly in contact and connection with the top face or the connection section. By means of the structure design of the present invention, the horizontal heat dissipation effect is greatly enhanced and the heat dissipation effect of the entire heat dissipation device is greatly enhanced.

Abstract: A manufacturing method and structure of heat pipe with adjustable working temperature range are provided. The heat pipe includes a tube, a capillary structure and a working liquid. The tube includes a passage having a length direction and a diameter direction. Besides, a part of the tube has a pressed deformation zone in the pipe diameter direction, and the pressed cross-sectional area of the deformation zone in the diameter direction is reduced by a reduction ratio with respect to an original cross-sectional area before pressing, so that the deformation zone has a higher fluid resistance. Thereby, the heat pipe can be operated under a certain working temperature range, and the working object can achieve the working efficiency.

Abstract: A pin-shaped first heat radiating fin low in fluid resistance is disposed in a region required to be high in cooling performance, and a second heat radiating fin high in fluid resistance of a shape in which a plurality of columns of grooves which each meander in zigzag at a narrow pitch are arranged side by side is disposed in a region only necessary to be low in cooling performance. Furthermore, the first and second heat radiating fins are installed in parallel to a direction of flow of refrigerant.

Abstract: A heat transfer device is disclosed having a housing including a first main wall and a second main wall, the housing having a sealed internal cavity, a liquid contained in the internal cavity, and a mixer able to set the liquid in motion, the heat transfer device being able to be switched between a first state and a second state in which the liquid is in motion and transfers heat by convection between the first main wall and the second main wall, the thermal conductance between the first main wall and the second main wall in the first state being four times less than the thermal conductance between the first main wall and the second main wall in the second state.

Abstract: A loop heat pipe includes an evaporator, a condenser, a liquid pipe, and a vapor pipe. The liquid pipe is formed a metal layer stack of metal layers. The metal layers include a first metal layer through which a first through hole extends in a thickness-wise direction. The liquid pipe includes a flow passage formed by at least the first through hole and having four walls that define the flow passage. The liquid pipe further includes a plurality of porous bodies that form at least two of the four walls of the flow passage.

Abstract: A vapor chamber that includes a housing composed of a first sheet and a second sheet facing each other and having outer edge portions thereof joined to each other to define an internal space, the second sheet having a plurality of projecting portions on an inner surface thereof that faces the internal space; a pillar between the first sheet and the second sheet and supporting them from the internal space; a wick arranged in the housing, and a working fluid enclosed in the housing. A first flow path and a second flow path are formed in the internal space, and a cross-sectional area of the second flow path is larger than a cross-sectional area of the first flow path.

Abstract: There is provided an aerosol-generating system including an aerosol-generating device and an aerosol-forming cartridge including at least one aerosol-forming substrate, wherein in use the aerosol-forming cartridge is at least partially received within the aerosol-generating device. The system further includes at least one electric heater configured to heat the at least one aerosol-forming substrate, at least one air inlet, and at least one air outlet. The system further includes an air flow channel extending between the at least one air inlet and the at least one air outlet. The air flow channel is in fluid communication with the aerosol-forming substrate, and has an internal wall surface on which one or more flow disturbing devices are disposed, the flow disturbing devices being arranged to create a turbulent boundary layer in a flow of air drawn through the air flow channel.

Abstract: A heat transferring module adapted to contact a heating element is provided. The heat transferring module includes a first plate, a second plate and a working fluid. The second plate is connected to the first plate to form a cavity therewith, and the cavity extends along an extension direction of a reference plane. The working fluid is located in the cavity, wherein the cavity is a first area, and a portion of the first plate or a portion of the second plate extending beyond the cavity is a second area. The first area transfers heat by heat convection, and the second area transfers heat by heat conduction.

Abstract: A cooling plate includes: first comb tooth flow paths extending from a first common flow path; second comb tooth flow paths extending from a second common path; first vertical flow paths each of which extends from the first comb tooth flow path; second vertical flow paths each of which extends from the second comb tooth flow path; first outer flow paths each of which extends from the first vertical flow path; second outer flow paths that are alternately adjacent to the first outer flow path; first coupling flow paths each of which extends from the first comb tooth flow path or the first outer flow path; second coupling flow paths that are alternately adjacent to the first coupling flow path; and heat receiving flow paths each of which communicates with the first coupling flow path and the second coupling flow path to receive heat of the heat receiving surface.

Abstract: A thin heat exchange panel includes a contact side that is in contact with a heat source and a plurality of heat exchange channels disposed in the contact side. A water inlet channel of the heat exchange panel is connected with a high-pressure pump for inputting high-pressure water, and a water outlet channel of the heat exchange panel is connected with a cooler to form a circulating cooling system. When the high-pressure pump is started, the high-pressure water quickly enters the water inlet channel. Reduced control holes communicating with the water inlet channel are configured to regulate the average flow rate and increase the speed of the water to bring a high-speed jet effect, which improves the heat exchange rate of the water in the heat exchange channels to achieve the effects of low damping, high heat dissipation efficiency and thinning.

Abstract: A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.

Abstract: A method of installing an asymmetric heat pipe in a heat sink includes providing an asymmetric heat pipe with additional material on one side; forming a cavity in a base of the heat sink leaving additional base material on the component side of the heat sink; inserting the asymmetric heat pipe in the cavity; and removing the additional material on the asymmetric heat pipe and the additional base material on the heat sink to form a smooth and substantially uniform contact surface on the component side. An apparatus includes a component; a heat sink with a cavity; and a flattened heat pipe inserted into the cavity; wherein the heat sink and the heat pipe have a smooth and substantially uniform surface on the side proximal to the component and the heat pipe has a thickness which is substantially the same size on a component side and an opposite side.

Abstract: Some embodiments include a thermal management system for a nanosecond pulser. In some embodiments, the thermal management system may include a switch cold plates coupled with switches, a core cold plate coupled with one or more transformers, resistor cold plates coupled with resistors, or tubing coupled with the switch cold plates, the core cold plates, and the resistor cold plates. The thermal management system may include a heat exchanger coupled with the resistor cold plates, the core cold plate, the switch cold plate, and the tubing. The heat exchanger may also be coupled with a facility fluid supply.

Abstract: A power storage module includes: a power storage element; a cooling member that is stacked on the power storage element and has a sealing body hermetically sealing a coolant and an absorption member disposed in the sealing body to absorb the coolant; and a heat transfer plate that is stacked on the power storage element with the cooling member sandwiched therebetween. The heat transfer plate is provided with protrusion portions that protrude to the cooling member side.

Abstract: A heat-dissipating board structure and a circuit board module are provided. The heat-dissipating board structure includes a first board, a second board, a heat-transmitting layer and a buffering liquid. The first board has a first inner surface and the first inner surface has a plurality of first metal protrusions thereon. The second board is correspondingly engaged with the first board to form an accommodating chamber therebetween. The second board has a second inner surface and the second inner surface has a plurality of second metal protrusions thereon. The heat-transmitting layer is disposed in the accommodating chamber and arranged between the first metal protrusions and the second metal protrusions. The buffering liquid is filled in a residual space of the accommodating chamber. Therefore, the heat-dissipating board structure can meet the design requirements of a light-weight and thin electronic product and can effectively remove heat from a heat source.

Abstract: A heat storage unit, at least comprises one single-layer closed case (2) that has at least one heat exchange surface (8, 9) and a non-heat exchange surface; the internal space of the closed housing (2) is filled with a foam skeleton (4); the phase change medium (6) is homogeneous distributed in the voids of the foam skeleton (4), and forms a composite material (02) together with the foam skeleton (4), the composite material has a higher thermal conductivity coefficient than that of the pure phase transition medium (6); vibration particles (3) are made of shape memory alloy, pressed into strips and then filled into the voids of the foam copper frame (4) by filtration; the ultrasonic generator (05) emits ultrasonic to induce the vibration particles (3) to generate vibration, the vibration converts the liquid phase transition medium (6) from natural convection or pure heat conduction to forced convection.

Abstract: A loop thermosiphon (LTS) heat sink includes an evaporator, a condenser, a gas conduit, and a liquid conduit. The evaporator includes a first surface, a second surface opposite to the first surface, and a third surface coupled between the first surface and the second surface. Each of the first surface and the second surface is configured to mount a heat generating component. One end of the gas conduit is coupled to one end of the liquid conduit, and another end of the gas conduit and another end of the liquid conduit are coupled to the evaporator through the third surface. The evaporator, the gas conduit, and the liquid conduit cooperatively form a circulation passage. A connecting portion of the gas conduit and the liquid conduit is received within the condenser.

Abstract: An energy delivery device cooling system includes a reservoir connector assembly and an elongate member. The elongate member has first and second lumens in fluid communication with the reservoir. The first lumen includes an outflow port and the second lumen includes a return port each in fluid communication with the reservoir. The device further includes a tubing system having a first end and a second end. The first end connected in fluid communication with the outflow port and the second end in fluid communication with the return port. The second end configured to return a fluid to the reservoir. The tubing system connects to an energy delivery device to cool the fluid.

Abstract: An object is to provide a semiconductor cooling device which optimally keeps the mixing amount of microbubbles in the refrigerant and prevents the reduction of the cooling effect of the semiconductor module. The semiconductor cooling device includes a refrigerant circulation path through which refrigerant circulates, a heat exchanger provided on the refrigerant circulation path on which a semiconductor module is installable and configured to exchange heat between the refrigerant and the semiconductor module, a microbubble generator provided on the refrigerant circulation path, and configured to generate microbubbles in the refrigerant, a controller configured to control the microbubble generator, and a refrigerant sensor configured to measure a temperature, a flow rate, a flow velocity, or a pressure of the refrigerant circulating in the refrigerant circulation path.

Abstract: A vapor chamber structure includes a main body, a fan and perforations. The main body has a heat absorption section, a heat dissipation section and a chamber. The heat absorption section and the heat dissipation section are respectively horizontally disposed on left and right sides of the main body. The heat absorption section is attached to at least one heat source. The chamber is positioned at the heat absorption section and partially extends to the heat dissipation section. The chamber has a capillary structure and at least one perforated section. The perforated section is connected between an upper side and a lower side of the chamber. The fan is disposed on one side of the heat dissipation section. The perforations are formed through the parts of the main body, which parts are free from the chamber and the parts of the main body, where the perforated section is disposed.

Abstract: A microchannel two-phase cooling apparatus includes a cooling manifold and a fluid diode array. The cooling manifold includes one or more fluid inlets, one or more fluid outlets, and a plurality of fluid channels extending between and fluidly coupling the one or more fluid inlets and the one or more fluid outlets. The fluid diode array includes a plurality of fluid diodes positioned within the cooling manifold. Individual fluid diodes of the fluid diode array are fluidly coupled to individual fluid channels. The fluid diode array includes a first set of fluid diodes having a first average diodicity and a second set of fluid diodes having a second average diodicity. The first average diodicity is greater than the second average diodicity and each individual fluid diode of the first set of fluid diodes has a greater diodicity than any individual fluid diode of the second set of fluid diodes.

Abstract: Techniques for autonomously modeling a two-phase cooling architecture are provided. In one example, a computer-implemented method can comprise generating, by a system operatively coupled to a processor, a reduced physics model based on a profile of a heat source and a parameter of a cooling structure. The reduced physics model can provide an output. Also, the computer-implemented method can comprise generating, by the system, a full physics model based on the output. The computer-implemented method can further comprise combining, by the system, the reduced physics model and the full physics model to define an architecture that achieves a flow distribution of a coolant.

Abstract: A heat dissipation module including a chamber, a first cooling member, and a barrier part is provided. The chamber has an accommodating space, at least one inlet, and at least one outlet. The at least one inlet is disposed in a first side wall of the chamber and communicates with the accommodating space. The at least one outlet is disposed in a second side wall of the chamber away from the at least one inlet and communicates with the accommodating space. The first cooling member is disposed in the accommodating space. The first cooling member has a guiding surface which extends obliquely upward. The barrier part is disposed outside the guiding surface of the first cooling member and has at least one through hole.

Abstract: Reconfigurable cooling assemblies for thermal management of integrated circuitry are provided. Such assemblies can be modular and can permit or otherwise facilitate scalable thermal performance with respect to power dissipation demands. In some embodiments, a reconfigurable modular cooling assembly can be reversibly configured to adjust reversibly the cooling capacity of the assembly for a defined power dissipation requirement. A form factor of a reconfigurable modular cooling assembly can be based at least on the defined power dissipation requirement. In some embodiments, a reconfigurable modular cooling assembly can include a pedestal member and multiple attachment members that can be reversibly coupled to or reversibly decoupled from the pedestal based at least on a power dissipation condition and/or a change thereof in a dissipative electronic component included in a semiconductor package.

Abstract: Techniques for autonomously modeling a two-phase cooling architecture are provided. In one example, a computer-implemented method can comprise generating, by a system operatively coupled to a processor, a reduced physics model based on a profile of a heat source and a parameter of a cooling structure. The reduced physics model can provide an output. Also, the computer-implemented method can comprise generating, by the system, a full physics model based on the output. The computer-implemented method can further comprise combining, by the system, the reduced physics model and the full physics model to define an architecture that achieves a flow distribution of a coolant.

Abstract: A heat transfer tube including an inner surface including a plurality of grooves. The plurality of grooves includes at least primary grooves and secondary grooves, wherein the primary grooves extend axially along a length of the tube, and the secondary grooves intersect the primary grooves.

Abstract: A loop heat pipe includes a liquid pipe and a vapor pipe that connect an evaporator and a condenser and form a loop-shaped passage. The liquid pipe includes two outermost metal layers, and inner metal layers stacked between the outer metal layers. The inner metal layers include one or more flow passages in which a working fluid flows, and a porous body communicating with the one or more flow passages. One inner metal layer includes a first bottomed groove opening to a side of another inner metal layer adjacent to the one inner metal layer, and the other inner metal layer includes a second bottomed groove opening to a side of the one inner metal layer. The one or more flow passages include a flow passage formed by the first and second bottomed grooves that are arranged to oppose and communicate with each other in a thickness direction.

Abstract: A dehumidification system includes a compressor, a primary evaporator, a primary condenser, a secondary evaporator, and a secondary condenser. The secondary evaporator receives an inlet airflow and outputs a first airflow to the primary evaporator. The primary evaporator receives the first airflow and outputs a second airflow to the secondary condenser. The secondary condenser receives the second airflow and outputs a third airflow to the primary condenser. The primary condenser receives the third airflow and outputs a dehumidified airflow. The compressor receives a flow of refrigerant from the primary evaporator and provides the flow of refrigerant to the primary condenser.

Abstract: A cooling device includes an evaporator, a condenser, a vapor pipe, and a liquid pipe. The evaporator includes a housing having a reservoir, a wick disposed in the housing and retaining the working fluid in the liquid phase, and a groove member having a plurality of flow channels through which the working fluid in the vapor phase flows. The wick has first, second and third layers. The first layer has a plurality of first apertures, and is higher in thermal conductivity than both the second and third layers. The third layer transports the working fluid in the liquid phase in the reservoir to the second layer. The second layer has a plurality of second apertures corresponding to the first apertures, the second apertures having aperture area larger than corresponding one of the first apertures. The second layer transports the working fluid in the liquid phase to the first layer.

Abstract: A heat conduction component and a mobile terminal are disclosed. The heat conduction component is applied to a mobile terminal. The heat conduction component includes a support part and a heat dissipation part. A cavity is disposed inside the support part. The heat dissipation part is disposed in the cavity, and the heat dissipation part has mesh capillary holes. The heat source component is located at one end of the heat dissipation part, a low temperature area is located at the other end of the heat dissipation part, and a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is located. A heat conduction medium is disposed in the mesh capillary hole of the heat dissipation part.

Abstract: A passive heat recovery or defrosting apparatus features an evaporator, a condenser, and vapour and liquid conveyance lines connected therebetween. The vapour and liquid conveyance lines respectively connect to upper and lower ends of the evaporator and condenser. The evaporator and/or condenser has a ring-shaped body for fitting around or inline with a pipe to achieve heat exchange relation with a fluid passing therethrough. The evaporator is installed on or inside a warm pipe or duct (e.g. waste drain pipe, clothes dryer exhaust duct, flue pipe, or indoor section of a sewer vent stack) at a lower elevation than the condenser. The condenser is placed on an outdoor end of either a sewer stack or air intake duct for defrosting purposes, or is placed on a water supply line or air intake of a hot water tank, clothes dryer, etc. Working fluid circulates passively between the evaporator and condenser.

Abstract: A liquid-cooling assembly includes two or more cooling sub-assemblies and a flexible interconnect assembly. The two or more cooling sub-assemblies are configured for cooling two or more respective pluggable connector-cages, each cooling sub-assembly including (i) a heat-conducting plate for coupling to a respective pluggable connector-cage, and (ii) a liquid-conducting channel having an inlet and an outlet for flowing cooling liquid. The flexible interconnect assembly is configured to transfer the cooling liquid to and from inlets and outlets of the cooling sub-assemblies, and to mechanically support the cooling sub-assemblies while permitting motion of the cooling sub-assemblies relative to one another.