Abstract: A structure having an optical slit therein. The structure includes a substrate having an opening therethrough and a metal layer disposed on the substrate, such metal layer having a photolithographically formed slit therein, such slit being narrower than the opening and being disposed over the opening, portions of the metal layer disposed adjacent the slit being suspended over the opening and other portions of the metal layer being supported by the substrate.

Abstract: Methods for wet etching a UBM layer and the resulting devices are disclosed. Embodiments may include patterning metal bumps on a wafer that has at least two metal layers thereon; exposing the wafer to a first acid solution to remove a portion of a first of the two metal layers exposed by the patterning of the metal bumps; and exposing the wafer to a second acid solution to remove a portion a second of the two metal layers exposed by the patterning of the metal bumps and the exposure of the wafer to the first acid solution, wherein an undercut below the metal bumps, formed by removal of the portions of the first and second metal layers, is less than 1.5 microns.

Abstract: A method for manufacturing the image sensor device is provided. The method includes depositing a first dielectric layer over a back surface of a substrate, forming a ridge over the first dielectric layer, depositing a second dielectric layer over the first dielectric layer, including filling in a space between two adjacent ridges. The method also includes removing the ridge to form a trench in the second dielectric layer and forming a metal grid in the trench.

Abstract: The present invention relates to a copper plating solution for relieving the deposit stress of an electroplated copper film. In the copper electroplating solution of the present invention, glycerin propoxylate ethoxylate is used as a carrier for relieving the deposit stress, and phenylurea is added as a deposit stress relieving additive. The copper electroplating solution of the present invention includes the phenylurea by from about 0.02 to about 0.08 g/l.

Abstract: An integrated circuit packaging system including: a fiber-less organic substrate including: a first dielectric layer, a first metal layer on the first dielectric layer, a second dielectric layer on the first dielectric layer and the first metal layer, and an interconnect via plated on the first metal layer and the second dielectric layer; an integrated circuit mounted over the second dielectric layer; and an integrated circuit interconnect between the integrated circuit and the interconnect via.

Abstract: Object of the present invention is to provide a method for manufacturing a printed wiring board which enables fine wiring formation at low costs and with high yields without introducing any special equipment, and a printed wiring board manufactured by the method.

Abstract: A touch sensing structure is provided. The touch sensing structure includes a substrate, a plurality of first conductive traces and a second conductive trace. The plurality of first conductive traces is formed on the substrate. Each of the first conductive trace includes a trunk and at least one branch. The trunks of the first conductive traces are disposed to be parallel with each other. The branch of each first conductive trace is extended from one side of the trunk toward the adjacent first conductive trace. The branches between the two adjacent first conductive traces are disposed to be opposite and alternative. A path is composed of the two adjacent trunks and the branches disposed to be opposite and alternative. The second conductive trace is formed on the substrate, disposed between the two adjacent first conductive traces and extended along the path.

Abstract: A dummy structure for a printed wiring board (PWB) includes a unit shape defined on the PWB, the unit shape configured to, based on a visual inspection thereof, provide an indication of one of: etching of a PWB circuit element within a desired tolerance range, over etching of the PWB circuit element, or under etching of the PWB circuit element.

Abstract: A method for assembling a 3D integrated circuit package that includes a base device and a top device. The method includes bonding (i) a pre-formed via array having a via rack and via elements and (ii) a base die to the substrate of the base device. The resulting sub-assembly is encapsulated in molding compound, and the via rack and any corresponding molding compound are removed, such as by grinding, to generate a base device with vias corresponding to the via elements and exposed bond posts on its top surface corresponding to the tops of the vias. A pre-packaged or unpackaged top device is then attached and bonded to the base device and, if necessary, encapsulated to form the 3D package with the exposed tops of the vias providing electrical connections between the base substrate and the top device.

Abstract: A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a copper foil layer/a release layer/a heat-resistant metal layer/a carrier foil is used; a supporting substrate is manufactured by laminating an insulating layer constituting material to the surface of the carrier foil constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the copper foil layer constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

Abstract: A method of manufacturing a piezoelectric vibration reed is provided. The piezoelectric vibration reed includes a pair of vibrating arm portions and a base portion. The pair of vibrating arm portions is disposed in parallel to each other. The base portion is configured to integrally support proximal end portions of the pair of vibrating arm portions in a longitudinal direction of the vibrating arm portions. The method of manufacturing the piezoelectric vibration reed forms a slit-shaped notched portion at a crotch portion located between the proximal end portions of the pair of vibrating arm portions.

Abstract: The invention relates to a process for improving the electrical and optical performance of a transparent electrically conductive material having silver nanowires. The invention also relates to a process for manufacturing a film made of a transparent electrically conductive material, such as a transparent electrode, a transparent heating film, or a film for electromagnetic shielding. The process of the invention includes the following steps: a) a step of bringing silver nanowires into contact with an acid solution, this solution having a pH lower than 7, preferably lower than 3; and b) a step of eliminating the acid. The field of application of the invention is in particular the field of optoelectronics.

Abstract: A touch panel and a manufacturing method of the same are introduced, characterized in that an electrically conducting-connecting pad set electrically connects a second transmission line set and a second axial touch sensing set, such that a first transmission line set, the second transmission line set, and a first axial touch sensing set below the second axial touch sensing set are concurrently formed on a substrate of the touch panel in the same process flow of the manufacturing method to thereby dispense with a procedure of alignment of the first axial touch sensing set and the first transmission line set and a procedure of alignment of the second axial touch sensing set and the second transmission line set, so as to achieve high precision and enhance the production yield and efficiency of the touch panel.

Abstract: A manufacturing method of a light barrier glass sheet, comprising: farming a metal layer (2) on a glass substrate (1); coating a first photoresist layer (3) on the metal layer (2), performing first exposure on the first photoresist layer (3) through a half tone mask, then performing first development on the first photoresist layer (3); removing partial region of the metal layer (2) through a first etching process; removing a partial thickness and a partial region of the first photoresist layer (3) through an ashing process; forming an insulating layer (4) on the exposed glass substrate (1), the exposed metal layer (2), the first photoresist layer (3) after the ashing process, and sidewalls of the photoresist layer (3) after the ashing process; removing the first photoresist layer (3), the insulating layer (4) on the first photoresist layer (3), and the insulating layer (4) on the sidewalls of the first photoresist layer (3) by a photoresist lifting-off process so as to form a via hole (7); forming a transpare

Abstract: An embodiment of the present application discloses a capacitive touch panel including a base substrate, on which a plurality of transparent conductive patters being capable of transmitting touch signals and not overlapping with each are provided, and each transparent conductive pattern is an integrated pattern made of a same material layer. An embodiment of the present application further provides a method for manufacturing a capacitive touch panel, which includes forming a plurality of transparent conductive patterns on a base substrate through one mask patterning process. An embodiment of the present application further includes a display device comprising the capacitive touch panel as described above. An embodiment of the present application can save masks and can manufacture capacitive touch panels at a low cost. Furthermore, the embodiments of the present application have advantages of high production efficiency and of high yield rate.

Abstract: An anode active material for a lithium secondary battery, the anode active material including a metal silicide core, a silicon shell disposed on the core, and a metal nitride disposed on a surface of the silicon shell opposite the core.

Abstract: The present invention can provide an etching composition for a chemical copper plating for the production of a printed-wiring board according to a semi-additive process, which comprises 0.2 to 5% by mass of hydrogen peroxide, 0.5 to 10% by mass of sulfuric acid, 0.001 to 0.3% by mass of phenylurea, 0.1 to 3 mass ppm of halogen ion and 0.003 to 0.3% by mass of tetrazoles, and wherein the ratio of the dissolution rate of the chemical copper plating (Y) to the dissolution rate of an electrolytic copper plating (X) at a liquid temperature of 30° C. (Y/X) is 4 to 7.

Abstract: A capacitive transparent conductive film comprises: a transparent substrate, comprises a first surface and a second surface which is opposite to the first surface; a light-shield layer, formed at the edge of the first surface of the transparent substrate, the light-shield layer forms a non-visible region on the first surface of the transparent substrate; and a polymer layer, formed on the first surface of the transparent substrate, and covering the light-shield layer, the surface of the polymer layer is patterned to form a meshed trench, the trench is filled with conductive material to form a sensing region on the surface of the polymer layer. The capacitive transparent conductive film can effectively protect the conductive material and has low cost and good conductivity. A preparation method of the capacitive transparent conductive film is also provided.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.

Abstract: A cleaning composition includes about 0.01 to about 5 wt % of a chelating agent; about 0.01 to about 0.5 wt % of an organic acid; about 0.01 to about 1.0 wt % of an inorganic acid; about 0.01 to about 5 wt % of an alkali compound; and deionized water.

Abstract: Connector inserts and other structures that have a high signal integrity and low insertion loss, are reliable, and are readily manufactured. One example may provide a connector insert formed primarily using a printed circuit board. Contacts on the connector insert may be akin to contacts on a printed circuit board and they may connect to traces having matched impedances on the printed circuit board in order to improve signal integrity and reduce insertion loss. The printed circuit board may be manufactured in a manner for increased reliability. Plating, solder block, and other manufacturing steps that are native to printed circuit board manufacturing may be employed to improve manufacturability. Specialized tools that may provide a chamfered edge on the connector inserts may be employed.

Abstract: A passivation composition and use of the composition in a method of forming a conductive pattern are provided. The passivation composition includes an oxidizing agent, an inorganic base with a general formula M(OH)n and a solvent, wherein M is a metal ion and n is the valence number of the metal ion. The method includes the following steps: (a) forming a polymer conductive layer on a substrate, wherein the polymer conductive layer is consisting of a first area and a second area. The first area is corresponding to a conductive area to be formed; and (b) passivating the second area by using the passivation composition to reduce the conductivity of the second area and form the conductive pattern on the substrate.

Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.

Abstract: Disclosed herein is a printed circuit board, including: a substrate; a seed layer formed on the substrate; and a circuit pattern formed on the seed layer and formed so that a diameter of an upper portion thereof and a width of a lower portion thereof are equal to each other or a diameter of the lower portion is larger than that of the upper portion. Therefore, the printed circuit board according to a preferred embodiment of the present invention forms the circuit pattern having the lower portion having the diameter larger than that of the upper portion, such that the electrical signal loss may be decreased and separation of the circuit pattern may be prevented, thereby improving whole reliability of the board.

Abstract: The present invention relates to a process for metallizing nonconductive plastics using an etching solution free of both trivalent chromium and hexavalent chromium. The etching solution is based on an sulphuric acidic solution containing a source of chlorate ions. After the treatment of the plastics with the etching solution, the plastics are metallized by means of known processes.

Abstract: Methods of selectively etching aluminum and aluminum layers from the surface of a substrate are described. The etch selectively removes aluminum materials relative to silicon-containing films such as silicon, polysilicon, silicon oxide, silicon carbon nitride, silicon oxycarbide and/or silicon nitride. The methods include exposing aluminum materials (e.g. aluminum) to remotely-excited chlorine (Cl2) in a substrate processing region. A remote plasma is used to excite the chlorine and a low electron temperature is maintained in the substrate processing region to achieve high etch selectivity. Aluminum oxidation may be broken through using a chlorine-containing precursor or a bromine-containing precursor excited in a plasma or using no plasma-excitation, respectively.

Abstract: The present invention discloses a printed circuit board, a semiconductor package having the same, and a method for manufacturing the same. A printed circuit board according to an aspect of the present invention includes: a package board including a mounting area and a peripheral area, the mounting area having a semiconductor chip mounted therein, the peripheral area surrounding the mounting area; a first central circuit pattern formed in the mounting area on one surface of the package board; a second central circuit pattern formed in the mounting area on the other surface of the package board and having a greater thickness than the first central circuit pattern; a first peripheral circuit pattern formed in the peripheral area on the one surface of the package board; and a second peripheral circuit pattern formed in the peripheral area on the other surface of the package board and having a greater thickness than the second peripheral circuit pattern.

Abstract: A method and system for integrated circuit fabrication is disclosed. In an example, the method includes determining a first process parameter of a wafer and a second process parameter of the wafer, the first process parameter and the second process parameter corresponding to different wafer characteristics; determining a variation of a device parameter of the wafer based on the first process parameter and the second process parameter; constructing a model for the device parameter as a function of the first process parameter and the second process parameter based on the determined variation of the device parameter of the wafer; and performing a fabrication process based on the model.

Abstract: There is provided a method of forming silicon anode material for rechargeable cells. The method includes providing a metal matrix, comprising no more than 30 wt % silicon, including silicon structures dispersed therein. The method further includes at least partially etching the metal matrix to at least partially isolate the silicon structures.

Abstract: Methods of fabricating the fusible link are directed to processing a multi-layer clad foil having a first layer suitable for forming a fusible link and a second layer suitable for forming one or more welding tabs. In some embodiments, the first layer is an aluminum layer and the second layer is a nickel layer. A two-step etching process or a single step etching process is performed on the clad foil to form an etched clad foil having multiple tabs made of the second layer and connected to the current collector conductor pads and battery cell conductor pads, and one or more connections made of the first layer that form aluminum conductors. The aluminum conductors are shaped and sized to form aluminum fusible conductors during either the etching process or a subsequent stamping process. A single fusible link or an array of fusible links can be formed.

Abstract: A patterned transparent conductor including a conductive layer coated on a substrate is described. More specifically, the transparent conductor can be patterned by screen-printing an acidic etchant formulation on the conductive layer. A screen-printable etchant formulation is also disclosed.

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract: Disclosed are a hollow graphene nanoparticle and a method for manufacturing the same. The hollow graphene nanoparticle is made of graphene sheets stacked together, and has a particle size of 10˜500 nm and a specific surface area greater than 500 m2/g. The method includes the steps of forming graphene, etching and heat treatment. First, a reducing agent is injected into an oven filled with protective gas, a carbon-containing gas compound or a second gas compound decomposing to generate carbon at higher temperature is added, a processing temperature is heated up to perform a redox reaction so as to form graphene nanoparticles containing side products, the graphene nanoparticles is then immersed in the acidic etching solution to remove the side products and obtain the hollow graphene nanoparticles.

Abstract: The present disclosure provides a touch panel, including a substrate, at least one sensing electrode layer, a wire layer, a first light-shielding layer and a second light-shielding layer. The substrate has a visible region and a non-visible region. The wire layer corresponds to the non-visible region, wherein the wire layer includes signal lines and at least one gap therebetween, the signal lines electrically connect the sensing electrode layer. The first light-shielding layer is disposed within the non-visible region and between the substrate and the wire layer, wherein the first light-shielding layer includes at least one recess and a position of the recess corresponds to a position of the gap. The second light-shielding layer corresponds to the recess, wherein an area covered by the second light-shielding layer is equal to or greater than an aperture of the recess. The present disclosure also provides a method for manufacturing a touch panel.

Abstract: A sensor for measuring a level of a liquid such as fuel and/or water in a tank such as a fuel tank. The sensor includes a stack of capacitors, each capacitor with one or more graphene measurement electrodes and one or more graphene reference electrodes. A measurement system is arranged to measure a capacitance of each capacitor between its measurement electrode(s) and its reference electrode(s) and thereby infer the liquid level. The graphene measurement and reference electrodes are formed in a single layer of graphene oxide by reductive etching.

Abstract: A method of fabricating composite filaments is provided. An initial composite filament including a core and a cladding (such as a Pt-group metal) is cut into smaller pieces (or is first mechanically reduced and then cut into smaller pieces). The smaller pieces of the filaments are inserted into a metal matrix, and the entire structure is then further reduced mechanically in a series of reduction steps. The process can be repeated until the desired cross sectional dimension of the filaments is achieved. The matrix can then be chemically removed to isolate the final composite filaments with the cladding thickness down to the nanometer range. The process allows the organization and integration of filaments of different sizes, compositions, and functionalities into arrays suitable for various applications.

Abstract: A method is provided for producing electrodes of flow cell having high power density. A plurality of seeds are distributed on a surface of a conductive carbon material. The seeds are etched into nanoparticles to form carbon nanotube (CNT) electrodes. The present invention can be applied to vanadium redox flow cell with advantages of the CNT electrodes, such as conductivity, corrosion resistance, mechanical strength and specific and electrochemical surface area. Electrons are directly passed to the material through CNTs and then to an external electronic load for improving power density of flow cell, making a cell pack more compact and reducing energy consumption on charging and discharging without using noble metal material.

Abstract: Provided is a plating method of a circuit substrate comprising a conductive pattern in which a metal layer containing at least silver and copper is exposed on an outer surface. The plating method comprises: step (A) of treating the circuit substrate with a first liquid agent containing an oxidizing agent; step (B) of treating the circuit substrate after the step (A) with a second liquid agent which dissolves copper oxide, and thereby removing copper oxide from the conductive pattern's surface; step (C) of treating the circuit substrate after the step (B) with a third liquid agent whose rate of dissolving silver oxide (I) at 25° C. is 1000 times or more faster than its rate of dissolving copper (0) at 25° C., and thereby removing silver oxide from the conductive pattern's surface; and step (D) of performing electroless plating on the conductive pattern of the circuit substrate after the step (C).

Abstract: A process for manufacturing a transparent body for a touch screen panel is described. The process includes: depositing a first transparent layer stack over a flexible transparent substrate, wherein said first transparent layer stack includes at least a first dielectric film with a first refractive index, and a second dielectric film with a second refractive index different from the first refractive index; providing a transparent conductive film over the first transparent layer stack; depositing a layer of a conductive material over the transparent conductive film; providing a polymer layer over the layer of a conductive material; imprinting a pattern, e.g. a 3D pattern, on the polymer layer; etching the layer of the conductive material based upon the pattern to form conductive paths for the touch screen panel; and etching the transparent conductive film based upon the pattern to form a structured transparent conductive pattern for touch detection.

Abstract: A chip electronic component may include: a magnetic body having a coil conductive pattern part embedded therein; and an oxide insulating film formed on a surface of the coil conductive pattern part. Even in the case that the insulating film is formed to be thinner than an insulating film, it may prevent the coil conductive pattern part from being exposed, whereby a magnetic material and the coil conductive pattern part may not contact each other. Therefore, a waveform defect may be prevented at a high frequency.

Abstract: The present disclosure relates to an electrowetting display device and a manufacturing method for the same, using a UV light reactive fluorosurfactant layer. The UV light reactive fluorosurfactant layer can include a UV-cured fluorine based material positioned above a cured UV reactive material. In an embodiment, the electrowetting display device can also include a substrate with a layer of pixel electrodes formed over the substrate, and partition walls formed over at least a portion of the layer of pixel electrodes. In one embodiment, the UV light reactive fluorosurfactant layer can be formed between the partition walls and above an inter-layer insulation film. In another embodiment, the UV light reactive fluorosurfactant layer can be formed between the partition walls and above the layer of pixel electrodes. The electrowetting display can also include a water repellent layer formed over the UV light reactive fluorosurfactant layer.

Abstract: An object is to achieve miniaturization and an increase in performance of a magnetic sensor device, and the magnetic sensor according to the present invention has a magnetic film and a metal electrode to be electrically coupled to the magnetic film, the magnetic film and the metal electrode constituting a magnetic sensor portion. The metal electrode is formed with level difference portions, and the magnetic film is formed on the level difference portions and sidewalls that connect the level difference portions.

Abstract: A touch screen panel includes a touch substrate, first sensing electrodes, second sensing electrodes, and outer lines. The touch substrate includes a touch active area and a touch non-active area. The first and second sensing electrodes are disposed in the touch active area and insulated from each other while crossing each other. Each first sensing electrode includes a first sensing metal layer and a first transparent sensing electrode layer. Each second sensing electrode includes a second sensing metal layer and a second transparent sensing electrode layer. Each outer line includes a first outer metal layer, a transparent outer electrode layer, and a second outer metal layer.

Abstract: The present invention provides a method of manufacturing a touch screen, comprising the steps of: a) forming a conductive layer on a substrate; b) forming an etching resist pattern on the conductive layer; and c) forming a conductive pattern having a line width smaller than the line width of the etching resist pattern by over-etching the conductive layer by using the etching resist pattern and a touch screen manufactured by the method. According to the present invention, a touch screen comprising a conductive pattern having an ultrafine line width can be economically and efficiently provided.

Abstract: Disclosed herein is a method for manufacturing a high frequency inductor, the method including; forming a primary coil for manufacturing the high frequency inductor on a wafer; coating a primary PSV on the wafer on which the primary coil is formed; forming a secondary coil for manufacturing the high frequency inductor, after the coating of the primary PSV; coating a secondary PSV, after the forming of the secondary coil; forming a barrier layer on an electrode portion to be exposed of the high frequency inductor, after the coating of the secondary PSV; filling and curing an insulating resin on the wafer, after the forming of the barrier layer; and polishing the cured resin up to the barrier layer to expose the electrode.

Abstract: One of objects is to reduce the effect caused by the volume expansion of an active material. An embodiment is a method for manufacturing an electrode for a power storage device which includes an active material over one of surfaces of a current collector. The active material is formed by forming a conductive body functioning as the current collector; forming a mixed layer including an amorphous region and a microcrystalline region over one of surfaces of the conductive body; and etching the mixed layer selectively, so that a part of or the whole of the amorphous region is removed and the microcrystalline region is exposed. Thus, the effect caused by the volume expansion of the active material is reduced.

Abstract: A method for manufacturing a touch screen panel includes forming first and second conductive layers on a substrate, forming a photosensitive layer on the second conductive layer, exposing the photosensitive layer using a first mask having a first light shielding pattern that corresponds to sensing electrodes and lines to be formed, removing the photosensitive layer at the first exposed portion, sequentially removing the second and first conductive layers at the first exposed portion using the first remaining photosensitive layer as a mask, exposing the photosensitive layer using a second mask having a second light shielding pattern that corresponds to the lines to be formed, removing the photosensitive layer at the second exposed portion, removing the second conductive layer at the second exposed portion using the second remaining photosensitive layer as a mask, thereby forming the sensing electrodes and the lines, and removing the second remaining photosensitive layer.

Abstract: There are provided a touch panel and a manufacturing method thereof, the touch panel including: a substrate, a plurality of fine conductive lines provided on one surface of the substrate, and a black treated part including a first black layer and a second black layer provided on the one surface of the substrate, wherein the first black layer, the plurality of fine conductive lines, and the second black layer are sequentially stacked on the substrate, the first black layer has a width wider than a line width of the fine conductive lines, and the second black layer has a width narrower than the line width of the fine conductive lines.

Abstract: Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal. In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.

Abstract: A method of forming a particulate material comprising silicon, the method comprising the step of reducing a particulate starting material comprising silica-containing particles having an aspect ratio of at least 3:1 and a smallest dimension of less than 15 microns, or reducing a particulate starting material comprising silica-containing particles comprising a plurality of elongate structural elements, each elongate structural element having an aspect ratio of at least 3:1 and a smallest dimension of less than 15 microns.