Abstract: A stretchable substrate includes a first elastomer, a plurality of unit devices on the stretchable substrate, a connecting wire configured to electrically connect adjacent unit devices, and a plurality of auxiliary structures each including a second elastomer and each at least partially overlapping with at least one unit device or the connecting wire, wherein the first elastomer and the second elastomer are separate, respective polymers that commonly include at least one structural unit.

Abstract: Methods for processing deposited metal nanowire inks with metal ions are used to form fused metal nanostructured networks. The metal nanowire inks include a hydrophilic polymer binder, such as a cellulose based binder. The metal nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

Abstract: A touch module includes first and second mesh electrode layers respectively with first and second irregular mesh patterns. Line segments of the first irregular mesh pattern are configured to form a first radial pattern having a first intersection point by translation. A top X % fan-blade shape area of line segment density in the first radial pattern is defined as a first dense area, in which X is at least 10. Line segments of the second irregular mesh pattern are configured to form a second radial pattern having a second intersection point by translation. A top X % fan-blade shape area of line segment density in the second radial pattern is defined as a second dense area. When the first radial pattern and the second radial pattern are translated so that the first and second intersection points coincide, the first dense area and the second dense area do not overlap.

Abstract: A method for manufacturing a vibrator device includes a first dry etching step of dry-etching a quartz crystal substrate having a first surface and a second surface from the side facing the first surface to form first grooves and part of the outer shapes of a first vibrating arm and a second vibrating arm, a second dry etching step of dry-etching the quartz crystal substrate from the side facing the second surface to form second grooves and part of the outer shapes of the first vibrating arm and the second vibrating arm, and thereafter, a wet etching step of wet-etching the side surfaces of the first vibrating arm and the second vibrating arm.

Abstract: A camera includes a camera focus adjustment device, a lens, and an image sensor coupled to the camera focus adjustment device. The camera focus adjustment device includes a flexure structure. The flexure structure includes an outer framework of structural members continuously interconnected by flexure notch hinges. The flexure structure also includes two inner structural members oriented in parallel and extending from the outer framework of structural members. A gap is between the two inner structural members. The camera focus adjustment device also includes a piezoelectric material within the gap and a pair of wedges within the gap. The pair of wedges is affixed to the piezoelectric material and to one inner structural member of the two inner structural members. Based on temperature-based piezoelectric activity associated with the piezoelectric material, the camera focus adjustment device is operable to move the image sensor relative to the lens.

Abstract: An acoustic resonator device is formed using a wafer-to-wafer bonding process by etching recesses into a first surface of a piezoelectric substrate, a depth of the recesses greater than a target piezoelectric membrane thickness; then wafer-to-wafer bonding the first surface of the piezoelectric substrate to a handle wafer using a releasable bonding method. The piezoelectric substrate is then thinned to the target piezoelectric membrane thickness to form a piezoelectric plate and at least one conductor pattern is formed on the thinned piezoelectric plate. The side of the thinned piezoelectric plate having the conductor pattern is bonded to a carrier wafer using a metal-to-metal wafer bonding process and the handle wafer is removed.

Abstract: The disclosure pertains to a method for the bonding of a component embedded into a printed circuit board. The methods include provisions of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer. Methods may also include embedding at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer. Methods may also include application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component. Methods may also include clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist.

Abstract: The invention relates to a method for sequencing a heteropolymeric target nucleic acid sequence that involves stochastic sensing. The invention also relates to a method for improving a pore for sequencing a target nucleic acid sequence by modifying one or more sites in the pore.

Abstract: A method of forming a semiconductor package includes providing a metal baseplate having a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.

Abstract: A method of recovering a used battery and apparatus for recovering the capacity of a secondary battery comprising: (1) preparing a secondary battery with deteriorated lifespan characteristics; (2) heating the secondary battery with deteriorated lifespan characteristics while pressing the secondary battery with deteriorated lifespan characteristics to compress a positive electrode, negative electrode, or separator included in the secondary battery; and (3) charging/discharging the secondary battery with deteriorated lifespan characteristics, the secondary battery having been pressed and heated, and the secondary battery with deteriorated lifespan characteristics may be charged and discharged while being pressed and heated, thereby exhibiting an effect of recovering the capacity of the secondary battery with deteriorated lifespan characteristics.

Abstract: A component carrier system with a component carrier, a base solder mask layer formed on a surface of the component carrier, and a top solder mask layer formed on top of a predefined section of the base solder mask. The predefined section of the base solder mask covers a target section of the component carrier.

Abstract: The present invention provides a tuning fork crystal oscillator plate and a manufacturing method therefor, and a piezoelectric device. The tuning fork crystal oscillator plate has a base and a pair of vibrating arms extending out of the base, wherein a front surface and a back surface of each vibrating arm are separately provided with step-shaped sinking grooves formed by photolithography and corrosion along a thickness direction, and the photolithography and corrosion are performed on the step-shaped sinking grooves along a length direction of the vibrating arms; the step-shaped sinking groove is provided with n steps; and outer surfaces of the step-shaped sinking groove are all plated with electrodes. The piezoelectric oscillator plate manufactured by the present invention has the advantages of low impedance, high frequency precision and low energy consumption.

Abstract: The present disclosure describes heat dissipating structures that can be formed either in functional or non-functional areas of three-dimensional system on integrated chip structures. In some embodiments, the heat dissipating structures maintain an average operating temperature of memory dies or chips below about 90° C. For example, a structure includes a stack with chip layers, where each chip layer includes one or more chips and an edge portion. The structure further includes a thermal interface material disposed on the edge portion of each chip layer, a thermal interface material layer disposed over a top chip layer of the stack, and a heat sink over the thermal interface material layer.

Abstract: The present invention relates to a negative electrode including a current collector and a negative electrode active material layer disposed on the current collector, wherein the negative electrode active material layer includes a negative electrode active material, a conductive agent, and a binder, wherein the negative electrode active material includes silicon particles having an average particle diameter (D50) of 4 ?m to 10 ?m, the conductive agent includes carbon nanotubes and a graphite-type conductive agent, and the binder includes a copolymer containing a polyvinyl alcohol-derived unit and an ionized substituted acrylate-derived unit.

Abstract: A method for manufacturing a semiconductor device includes the steps of a first separation process of separating the semiconductor layer from the first substrate by bringing a pick-up substrate into close contact with the semiconductor layer and then moving the pick-up substrate away from the first substrate, pressing of pressing the semiconductor layer that is in close contact with the pick-up substrate to the second substrate, temperature maintenance of maintaining temperatures of contact surfaces of the semiconductor layer and the second substrate at a temperature higher than room temperature while pressing the semiconductor layer onto the second substrate, and a second separation process of separating the semiconductor layer from the pick-up substrate after the temperatures of the contact surfaces are maintained at the temperature higher than room temperature.

Abstract: An electroconductive film (101) comprises a metal thin-film (10) on a first main surface of a flexible substrate (40) that includes a resin film (5). The thickness of the flexible substrate is 1 mm or less. The absolute value |H2?H1| of the difference between the heating dimensional change rate H1 of the electroconductive film and the heating dimensional change rate H2 of a film obtained by removing the metal thin-film from the electroconductive film is preferably 0.10% or less. There is a tendency that undulation of a temperature sensor film after patterning of the metal thin-film is further suppressed as the value of |H2?H1| decreases.

Abstract: A stretchable mounting substrate that includes a first substrate including a stretchable base material and a stretchable wiring on the stretchable base material; a second substrate including a wiring for an electronic component, the second substrate overlapping at least a part of the first substrate in a plan view of the stretchable mounting substrate; and a connection member connecting the first substrate and the second substrate, the connection member including a connection base material and a connection wiring connecting the stretchable wiring of the first substrate and the wiring of the second substrate 20, wherein the connection member is configured to be deformed in accordance with an expansion/contraction direction of the first substrate so that an expansion/contraction ratio of a region of the first substrate overlapping the second substrate in the plan view is larger than an expansion/contraction ratio of the second substrate.

Abstract: A method of forming a bond between substrates and manipulating the bond comprises: emitting a first laser energy onto a strip of an absorption material disposed between a first substrate and a second substrate until the strip diffuses into the first substrate and the second substrate resulting in workpiece with a bond between the first substrate and the second substrate; emitting a second laser energy through the workpiece at the bond to create a fault line through the bond, the first substrate, and the second substrate, the second laser energy provided by an approximated Bessel beam, the approximated Bessel beam incident upon the bond having a diameter that is greater than a width of the bond; and repeating emitting the second laser energy step along a length of the bond to create a series of fault lines through the bond, the series of fault lines forming a contour.

Abstract: A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle ? formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.

Abstract: An electronic device is provided. The electronic device includes a millimeter wave (mmWave) antenna including a plurality of conductive patches, a wireless communication circuit, and a radio frequency (RF) cable electrically connecting the mmWave antenna to the wireless communication circuit. A first portion of the RF cable includes a base dielectric, a metal plate disposed on one surface of the base dielectric, and a shielding film including a first region in contact with the metal plate, a second region spaced apart from the metal plate by a first height, and a third region configured to connect the first region and the second region, at least one waveguide is formed by the second region, the third region, and a portion of the metal plate, and the wireless communication circuit transmits and/or receives RF signals corresponding to the plurality of conductive patches through the at least one waveguide.

Abstract: A laminated shielding inductor includes a laminated body, an internal coil, and a shielding cover; the laminated body includes a plurality of insulator layers; shielding conductor through grooves which are located at the periphery of the internal coil are formed in the plurality of insulator layers; shielding conductors are arranged in the shielding conductor through grooves, are electrically and mutually connected and jointly form a shielding conductor laminated layer; a shielding conductor upper layer and a shielding conductor lower layer are respectively arranged above and below the internal coil; and the shielding conductor laminated layer, the shielding conductor upper layer and the shielding conductor lower layer are closed to form the shielding cover. Thus, high shielding effect of the laminated chip inductor can be realized, external radiation of the laminated chip inductor is effectively reduced, and the reliability of a circuit system is improved.

Abstract: A method for etching an oxide semiconductor film includes: providing a substrate including a mask of a silicon-containing film on an oxide semiconductor film containing at least indium (In), gallium (Ga), and zinc (Zn); supplying a processing gas containing a bromine (Br)-containing gas or an iodine (I)-containing gas; and etching the oxide semiconductor film by plasma generated from the processing gas.

Abstract: Systems, apparatuses and methods may provide for an antenna system including a cavity and a broadband antenna coupled to the cavity. The broadband antenna may include surfaces defining a slot, wherein a cross-section of the cavity defines a resonant frequency range of the slot. The broadband antenna may also include a plurality of transmission lines, wherein the plurality of transmission lines bridge the slot and are spaced apart at a sub-wavelength distance with respect to a target frequency range of the antenna system. Additionally, the broadband antenna may include a plurality of inductive tuning elements, each inductive tuning element being disposed adjacent to one of the plurality of transmission lines, wherein the target frequency range is a function of the resonant frequency range and an impedance associated with the plurality of inductive tuning elements.

Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

Abstract: A radio-frequency identification fitting ring assembly includes a fitting ring having a ring portion and two sheet portions that respectively extend outward from a same side of the ring portion. The sheet portions are clamped to be in contact with each other and respectively have a through hole. A fixing member passes through the through holes and has a first expanded portion and a second expanded portion on two ends of the fixing member, respectively, to restrict the two sheet portions. A radio-frequency identification member is disposed on the first expanded portion. A part of the radio-frequency identification member is exposed out of the first expanded portion. When the present invention is used, the fitting ring fits around a hose clamp for fixing, and the radio-frequency identification member could be read or written by a read/write device for marking or identifying an information related to the hose clamp later.

Abstract: A method for manufacturing a wiring substrate includes forming multiple conductor pads on an insulating layer such that the conductor pads include multiple first conductor pads and multiple second conductor pads, forming multiple protruding parts on surfaces of the first conductor pads of the conductor pads, respectively, forming a resin layer such that the resin layer covers the insulating layer and the conductor pads, exposing, from the resin layer, end portions of the protruding parts on the opposite side with respect to the insulating layer, forming, in the resin layer, multiple openings such that the openings expose surfaces of the second conductor pads of the conductor pads, respectively; and forming a coating film on the surfaces of the second conductor pads exposed in the openings.

Abstract: A method of manufacturing a semiconductor device includes forming a lower structure including a plurality of transistors, forming a conductive layer on the lower structure, forming first preliminary pad mask patterns and wiring mask patterns on the conductive layer, forming pad mask patterns by patterning the first preliminary pad mask patterns while protecting the wiring mask patterns, and etching the conductive layer using the pad mask patterns and the wiring mask patterns as an etching mask to form pad patterns and wiring patterns.

Abstract: An acoustic resonator is fabricated by bonding a first piezoelectric plate to a substrate and spans locations for a first and second cavity in the substrate. A top surface of the first plate is planarized to a first thickness. A bonding layer is formed on the first piezoelectric plate and spans the first and second cavity locations. A second piezoelectric plate is bonded to the bonding layer and spans the first and second cavity locations. A top surface of the second plate is planarized to a second thickness. A portion of the second piezoelectric plate spanning the second cavity location is etched away to form a first membrane over the first cavity location and a second membrane over the second cavity location. Interdigital transducers are formed on the first and second membranes over the first and second cavity location to form a first and second resonator on the same die.

Abstract: A semiconductor oxide plate is formed on a recessed surface in a semiconductor matrix material layer. Comb structures are formed in the semiconductor matrix material layer. The comb structures include a pair of inner comb structures spaced apart by a first semiconductor portion. A second semiconductor portion that laterally surrounds the first semiconductor portion is removed selective to the comb structures using an isotropic etch process. The first semiconductor portion is protected from an etchant of the isotropic etch process by the semiconductor oxide plate, the pair of inner comb structures, and a patterned etch mask layer that covers the comb structures. A movable structure for a MEMS device is formed, which includes a combination of the first portion of the semiconductor matrix material layer and the pair of inner comb structures.

Abstract: A method for manufacturing a liquid crystal display panel and a liquid crystal display panel are provided. The method of manufacturing a liquid crystal display panel comprises the following steps: grinding the display device along a preset edge and removing the adhesive layer on a side of the preset edge away from a frame sealant, to obtain the liquid crystal display panel.

Abstract: A method for preparing a flexible electrode is provided. The method comprises sequentially forming a flexible base layer and an intermediate conductive layer on a carrier plate; treating an elastomeric template having an electrode pattern with an acid, followed by transferring and printing the electrode pattern onto the intermediate conductive layer to form an electrode inducing layer; forming a titanium dioxide-polydopamine composite layer in a gap of the electrode inducing layer; forming a platinum electrode layer on the titanium dioxide-polydopamine composite layer; removing the carrier plate. The invention solves the problems of slow formation of a polydopamine film and slow formation of a platinum electrode layer. A flexible electrode is further provided.

Abstract: An apparatus is provided that is in communication with an age verification system and an accessory. The apparatus may include at least one interface element configured to receive information indicative of an age or identity of a user, a first communication interface configured to connect with the age verification system, a second communication interface configured to connect with the accessory, and circuitry. The circuitry may be configured to activate the accessory through the second communication interface to provide access to an age restricted product in response to receiving an age verification from the age verification system through the first communication interface.

Abstract: Disclosed herein are methods for manufacturing an integrated circuit (IC) structure, e.g., for manufacturing a metallization stack portion of an IC structure, with one or more self-aligned vias integrated in the back end of line (BEOL), and related semiconductor devices. The methods may employ direct metal etch for scaling the BEOL pitches of the metallization layers. In one aspect, an example method results in fabrication of a via that is self-aligned to both a metal line above it and a metal line below it. Methods described herein may provide improvements in terms of one or more of reducing the misalignment between vias and electrically conductive structures connected thereto, reducing the RC delays, and increasing reliability if the final IC structures.

Abstract: An electronic device includes a display module including a display panel including a first area in which a pixel is disposed, a second area adjacent to the first area and bent with respect to an imaginary axis, a data line connected to the pixel, and a first line insulated from the pixel, an optical film, and a bending cover layer and a window module including a glass substrate and a window protective layer including a cover portion disposed on the glass substrate and a protrusion portion protruding from the cover portion. An end of the optical film and an end of the bending cover layer, which faces the end of the optical film, defines a separation area, the data line and the first line overlap the separation area when viewed in a plane, and the protrusion portion overlaps the first line in the separation area when viewed in a plane.

Abstract: Aspects of the present disclosure involve a system and a method for performing operations comprising: detecting physical touch of a touch-sensitive component on a back portion of a client device, the client device displaying a graphical user interface on a touch-sensitive display screen of a front portion of the client device; in response to detecting the physical touch, transmitting an electrical signal representing the physical touch of the touch-sensitive component on the back portion of the client device to the touch-sensitive display screen of the front portion of the client device; and causing an operation associated with the graphical user interface to be executed in response to the touch-sensitive display screen receiving the electrical signal representing the physical touch of the touch-sensitive component on the back portion of the client device.

Abstract: An intraluminal ultrasound imaging device includes a flexible elongate member configured to be positioned within a body lumen of a patient. The flexible elongate member includes a proximal portion and a distal portion. The device also includes an ultrasound imaging assembly disposed at the distal portion of the flexible elongate member. The ultrasound imaging assembly is configured to obtain imaging data of the body lumen. The ultrasound imaging assembly includes a transducer array including a substrate, a silicon oxide layer disposed over the substrate, and a plurality of rows of micromachined ultrasound transducer elements disposed on the silicon oxide layer. Two of the plurality of rows of micromachined ultrasound transducer elements are spaced apart by a trench formed by etching through a screen formed in the silicon oxide layer. Associated devices, systems, and methods are also provided.

Abstract: Disclosed among other aspects is a charged particle inspection system including an absorbing component and a programmable charged-particle mirror plate arranged to modify the energy distribution of electrons in a beam and shape the beam to reduce the energy spread of the electrons and aberrations of the beam, with the absorbing component including a set of absorbing structures configured as absorbing structures provided on a transparent conductive layer and a method using such an absorbing component and with the programmable charged-particle mirror plate including a set of pixels configured to generate a customized electric field to shape the beam and using such a programmable charged-particle mirror plate.

Abstract: A method of manufacturing a circuit board includes preparing a substrate having electrical conductivity, removing a portion of a first surface of the substrate to form a plurality of pillars on the first surface of the substrate, locating an insulating material on the first surface of the substrate to cover a space between the plurality of pillars of the substrate, forming a pattern on a second surface, which is opposite to the first surface of the substrate, by removing a portion of the second surface of the substrate, forming a first metal layer on the first surface of the substrate, and forming a second metal layer on the second surface of the substrate.

Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.

Abstract: An ink includes a boron-doped nanodiamond having a specific surface area of 110 m2/g or greater, and electrical conductivity at 20° C. of 5.0×10?3 S/cm or greater.

Abstract: A method of fabricating a visible spectrum optical component includes: providing a substrate; forming a resist layer over a surface of the substrate; patterning the resist layer to form a patterned resist layer defining openings exposing portions of the surface of the substrate; performing deposition to form a dielectric film over the patterned resist layer and over the exposed portions of the surface of the substrate, wherein a top surface of the dielectric film is above a top surface of the patterned resist layer; removing a top portion of the dielectric film to expose the top surface of the patterned resist layer and top surfaces of dielectric units within the openings of the patterned resist layer; and removing the patterned resist layer to retain the dielectric units over the substrate.

Abstract: A method for forming a semiconductor structure is provided. In one form, a method includes: providing a base, where the base includes first regions and a second region located between the first regions; forming a pattern definition layer on the base; forming discrete mask layers on the pattern definition layer, the mask layers and the base defining openings, where openings of the first regions serve as first openings, and an opening of the second region serves as a second opening; forming a filling layer in the second opening; and etching, using the mask layers and the filling layer as masks, the pattern definition layer exposed from the first openings, to form target patterns.

Abstract: A method of manufacturing a glass includes forming a first etch protection layer on a first surface of a glass substrate, and forming a second etch protection layer on a second surface of the glass substrate; removing a part of the first protection layer and a part of the second protection layer by applying a laser pulse penetrating the glass substrate from above the first surface of the glass substrate; forming a cut part in the glass substrate by etching the glass substrate using an etching solution; and removing the first etch protection layer and the second etch protection layer. The second surface is opposite to the first surface.

Abstract: A substrate for mounting a light-emitting element according to the present disclosure contains a crystal particle of aluminum oxide and is composed of an alumina-based ceramic that contains 97% by mass or more of Al as a value of an Al2O3 equivalent among 100% by mass of all components thereof. An average value of an equivalent circle diameter of the crystal particle is 1.1 ?m or greater and 1.8 ?m or less and a standard deviation of an equivalent circle diameter thereof is 0.6 ?m or greater and 1.4 ?m or less.

Abstract: A polishing liquid containing: abrasive grains; a hydroxy acid; a polymer compound having at least one selected from the group consisting of a hydroxyl group and an amide group; and a liquid medium, in which a zeta potential of the abrasive grains is positive, and a weight average molecular weight of the polymer compound is 3000 or more.

Abstract: A soybean cultivar designated 03130400 is disclosed. The invention relates to the seeds of soybean cultivar 03130400, to the plants of soybean cultivar 03130400, to the plant parts of soybean cultivar 03130400, and to methods for producing progeny of soybean cultivar 03130400. The invention also relates to methods for producing a soybean plant containing in its genetic material one or more transgenes and to the transgenic soybean plants and plant parts produced by those methods. The invention also relates to soybean cultivars or breeding cultivars, and plant parts derived from soybean cultivar 03130400. The invention also relates to methods for producing other soybean cultivars, lines, or plant parts derived from soybean cultivar 03130400, and to the soybean plants, varieties, and their parts derived from use of those methods. The invention further relates to hybrid soybean seeds, plants, and plant parts produced by crossing cultivar 03130400 with another soybean cultivar.

Abstract: Methods of depositing a film selectively onto a first material relative to a second material are described. The substrate is pre-cleaned by heating the substrate to a first temperature, cleaning contaminants from the substrate and activating the first surface to promote formation of a self-assembled monolayer (SAM) on the first material. A SAM is formed on the first material by repeated cycles of SAM molecule exposure, heating and reactivation of the first material. A final exposure to the SAM molecules is performed prior to selectively depositing a film on the second material. Apparatus to perform the selective deposition are also described.

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70° C. to 100° C.; and completely curing the bonding layer.

Abstract: A semiconductor apparatus include a first electrode, an insulating layer covering an end of the first electrode, a functional layer arranged on the first electrode and the insulating layer, and a second electrode arranged above the functional layer, wherein, in a cross-section passing through the insulating layer, and the first electrode, the insulating layer includes a first portion having a side surface inclining at an angle of 45° or more and 90° or less, a second portion having a side surface inclining at an angle smaller than 45°, and a third portion below the first portion, and having a side surface inclining at an angle smaller than 45°, and wherein a length of the second portion in a direction vertical to the first electrode is larger than that of the third portion.

Abstract: Disclosed is a method of fabricating a display device. The method comprises forming a dielectric layer on an encapsulation layer including a first encapsulation region and a second encapsulation region adjacent to the first encapsulation region, forming a conductive layer on the dielectric layer, forming a first photoresist layer on the conductive layer that overlaps each of the first and second encapsulation regions, forming a second photoresist layer on the first photoresist layer that overlaps the second encapsulation region, and etching the conductive layer based on the first and second photoresist layers. When viewed in a thickness direction of a display panel including the encapsulation layer, at least a portion of the encapsulation layer overlapping the second encapsulation region has a thickness greater than that of the encapsulation layer overlapping the first encapsulation region.