Abstract: A magnetic recording head is provided. The magnetic recording head comprises a write pole and a write coil structure configured to generate a magnetic field in the write pole. The write coil structure comprises a substrate layer and a coil material disposed within the substrate layer. The write coil structure is substantially free of photoresist. A method for forming a write coil structure is also provided. The method comprises the steps of providing a substrate layer, forming a photoresist pattern mask over the substrate layer, opening a damascene trench in the substrate layer by reactive ion etching, and disposing a coil material into the damascene trench in the substrate layer.

Abstract: Disclosed is a powder coated with copper (I) oxide, in which copper (I) oxide is adhered well, which can be dispersed well in a stain-proof coating, and which can impart high storage stability to a stain-proof coating.

Abstract: This invention relates to novel calcium phosphate coated implantable medical devices, and electrochemical deposition processes for making same. A process of coating an implantable medical device with a calcium phosphate coating comprising: (a) subjecting a substrate to a surface pretreatment whereby adhesion of the calcium phosphate coating to the substrate is enhanced; (b) immersing the pretreated substrate in an electrolyte comprising calcium and phosphate species; and (c) coating calcium phosphate onto the substrate by electrochemical deposition.

Abstract: The invention is directed to a corrosion protective layer, a process for providing an anodisable metal surface with a corrosion protective layer, a metal surface obtainable by such process, and the use thereof. The invention provides a corrosion protective layer, comprising the metal in oxidised form and an XyOz network, wherein said layer is essentially free of hexavalent chromium, and wherein y is 1-3, z is 1-3, and X is chosen from the group consisting of Si, Al, Ti, Zr, Ce,Mo and Mg.

Abstract: Generally, the process includes depositing a barrier layer on a feature formed in a dielectric layer, decorating the barrier layer with a metal, performing a grafting process, initiating a copper layer and then filing the feature by use of a bulk copper fill process. Copper features formed according to aspects described herein have desirable adhesion properties to a barrier layer formed on a semiconductor substrate and demonstrate enhanced electromigration and stress migration results in the fabricated devices formed on the substrate.

Abstract: The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that contains peroxide; contacting the etched substrate surface with an acidic treatment solution that contains permanganate; activating the treated substrate surface in an acidic activation solution that contains peroxide; contacting the activated substrate surface with an acidic catalytic solution that contains at least a thiophene derivate and at least a sulfonic acid derivate; metallization of the thus treated substrate surface in an acidic galvanic metallization bath.

Abstract: The present invention provides a casting roll of a twin-roll strip caster, including: a nickel plating layer formed on an outer circumferential surface and an end surface of the casting roll; a nickel-boron alloy plating layer formed on the nickel plating layer located on the end surface of the casting roll; and a hard plating layer formed on the nickel plating layer located on the outer circumferential surface of the casting roll and an outer circumferential surface of the nickel-boron alloy plating layer located on the end surface of the casting roll. The present invention improves durability of the casting roll.

Abstract: Partially aromatic polyamide compositions containing an aliphatic polyamide and an alkaline earth metal carbonate have excellent adhesion to metal coatings which are produced by electroless and/or electrolytic plating. Also described is a process for the electroless and/or electrolytic coating of these compositions. The resulting articles are useful as parts in automotive and industrial applications.

Abstract: A high quality, highly adherent layer of a metal and oxygen material such as a transparent electrically conductive oxide material is electro deposited onto a substrate in a solution deposition process. The substrate is activated prior to the electro deposition of the metal and oxygen material thereonto by contacting it with a multidentate activating agent which promotes the adhesion of the metal and oxygen material to the substrate. Use of the activation agent eliminates the need to pre-deposit a “seed” layer of the metal and oxygen material onto the substrate by a vacuum deposition process. Process parameters are controlled so as to result in the deposition of a high quality layer of material which is suitable for use in a back reflector structure of a high efficiency photovoltaic device In particular instances the activation method may be implemented in a continuous, roll-to-roll process.

Abstract: Methods and systems for electrodeposition of Indium, Gallium, or other metals within a metal acoustic resonator chamber are provided, including for electrodeposition of Indium or Gallium as a strike layer on an interior surface of a cavitation chamber. The resultant strike layer affords an accommodating wetting surface for subsequent filling with a liquid metal and performing cavitation therein. In some embodiments, this allows for the use of liquid metal in an acoustic resonator without the damping effects inherent with oxide boundaries or other defects.

Abstract: A flexible dry electrode and the manufacturing method thereof are provided. The electrode has an electroplated uneven surface and at least one hole and is made of porous material.

Abstract: After treated in a solution containing ozone, a plating material is brought into contact with a solution containing at least one of an anionic surface active agent and a nonionic surface active agent, and an alkaline component. Ozone acts to locally break unsaturated bonds on a surface of the plating material to form C—OH bonds or C?O bonds, thereby activating the surface of the plating material, and since a surface active agent 1 is adsorbed thereon, a catalyst 2 is adsorbed on hydrophilic groups of the surface active agent 1 which has been adsorbed on the above-described functional groups. Consequently, no etching treatment is required, and an electroless plated coating having excellent adhesion can be formed without roughening the surface of the resin material.

Abstract: A trivalent chromium electroplating solution in accordance with the present invention contains at least one trivalent chromium salt for electroplating a chromium coating layer on a workpiece. By using the low toxic trivalent chromium to substitute highly toxic hexavalent chromium, an electroplating process of the present trivalent chromium electroplating solution has less pollution.

Abstract: There is provided a metallic glass component with its surface layer having both durability of a film and chromatic color properties, and a method for forming the surface layer. Surface active treatment is performed wherein the surface of the metallic glass component is reacted with a mixed aqueous solution of nitric acid and hydrofluoric acid to remove an oxide film and to provide an anchor bond shape on the surface of a metallic glass component, and electroplating or electroless plating is then performed, to form a plating film on the surface of the metallic glass component. It is thereby possible to form a surface layer of a metallic glass which has both durability and a chromatic color.

Abstract: A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.

Abstract: A method of treating a metal substrate comprise the steps of: anodizing the metal substrate to create pores on the surface of the substrate; and treating the metal substrate by NCVM to form a NCVM coating on the surface of the substrate.

Abstract: A magnetic head suspension having a thin metallic plate as a substrate which is caused to have a new function besides a function as a spring. The magnetic head suspension plural lines for connecting a magnetic head and a control circuit board to each other are formed over a thin metallic plate having a spring property through an insulating layer, and are integrated with the thin metallic plate A metallic pad made of a same metal layer as the plural lines is formed independently of the lines, an opening is made in a portion of the metallic pad to penetrate the insulating layer and then to reach the thin metallic plate, and an electroconductive region is formed into the opening by metal plating, thereby connecting the metallic pad and the thin metallic plate electrically to each other.

Abstract: In a method of producing a temperature sensor including at least one lead wire of a non-noble metal or of an alloy containing a non-noble metal, at first a lead wire is attached to the temperature sensor. An oxide layer is removed from at least one portion of the lead wire, and the at least one portion of the lead wire is chemically gilded immediately after removing the oxide layer.

Abstract: A method of fabricating a nanoporous material, the method comprising the steps of: (i) heating a substrate in the presence of at least one reducing agent and at least one precursor solution; and (ii) cooling the resulting nanoporous material. The nanoporous material may be used for detection of a substrate, for an electrode in a fuel cell, and as a catalyst in the electro-oxidation of an organic species.

Abstract: An electrolytic copper plating process comprising two steps is proposed. The process is particularly suited to plating in very confined spaces. The first step comprises a pre-treatment solution comprising an anti-suppressor that comprises a sulfur containing organic compound, preferably incorporating an alkane sulfonate group or groups and/or an alkane sulfonic acid. The second step comprises an electrolytic copper plating solution based on an alkane sulfonic acid.

Abstract: An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for draining of process solution, both during processing and subsequent cleaning/rinsing of the pad. Drainage occurs continually during processing, cleaning and rinsing, and so is constricted through the end openings relative to the grooves, to prevent wastage. The end openings are sufficiently large, however, to substantially completely drain fluids from the grooves between steps without delaying robotic motions.

Abstract: This invention discloses an electrochemical method for the preparation of single atom tips to replace the traditional vacuum evaporation method. The invented method for preparation of single atom tips includes the following steps: A substrate single crystal metal wire etched electrochemically to form a tip. The surface of the metal tip is cleaned. A small quantity of noble metal is plated on the apex of the tip in low concentration noble metal electrolyte. Annealing in vacuum or in inert gas ambient to diffuse the additional electroplated noble metal atoms and thus a single atom tip is formed on the surface of the substrate. The present invention also discloses the single atom tip so prepared. The single atom tip of this invention has only a very small number of atoms, usually only one atom, at its apex.

Abstract: In one embodiment of the present disclosure a method for forming a PEM fuel cell electrode is provided. The method includes applying a hydrophilic wetting agent on an electrode surface. A catalyst layer is deposited on the wetted electrode surface by pulse electrodeposition, at least a portion of the catalyst penetrating the electrode surface. The electrode surface is heat treated.

Abstract: In one embodiment of the invention, an electroplating aqueous solution is disclosed. The electroplating aqueous solution includes at least two acids, copper, at least one accelerator agent, and at least two suppressor agents. The at least one accelerator agent provides an acceleration strength of at least about 2.0 and the at least two suppressor agents, collectively, provide a suppression strength of at least about 5.0. Methods of making and using such an electroplating aqueous solution are also disclosed.

Abstract: Providing a copper plating method with which to precipitate copper-plated membranes that are uniform and flat, and that have good mirror gloss even when relatively thin copper plated membranes are formed. A copper plating method wherein the object to be plated and a pre-treatment solution in which bromide compound ions are contained are brought into contact and copper is precipitated by means of electrical plating using a copper plating solution.

Abstract: A surface, especially a galvanically molded transport cylinder sleeve, has a surface structure for contacting printing material, in particular sheets of paper. The surface structure includes first structural elevations spaced apart from each other by a minimum distance A1 and having a height B1 and second structural elevations spaced apart from each other by a minimum distance A2 and having a height B2 with B2<B1. A ratio between the distances A1 and A2 ranges between 10:1 and 1:1. The surface has support areas for supporting the printing material. The printing material is prevented from contacting a planar horizontal surface between the support areas of first, higher structural elevations due to second, lower structural elevations with support areas thereof that are formed between the first, higher structural elevations. A machine for processing printing material and a method for producing areas with a surface structure, are also provided.

Abstract: A disclosed form of mechanically assisted electroplating leads to a flat, thin, overburden. In one example, an accelerator is deposited on a copper surface and mechanically removed in a simplified CMP-like apparatus. The wafer is then plated in an electrolyte containing little or no accelerating additives.

Abstract: An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.

Abstract: A method for manufacturing a heat resistant resin film with a metal thin film is configured to include the steps of: biasing a conductive material to one surface of the heat resistant resin film; and applying electrolytic plating to the heat resistant resin film while using the conductive material biased to the one surface of the heat resistant resin film as an electrode, so as to form a metal thin film on the heat resistant resin film.

Abstract: A trivalent chromium electroplating solution in accordance with the present invention contains at least one trivalent chromium salt for electroplating a chromium coating layer on a workpiece. By using the low toxic trivalent chromium to substitute highly toxic hexavalent chromium, an electroplating process of the present trivalent chromium electroplating solution has less pollution.

Abstract: This invention relates to a method of anodising magnesium material which includes anodising the magnesium while it is immersed in an aqueous electrolyte solution having a pH above 7, and in the presence of a phosphate, the electrolyte solution also containing a sequestering agent. The method may further include the provision of a plasma suppressing substance within the electrolyte solution. Furthermore, the electrolyte solution may also preferably include a tertiary amine such a TEA, and the current passed through the electrolyte solution may preferably be a straight DC current.

Abstract: A pre-treating solution for electroplating magnesium alloy surface contains copper ions, a complexing agent and an additive, wherein the complexing agent is selected from potassium sodium tartrate, potassium tartrate, sodium tartrate, tartaric acid, and dissolvable salts derivative from tartaric acid and the additive is selected from sodium phosphate, sodium hypophosphite, phosphoric acid and dissolvable salts derivative from phosphoric acid or hypophosphite acid. The magnesium alloy is dipped in the pre-treating solution and electroplated with a copper coating layer. Then, the magnesium alloy is further dipped in a copper sulfate solution for thickening the copper coating layer and lastly coated with an anti-corrosion metal layer. Thereby, magnesium alloy has excellent anti-corrosion and anti-wearing efficiency and varnish appearance. Moreover, the pre-treating solution contains no cyanide and thus is low toxic and safe to operator during electroplating and to environment after discharging.

Abstract: Disclosed is a method of preparing a copper electroplating layer having high adhesion to a magnesium alloy, which is advantageous because the usability of the magnesium alloy, having the highest specific strength among actually usable metals, can be increased through the development of a process of forming a uniform copper plating layer upon electroplating of the magnesium alloy. The method of preparing a copper electroplating layer having high adhesion to a magnesium alloy of this invention is characterized in that the magnesium alloy is pretreated with a plating pretreatment solution to form a film for electroplating, serving as a magnesium alloy pretreatment layer, exhibiting a uniform current distribution, which is then electroplated with copper to form the copper plating layer. According to this invention, through the pretreatment of the magnesium alloy, the adhesion of the copper plating layer to the film for electroplating formed on the magnesium alloy can be increased.

Abstract: A roll for metal rolling has a roughened surface formed by an electrolytic treatment in an electrolytic solution while using the roll as an anode. When the roll is used to emboss an aluminum plate, it is possible to obtain an aluminum plate with an uneven structure having regulated positions of levels of peaks and a larger number of the peaks. A presensitized plate formed by use of the aluminum plate as a support has excellent printing performances particularly in the number of printed sheets and sensitivity.

Abstract: A conductive diamond electrode including an electrode substrate comprising a material selected from the group consisting of a valve metal and an alloy based on the valve metal, at least a surface of the metal or alloy having been subjected to plasticization processing, or heat treatment in vacuum or inert atmosphere; and a conductive diamond film formed on the plasticization processed surface of the electrode substrate. When the electrode substrate is subjected to plasticization processing and heat treatment, peeling resistance of the conductive diamond film is improved, thereby an electrode life is prolonged.

Abstract: The invention relates to a method for electroplating a metal deposit on electroplatable portions of composite articles that have both electroplatable and non-electroplatable portions. In this method, the invention is an improvement which comprises treating the articles prior to electroplating to provide the electroplatable portions with enhanced electroplatability. This is achieved by passing a current though a near neutral pH solution that contains a conductivity agent and a buffer to reduce or remove surface oxides and contaminants from such portions without deleteriously affecting the non-electroplatable portions of the articles. When the treated surfaces are subsequently subjected to metal plating, a uniform, smooth metal deposit is achieved.

Abstract: A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating.

Abstract: Disclosed is a method of manufacturing an electronic device, comprising forming a concave portion on the surface of a base member, forming an electrically conductive seed layer on that surface of the base member on which a plated film is to be formed, and applying an electrolytic plating treatment with the seed layer used as a common electrode under the condition that a substance for accelerating the electrolytic plating is allowed to be present in the concave portion of the base member in an amount larger than that on the surface of the base member to form a plated film.

Abstract: The invention concerns an anode for gas evolution in electrochemical applications comprising a titanium or other valve metal substrate characterized by a surface with a low average roughness, having a profile typical of a localized attack on the crystal grain boundary. The invention further describes a method for preparing the anodic substrate of the invention comprising a controlled etching in a sulfuric acid solution.

Abstract: A composition and process for electroplating a conductive metal layer onto the surface of a non-conductive material is disclosed. The composition and process utilizes an obvious dispersion traditional carbon black particles and highly conductive carbon black particles. The mixture of carbon blacks provides optimum dispersion and electroplating properties.

Abstract: A method for producing an array of oriented nanofibers that involves forming a solution that includes at least one electroactive species. An electrode substrate is brought into contact with the solution. A current density is applied to the electrode substrate that includes at least a first step of applying a first substantially constant current density for a first time period and a second step of applying a second substantially constant current density for a second time period. The first and second time periods are of sufficient duration to electrically deposit on the electrode substrate an array of oriented nanofibers produced from the electroactive species. Also disclosed are films that include arrays or networks of oriented nanofibers and a method for amperometrically detecting or measuring at least one analyte in a sample.

Abstract: The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.

Abstract: The invention relates to a composition for treating magnesium alloys aimed at improving the resistance thereof to corrosion. The composition is an aqueous solution with a pH ranging between 7 and 10, containing a niobium salt, hydrofluoric acid, and optionally a zirconium salt, phosphoric acid, and boric acid. The alloy is treated in an electrochemical cell in which said alloy acts as an anode. The cell contains an inventive composition at a temperature between 20° C. and 40° C. as an electrolyte. An initial voltage which is sufficient to create a current density between 1.5 and 2.5 A/dm2 is applied to the cell, whereupon the voltage is progressively increased to a level ranging between 240 and 330 V in order to maintain the initial current density.

Abstract: Apparatus and method for treating a surface of a substrate for electrolytic or electroless plating of metals in integrated circuit manufacturing. In one embodiment the method includes forming a barrier layer on a substrate. A metal-seed layer is then formed on the barrier layer. The method continues by performing in situ surface treatment of the metal-seed layer to form a passivation layer on the metal-seed layer. In another embodiment of a method of this invention, a substrate is provided into an electroplating tool chamber. The substrate has a barrier layer formed thereon, a metal seed layer formed on the barrier layer and a passivation layer formed over the metal seed layer. The method continues by annealing the substrate in forming gas to reduce the passivation layer. A conductive material is deposited on the substrate using an electrolytic plating or electroless plating process.

Abstract: The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a water-soluble polymer; treating the substrate surfaces with a permanganate solution; treating the substrate surfaces with an acidic aqueous solution or an acidic microemulsion of aqueous base containing at least one thiophene compound and at least one alkane sulfonic acid selected from the group comprising methane sulfonic acid, ethane sulfonic acid and ethane disulfonic acid; electrolytically metallizing the substrate surfaces.

Abstract: A method of manufacturing electronic devices, in particular, but not exclusively, semiconductor devices, and apparatus for carrying out such a method, in which method wafers 1, which are provided at a surface 2 with a material 3 to be removed, are subjected, while being divided into successive batches, to a wet treatment in a bath 4 containing a solution 5 of an active component in a solvent. The successive batches of wafers 1 are immersed in the solution 5 at first time intervals during the wet treatment of the successive batches, which first time intervals each consist of a processing period during which the material 3 is removed from the surface 2 of the wafers 1, thereby forming ionic components, and a waiting period following the removal of the wafers 1 from the bath 4 at the end of the processing period.

Abstract: The present invention relates to a method for activation of a cathode comprising at least a cathode substrate wherein the cathode is cleaned by means of an acid, the cleaned cathode is coated with at least one electrocatalytic coating solution, drying the coated cathode until it is at least substantially dry, and thereafter contacting the cathode with a solvent redissolving precipitated electrocatalytic salts or acids formed on the cathode, originating from the electrocatalytic solution, to form dissolved electrocatalytic metal ions on the cathode surface, so that said electrocatalytic metal ions can precipitate as metals on the cathode. The invention also comprises a cathode obtainable by the method and the use of an activated cathode in an electrolytic cell for producing chlorine and alkali hydroxide.

Abstract: A nanomachined and micromachined electrode (10) is disclosed that is produced by providing a layer of aluminum (11) positioned upon a conductive substrate (12), anodizing the layer of aluminum to produce a layer of aluminum oxide (13) having an array of pores (14), depositing a sacrificial metal (17) within the pores of the aluminum oxide layer, etching the aluminum oxide layer so as to leave an array of sacrificial metal rods (18), depositing a layer of electrode material (19) between the array of sacrificial metal rods, and etching the sacrificial metal rods so that a layer of copper remains having an array of pores (20) where the sacrificial metal rods had existed. The layer of copper is the electrode (10).

Abstract: Medical devices that include oxidizable portions can be plated after a two step activation process that includes successive applications of two aqueous solutions of ammonium bifluoride. Once plated, such materials can be soldered using conventional solders and fluxes. Medical devices can be assembled by soldering together plated materials. Oxidizable materials can be plated with radiopaque materials to yield medical devices that are more visible to fluoroscopy.

Abstract: A flexible printed board production method which ensures higher adhesion of copper, excellent workability, easier continuous production and lower costs. The flexible printed board production method comprises the steps of: treating a surface of a polyimide resin film with plasma or short wavelength ultraviolet radiation; activating the treated surface with the use of an alkali metal hydroxide; electrolessly plating the surface of the polyimide resin film with nickel; and electroplating the electrolessly plated surface of the polyimide resin film with copper, whereby a copper layer is formed on the surface of the polyimide resin film.