Abstract: A filler panel for blocking an unused portion of a communications system. That filler panel may include an electromagnetic shielding base and a base cover removably coupled to the electromagnetic shielding base. The filler panel may also include an air dam composed substantially of low-cost, nonconductive material coupled to either the electromagnetic shielding base or to the base cover through the electromagnetic shielding base.

Abstract: To provide more compact dimensions of a via structure formed by signal via pairs and ground vias in multilayer substrate. A multilayer substrate is provided such that the multilayer substrate comprising a high-isolated via cell wherein the high-isolated via cell comprises: two signal via pairs; a shield structure around two signal via pairs consisting of ground vias and ground strips connected to ground vias wherein the shield structure is formed symmetrically in respect to two via pairs to reduce the transformation between mixed modes and also leakage from two signal via pairs; a clearance hole separating signal via pairs from other conductive parts of the multilayer substrate and having predetermined dimensions to provide broadband operation of the high-isolated via cell; and the separating strip disposed symmetrically between said signal via pairs to provide crosstalk reduction between two signal via pairs and common mode decrease.

Abstract: An electrical device comprising an electronic component mounted to a surface of a printed circuit board, a ground connection on said surface, and electromagnetic interference (EMI) shielding. The EMI shielding includes an electrical insulator coating the electronic component, the insulator contacting the surface, and a conductive layer covering the electrical insulator, and contacting the electrical insulator and the ground connection.

Abstract: The invention relates to an electromagnetic radiation attenuator and a method for controlling the spectrum thereof. The attenuator of the invention is formed from an attenuating sheet located such that, in the position of use of the attenuator, said electromagnetic radiation is incident on the attenuator sheet, and from a conductive base located, in the position of use of the attenuator, beneath said attenuator sheet. The attenuator sheet is formed by two layers, the first layer, made of dielectric material and of thickness d3, being located directly on the metal sheet, and the second layer, of thickness d2 formed by a dielectric material containing non-magnetic metal microwires with an insulating sheath of 1 to 2 mm in length, being located on the first layer and coating the whole, with the particularity that the second sheet is formed from a mixture of paint and microwires applied on the first sheet.

Abstract: The present invention provides a configuration of an electronics enclosure, including a computer chassis in which three-dimensional shapes that may be in the form of a partial or quarter-sphere or cube or other periodic “patterns” may be stamped, molded, cut, or extruded into a lid and a five-sided “box” to provide improved EMI shielding, such that the need for gaskets is reduced or eliminated.

Abstract: A shielding assembly includes a hollow frame, a pair of first resilient clips and a cover. The frame defines a receiving room and includes a pair of opposite first sidewalls, a second sidewall, a third sidewall opposite to the second sidewall, and a plurality of platforms configured along at least two diagonal corners of the hollow frame. Each of the resilient clip includes a clamping portion extending to suspend in the receiving room. The first resilient clips and the platforms are cooperatively defining a pair of guiding grooves. The cover is inserted into the guiding grooves and positioned between the platforms and first resilient clips by the clamping portions and the platforms resisting on two sides of the cover respectively.

Abstract: A filler panel for an electronics shelf is provided. The electronics shelf includes a plurality of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a back wall, a top wall, a bottom wall and a single side wall. The front wall, back wall, top wall and bottom wall are configured to fill a width of a slot of the electronics shelf. The side wall is configured to extend into a depth of the slot, The filler panel also includes an electromagnetic shielding portion comprising a conductive material that is coupled to the main body. The main body further includes one or more vents positioned in each of the top wall and the bottom wall, the vents configured to allow air flow though the main body.

Abstract: A filler panel for an electronics shelf is provided. The electronics shelf includes a number of slots each configured to receive an electronic device. The filler panel includes a non-conductive main body that includes a front wall, a side wall, and a back wall. The front wall and back wall are configured to fill a width of a slot of the electronics shelf and the side wall is configured to extend into a depth of the slot. The filler panel also includes an electromagnetic shielding portion made of a conductive material and coupled to the main body. Furthermore, the main body includes one or more cable clips each configured to retain one or more cables within the main body.

Abstract: A shielding assembly comprises at least two shielding modules, each comprising a frame and a cover mounted on the frame. Each of the at least two covers comprises a plurality of engaging portions and a plurality of slots between each two adjacent engaging portions, and one portion of one of the at least two frames abuts one portion of another of the at least two frames. Each of the plurality of engaging portions of one of the at least two covers is received in a corresponding slot of another of the at least two covers to connect the at least two shielding covers to form a cover to reduce electromagnetic interference for an electronic components positioned on a circuit board.

Abstract: Disclosed is an electromagnetic wave absorbent which exhibits high electromagnetic wave absorption performance over a wide band. The electromagnetic wave absorbent contains a conductive fiber sheet which is obtained by coating a fiber sheet base with a conductive polymer and has a surface resistivity within a specific range. The conductive fiber sheet is formed by impregnating a fiber sheet base such as a nonwoven fabric with an aqueous oxidant solution that contains a dopant, and then bringing the resulting fiber sheet base into contact with a gaseous monomer for a conductive polymer, so that the monomer is oxidatively polymerized thereon.

Abstract: A shielded cable interface module having cable receiving grooves extending laterally to an edge of the board, each including a center conductor groove, an insulator groove, and a shield groove. A center conductor via and a shield via extend through the board. A conductor plane on the cable termination side surrounds the cable receiving grooves. The conductor plane includes a non-conductor region within the conductor plane adjacent to each of the conductor center conductor grooves. Ground vias associated with the cable receiving grooves are spaced apart from and partially surround the center conductor via outside and adjacent to the non-conductor region, the ground vias extend through the printed circuit board from the cable termination side to the system interface side.

Abstract: A shield can of a mobile terminal is provided. The shield can of the mobile terminal includes: at least one shield can installed in a main circuit board of the mobile terminal, and at least one separation wall formed between electronic elements in which electromagnetic interference occurs within the shield can. Hence, shield ability can be improved and simplified manufacturing process of the separation wall can reduce cost.

Abstract: Enclosures for at least partially shielding an at least partially enclosed volume from electromagnetic interference and various methods for producing such enclosures are described. Enclosures for at least partially shielding an at least partially enclosed volume from electromagnetic interference may be prepared by bonding at least two sections of carbon foam with a carbonizable binder to provide an enclosure, wherein said enclosure defines an at least partially enclosed volume, and carbonizing the carbonizable binder to provide an electrically conductive carbon char. An enclosure for at least partially shielding an at least partially enclosed volume from electromagnetic interference may include at least two sections of electrically conductive carbon foam interconnected by an electrically conductive carbon char. The electrically conductive carbon char is substantially electrically continuous with the sections of electrically conductive carbon foam.

Abstract: A shield can includes a frame having a hole in the top wall thereof, and an enclosure attached to the frame and covering the hole. The frame and the enclosure are formed by punching a metallic piece, the enclosure corresponds to the hole in shape and size, the enclosure is fixed to the upper surface of the top wall. The invention also discloses the method for fabricating the shield can.

Abstract: The invention relates to an electromagnetic limiter. The limiter comprises a multilayer having an electrically conducting pattern superposed on a dielectric structure. Further, the multilayer is provided with at least one electromagnetically transparent aperture that is electromagnetically transparent for plane wave incidence. In addition, the limiter comprises a non-controlled non-linear structure interconnecting opposite edges of the electromagnetically transparent aperture.

Abstract: A thermal-electrical assembly (200) provides with improved heat sinking, electrical shielding and electrical grounding. The thermal-electrical assembly is configured using a shield (202) having a windowed aperture (204), a pliable frame (206) formed of thermally and electrically conductive material having contours (210) that fit within and are retained by the windowed aperture, and a thermal insert (208) formed to fit within the pliable frame. The combination of pliable frame 206 and thermal insert (208) close off the shield (202) while providing contact areas for dissipating heat from heat generating circuitry or components. Communication devices, such as portable radios having tight space constraints, can incorporate the thermal-electrical assembly (200) to minimize electrical emissions while maximizing heat dissipation.

Abstract: A conformal electro-magnetic (EM) shield and a method of applying such a shield are provided herein as well as variations thereof. Variations include, but are not limited to, frequency-selective shielding, shields containing active and/or passive electronic components, and strippable shields that can easily be applied to and removed from underlying components. Variations of a shield structure include at least an insulating layer between the underling component and the shield, and shielding and/or capping layers disposed over the insulating layer.

Abstract: The present invention is a film for prevention of electromagnetic interference and transmission of wireless signals. A conductive lamination is integrally attached to a preset position of a substrate and shaped as a film and a signal transceiver. The method of forming the film includes selecting a substrate and selecting a signal transmitting and receiving mode and a form of the conductive surface according to a specific need. A film-shaped signal transceiver and conductive lamination are integrally formed on a preset area of the substrate. By plating and/or coating, the present invention can form a conductive lamination on the substrate with both functions as a signal transceiver and a shield.

Abstract: The present invention is an electromagnetic frequency and non-ionizing radiation harmonizer that can be a film, a sheet or a textile that harmonizes or mitigates electromagnetic frequency (EMF) radiation from non-ionizing EMF emitting devices while allowing an integration of vibrations or frequency mediums. The invention also includes a method of using an electromagnetic frequency radiation and non-ionizing radiation harmonizer that includes the steps of obtaining a film, a sheet or a textile that harmonizes or mitigates electromagnetic frequency (EMF) radiation from one or more non-ionizing EMF emitting devices and disposing the film, sheet or textile in direct contact or within dose proximity of one or more non-ionizing EMF emitting devices.

Abstract: Disclosed herein is an electromagnetic bandgap structure, including: a dielectric layer; a plurality of conductive plates formed on one side of the dielectric layer; a stitching via serving to electrically connect two adjacent conductive plates of the plurality of conductive plates; and a first dummy via formed each of the plurality of conductive plates in a direction of thickness of the dielectric layer, and a printed circuit board comprising the electromagnetic bandgap structure. The printed circuit board comprising the electromagnetic bandgap structure can solve a mixed signal problem even when an analog circuit and a digital circuit are simultaneously mounted therein.

Abstract: A shield can fixing device of an electronic device is provided. The fixing device includes a base having a specific length and attached to a shield can fixing line of the printed circuit board, a pair of panels, each of which is bent upwards and formed on the base to have a slit between them for inserting a lateral portion of the shield can, at least one opening portion formed in any one or both of the panels, and an insertion protrusion formed in the lateral portion located in a corresponding position to the opening portion in a protruding manner to ensure a fixing force of the shield can. The shield can fixing device is fixed by inserting a lateral portion of a shield can between double walls.

Abstract: A shield case of the invention includes a receiving portion of generally rectangular tuboid shape adapted to accommodate a body with contacts arrayed, the receiving portion having a top plate and side walls; a folded-back portion, provided at a front end of the receiving portion and folded back rearward, or provided at a rear end of the receiving portion and folded back forward; and a cover of generally downward U-shape, extending from the folded-back portion and along the top plate and the side walls of the receiving portion.

Abstract: The invention provides a shield cover adapted to cover at least a first electronic component mounted on a first surface of a circuit board. The first electronic component has a metal shell or has a ground/earth terminal on a lateral surface thereof. The shield cover has a contact portion being elastically contactable with a lateral surface of the metal shell or the ground/earth terminal of the first electronic component.

Abstract: This is directed to an EMI shield constructed from a conformal coating. A circuit board can include electronic components for which EMI shielding is required. To provide such shielding in a space-efficient manner, a first non-conductive conformal coating can be placed over the circuit board and the electronic components. A second conductive conformal coating can then be placed over the first such that at least portions of the second coating around the periphery of the electronic components are electrically coupled to the circuit board.

Abstract: Disclosed herein are various exemplary embodiments of shielding enclosures. In an exemplary embodiment, a shielding enclosure generally includes a frame and a lid. The frame includes vertically extending sidewalls and horizontally inwardly extending lateral flanges therefrom. The lateral flanges define a top opening of the frame and include outwardly extending detent legs. The lid includes a top portion for covering the top opening of the frame. The lid also includes flanges downwardly extending from edges of the top portion. At least one of the flanges has a detent structure, such that when the lid is installed on the frame the detent legs of the frame are engaged by the detent structure. The detent structure may, for example, be detent slots or detent protrusions.

Abstract: A shield for electronic elements of a circuit board includes a frame and a cover, the frame including a peripheral wall comprising a plurality of fixed portions thereon, wherein the fixed portion includes a protrusion and a gap, the protrusion formed on the inner side of the peripheral wall, and the cover has a plurality of folding pieces corresponding to the fixed portions, the folding pieces defines an aperture, and the cover is mounted on the frame, the folding pieces match with the fixed portions correspondingly, the protrusion passes the aperture and locks with the aperture. When the cover is detached, the folding pieces are resisted via the gap to make the protrusion to break away from the aperture of the folding piece, enabling the cover to be opened.

Abstract: Disclosed is a printed circuit board including an electromagnetic bandgap structure. The electromagnetic bandgap structure for blocking a noise is inserted into the printed circuit board. The electromagnetic bandgap structure can include a first conductive plate; a second conductive plate arranged on a planar surface that is different from that of the first conductive plate; a third conductive plate arranged on a planar surface that is different from that of the second conductive plate; and a stitching via unit configured to connect the first conductive plate and the third conductive plate by bypassing the planar surface on which the second conductive plate is arranged and including a first inductor element.

Abstract: An electromagnetic interference (EMI) shielding apparatus generally includes a lid and a framework. The lid includes a top portion having at least one projection joining part thereon. The at least one projection joining part has a peripheral contour. The framework includes a top portion and a lateral side extending downward from the top portion. The top portion includes at least one joining opening having a peripheral contour coinciding with the peripheral contour of the at least one projection joining part of the lid. Accordingly, the at least one projection joining part of the lid is engagable with the at least one joining opening of the framework via an interference fit.

Abstract: Contactless payment cards with on-card microchips are transported in mailers with RF shielding. The RF shielding is designed to prevent communication with and skimming of information from the contactless cards enclosed in the mailers while in transit.

Abstract: The functionality or viability of this invention (Metallic Card Shield) is based on the properties of the natural chemical element Aluminum, which is known and proven to block or reflect both micro wave energy and radio wave energy. It is these two energies, the microwave and the radio wave, which are suspected of being the main culprits in the demagnetization of cards that employ a magnetic stripe to carry information. It is also by means of the radio wave that cards carrying an RFID enabled microchip may be hacked and their information read by unauthorized persons. Therefore it is the pure element Aluminum, which this invention seeks to capitalize upon and use to protect cards from having their information either erased or accessed by unauthorized persons.

Abstract: A shield case of the invention includes a base of a generally U-shape in front view having widthwise end portions, the end portions each having a front surface and a back surface; a pair of folded-back portions, provided on the front the back surfaces of the end portions of the base and folded back backward, or alternatively provided on the back surfaces of the end portions of the base and folded back forward; a pair of side walls, extending from the folded-back portions along a length of the end portions of the base; a pair of first locking pieces, extending downward from the side walls; and a linking portion adapted to link between the side walls. The base, the side walls, and the linking portion define a body containing portion.

Abstract: As a multi-layered board, an EMI noise reduction board, having an electromagnetic bandgap structure with band stop frequency properties inserted into an inner portion of the board, includes a first area, in which a ground layer and a power layer are formed, and a second area, placed on a side surface of the first area, in which it has the electromagnetic bandgap structure formed therein so as to shield an EMI noise radiated to the outside through the side surface of the first area. The electromagnetic bandgap structure includes a plurality of first conductive plates, placed along the edge of the board, a plurality of second conductive plates, disposed on a planar surface that is different from the first conductive plates such that the second conductive plates are alternately disposed with the first conductive plates, and a via, which connects the first conductive plates to the second conductive plates.

Abstract: An electromagnetic-wave-absorbing film comprising a plastic film, and a single- or multi-layer, thin metal film formed on at least one surface of the plastic film, the thin metal film being provided with large numbers of substantially parallel, intermittent, linear scratches with irregular widths and intervals.

Abstract: The present invention discloses a container or bag with several types of compartments with different forms of electromagnetic/wireless shielding. The types of compartments include a) an electromagnetic/wireless shielded compartment useful for line-of-site type shielding, b) an electromagnetic/wireless shielded compartment useful when a complete shielding enclosure is needed, and c) an unshielded compartment. The line-of-site shielded compartment prevents wireless access to the contents contained within when a complete shielding enclosure is not required, for example, for objects containing RFID tags, such as passports, books, and clothing. The compartment with a complete shielding enclosure prevents wireless access to devices that require a complete Faraday type cage, such as mobile phones, PDAs, or computers. Placing these and other devices within the shielded compartments protects them from remote access, and the data within is shielded from unscrupulous individuals.

Abstract: A gasket is interposed between a circuit board that generates electromagnetic waves and a conductive member, and includes an elastic member separating the circuit board from the conductive member. The gasket is electrically connected with the circuit board by a conductive layer to receive the electromagnetic waves from the circuit board. The conductive layer is covered with an insulating layer except for a contact area where the conductive layer is coupled with the circuit board. The insulating layer blocks the electromagnetic waves received from the circuit board. The electromagnetic wave noise of a display apparatus is reduced even if a contact failure occurs between the gasket and a top chassis.

Abstract: An electronic ballast and ballast housing having an integral ground for a circuit board positioned within the housing. A ‘snap in’ capture means holds circuit board under flexion so as to press a circuit grounding means in electrical contact with an integral grounding device attached to the ballast housing and providing electrical continuity between the circuit grounding means and the ballast housing. The coupler includes a grounding tab with a fulcrum extension extending from the housing and holding a ground plane surface of the circuit board by means of serrated teeth. An alignment tab disposed on a housing wall receives an alignment slot disposed in the circuit board so as to provide proper alignment of the electrical contacts. The coupler includes an overhead extension that engages a jumper wire in the circuit of the circuit board.

Abstract: The present invention addresses the prevention of local entrapment of air between an electromagnetic interfere suppression sheet attached to an adherend and the adherend, and thereby achieve placement of the electromagnetic interference suppression layer at a constant distance from the adherend surface and obtain a uniform electromagnetic interference suppression effect across the entire attachment surface. There is provided an electromagnetic interference suppression sheet comprising an electromagnetic interference suppression layer that contains a soft magnetic powder and an organic binder, and a pressure-sensitive adhesive layer having a structured surface with the side opposite the structured surface being laminated in contact with the electromagnetic interference suppression layer, wherein a continuous groove reaching to the outer perimeter of the pressure-sensitive adhesive layer is formed in the structured surface.

Abstract: Systems and methods for simple, efficient and/or cost effective manufacturing and assembly of electronic devices are provided. The various systems and methods of the invention may include various ways of coupling, attaching, and/or connecting the various components of the system to one another, for improved cost and ease of assembly. A number of clips may be used to attach together various parts of an electronic system and housing including circuit devices, enclosure lid and housing, and/or cabling. These clips may be screw-less, may be made of a resilient or spring material, designed so that they quickly snap into place so as to provide good mechanical strength and electrical connection. Various circuit elements may include planar circuits, and may include filters made of a high temperature superconductor material. A planar cable may be used for electrical connecting of components. These systems and devices may be used in, for example, wireless communication systems.

Abstract: A composite for use in electromagnetic interference (EMI) shielding applications includes a carbon nanotube(CNT)-infused fiber material disposed in at least a portion of a matrix material. The composite is capable of absorbing or reflecting EM radiation, or combinations thereof in a frequency range from between about 0.01 MHz to about 18 GHz. The electromagnetic interference (EMI) shielding effectiveness (SE), is in a range from between about 40 decibels (dB) to about 130 dB. A method of manufacturing the composite includes disposing a CNT-infused fiber material in a portion of a matrix material with a controlled orientation of the CNT-infused fiber material within the matrix material, and curing the matrix material. A panel includes the composite and is adaptable to interface with a device for use in EMI shielding applications. The panel is further equipped with an electrical ground.

Abstract: An apparatus and method is provided for isolating a telecommunication device by introducing the device to a first container part of a container, the container having a first container part and a second container part, the first container part being accessed from the second container part through a first seal, the first seal having an open state and a closed state, the second container part being accessed from the environment around the container through a second seal, the second seal having an open state and a closed state. The first container part and second container part, at least in part are formed of a flexible electrical conductor to provide electromagnetic shielding. The method includes the device being introduced to the first container part of the container with the first seal and the second seal in the open state, one or both of the first and second seals then being placed in the closed state to isolate the device from external electromagnetic radiation.

Abstract: A shielding can (100) includes a shielding case (10) configured to reducing electromagnetic interference, and a cushion (20) integrally mounted to the shielding case by insert molding. The cushion is configured to absorb shock force. A method for making the shielding can includes the following steps: providing a mold; placing a shielding case in the mold; injecting shock absorbing material into the mold to form a cushion on the shielding case; cooling the molded shielding can; and removing the shielding can from the mold.

Abstract: A combined environmental and electromagnetic rotary seal. The invention is adapted for use between two mutually rotating components of an electromagnetic energy transmission system and provides simultaneous protection against contamination from the environment and unwanted electromagnetic leakage. In the illustrative embodiment, a first set of grooves is cut into the exterior of a first conductive cylindrical component whose interior contains a portion of a millimeter-wave beam waveguide energy transmission system, the grooves comprising the electromagnetic portion of the seal and a second set of grooves is cut into the interior of the conductive housing enclosing the first conductive cylindrical component.

Abstract: Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates; and a metal layer disposed over or under the conductive layer and including a stitching pattern to electrically connect a first conductive plate to a second conductive plate of the plurality of conductive plates. The bandgap structure includes a spiral stitching pattern formed in a metal layer different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.

Abstract: Disclosed herein are an electromagnetic bandgap structure and a printed circuit board having the same. The bandgap structure includes a conductive layer including a plurality of conductive plates, a first metal layer disposed under the conductive layer and including a first stitching pattern electrically connected to a first conductive plate of the plurality of conductive plates, and a second metal layer disposed under the first metal layer and including a second stitching pattern electrically connected to both the first stitching pattern and a second conductive plate of the plurality of conductive plates. The bandgap to structure includes stitching patterns formed in two layers different from the conductive layer, thus offering a stop-band having a desired bandwidth in a compact structure.

Abstract: An RF isolation container that includes a counterweight system to assist an operator with opening and closing operations, an electromagnet locking mechanism for easier and consistent locking of the RF isolation container and a motion damping mechanism to relieve fatigue on operating components and on human operators.

Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

Abstract: A system for protecting electronic components to be disposed inside a computer housing comprising a gliding connector aligner for disposing inside the housing. The aligner has a central flat surface to be disposed over electronic components and a plurality of appendages with at least one nub each disposed at an opposing end to that of the central surface. The appendages are substantially perpendicular to the flat surface. An EMC gasket is also provided around the housing. The gasket in one embodiment has a plurality of portions with each portion having a central support line from which a plurality of complementary spring fingers emanates. The portions are connected to one another via a tab such that said gasket can be stretched around all housing corners such that said spring fingers from different portions are placed in a substantially perpendicular direction to one another.

Abstract: A grounding apparatus (200) includes at least one conductive member (20), a sliding mechanism (30) and a flexible printed circuit board (40). The sliding mechanism is conductive and electrically connected to the conductive member. The flexible printed circuit board includes a conductive layer (421) and a grounding end (4231), the conductive layer and the grounding end are electrically connected to the sliding mechanism.

Abstract: A shielding apparatus has first and second electrically conductive sheets attached to an interior of a housing. A gap between the first and second electrically conductive sheets has a size based on a predefined desired cutoff frequency, and the widths of the first and second electrically conductive sheets are no more than twice the size of the gap. The lengths of the first and second electrically conductive sheets are at least four times the size of the gap.

Abstract: Protective containers for electronic equipment, and methods of testing and manufacture thereof, are provided. The cabinets provide a HEMP protection level to electronic equipment housed therein that meets a HEMP protection level according to MIL-STD-188-125-1.