Abstract: A radio-frequency identification fitting ring assembly includes a fitting ring having a ring portion and two sheet portions that respectively extend outward from a same side of the ring portion. The sheet portions are clamped to be in contact with each other and respectively have a through hole. A fixing member passes through the through holes and has a first expanded portion and a second expanded portion on two ends of the fixing member, respectively, to restrict the two sheet portions. A radio-frequency identification member is disposed on the first expanded portion. A part of the radio-frequency identification member is exposed out of the first expanded portion. When the present invention is used, the fitting ring fits around a hose clamp for fixing, and the radio-frequency identification member could be read or written by a read/write device for marking or identifying an information related to the hose clamp later.

Abstract: A method for manufacturing a wiring substrate includes forming multiple conductor pads on an insulating layer such that the conductor pads include multiple first conductor pads and multiple second conductor pads, forming multiple protruding parts on surfaces of the first conductor pads of the conductor pads, respectively, forming a resin layer such that the resin layer covers the insulating layer and the conductor pads, exposing, from the resin layer, end portions of the protruding parts on the opposite side with respect to the insulating layer, forming, in the resin layer, multiple openings such that the openings expose surfaces of the second conductor pads of the conductor pads, respectively; and forming a coating film on the surfaces of the second conductor pads exposed in the openings.

Abstract: An acoustic resonator is fabricated by bonding a first piezoelectric plate to a substrate and spans locations for a first and second cavity in the substrate. A top surface of the first plate is planarized to a first thickness. A bonding layer is formed on the first piezoelectric plate and spans the first and second cavity locations. A second piezoelectric plate is bonded to the bonding layer and spans the first and second cavity locations. A top surface of the second plate is planarized to a second thickness. A portion of the second piezoelectric plate spanning the second cavity location is etched away to form a first membrane over the first cavity location and a second membrane over the second cavity location. Interdigital transducers are formed on the first and second membranes over the first and second cavity location to form a first and second resonator on the same die.

Abstract: A method of manufacturing a semiconductor device includes forming a lower structure including a plurality of transistors, forming a conductive layer on the lower structure, forming first preliminary pad mask patterns and wiring mask patterns on the conductive layer, forming pad mask patterns by patterning the first preliminary pad mask patterns while protecting the wiring mask patterns, and etching the conductive layer using the pad mask patterns and the wiring mask patterns as an etching mask to form pad patterns and wiring patterns.

Abstract: A semiconductor oxide plate is formed on a recessed surface in a semiconductor matrix material layer. Comb structures are formed in the semiconductor matrix material layer. The comb structures include a pair of inner comb structures spaced apart by a first semiconductor portion. A second semiconductor portion that laterally surrounds the first semiconductor portion is removed selective to the comb structures using an isotropic etch process. The first semiconductor portion is protected from an etchant of the isotropic etch process by the semiconductor oxide plate, the pair of inner comb structures, and a patterned etch mask layer that covers the comb structures. A movable structure for a MEMS device is formed, which includes a combination of the first portion of the semiconductor matrix material layer and the pair of inner comb structures.

Abstract: A method for manufacturing a liquid crystal display panel and a liquid crystal display panel are provided. The method of manufacturing a liquid crystal display panel comprises the following steps: grinding the display device along a preset edge and removing the adhesive layer on a side of the preset edge away from a frame sealant, to obtain the liquid crystal display panel.

Abstract: A method for preparing a flexible electrode is provided. The method comprises sequentially forming a flexible base layer and an intermediate conductive layer on a carrier plate; treating an elastomeric template having an electrode pattern with an acid, followed by transferring and printing the electrode pattern onto the intermediate conductive layer to form an electrode inducing layer; forming a titanium dioxide-polydopamine composite layer in a gap of the electrode inducing layer; forming a platinum electrode layer on the titanium dioxide-polydopamine composite layer; removing the carrier plate. The invention solves the problems of slow formation of a polydopamine film and slow formation of a platinum electrode layer. A flexible electrode is further provided.

Abstract: An apparatus is provided that is in communication with an age verification system and an accessory. The apparatus may include at least one interface element configured to receive information indicative of an age or identity of a user, a first communication interface configured to connect with the age verification system, a second communication interface configured to connect with the accessory, and circuitry. The circuitry may be configured to activate the accessory through the second communication interface to provide access to an age restricted product in response to receiving an age verification from the age verification system through the first communication interface.

Abstract: Disclosed herein are methods for manufacturing an integrated circuit (IC) structure, e.g., for manufacturing a metallization stack portion of an IC structure, with one or more self-aligned vias integrated in the back end of line (BEOL), and related semiconductor devices. The methods may employ direct metal etch for scaling the BEOL pitches of the metallization layers. In one aspect, an example method results in fabrication of a via that is self-aligned to both a metal line above it and a metal line below it. Methods described herein may provide improvements in terms of one or more of reducing the misalignment between vias and electrically conductive structures connected thereto, reducing the RC delays, and increasing reliability if the final IC structures.

Abstract: An electronic device includes a display module including a display panel including a first area in which a pixel is disposed, a second area adjacent to the first area and bent with respect to an imaginary axis, a data line connected to the pixel, and a first line insulated from the pixel, an optical film, and a bending cover layer and a window module including a glass substrate and a window protective layer including a cover portion disposed on the glass substrate and a protrusion portion protruding from the cover portion. An end of the optical film and an end of the bending cover layer, which faces the end of the optical film, defines a separation area, the data line and the first line overlap the separation area when viewed in a plane, and the protrusion portion overlaps the first line in the separation area when viewed in a plane.

Abstract: Aspects of the present disclosure involve a system and a method for performing operations comprising: detecting physical touch of a touch-sensitive component on a back portion of a client device, the client device displaying a graphical user interface on a touch-sensitive display screen of a front portion of the client device; in response to detecting the physical touch, transmitting an electrical signal representing the physical touch of the touch-sensitive component on the back portion of the client device to the touch-sensitive display screen of the front portion of the client device; and causing an operation associated with the graphical user interface to be executed in response to the touch-sensitive display screen receiving the electrical signal representing the physical touch of the touch-sensitive component on the back portion of the client device.

Abstract: An intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient. The flexible elongate member includes a proximal portion and a distal portion. The device also includes an ultrasound imaging assembly disposed at the distal portion of the flexible elongate member. The ultrasound imaging assembly is configured to obtain imaging data of the body lumen. The ultrasound imaging assembly includes a transducer array including a substrate, a silicon oxide layer disposed over the substrate, and a plurality of rows of micromachined ultrasound transducer elements disposed on the silicon oxide layer. Two of the plurality of rows of micromachined ultrasound transducer elements are spaced apart by a trench formed by etching through a screen formed in the silicon oxide layer. Associated devices, systems, and methods are also provided.

Abstract: Disclosed among other aspects is a charged particle inspection system including an absorbing component and a programmable charged-particle mirror plate arranged to modify the energy distribution of electrons in a beam and shape the beam to reduce the energy spread of the electrons and aberrations of the beam, with the absorbing component including a set of absorbing structures configured as absorbing structures provided on a transparent conductive layer and a method using such an absorbing component and with the programmable charged-particle mirror plate including a set of pixels configured to generate a customized electric field to shape the beam and using such a programmable charged-particle mirror plate.

Abstract: A method of manufacturing a circuit board includes preparing a substrate having electrical conductivity, removing a portion of a first surface of the substrate to form a plurality of pillars on the first surface of the substrate, locating an insulating material on the first surface of the substrate to cover a space between the plurality of pillars of the substrate, forming a pattern on a second surface, which is opposite to the first surface of the substrate, by removing a portion of the second surface of the substrate, forming a first metal layer on the first surface of the substrate, and forming a second metal layer on the second surface of the substrate.

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Abstract: A method of fabricating a visible spectrum optical component includes: providing a substrate; forming a resist layer over a surface of the substrate; patterning the resist layer to form a patterned resist layer defining openings exposing portions of the surface of the substrate; performing deposition to form a dielectric film over the patterned resist layer and over the exposed portions of the surface of the substrate, wherein a top surface of the dielectric film is above a top surface of the patterned resist layer; removing a top portion of the dielectric film to expose the top surface of the patterned resist layer and top surfaces of dielectric units within the openings of the patterned resist layer; and removing the patterned resist layer to retain the dielectric units over the substrate.

Abstract: An ink includes a boron-doped nanodiamond having a specific surface area of 110 m2/g or greater, and electrical conductivity at 20° C. of 5.0×10?3 S/cm or greater.

Abstract: A method for forming a semiconductor structure is provided. In one form, a method includes: providing a base, where the base includes first regions and a second region located between the first regions; forming a pattern definition layer on the base; forming discrete mask layers on the pattern definition layer, the mask layers and the base defining openings, where openings of the first regions serve as first openings, and an opening of the second region serves as a second opening; forming a filling layer in the second opening; and etching, using the mask layers and the filling layer as masks, the pattern definition layer exposed from the first openings, to form target patterns.

Abstract: A method of manufacturing a glass includes forming a first etch protection layer on a first surface of a glass substrate, and forming a second etch protection layer on a second surface of the glass substrate; removing a part of the first protection layer and a part of the second protection layer by applying a laser pulse penetrating the glass substrate from above the first surface of the glass substrate; forming a cut part in the glass substrate by etching the glass substrate using an etching solution; and removing the first etch protection layer and the second etch protection layer. The second surface is opposite to the first surface.

Abstract: A substrate for mounting a light-emitting element according to the present disclosure contains a crystal particle of aluminum oxide and is composed of an alumina-based ceramic that contains 97% by mass or more of Al as a value of an Al2O3 equivalent among 100% by mass of all components thereof. An average value of an equivalent circle diameter of the crystal particle is 1.1 ?m or greater and 1.8 ?m or less and a standard deviation of an equivalent circle diameter thereof is 0.6 ?m or greater and 1.4 ?m or less.

Abstract: A polishing liquid containing: abrasive grains; a hydroxy acid; a polymer compound having at least one selected from the group consisting of a hydroxyl group and an amide group; and a liquid medium, in which a zeta potential of the abrasive grains is positive, and a weight average molecular weight of the polymer compound is 3000 or more.

Abstract: A soybean cultivar designated 03130400 is disclosed. The invention relates to the seeds of soybean cultivar 03130400, to the plants of soybean cultivar 03130400, to the plant parts of soybean cultivar 03130400, and to methods for producing progeny of soybean cultivar 03130400. The invention also relates to methods for producing a soybean plant containing in its genetic material one or more transgenes and to the transgenic soybean plants and plant parts produced by those methods. The invention also relates to soybean cultivars or breeding cultivars, and plant parts derived from soybean cultivar 03130400. The invention also relates to methods for producing other soybean cultivars, lines, or plant parts derived from soybean cultivar 03130400, and to the soybean plants, varieties, and their parts derived from use of those methods. The invention further relates to hybrid soybean seeds, plants, and plant parts produced by crossing cultivar 03130400 with another soybean cultivar.

Abstract: Methods of depositing a film selectively onto a first material relative to a second material are described. The substrate is pre-cleaned by heating the substrate to a first temperature, cleaning contaminants from the substrate and activating the first surface to promote formation of a self-assembled monolayer (SAM) on the first material. A SAM is formed on the first material by repeated cycles of SAM molecule exposure, heating and reactivation of the first material. A final exposure to the SAM molecules is performed prior to selectively depositing a film on the second material. Apparatus to perform the selective deposition are also described.

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70° C. to 100° C.; and completely curing the bonding layer.

Abstract: Disclosed is a method of fabricating a display device. The method comprises forming a dielectric layer on an encapsulation layer including a first encapsulation region and a second encapsulation region adjacent to the first encapsulation region, forming a conductive layer on the dielectric layer, forming a first photoresist layer on the conductive layer that overlaps each of the first and second encapsulation regions, forming a second photoresist layer on the first photoresist layer that overlaps the second encapsulation region, and etching the conductive layer based on the first and second photoresist layers. When viewed in a thickness direction of a display panel including the encapsulation layer, at least a portion of the encapsulation layer overlapping the second encapsulation region has a thickness greater than that of the encapsulation layer overlapping the first encapsulation region.

Abstract: A semiconductor apparatus include a first electrode, an insulating layer covering an end of the first electrode, a functional layer arranged on the first electrode and the insulating layer, and a second electrode arranged above the functional layer, wherein, in a cross-section passing through the insulating layer, and the first electrode, the insulating layer includes a first portion having a side surface inclining at an angle of 45° or more and 90° or less, a second portion having a side surface inclining at an angle smaller than 45°, and a third portion below the first portion, and having a side surface inclining at an angle smaller than 45°, and wherein a length of the second portion in a direction vertical to the first electrode is larger than that of the third portion.

Abstract: A mechanical link for microelectromechanical and/or nanoelectromechanical structure, includes a mobile component, a fixed component extending on a plane, and apparatus for detecting displacement of the mobile component relative to the fixed component. The mechanical link includes: a first link to the fixed component and mobile component, allowing rotation of the mobile component relative to the fixed component about an axis of rotation; a second link connecting the mobile component to the detection apparatus at a distance and perpendicular to the axis of rotation; a third link to the fixed component and detection apparatus, guiding the detection apparatus in a direction of translation in the plane; wherein the combination of the second link and third link can transform rotational movement of the mobile component into translational movement of the detection apparatus in the direction of translation.

Abstract: A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.

Abstract: An x-ray anode for an x-ray emitter has a structured surface provided for impingement with electrons. According to an embodiment of the invention, the structured surface has a surface structure which alternates periodically at least in sections and which varies in the micrometer range with respect to its depth extension and periodicity.

Abstract: In one exemplary embodiment, described herein is an ALE process for etching an oxide. In one embodiment, the oxide is silicon oxide. The ALE modification step includes the use of a carbon tetrafluoride (CF4) based plasma. This modification step preferentially removes oxygen from the surface of the silicon oxide, providing a silicon rich surface. The ALE removal step includes the use of a hydrogen (H2) based plasma. This removal step removes the silicon enriched monolayer formed in the modification step. The silicon oxide etch ALE process utilizing CF4 and H2 steps may be utilized in a wide range of substrate process steps. For example, the ALE process may be utilized for, but is not limited to, self-aligned contact etch steps, silicon fin reveal steps, oxide mandrel pull steps, oxide spacer trim, and oxide liner etch.

Abstract: A display apparatus includes a substrate; a plurality of display units on the substrate, each including a thin film transistor including at least one inorganic layer, a passivation layer on the thin film transistor, and a display device electrically connected to the thin film transistor; and a plurality of encapsulation layers respectively encapsulating the plurality of display units. The substrate includes a plurality of islands spaced apart, a plurality of connection units connecting the plurality of islands, and a plurality of through holes penetrating through the substrate between the plurality of connection units. The plurality of display units are on the plurality of islands, respectively. The at least one inorganic layer and the passivation layer extend on the plurality of connection units. The passivation layer includes a trench exposing the at least one inorganic layer. The encapsulation layer contacts the at least one inorganic layer exposed via the trench.

Abstract: A mounting element (8) for releasably receiving a sensor (18) for transferring and/or receiving electrical currents and/or signals relating to a body of an organism, comprising a mounting element base (9) having a receiving space (17) for receiving the sensor (18), the receiving space (17) comprising a floor (19), a wall (16) disposed on the floor (19) and disposed on at least three sides, an opening (20) formed by at least one tab (21, 22), at least one clip closure (23, 24), and further comprising a cover (10) for the mounting element base (9), an at least three-sided wall being disposed on the inner side (11) thereof, the end face (30) thereof being implemented for contacting the end face (41) of the wall (16), wherein at least one counterpart (28, 29) to the at least one clip closure (23, 24) is disposed on the wall (27), and the mounting element base (9) and the cover (10) are connected to each other by a connecting element (13) such that the cover (10) is displaceable relative to the mounting element ba

Abstract: A method of fabricating a multilayer superconducting printed circuit board comprises first, forming a bimetal foil to overlie a substrate, the bimetal foil comprising a first layer of a first metal, a layer of a second metal, and a second layer of the first metal, and then etching the second layer of the first metal. Forming a bimetal foil to overlie a substrate may include forming a bimetal foil comprising a first layer of a normal metal, a layer of a superconducting metal, and a second layer of the normal metal. Etching the second layer of the first metal may include preparing a patterned image in the second layer of the first metal for etching, processing the patterned image through a cleaner, rinsing the patterned image, and then, immersing the patterned image in a microetch.

Abstract: A touch panel has a substrate having a display region and a peripheral region, a touch sensing electrode disposed in the display region of the substrate, and a peripheral circuit disposed in the peripheral region of the substrate. The touch sensing electrode is electrically connected to the peripheral circuit, and the touch sensing electrode layer includes a first portion of a patterned metal nanowire layer. The peripheral circuit includes a patterned conductive layer and a second portion of the metal nanowire layer. At least a non-conductive material of the conductive layer is between the peripheral circuit and a second peripheral circuit.

Abstract: A semiconductor device and a method for forming the semiconductor device are provided. The method includes providing a substrate, and forming a first core layer on the substrate. The substrate includes a pull-up transistor region. The method also includes forming separately arranged second core layers on the first core layer, and forming a first sacrificial sidewall spacer on a sidewall of a second core layer. A gap is formed between adjacent first sacrificial sidewall spacers over the pull-up transistor region. In addition, the method includes removing the second core layers, and then etching the first core layer using the first sacrificial sidewall spacers as a mask until the substrate is exposed. The gap is transferred to a region between adjacent etched first core layers over the pull-up transistor region. Further, after etching the first core layer, the method includes forming a dielectric layer to fully fill the gap.

Abstract: The present invention provides an antenna structure for metal environment. The antenna structure comprises a radiating conductor, a first ground conductor, and a second ground conductor. The radiating conductor comprises a first opening circuit, and a second opening circuit, in which the first opening circuit is opened at a first side of the radiating conductor, and the second opening circuit is opened at a second side of the radiating conductor. The first ground conductor is electrically coupled to a third side of the radiating conductor while the second ground conductor is electrically coupled to a fourth side of the radiating conductor. Alternatively, the present invention further provides an antenna device by folding the antenna structure having RFID chip electrically attached thereon to cover a substrate, whereby the antenna device could be accessed in a metal environment.

Abstract: The invention relates to a method for manufacturing an electrode, preferably an implantable electrode array comprising the following steps: Applying (101) a layer of electrically conducting material (4) above a substrate material (1) for forming the electrically conductive traces; applying (102) a layer of insulating material (6) directly on top of the layer of electrically conducting material (4) for covering the electrically conductive traces; patterning (103) the layer of insulating material (4) by partly exposing the layer of electrically conducting material (4) to form at least one contact area (8) on the layer of the electrically conducting material (4), wherein a mask for patterning the layer of insulating material (6) defines a region (9) in the at least one contact area (8) at which the insulating material (6) in the at least one contact area (8) remains; and partly applying (104) a top layer (13) of electrically conducting material (4) at the contact area (8) on top of the layer of insulating materi

Abstract: An etching composition for silicon nitride comprising: a phosphoric acid compound; water; and at least one of a silane compound represented by Formula 1, below, and a reaction product thereof, and an etching method using the same are disclosed,

Abstract: An MEMS device includes: a first member; a second member forming a sealed space with the first member therebetween; and a third member disposed between the first member and the second member and joined to the first member and the second member, in which the third member has lower rigidity than rigidity of the first member and the second member, and the third member is provided with a communication portion that establishes communication between the sealed space and an external space.

Abstract: This disclosure provides systems, methods, and apparatus related to acoustic transducers.

Abstract: In certain embodiments, an accelerometer is a microelectromechanical systems (MEMS) device including a proof mass, an anchor located in an opening defined by a body of the proof mass, a spring, a drive electrode, and a sense beam. The spring and the proof mass form a spring system suspended from the anchor. The sense beam oscillates at a particular resonance frequency based on application of a signal to the drive electrode. The MEMS device further includes a support structure coupled to the anchor. The support structure operates as a stress decoupling area and includes a support beam, with the spring corresponding to an end of the support beam that has a reduced thickness. The sense beam has a first end attached to the proof mass and a second end attached to the support beam such that the sense beam is orthogonal to the support beam.

Abstract: An integrated energy storage component that includes a substrate supporting a contoured layer having a region with a contoured surface such as elongated pores. A stack structure is provided conformally over the contoured surface of this region. The stack is a single or repeated instance of MOIM layers, or MIOM layers, the M layers being metal layers, or a quasi-metal such as TiN, the O layers being oxide layers containing ions, and the I layer being an ionic dielectric. The regions having a contoured surface may be formed of porous anodized alumina.

Abstract: The present application pertains to testing methods and apparatus useful in single phase or two-phase liquid immersion cooling systems. Single phase systems use a fluid similar to mineral oil in which to immerse the servers. As the fluid is heated by the operating servers the fluid is circulated to one or more heat exchangers for cooling so the fluid never boils. In contrast, two-phase systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of immersion cooling so actual servers are not required to test various aspects of the liquid immersion cooling units.

Abstract: Aspects of the present disclosure involve a system and a method for performing operations comprising: detecting physical touch of a touch-sensitive component on a back portion of a client device, the client device displaying a graphical user interface on a touch-sensitive display screen of a front portion of the client device; in response to detecting the physical touch, transmitting an electrical signal representing the physical touch of the touch-sensitive component on the back portion of the client device to the touch-sensitive display screen of the front portion of the client device; and causing an operation associated with the graphical user interface to be executed in response to the touch-sensitive display screen receiving the electrical signal representing the physical touch of the touch-sensitive component on the back portion of the client device.

Abstract: This polarizer is a polarizer having a wire grid structure that includes a transparent substrate, a dielectric film which extends across one surface of the transparent substrate and has a lower refractive index than the transparent substrate, and a plurality of projections which extend in a first direction on top of the dielectric film and are arrayed periodically at a pitch that is shorter than the wavelength of the light in the used light region, wherein the transparent substrate has a thermal conductivity of at least 10 W/m·K but not more than 40 W/m·K, the plurality of projections each have, in order from the side closer to the dielectric film, a first dielectric layer, a reflective layer and a functional layer, the reflective layer contains a metal or a metal compound, and the functional layer is formed from a material different from the reflective layer.

Abstract: Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a trench in the IMD layer, forming a synthetic antiferromagnetic (SAF) layer in the trench, forming a metal layer on the SAF layer, planarizing the metal layer and the SAF layer to form a metal interconnection, and forming a magnetic tunneling junction (MTJ) on the metal interconnection.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: Density-graded adhesion layers on conductive structures within a microelectronic package substrate are described. An example is a density-graded adhesion layer that includes a dense region proximate to a conductive structure that is surrounded by a less dense (or porous) region adjacent to an overlying dielectric layer. Providing such a graded adhesion layer can have a number of benefits, which can include providing both mechanical connections for improved adhesion with a surrounding dielectric layer and provide hermetic protection for the underlying conductive structure from corrosive species. The adhesion layer enables the conductive structure to maintain its as-formed smooth surface which in turn reduces insertion loss of signals transmitted through the conductive structure.

Abstract: An electrical conductor structure comprises a substrate and an electrical conductor disposed on or in the substrate. The electrical conductor comprises a first layer and a second layer disposed on a side of the first layer opposite the substrate. The first layer comprises a first electrical conductor that forms a non-conductive layer on a surface of the first electrical conductor when exposed to air and the second layer comprising a second electrical conductor that does not form a non-conductive layer on a surface of the second electrical conductor when exposed to air. A component comprises a connection post that is electrically connected to the second layer and the electrical conductor. The first and second layers can be inorganic. The first layer can comprise a metal such as aluminum and the second layer can comprise an electrically conductive metal oxide such as indium tin oxide.