Abstract: The present disclosure relates to a hermetic package with improved RF stability and performance. The package includes a carrier, a bottom dielectric ring over the carrier, a bottom metal layer over the bottom dielectric ring, a top dielectric ring over the bottom metal layer, a top metal layer over the top dielectric ring, an exterior plated layer, and multiple top vias. Herein, the bottom metal layer includes signal sections and at least one ground section, which is electrically isolated from the signal sections. The exterior plated layer covers at least a portion of a first exterior sidewall of the bottom ring structure and electrically couples the carrier to the at least one ground section. The multiple top vias extend through the top dielectric ring and electrically couple the top metal layer to the at least one ground section.

Abstract: Apparatus for dissipating heat during the operation of a device. In accordance with some embodiments, the apparatus compares spaced-apart first and second heat sources. A thermally conductive plate is disposed between the first and second heat sources. A thermal interface layer is contactingly disposed between the plate and the first heat source, and has a relatively higher thermal conductivity so that heat generated by the first heat source passes through the thermal interface layer and to the plate. A thermal barrier layer is contactingly disposed between the plate and the second heat source to mechanically support the plate relative to the second heat source. The thermal barrier layer has a relatively lower thermal conductivity to thermally isolate the conductive plate from the second heat source.

Abstract: A system for determining structural characteristics of an electromagnetic energy shielding material during a manufacturing process includes a transmitting antenna device mounted for a reciprocal linear movement across a width thereof, the transmitting antenna device being connected to a source of the electromagnetic energy and operable to transmit waves of the electromagnetic energy through the thickness of the electromagnetic energy shielding material during the reciprocal linear movement. A receiving antenna device is also mounted for the reciprocal linear movement in an alignment with the transmitting antenna device and operable to receive, during the reciprocal linear movement, the waves of electromagnetic energy being absorbed and attenuated by the electromagnetic energy shielding material.

Abstract: A cover for an electronic module that has a housing holding a electrical component and a circuit board for operating the electrical component includes a cover plate having an interior surface and an exterior surface. The cover plate has a dielectric body. A majority of at least one of the interior surface and the exterior surface includes a conductive layer to provide electrical shielding for the cover plate. A connector portion is formed integrally with the cover plate defining a unitary structure. The connector portion includes a plurality of contact channels and a shroud extending from the exterior surface that surrounds a receptacle configured to receive a plug connector therein. Contacts are held in corresponding contact channels that have mating ends positioned in the receptacle and mounting ends exposed beyond the interior surface for mounting to the circuit board.

Abstract: A headphone socket assembly for use in electronic equipment, includes: a headphone socket electrically connected to a circuit board in the electronic equipment; and an electromagnetic shielding device disposed at a periphery of the headphone socket.

Abstract: A method of manufacturing a flexible electronics module includes mounting at least two functional components onto a flexible substrate, forming stretchable electrical interconnects configured to provide connection between the two functional components, and cutting shapes into the flexible substrate to increase an ability of the flexible substrate to stretch and flex, wherein the electrical interconnects to the functional components are placed to avoid the shapes.

Abstract: A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing shielding materials. The shield for circuitry on a circuit board comprising an aluminum material plated with a solderable material, the shield providing electromagnetic interference and radio frequency interference shielding and heat transfer when positioned over a circuit.

Abstract: An apparatus is described herein. The apparatus includes a receptacle to receive a plug to couple a peripheral device to a computing device. The apparatus includes a ground contact of a printed circuit board of the computing device. The apparatus includes a shield communicatively coupled to the ground contact, wherein the shield is to reduce radio frequency interference (RFI) from an interface between the plug and the receptacle.

Abstract: A system and method for enabling automated testing of wireless data packet signal transceiver devices under test (DUTs). One or more DUTs are enclosed inside respective chambers within a shielded enclosure providing electromagnetic shielding for its interior region. Each DUT is powered by an internal power source and its radio frequency (RF) signal port is connected to an external RF signal interface at an outer wall of the shielded enclosure. An anchor at an outer wall of the shielded enclosure enables mechanical engagement with and physical displacement of the shielded enclosure, thereby allowing DUTs to be manipulated using pick and place automation devices for engagement with and connection to automated test equipment. Such test equipment can be assembled into vertically stacked RF signal test stations with which shielded DUT enclosures are engaged by physically mating their respective power and RF signal ports using the pick and place automation device.

Abstract: A heat-dissipating EMI/RFI shield (100) has a shield base (110), a shield cap (130), and a heat sink (150). The shield base has at least one sidewall (112) which defines an open area (113). At least one mounting leg (114) extends from the sidewall and is affixed to a printed circuit board (200). The shield cap has a collar (136) which defines an opening in the shield cap. The shield cap is configured to be mated to the shield base. The heat sink has a boss (156) extending therefrom. The heat sink is configured to be mated to the shield cap. The boss is configured to protrude at least partially into the opening in the shield cap and to make thermal contact with a selected heat generating component (210) on the printed circuit board.

Abstract: A control module includes a circuit board having conductor paths arranged on at least one plane and having at least one rigid, inflexible conductor path section. The control module also includes an electronic control circuit which electrically contacts the conductor paths and has electrical components. The control module also includes a pan-shaped cover part protecting the control circuit. The cover part is arranged over a part of the electronic control circuit and contacts a side of the circuit board in a sealing manner with a flat contact region aligned parallel to the side. At least part of the electronic control circuit is protectively arranged in a housing inner chamber between the cover part and the circuit board, and electrical contacts of the circuit board are provided outside of the housing inner chamber, which is covered by the cover part, to contact electrical components of the control module.

Abstract: To provide a lid body portion with an improved mounting ratio of an electronic device component, an electronic device package and an electronic device including the same. There is provided a lid body portion including a concave portion in which a space portion is formed by a bottom portion and a side plate portion and a flange portion extending from an outer edge portion in an opening portion of the concave portion to the outside, in which a side-plate inner surface as a surface facing the space portion of the concave portion in the side plate portion inclines to the outside of the space portion.

Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers or lids attachable to the frames. Also disclosed are exemplary embodiments of electrically-conductive foam frames for shielding apparatus or assemblies. Further, exemplary embodiments are disclosed of methods relating to making shielding apparatus or assemblies including electrically-conductive foam frames. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.

Abstract: An electronic device includes a metallic body, a circuit substrate having electronic components and wiring conductors, a heat conduction member that absorbs a heat generated by the electronic components, and a heat radiation member provided between the metallic body and the heat conduction member. The heat radiation member includes a heat introduction portion surface-contacted with the heat conduction member, a heat discharge portion surface-contacted with the metallic body, and a heat conduction portion that conducts the heat from the heat introduction portion to the heat discharge portion. The heat conduction portion is provided to be separated from the wiring conductors so as not to electromagnetically couple to the wiring conductors.

Abstract: In use in a battery, a first spiral-wound battery element and associated wiring generates a first magnetic field and a second spiral-wound battery element and associated wiring generates a second magnetic field. The first element, the second element and the wiring may be arranged within a casing so that the first magnetic field is proximate to the second magnetic field and oriented in an opposite polarity. Conveniently, it may be shown that the total magnetic field generated by the battery has significantly lower magnitude than the total magnetic field generated by a conventional battery for the same current drain and same wiring structure.

Abstract: An EMP/HEMP protection device for protecting equipment from electromagnetic pulses. The protection device includes a housing defining a cavity therein and separated into two chambers, a dirty chamber for propagation of signals before filtering of electromagnetic interference, and a clean chamber, isolated from the dirty chamber, for propagation of signals after filtering. A rigid-flex printed circuit board (PCB) is disposed in the cavity for facilitating electrical connections between the chambers. Surface mount electrical components for EMP/HEMP protection are coupled with the rigid-flex PCB. Power and/or data signals are transferred from the dirty chamber to the clean chamber though a wave guide below cutoff (WBC). The WBC is formed from opposing electrical ground planes within a center PCB of the rigid-flex PCB. An electrically conductive and weather sealing gasket is disposed in the cavity of the housing for further EMI isolation.

Abstract: A panel for an electromagnetic shield includes a light-weight, porous, electrically-conductive core layer of metallic foam having generally parallel opposed surfaces and a face sheet having rigidity properties superior to the rigidity properties of the core layer laminated to a surface of the core layer. Alternatively, a panel for a broadband electromagnetic shield includes a composite fiber-reinforced core having opposed surfaces and a layered electrically-conductive composite cover disposed on a surface of the core. The cover includes a first stratum of porous metal exhibiting pronounced low-frequency electromagnetic shielding properties and a second stratum of electrically-conductive elements exhibiting pronounced high-frequency electromagnetic shielding properties secured in an overlapping electrically-continuous relationship to the first stratum, the first stratum being a metallic lattice, and the electrically-conductive elements being a non-woven veil of electrically-nonconductive metal-coated fibers.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.

Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.

Abstract: An electromagnetically shielded enclosure that is portable and lightweight with a double perimeter entry seal. The electromagnetically shielded enclosure can be used for applications such as testing and security and can be scaled from a bench top unit to a large field deployed enclosure. The electromagnetically shielded enclosure has a novel entry seal that eliminates the electromagnetic leakage that is common around the entry areas of such enclosures. The entry seal of the electromagnetically shielded enclosure is made up of a door having a first perimeter closure material and a second perimeter closure material and an enclosure opening having a first perimeter closure and a second perimeter closure where the first perimeter closure material aligns with the first perimeter closure and the second perimeter closure material aligns with the second perimeter closure. This double perimeter entry seal provides for electromagnetic isolation within the electromagnetically shielded enclosure.

Abstract: Methods are provided for creating and operating data centers. A data center may include an information technology (IT) load and a fuel cell generator configured to provide power to the IT load.

Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.

Abstract: An enclosure that has an interior space sized to receive a portable electronic device. The enclosure has a shielding layer that can shield and prevent communications between the interior space and the outside world in a first configuration. In a second configuration, communication is allowed. A signal transfer element is attached to the enclosure housing that can be moved between an isolation configuration and a communication configuration.

Abstract: Provided is an electromagnetic wave shielding sheet including: a substrate that is formed in a nano-web form by spinning a polymer material into fiber strands by a spinning method; a conductive metal layer that is formed on one surface of the substrate for shielding electromagnetic waves; and an adhesive layer formed on the other surface of the substrate, to thereby make a thickness of the electromagnetic wave shielding sheet thin, and improve electromagnetic wave shielding performance.

Abstract: A shielding assembly is used to shield electronic element positioned on a motherboard of an electronic device. The shielding assembly includes a shielding frame fixed to a first surface of the motherboard, a heat dissipating module, and a shielding plate. The heat dissipating module is detachably assembled to the shielding frame. When the heat dissipating module is assembled to the shielding frame, the heat dissipating module and the shielding frame form a shielding space to receive the electronic element. The shielding plate is fixed to a second surface of the motherboard opposite to the shielding frame to completely shield the electronic element.

Abstract: An electromagnetic frequency and non-ionizing radiation harmonizer that may be a film, a sheet or a textile that harmonizes or mitigates electromagnetic frequency radiation from non-ionizing EMF emitting devices while allowing an integration of vibrations or frequency mediums. The harmonizer includes a method of utilizing an electromagnetic frequency radiation and non-ionizing radiation harmonizer that includes the steps of obtaining a film, a sheet or a textile that harmonizes or mitigates electromagnetic frequency radiation from one or more non-ionizing EMF emitting devices and disposing the film, sheet or textile in direct contact or within dose proximity of one or more non-ionizing EMF emitting devices.

Abstract: An optical transceiver that reduces the EMI noise leaked therefrom is disclosed. The optical transceiver provides a metal housing, an optical subassembly, and an electronic circuit. The metal housing includes a first space to install the electronic circuit, and a second space to install the optical subassembly. At least the first space has inner surfaces having a corrugated shape to reduce the resonance of the electromagnetic waves.

Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.

Abstract: An electromagnetic interference (EMI) absorber includes an EMI conductive sheet having first and second portions, the first portion absorbing EMI from an EMI absorption target and the second portion for conducting EMI to an EMI discharge target, and an elastic member covered by the first portion.

Abstract: An electrical component with conductive material(s) that is suitable for use within the electromagnetic field path of a wireless power transfer system. The electronic component includes conductive materials that are sufficiently thin to absorb no more than an acceptable amount of the electromagnetic field, yet thick enough to remain sufficiently conductive to perform the desired electrical function. In embodiments in which the wireless power supply delivers up to 20 watts of power, the conductive materials are not substantially thicker than about 1/10 the skin depth of the material at the anticipated wireless power frequency. The electrical component may be disposed at any location between the wireless power supply transmitter and the remote device receiver. The present invention permits the use of a wide rang of electrical components in the field path, such as a display, a sensor or a component capable of selectively operating as both.

Abstract: A shell of an electronic device includes a resin base formed by injecting molten resin into an injection mold, and a film layer including a base layer attached to the resin base and an electro magnetic interference shielding layer attached to the base layer and opposite to the resin base.

Abstract: An electromagnetic interference (EMI) shield for reducing the electromagnetic interference and substantially uniformly distribute heat is disclosed. The EMI shield comprises a first layer configured to shield EMI and a second layer configured to dissipate heat. The EMI shield further comprises an interface. Some embodiments also provide methods for shielding EMI and uniformly dissipate heat of an electronic component.

Abstract: A shielding apparatus is provided. The apparatus includes a printed circuit board including a plurality of catching parts, a shield member configured to cover the printed circuit board, and at least one shield fastening part provided in the shield member and configured to be one of fastened to and separated from the plurality of catching parts by a resilient force while not protruding.

Abstract: An electromagnetic shield for a storage device comprising a printed circuit board (PCBA) defining a plated through hole defining a generally cylindrical plated surface. The electromagnetic shield may comprise a top surface and sides oriented generally perpendicular to the top surface. One or more of the sides comprise a press-fit connector configured for removable insertion in the plated through hole. The press-fit connector may comprise at least one resilient member defining a longitudinal axis and configured to resiliently bow out in a direction generally perpendicular to the longitudinal axis during insertion and press against the plated surface of the through hole to displace plating material formed thereon to form a gas-tight seal between the at least one resilient member and the plated surface.

Abstract: A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of the package, wherein the metal ring is coplanar with the redistribution line.

Abstract: The present invention concerns a shield shell (70) to be connected to a case made of metal and including a shell main body (71) with a case connecting portion (74) to be connected to the case, a single collective shield connecting portion (72) provided on the shell main body (71) and formed into an elliptical tubular shape, and a plurality of individual-core shield connecting portions (77) provided on the shell main body (71) and formed into a cylindrical shape. The present invention may also concern a shield connector (10) including the shield shell (70), a housing (40) to be held onto the shield shell (70), wires with terminal fittings (20) inserted through the interior of the housing (40), and a single braided wire (90) connected to the single collective shield connecting portion (72) of the shield shell (70).

Abstract: This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.

Abstract: Provided is a magnetic field shield sheet for a digitizer, which blocks an effect of a magnetic field generated from various components of a main body of the portable terminal device and at the same time improves the sensitivity of an electronic pen when a digitizer feature is implemented in the portable terminal device, while minimizing an influence upon a geomagnetic sensor. The magnetic field shield sheet includes: at least one layer thin magnetic sheet made of a nanocrystalline alloy and flake-treated so as to be separated into a plurality of fine pieces; a protective film that is adhered on one surface of the thin magnetic sheet via a first adhesive layer provided on one side of the protective film; and a double-sided tape that is adhered on the other surface of the thin magnetic sheet via a second adhesive layer provided on one side of the double-sided adhesive tape.

Abstract: A housing for an electronic device unit includes a first case and a second case that are formed in a shape of a box with one of respective surfaces thereof being opened and are formed to be a box body. The housing includes an insulating plate that extends from the opening part of the first case to a side of the second case and overlaps with a wall surface of the second case. An engaging convex part is formed on a surface where the insulating plate is overlapped and an engaging hole that engages with the engaging convex part to regulate separation of the first case and the second case is formed. The insulating plate is in a shape in which an edge of the insulating plate spreads with a predetermined width from an opening edge where the first case and the second case are butted and the engaging hole.

Abstract: An electromagnetic wave propagation disruption device with a metamaterial structure including: a plurality of conductive elements arranged on a top face of a substrate; a plurality of interconnection networks electrically interconnecting at least some of these conductive elements, wherein these networks are not electrically connected to each other. At least two of these networks are dimensioned differently to each other, thus involving that distances between interconnected conductive elements are different from one network to another, to generate phase shifts, between the conductive elements interconnected thereby, different from one network to the other. A ground plane with holes is arranged on a bottom face of the substrate and metallic vias are formed in the substrate, each of them including an upper end in contact with a conductive elements and a lower end arranged facing one of the holes of the ground plane, with no electrical contact with the ground plane.

Abstract: This is directed to methods and apparatus for shielding a circuitry region of an electronic device from interference (e.g., EMI). A conductive dam may be formed about a periphery of the circuitry region. A non-conductive or electrically insulating fill may then be applied to the circuitry region within the dam. Next, a conductive cover may be applied above the fill. The cover may be electrically coupled to the dam. The dam may include two or more layers of conductive material stacked on top of one another. In some embodiments, the conductive cover may be pad printed or screen printed above the fill. In other embodiments, the conductive cover may be a conductive tablet that is melted above the fill.

Abstract: In an aspect, in general, an apparatus includes an electrically conductive housing including a first portion and second portion, the first portion including electronic circuitry. An electromagnetic shield separates the first portion and the second portion and is configured to electromagnetically isolate the electronic circuitry of the first portion from the second portion. The electromagnetic shield includes a plurality of electrically conductive walls partially separating the first portion and the second portion, a plurality of electrically conductive spring loaded fingers extending from an end of at least one of the plurality of electrically conductive walls and configured to contact an inner surface of the housing. Together, the plurality of electrically conductive walls and the plurality of electrically conductive spring loaded fingers separate the first portion and the second portion.

Abstract: An electronic control unit is configured in such a way that the groove-shaped concave portion of the second case member includes a first concave portion, in which a groove width at a bottom surface side is narrow, and a second concave portion, in which a groove width at an aperture surface side is wide, and the first concave portion and the second concave portion are linked by an inclined step portion in such a way that a groove width at the step portion is increased in a direction from the bottom surface side to the aperture surface side, and moreover, a tip of the rail-shaped convex portion of the first case member is fitted into the first concave portion at the bottom surface side of the second case member.

Abstract: A shielding system includes a resealable enclosure configured to receive a handheld device. An electroconductive layer is configured to magnetically and/or electrically shield the handheld device.

Abstract: A package includes a die, and a molding material molding the die therein. A metal shield case includes a first metal mesh over and contacting the molding material and the die, a second metal mesh underlying the die, and a Through-Assembly Via (TAV) in the molding material and forming a ring encircling the die. The TAV is electrically connected to the first metal mesh and the second metal mesh.

Abstract: A ground apparatus for connecting components for a portable terminal suppresses the occurrence of noise by grounding a connector. The ground apparatus includes a connector engaging portion at one side of a main board. A connector that includes a grounding portion is inserted into the connector engaging portion. A shield can is disposed to cover at least at part of the main board. The shield can includes a ground structure formed at the connector engaging portion area to enclose the connector and electrically couple the ground structure with the ground portion of the connector.

Abstract: A printed wiring board including a conductive layer, the conductive layer including a network of nanotubes with respective longitudinal axes, the nanotubes arranged such that their longitudinal axes are aligned substantially parallel to one another in a configuration such that electrical current passing through the conductive layer along a first axis substantially parallel to the longitudinal axes of the nanotubes experiences one degree of dissipation, and electrical current passing through the conductive layer along a second axis experiences a higher degree of dissipation.

Abstract: A circuit module includes a substrate that has a substantially rectangular parallelepiped shape and includes a plurality of inner conductive layers, an electronic component disposed on a first main surface of the substrate, an insulating layer disposed on the first main surface of the substrate so as to cover the electronic component, a shielding layer disposed on a surface of the insulating layer, and a ground electrode connected to the plurality of inner conductive layers. At least two of the inner conductive layers are directly connected to the shielding layer.

Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.

Abstract: A shield can is described. In one or more implementations, a shield can includes a frame configured to be installed on a printed circuit board. The shield can also includes a lid configured to be connected to the frame after installation of the frame to form the shield can over one or more components that are installed on the PCB.