Abstract: A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brightness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.

Abstract: Disclosed is a method of manufacturing an assembly of components joined by brazing, comprising the steps of: (i) forming the components of which at least one is made from a multi-layered brazing sheet product, the multi-layered brazing sheet product comprising a core sheet (a) having on at least one surface of the core sheet an aluminium clad layer (b), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, a layer (c) comprising nickel on the outer surface of the aluminium clad layer, and a layer (d) comprising zinc or tin as a bonding layer between the outer surface of the aluminium clad layer and the layer comprising nickel; (ii) forming at least one other component of a metal dissimilar to the core sheet of the multi-layered brazing sheet product and selected from the group consisting of titanium, plated titanium, coated titanium, bronze, brass, stainless steel, plated stainless steel, coated stainless steel, low-carbon steel, plated

Abstract: An electroplating system (30) and process makes electrical current density across a semiconductor device substrate (20) surface more uniform during plating to allow for a more uniform or tailored deposition of a conductive material. The electrical current density modifiers (364 and 37) reduce the electrical current density near the edge of the substrate (20). By reducing the current density near the edge of the substrate (20), the plating becomes more uniform or can be tailored so that slightly more material is plated near the center of the substrate (20). The system can also be modified so that the material that electrical current density modifier portions (364) on structures (36) can be removed without having to disassemble any portion of the head (35) or otherwise remove the structures (36) from the system. This in-situ cleaning reduces the amount of equipment downtime, increases equipment lifetime, and reduces particle counts.

Abstract: Disclosed is a method of reducing whisker formation in tin films by the use of a thin metal undercoat. Also disclosed are structures having tin films with substantially reduced whisker formation.

Abstract: A method of depositing a metal coating (28) on the interconnect (26) of a tubular, hollow fuel cell (10) contains the steps of providing the fuel cell (10) having an exposed interconnect surface (26); contacting the inside of the fuel cell (10) with a cathode (45) without use of any liquid materials; passing electrical current through a contacting applicator (46) which contains a metal electrolyte solution; passing the current from the applicator (46) to the cathode (45) and contacting the interconnect (26) with the applicator (46) and coating all of the exposed interconnect surface.

Abstract: A process and apparatus for supplying a soluble metal compound to an electrolyte solution uses a powder wetting device in a loop from a working tank. The powder wetting machine supplies the powdered metal compound directly into the electrolyte solution which rapidly dissolves to replenish the electrolyte compound during the treating process. The process and apparatus are particularly suitable for replenishing the metal salts consumed during an electroplating process.

Abstract: The invention discloses a method for coating foil comprised of nickel or a nickel alloy by sputtering a layer comprised of a metal compound on the foil in a vacuum. The foil is treated in an argon plasma with a pressure of 1031 3 to 10−2 millibar, for a variable time with a variable rate, and with energy of the plasma ions. A chromium oxide layer or a layer containing chromium oxide is successively sputtered by means of a reactive magnetron atomizing of at least one target comprised of chromium or an alloy containing chromium. The layer is sputtered with at least one atomization source in an argon-oxygen mixture with a pressure of 10−3 to 10−2 millibar. The operating point is constantly maintained in given boundaries and the foil is bonded in a defined thermal contact with a thermal buffer when the foil is being coated. The foil is coated until a given interference color pertaining to an interference of a first or second order is reached on the foil.

Abstract: A mold for a microlens includes a substrate at least a portion of which is electrically conductive, such as an electrically-conductive substrate or a substrate with an electrode layer, an insulating mask layer formed on the substrate and including an opening or plural openings, and a plated layer electroplated in the opening and on the mask layer. A first condition that a diameter or width (&phgr;) of the opening has a relation of &phgr;≦0.35R, wherein (R) is a radius of curvature of the plated layer right above the opening, or a second condition that the diameter or width (&phgr;) of the opening is &phgr;≦10 &mgr;m, is met.

Abstract: A method for galvanically depositing nickel, cobalt, nickel alloys or cobalt alloys in a galvanic bath includes using electrolytes containing nickel compounds or cobalt compounds. At least one anode and at least one cathode of the bath are subject to periodic current pulses. The IA/IC ratio of the anode current density IA to the cathode current density IC is selected to be greater than 1 and smaller than 1.5. The charge ratio QA/QC=TAIA/TCIC of the charge QA, transported during an anode pulse of duration TA, to the charge QC transported during a cathode pulse of duration TC , is between 30 and 45. A bath for carrying out the method may have contoured anodes, current restrictors, a cleaning device for the electrolyte, and a circulating device with recycling of the electrolyte through nozzles.

Abstract: Disclosed are methods for depositing a conductive layer on a substrate having a barrier layer and/or a dielectric layer. Such methods are particularly suitable for depositing an electroplated copper layer on a substrate having small apertures, and preferably very small apertures.

Abstract: An article includes a colored electroplated metallic coating comprising both nickel and zinc, on an underplate of copper, brass, bright nickel or matt nickel, supported on a metallic or plastic substrate, various colors in the electroplated coating being exemplified. The electrolyte contains Ni2+, Zn2+, (NH4)+ and thiocyanate ions in specified concentrations, but no oxidative ion, color variation of the coating being achieved exclusively by variation of current density, time of the electroplating step and current quantity, provided that the current density at the cathode underplate is within the range of 0.01 to 0.5 A/dm2.

Abstract: The present invention is applicable to composite particles for composite dispersion plating used for forming a self-lubricating composite dispersion coating and a method of plating using such composite particles as well as a plating (coating) using the same. The purpose of the invention is to obtain a composite particle for composite dispersion plating which is comprised of a particle with an excellent capability of reducing the friction and a low or very low specific gravity, and a method of plating using such composite particles. In this invention, each of the composite particles includes a friction-reducing mother or core particle (1) encapsulated with shell particles (2) comprised of the same components as a base metal of a composite dispersion plating bath (5). This provides a composite particle for composite dispersion plating which is comprised of a particle with an excellent capability of reducing the friction and a low or very low specific gravity.

Abstract: A continuous layer of a metal is electrodeposited onto a substrate having both hydrodynamically inaccessible recesses and hydrodynamically accessible recesses on its surface by a twostep process in which the hydrodynamically inaccessible recesses are plated using a pulsed reversing current with cathodic pulses having a duty cycle of less than about 50% and anodic pulses having a duty cycle of greater than about 50% and the hydrodynamically accessible recesses are then plated using a pulsed reversing current with cathodic pulses having a duty cycle of greater than about 50% and anodic pulses having a duty cycle of less than about 50%.

Abstract: A smooth layer of a metal is electroplated onto a microrough electrically conducting substrate by immersing the substrate and a counterelectrode in an electroplating bath of the metal to be electroplated and passing a modulated reversing electric current between the electrodes. The current contains pulses that are cathodic with respect to said substrate and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle less than about 50% and said anodic pulses have a duty cycle greater than about 50%, the charge transfer ratio of the cathodic pulses to the anodic pulses is greater than one, and the frequency of said pulses ranges from about 10 Hertz to about 12000 Hertz. The plating bath is substantially devoid of levelers and may be devoid of brighteners.

Abstract: Disclosed is an Ni-plated layer of biaxial texture, which is formed by electroplating. In the Ni-plated layer,peaks measured on a &thgr;-rocking curve have a FWHM of 7° or less in terms of the misorientation on the c-axis; and peaks measured on &phgr;-scan have a FWHM of 21° or less in terms of the misorientation on the plane formed by the a-axis and the b-axis. Also, a process of electroplating a Ni layer are disclosed. The process comprises forming a Ni-plated layer of biaxial texture under a magnetic field by electroplating and subjecting the Ni-plated layer to thermal treatment to develop the biaxial texture. This electroplating process is expected to give a significant contribution to the development of the electroplating technology and to replace the vacuum deposition used for the preparation of thin film magnetic materials or thin film piezoelectric materials.

Abstract: A process for the electrolytic deposition of a metal, preferably copper or an alloy of copper, directly onto a barrier layer coated on a dielectric layer. The process is advantageous because it electrolytically deposits metal in a pattern that is either the duplicate of a first conductive pattern under the dielectric or the inverse image of the first conductive pattern, depending on the first conductive pattern shape. Thus, metal is deposited on the barrier layer duplicating a first conductive pattern under the dielectric layer when the first pattern is a serpentine pattern and the metal deposits in the spaces between the conductive lines of a first conductive pattern of a discrete passive element such as a spiral.

Abstract: The invention relates to use of capture compounds such as a crown ether to facilitate selected compositions and processes employed in manufacture of electronic packaging devices such as printed circuit boards, semiconductor integrated circuit systems, multichip modules, lead frames and other interconnection devices, flat panel display substrates, and the like.

Abstract: The present invention describes a method of producing gold coating on a workpiece having a palladium surface, having the steps of: a) making an aqueous solution containing at least one compound selected from the group of compounds containing gold(I) and gold(III) ions and additionally at least one organic compound selected from the group consisting of formic acid, aromatic carboxylic acids having the chemical formula: where R1, . . . , R4=H, alkyl, alkenyl, alkynyl, OH, and the salts, esters or amides of these compounds; b) adjusting the pH of the solution to 1 to 6 using pH adjusting agents; and c) bringing the workpiece into contact with the solution such that gold coating is plated onto the palladium surface.

Abstract: Excessive evolution of hydrogen in electrolytic deposition of metals on a cathode substrate can be controlled by using a pulsed reverse current. Reverse current pulses interposed between the forward current pulses consume at least some of the nascent hydrogen and prevent the local pH at the cathode surface from becoming excessively alkaline. Control of hydroxide ion concentration by pulsed reverse current alleviates problems caused by reaction of metal-bearing-ions with hydroxide ions generated near the cathode by evolution of hydrogen. The method is useful in depositing functional chromium coatings on electrically conductive substrates from plating baths comprising aqueous solutions of trivalent chromium salts. In such a method the current comprises forward pulses having a duty cycle of from about 50% to about 90% and reverse pulses having a duty cycle of from about 5% to about 30%, and a frequency of from about 5 Hz to about 700 Hz.

Abstract: A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.

Abstract: A process for controlling the micelle size distribution of an alkylene oxide dispersion in a nickel-plating electrolyte is used to maintain the electrolyte in a condition suitable for producing nickel coatings having a uniform satin finish in which finish characteristics such as roughness depth are maintained within desired limits. The process involves steps of removing a portion of the electrolyte from the electroplating bath, filtering the alkylene oxide from the electrolyte removed from the electroplating bath, adding alkylene oxide to the electroplating bath, and returning the filtered electrolyte to the electroplating bath. The process removes larger alkylene oxide micelles from the electrolyte and replaces them with smaller micelles to maintain a desired micelle size distribution.

Abstract: The present invention relates to the electrodeposition of transition metal and rare earth alloys from aqueous solutions to form thin films. The present invention which comprises the preparation of suitable mixtures of water soluble compounds containing the desired transition metal (TM) and rare earth (RE) elements, establishing appropriate bath conditions and applying specific current densities across the bath solution to cause a film with the desired properties to be deposited on a target substrate.

Abstract: An apparatus and method are provided for coating particles in a rotating container. A cathode forms an electrically conductive inner surface of a side wall of the container. An anode is positioned relative to the cathode so as to permit both the cathode and the anode to be immersed together in an electrically conductive fluid. A motor is connected to the container and arranged to cause the container to rotate so as to generate a centrifugal force. Particles are placed in the container, the container is filled with the electrically conductive fluid, and electrical current is caused to pass from the cathode to the anode through the electrically conductive fluid while the container is rotated. The particles rest against the electrically conductive inner surface of the side wall of the container while the electrical current passes from the cathode to the anode, so as to result in deposition of a coating material from the electrically conductive fluid onto the particles.

Abstract: A process for non-continuous galvanization of a metal object with a Zn—Al alloy including the steps of pre-coating the object with a metallic layer of sufficient thickness to protect the object from oxidation and yet sufficiently thin to permit the pre-coating to substantially completely react with or dissolve in the molten Zn—Al bath, subjecting the precoated object to a surface activation treatment by immersing it in hydrochloric acid and thereafter allowing the surface to dry with a protective coating of a chloride salt, and thereafter immersing the object in the Zn—Al bath.

Abstract: A process and apparatus for supplying a soluble metal compound to an electrolyte solution uses a powder wetting device in a loop from a working tank. The powder wetting machine supplies the powdered metal compound directly into the electrolyte solution which rapidly dissolves to replenish the electrolyte compound during the treating process. The process and apparatus are particularly suitable for replenishing the metal salts consumed during an electroplating process.

Abstract: The present invention provides a porous electrode used for a conductive material-filled polymer composite. At least one surface of the porous electrode is an open porous structure, which includes a plurality of macropores and micropores randomly distributed and interconnected with each other. The conductive material-filled polymer composite includes a polymer substrate and conductive particles filled therein. When the surface of the open porous structure of the porous electrode is bonded with the conductive material-filled polymer composite, the conductive particles in the conductive material-filled polymer composite can be trapped in the macropores of the porous structure, and the polymer substrate in the conductive material-filled polymer composite can be immersed into the micropores of the porous structure. This enables a better direct contact between the conductive particles and the porous electrode.

Abstract: Deposition of metal in a preferred shape, including coatings on parts, or stand-alone materials, and subsequent heat treatment to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25° C. This technique involves depositing a material in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment. This moderate heat treatment differs from other commonly employed “stress relief” heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. Coating and heat treating a spring-shaped substrate provides a resilient, conductive contact useful for electronic applications.

Abstract: A process for electroplating metal on a resistive substrate and the article of manufacture produced therefrom are disclosed. The metal layer is electroplated onto the resistive substrate in an electroplating bath having a polarization parameter &xgr; less than approximately 10 such that the metal layer is of substantially uniform thickness. The polarization parameter &xgr; of less than approximately 10 for the electroplating bath can be achieved by numerous means, such as by providing a low metal ion concentration in the electroplating bath or by adding one or more additives to the electroplating bath. The present invention may be used with a variety of metals and resistive substrates.

Abstract: Thin, light weight bipolar plates for use in electrochemical cells are rapidly, and inexpensively manufactured in mass production by die casting, stamping or other well known methods for fabricating magnesium or aluminum parts. The use of a light metal, such as magnesium or aluminum minimizes weight and simultaneously improves both electrical and thermal conductivity compared to conventional carbon parts. For service in electrochemical cells these components must be protected from corrosion. This is accomplished by plating the surface of the light weight metal parts with a layer of denser, but more noble metal. The protective metal layer is deposited in one of several ways. One of these is deposition from an aqueous solution by either electroless means, electrolytic means, or a combination of the two. Another is deposition by electrolytic means from a non-aqueous solution, such as a molten salt.

Abstract: An aqueous solution for the reductive deposition of metals comprising, besides water, (A) a phosphine of the general formula (1)  in which R1, R2, and R3 denote lower alkyl groups, at least one of which being hydroxy-or amino-substituted lower alkyl group, and (B) a soluble compound of a metal or a compound of a metal solubilized through the formation of a soluble complex by said phosphine.

Abstract: A method and a device are described for the repair and/or touch-up of small surface flaws in large press plates or endless bands of sheet metal, especially steel sheet, having a structured metal coating and a hard-chrome plating for surface-embossing plastic-coated wooden or laminated panels. Each flaw is repaired by surrounding it with a mask, pickling, and galvanically metallizing it. For a simplified and cost-favorable repair or touch-up, a galvanic solution is applied to the masked and pickled flaw for microgalvanizing damaged areas smaller than 14 mm.sup.2 by dipping the tip of an electrode into the solution. The pickled flaw can first be provided with a thin, microgalvanically applied nickel layer, and it is then copper-plated. The copper build-up is restructured by hand, if necessary, and covered with a hardened cobalt layer.

Abstract: Grain oriented electrical steel sheet with a very low iron loss and a method for producing the same, wherein the surface of the iron substrate of the grain oriented electrical steel sheet is subjected to an enhancement treatment of crystal grain orientation or surface smoothing to a mean roughness of about 0.20 .mu.m or less, electroplating a chromium plating layer on the substrate with heterogeneous growth, and applying a tension coating film to the plating layer.

Abstract: A lead frame material, which can be provided with an etching stop layer without requiring a troublesome process such as vapor deposition and has an excellent heat-resistance, is obtained by forming a nickel-phosphorus alloy layer (B) of 1.6 to 10 .mu.m thickness containing 0.3 to 1.0 wt % of phosphorus on a copper or copper alloy layer (A) of 35 to 300 .mu.m thickness, and forming an optional copper layer (C) of 0.2 to 30 .mu.m thickness on the nickel-phosphorus alloy layer (B).

Abstract: A process for depositing a conformable nickel coating on a lead frame is disclosed. The metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least about 82 degrees with a bend radius of about 100 .mu.m to about 300 .mu.m. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 .mu.m. The conformable nickel coating is formed using an electroplating bath containing nickel as a nickel complex, a nickel salt, a buffer and a fluorochemical wetting agent.

Abstract: An apertured and porous metal article can find use, for example, in diaphragm or membrane electrolysis cells. The article may comprise a thin and flexible metal foam of small pores which, typically, has been perforated with large apertures. The article may also be provided with an electrocatalytic coating. It can be in substantial physical contact with a membrane or diaphragm separator used in the cell for separating anode and cathode members or compartments. There is also disclosed the preparation of the article and an electrolysis cell utilizing the resulting apertured and porous metal article.

Abstract: Disclosed is a nickel electroplating bath or a nickel alloy electroplating bath used for electroplating a conductor partially masked with an organic high-molecular resist layer, wherein the nickel electroplating bath contains a water-soluble nickel salt, and the nickel alloy electroplating bath contains both a water-soluble nickel salt and a water-soluble salt of a metal capable of being alloyed with nickel. The above electroplating bath is incorporated with an electrical conductive salt containing at least one cation selected from the group consisting of an ammonium ion, magnesium ion, calcium ion, aluminum ion, and barium ion. Further, the electrical conductive salt substantially does not contain a sodium ion and a potassium ion as cations. Such an electroplating bath is capable of electroplating a conductor partially masked with an organic high-molecular resist layer without floating of the resist layer.

Abstract: A method of electrodepositing nickel and nickel alloys on a metal surface of a substrate wherein a Watts or other nickel deposition electrolyte is used as the bath in the presence of a conventional base brightener. According to the invention, an ethylene-oxide adduct or propylene-oxide adduct or ethyleneoxide/propylene-oxide adduct is added in an amount less than 5 mg/l and the deposition is carried out at 40 to 75.degree. C. and the concentration of the adduct and the temperature are so selected that during operation and with visual inspection there is no cloudiness nor any diffuse scattering of light incident upon the bath.

Abstract: A method for electroplating a silicon substrate in manufacturing a semiconductive device is provided. Electroplating process chamber contacts or fingers used in positioning a silicon substrate or wafer during an electroplating process are plated with a metal layer to prevent oxidation of the contacts. Oxidation of the contacts may result in increased and varying resistance of the contacts and thus nonuniform plating of the silicon wafer and possibly even deplating of a seed layer. A 20 mA/cm.sup.2 current is applied to the contacts which are immersed in an electrolyte solution before loading a silicon wafer. A silicon wafer is then loaded into the electroplating process chamber containing the electrolyte solution. The preplating of the contacts enables the formation of a uniform metal layer on the silicon substrate. Additionally, voltage then may be applied to the contacts after unloading the silicon wafer to reduce oxidation.

Abstract: The subject of the invention is a process for conditioning the copper or copper-alloy external surface of an element of a mold for the continuous casting of metals, of the type including a step of nickel plating of said surface and a step of nickel removal therefrom, wherein:a preparation of said surface, comprising in succession an operation of cleaning said bare surface, an operation of pickling said bare surface in an oxidizing acid medium and an operation of brightening said bare surface, is carried out;then, an operation of nickel plating of said bare surface is carried out by electroplating, by placing said element as the cathode in an electrolyte consisting of an aqueous nickel sulfamate solution containing from 60 to 100 g/l of nickel;then, after said element has been used, an operation of partially or completely removing the nickel from said surface electrolytically is carried out, by placing said element as the anode in an electrolyte consisting of an aqueous nickel sulfamate solution containing fro

Abstract: An article is coated with a multilayer coating comprising a semi-bright nickel layer deposited on the surface of the article, a bright nickel layer deposited on the bright nickel layer, a palladium strike layer deposited on the semi-bright nickel layer, a ruthenium layer deposited on the palladium strike layer, a refractory metal, preferably zirconium, strike layer deposited on the ruthenium layer, and a refractory metal compound, preferably zirconium nitride, deposited on the refractory metal strike layer. The coating provides the color of polished brass to the article and also provides abrasion and corrosion protection.

Abstract: This invention is predicated on the discovery by the present applicants that boric acid in conventional nickel plating baths is responsible for excessive lateral growth in the electroplating of nickel on nickel ferrite substrates. While nickel baths without boric acid do not yield acceptable electrodeposits, the boric acid interacts with the ferrite substrate to cause excessive lateral growth. Applicants further discovered that by eliminating the boric acid and adding another acidic plating buffer such as citric acid, one can obtain isotropic nickel plating and produce a wire-bondable surface.

Abstract: An electrolytic cell comprising bipolar electrodes is employed for electrochemical deposition of copper, zinc, lead, nickel or cobalt. An interior space is provided between the cathode side and the anode side of a bipolar electrode. The electrolyte can flow substantially without an obstruction through the interelectrode space between adjacent electrodes. The current densities in the interelectrode space amount to 800 to 8000 A/m.sup.2. Gas is evolved on the anode side of the bipolar electrodes and causes liquid to flow along the anode side. In the middle of the height of the anode side that liquid flow has a vertical component having a velocity of 5 to 100 cm/second. Electrolyte solution flows from the upper edge portion of the anode side to a return flow space, in which the solution flows downwardly. From the return flow space the solution is returned to the lower portion of the interelectrode space.

Abstract: A porous nickel electrode substrate having a central high conductivity core sandwiched between two layers of porous conductive material such as nickel foam or nickel felt. The porous conductive material is plated with nickel and then sintered. By selectively controlling the plating of nickel on the porous material, variable conductivities may be designed into the substrate.

Abstract: A plating liquid for forming a nickel plating layer containing a dispersed substance and phosphorus having 1.0 g/l or more of sodium is desirably utilized in the high speed plating process. Other important aspects of the invention include a plating method using the aforementioned plating liquid, characterized in that a voltage is impressed while permitting the plating liquid to flow between a surface to be plated of a workpiece at a plating liquid flow rate of 1.0-3.0 m/sec and an electric current density of 20-200 A/dm.sup.2, and an engine cylinder having a plated interior surface characterized in that the plating layer of the cylinder is formed by a high speed plating treatment using the aforementioned plating liquid.

Abstract: Process for the electrolytic deposition of composite nickel onto the face of a part of a motor vehicle, in particular the bore of a casing or engine block of an internal combustion engine comprising at least three successive stages, the first being an electrochemical activation stage where the part is brought to anodic polarity in a bath containing a halogenated acid salt of nickel, the second being a stage of superactivation of the surface and the third being a stage of electrolytic deposition of a nickel layer containing particles of solid substances where the part is brought to cathodic polarity in a nickel-plating bath containing a charge of solid particles of which the diameter is advantageously between 0.5 and 5 microns and which can be of silicon carbide or any other hardening element, optionally mixed with particles of graphite.

Abstract: A method of making, for cathode ray tubes and the like, an inner shield material that has superior magnetic characteristics and rust resistance. The method does not require conventional blackening processes. Sheet steel or strip is nickel-plated with a nickel-iron diffusion layer and then annealed. The annealing improves the magnetic characteristics. The sheet is cold-rolled prior to annealing to provide a roughened surface, which decreases the chances of sticking during the annealing process. In one embodiment the sheet is pickled, cold-rolled, annealed, cold rolled again, nickel plated, and then annealed again. Annealing between the first and second cold-rolling operations improves the magnetic characteristics.

Abstract: A process for the preparation of N-allyl compounds of the general formula I ##STR1## in which ##STR2## denotes a nitrogen-containing heterocyclic compound, R.sup.1, R.sup.3, and R.sup.4 independently denote hydrogen or C.sub.1 -C.sub.4 alkyl,R.sup.2 denotes hydrogen or methyl,n is equal to 1, 2, 3, or 4, andX denotes a water-solubilizing anion,wherein a compound of formula II ##STR3## is caused to react, in aqueous medium, with a compound of formula III ##STR4## in which A denotes a radical which can be eliminated as an anion. The compounds produced by the process of the invention are very well suited for use as brighteners in nickel electroplating.

Abstract: A tin immersion composition of matter is disclosed comprising a compound comprising divalent tin ion, a compound comprising fluoride ion, and a compound comprising acid hydrogen ion. A process for treating an aluminum-copper or an aluminum-silicon alloy to improve the adhesion of metal layers to the alloy is also disclosed comprising contacting the alloy with an acidic tin immersion composition to produce a tin immersion coating on the alloy, and contacting the tin immersion coating with an etchant to substantially remove the tin immersion coating and produce an etched alloy surface.

Abstract: Water-soluble high molecular weight molecules are made present as a dispersing agent in a dispersion coating bath of a solution of a water-soluble nickel salt containing graphite dispersed therein, and a mold for molding glass is immersed therein in a manner that the mold serves as the cathode and the nickel metal serves as the anode in order to effect the electroplating while suppressing nickel or a nickel-based alloy in the film from granular growth in a vertical direction or in the direction of the plane thereof. On the inner surfaces of the mold is formed a film which comprises a matrix of nickel or the nickel-based alloy which as a whole has a flake-like form that is continuous and exists in an open cellular form and a graphite granule phase which is held in the open cells and is outwardly exposed on the surface.

Abstract: A method for the production of metal foam with high specific surface area is disclosed. A foam material which may be either conductive or nonconductive is provided. If the material is nonconductive, an electrically conductive covering layer is formed. The electrically conductive foam material is then electrolytically coated with nickel from a nickel plating bath. The bath includes at least one unsaturated organic second class brightener in an amount effective to promote preferential growth of nickel onto the foam material such that the value of the growth ratio R, defined by the total of the growth of metal onto the foam material in the direction of the preferential growth divided by the total of the growth of metal in a direction perpendicular to the direction of the preferential growth, is greater than one. The nickel plating may be carried out using pulse current. The bath liquid may be flowed through the openings of the foam substrate in one or more directions during the deposition.