Abstract: A movement device, particularly for cutting torches of the plasma type, comprising a working head that can move along three Cartesian axes which are mutually perpendicular and supports a cutting torch for cutting mechanical pieces and the like, elements being comprised for the combined rotary and translational motion of the cutting torch with respect to the working head in order to vary the inclination of the cutting flow with respect to the mechanical piece or the like being worked on; the center of instantaneous rotation of the cutting torch, with respect to which the elements for combined rotary and translational motion operate, substantially coinciding with the focal point of the cutting torch.

Abstract: The present disclosure provides a method for determining a hole completing in laser drilling of a hole in a near wall of an airfoil. The method includes drilling a hole in the near wall of the airfoil using a laser drill. The laser drill may move in a pattern relative to the airfoil. The method also includes determining when the drilling of the hole is complete based on a calculated time duration between successive breakthroughs of a laser from the laser drill through the near wall of the airfoil, or based on a calculated time duration since the latest breakthrough of the laser from the laser drill through the near wall of the airfoil.

Abstract: Provided is a method of cutting a glass sheet (G) by performing at least localized heating along a preset cutting line (5) of the glass sheet (G), the method comprising cutting a full body of the glass sheet (G) by performing at least the localized heating along the preset cutting line (5) of the glass sheet (G) under a state in which support members (2 (8)) for supporting, from a back surface side of the glass sheet (G), portions of the glass sheet (G) that are situated apart from the preset cutting line (5) toward both sides thereof are arranged apart from each other so as to form a space (S) on the back surface side of the preset cutting line (8).

Abstract: Disclosed is a method for producing series of cut-out forms from a continuous web. The method includes: receiving a plurality of print jobs, each one of the print jobs defining an image, a cut-out contour, and a desired number of copies; generating a set of printing patterns including images from print jobs, which may be combined to obtain the desired numbers of copies of the print jobs; making the printing patterns available to a printer in a combination to obtain the desired copies of the print jobs; generating a set of cut-out patterns including cut-out contours from print jobs, which may be combined to match the combined printing patterns; making the cut-out patterns available to a cutting device; and instructing the cutting device about the sequence in which the cut-out patterns must be applied to cut cut-out forms according to the cut-out contours.

Abstract: A method for producing an analysis tape for fluid samples, in particular body fluids, is proposed. The method comprises providing a laminate tape having a laminate carrier tape and at least one diagnostic functional layer, and cutting the laminate tape in such a way that a diagnostic auxiliary label arises; transferring the diagnostic auxiliary label to a vacuum roller; and transferring the diagnostic auxiliary label to a carrier tape. In general, at least one vacuum roller is used for the transfer of the diagnostic auxiliary label to the carrier tape. The cutting of the diagnostic functional layer is effected in such a way that a free end of the diagnostic functional layer is lifted off from the laminate carrier tape by guiding the laminate carrier tape around a cutting edge with a small radius, wherein the diagnostic functional layer is cut at a predetermined distance from the lifted off free end by means of a cutting device.

Abstract: A laser cutting device includes a control unit which sets a steady oxygen concentration, a moving speed of a laser nozzle and laser beam steady control conditions based on a material and a plate thickness of the workpiece, decreases the moving speed of the laser nozzle to a first setting speed when the laser nozzle arrives a first setting position in front of an end point of a cutting trajectory, and decreases a relative moving speed of the laser nozzle to a second setting speed by varying the oxygen concentration of the cutting gas and the control condition of the laser beam when the laser nozzle arrives at a second setting position.

Abstract: A method for manufacturing an airfoil includes confining an unfocused laser beam inside a first fluid column to create a confined laser beam, directing the confined laser beam at a surface of the airfoil, and penetrating the surface of the airfoil with the confined laser beam. The method further includes detecting penetration of the confined laser beam through the surface of the airfoil via an optical sensor disposed within a cavity defined within the airfoil.

Abstract: Apparatus for drilling a via-hole in a printed circuit board (PCB) includes a carbon monoxide laser deliver laser radiation pulses. The pulses have a relatively broad wavelength-range, and slow rising and falling edges. The rising and falling edges of the pulses are clipped using and acousto-optic modulator. A dispersion-compensator compensates for dispersion in the clipped pulses introduced by the AOM. Achromatic focusing optics focus the dispersion-compensated, clipped pulses on the PCB for the via-hole drilling.

Abstract: The process for manufacturing wafers includes the steps of mounting an ingot as a work piece in a manner that permits rotation about a longitudinal axis of rotation and rotating the ingot about its longitudinal axis of rotation to permit a microwave device that generates an energized beam to penetrate an outer surface layer thereof. Furthermore, the process includes exfoliating the outer surface layer with the energized beam, removing the exfoliated outer surface layer from the ingot as a continuous planar strip and cutting the continuous planar strip into a wafer.

Abstract: In a method of slicing products, in particular food products, a plurality of products are supplied next to one another along a product support to a cutting plane in which a cutting blade moves, in particular in a rotating and/or revolving manner. The products are initially offset relative to one another in a stepped manner in the product supply direction via the product conveyors in that, starting from a first product, the further products up to the respective outermost product, which are arranged next to one another at at least one side, are set back by a respective amount against the product supply direction, and indeed further than the respective preceding product. The products offset in a stepped manner with respect to one another are traveled to light barriers at a defined speed. The positions of the product starts are detected with respect to the cutting plane via the light barriers.

Abstract: There is provided a hybrid ultraprecision machining device for manufacturing a micro-machined product from a workpiece, the machining device comprising: an electromagnetic-wave-machining means for roughly machining the workpiece; a precision-machining means for precisely machining the roughly machined workpiece, the precision-machining means being equipped with a replaceable cutting tool selected from the group consisting of a planar tool, a shaper tool, a fly-cutting tool, a diamond-turning tool and a micro-milling tool; a shape-measurement means for measuring a shape of the workpiece upon use of the electromagnetic-wave machining means and the precision-machining means; and a control means for controlling the electromagnetic-wave-machining means or the precision-machining means, based on information on the shape of the workpiece, the shape being measured by the shape-measuring means.

Abstract: A method is disclosed for scribing a contained crack or vent in a chemically strengthened glass sheet. The glass has shallow surface regions under compressive stress, bounding a central region under tensile stress. The vent is formed by rapidly bulk-heating the glass, using radiation from a carbon monoxide laser, to a depth just below a surface compressive region and extending marginally into the tensile stress region then rapidly cooling the heated region with a water mist spray. The glass sheet can be subsequently divided along the vent by application of mechanical or thermal stress.

Abstract: A laser welding device may include: a frame including a lower die supporting at least two sheets of welding objects and an upper die mounted over the lower die to be spaced apart from the lower die; a pressing plate movably mounted on the upper die in a vertical direction and pressing the welding objects; a rotating member mounted on the pressing plate and rotating based on a pressing central shaft of the pressing plate; a tilting member disposed in a direction intersecting the pressing central shaft and connected to the rotating member to be tilted in a vertical direction; and a scanner head reciprocally mounted on the tilting member along a length direction, scanning the laser beam in an X axis and a Y axis, and irradiating the laser beam to the welding object.

Abstract: Method and apparatus for laser scoring a sheet material. An elongated laser beam having S-mode intensity profile in the width direction and a flat-top-mode profile in the length direction is used to achieve high precision scoring. The invention can be used for scoring large-size glass substrates for LCD displays.

Abstract: A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that includes pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving the substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves. The laser pulses may be delivered in a burst train for lowering the energy threshold for filament formation, increasing filament length, thermally annealing of the filament modification zone to minimize collateral damage, and increasing the processing speed compared with the use of low repetition rate lasers.

Abstract: The invention relates to a processing device (I) for elongate profile sections (2) comprising a clamping device (4) by means of which the elongate profile section (2) can be secured in a positionally stable manner, and a processing tool (6) by means of which the secured elongate profile (2) can be processed, a central component (5) being provided that has at least one first integrated guide (7) for the processing tool (6) and at least one second integrated guide (10, 11) for the clamping device (4).

Abstract: A laser machining apparatus, including: a laser light source; a transparent member that is set on an optical path of a laser beam and transmits the laser beam; a contact type temperature difference sensor, set on a surface of the transparent member outside an irradiation range of the laser beam, for detecting a temperature difference between a surface of the transparent member, which is spaced apart from a center of the transparent member by a first distance, and another surface of the transparent member, which is spaced apart from the center of the transparent member by a second distance larger than the first distance; and a controller correcting a focal position based on the temperature difference detected by the contact type temperature difference sensor to stabilize a beam diameter of the laser beam condensed onto a machining object.

Abstract: A method for remotely facilitating labeling of laboratory media may include placing a user request at a computing system serving as a remote computing system, the user request including print content to remotely facilitate labeling of a laboratory media within a laboratory environment. The laboratory media may include at least one of a media cassette or a media slide to hold one or more laboratory samples. The method may further include communicating the user request from the computing system to a printing device over a network. The printing device representing a local computing system. The method may further include remotely facilitating the printing device to label the laboratory media.

Abstract: A machining head of a laser machining apparatus comprises focusing optics which focus laser radiation. A measuring device measures changes of the focal length of the optics. The measuring device has a light source for generating measuring light different from the laser radiation. A light-exit window for the measuring light is imaged, with assistance of the focusing optics or a part thereof, onto a reflecting reference surface arranged to be stationary relative to the exit window and the focusing optics. A light sensor detects measuring light that has emerged from the exit window, has passed through the focusing optics or the part thereof, was reflected on the reflecting surface, and has again passed through the focusing optics or the part thereof. An evaluating device ascertains the change in the focal length of the focusing optics from measuring signals made provided by the light sensor.

Abstract: A method for orientating a focused laser cutting beam eccentrically relative to the nozzle axis of a cutting gas nozzle and a laser processing machine for performing the same, the method including: arranging a redirecting mirror in a beam path of the laser cutting beam upstream of the cutting gas nozzle, the mirror being rotated about a direction which is coaxial with the nozzle axis and/or about a direction which is perpendicular relative to the nozzle axis and which corresponds to the beam incidence direction of the laser beam on the redirecting mirror. The cutting gas nozzle and the redirecting mirror are arranged in a second structural unit of a laser processing head, for rotation about the direction corresponding to the beam incidence direction relative to a first structural unit.

Abstract: A detection apparatus and method for testing optical performance of beam shaping element used in ultraviolet lithography machine; The apparatus comprises visible wavelength laser and other optical units placed along the optical axis including, in order from laser side, (a) beam expander lens group, (b) beam splitter, (c) first far field imaging lens, (d) adjustable aperture or (e) CCD image sensor, (f) second far field imaging lens and (g) energy sensor. The detection apparatus is suitable be employed to detect the optical performance of beam shaping element working at any ultraviolet band, and provides the features of low cost, easy operation and quick measurement.

Abstract: A method for oblique laser beam cutting of a workpiece and system for performing the same, in which a supersonic flow of cutting gas discharged from a cutting gas nozzle is orientated at an oblique cutting angle with respect to a surface of a workpiece, and in which the workpiece and the laser beam are moved relative to each other during the oblique laser beam cutting operation. The oblique cutting angle extends along a plane that is perpendicular to a direction of advance. During operation, the position of the laser beam on the workpiece surface is adjusted in such a manner that the laser beam strikes the workpiece surface in a high-pressure region formed within the supersonic flow of the cutting gas.

Abstract: In QFN packages for vehicles which are required to have high reliability, the side surface of leads is mostly covered with lead-to-lead resin protrusions, which prevent smooth formation of solder fillets during reflow mounting. When the lead-to-lead protrusions are mechanically removed using a punching die, there is a high possibility of causing cracks of the main body of the package or terminal deformation. When a spacing is provided between the punching die and the main body of the package in order to avoid such damages, a resin residue is produced to hinder complete removal of this lead-to-lead resin protrusion. The present invention provides a method for manufacturing semiconductor device of a QFN type package using multiple leadframes having a dam bar for tying external end portions of a plurality of leads.

Abstract: Embodiments of the present invention relate to methods and apparatus for control of laser devices and safety features related to utilization of laser devices in substrate processing systems. In one embodiment, a system for processing a substrate is provided. The system includes a chamber having a processing volume, a first laser device to emit a beam at a first wavelength into the processing volume, and a second laser device to emit a beam at a second wavelength into the processing volume, wherein the second wavelength is different than the first wavelength, and the second laser device comprises a filter adapted to attenuate one or both of the first wavelength and the second wavelength.

Abstract: A machining head of a laser machining tool includes a mechanical connector for connecting the machining head to a component of the laser machining tool, and a light path connector (15) and/or an electrical connector (16) and/or a fluid connector (17). The provided connectors are designed such that connections can be realized via one or more common relative movements between the machining head (10) and the component (5) of the laser machining tool, including a mechanically rigid connection to corresponding connectors on the component of the laser machining tool.

Abstract: A method for laser-cutting a carbon fiber substrate such as a preform is configured from fabric material comprising at least carbon fibers, characterized by cutting the carbon fiber substrate at initial conditions which have been set so that the state of the substrate that is being cut with a laser can be suppressed with or prevented from deviating from a target state. By the method, it is possible to effectively solve various problems such as dissipation of heat, positional shifting from the focal length range of the laser, and soot, and the carbon fiber substrate can be stably cut at the target desired state.

Abstract: A path of a cutter head of a laser cutting machine is modified to cut features according to a pattern from a material. A no-travel zone that the laser cutter avoids while performing lateral movements between cuts is specified. Locations of the path that cross the no-travel zones are also specified. The path is then modified such that all locations that violate the no-travel zone are removed so that the laser cutter detours around the no-travel zone when performing the lateral movements.

Abstract: A laser cutting head powered by a laser emission apparatus including optical transmission devices and associated with a cutting machine tool, includes collimation device to collimate a laser beam coming from the laser emission apparatus, focusing device to focus a collimated laser beam leaving the collimation devices and a casing to house and contain the focusing unit. The focusing unit includes at least one focusing lens and support devices to house and hold the focusing lens and move it along an adjustment direction within the casing in order to vary a focal point of the laser beam leaving the focusing lens. The laser cutting head includes a cooling unit secured to the casing and heat conducting devices used to connect the support devices with the cooling unit in order to extract the heat generated by the laser beam crossing the focusing lens by thermal conduction from the support devices and from the focusing lens.

Abstract: A laser processing device (100) comprises a laser light source (101) for emitting a laser light (L) and a laser light source controller (102) for controlling the pulse width of the laser light (L) and irradiates an object to be processed (1) with the laser light (L) while locating a converging point (P) within the object (1), so as to form a modified region along a line to cut (5) of the object (1) and generate a fracture extending in a thickness direction of the object (1) from the modified region as the modified region is formed. In the laser processing device (100), the laser light source controller (102) changes the pulse width of the laser light (L) according to a data table in which the fracture length, the thickness of the object (1), and the pulse width of the laser light (L) are associated with each other. That is, the pulse width is changed according to the fracture length generated from the modified region.

Abstract: In a method and device for machining material, an unfocused beam of laser radiation is focused and directed at the material surface, creating an interface of laser radiation and material to be machined. The beam waist, which results from the focusing the laser radiation, is held in the region of the interface of laser radiation and material. The spacing of the beam waist from the upper or lower side of the interface in the axial direction corresponds at most to triple the value of the penetration depth of the interface into the material. The focusing is effected such that components of the laser radiation are made divergent not just in the propagation direction downstream of the beam waist but also in the beam waist itself and/or also in the propagation direction upstream of the beam waist.

Abstract: A laser irradiation apparatus for irradiating a laser beam to a semiconductor layer including a plurality of pixel areas, the apparatus includes a laser generator generating the laser beam, and an optical switching unit time-dividing the laser beam generated from the laser generator and transmitting a plurality of time-divided laser beams to a plurality of optical systems. The apparatus includes a first optical system of the plurality of optical systems that receives a first time-divided laser beam and irradiates a first laser slit beam along a first irradiation direction, and a second optical system of the plurality of optical systems that receives a second time-divided laser beam and irradiates a second laser slit beam along a second irradiation direction that is parallel with the first irradiation direction. The first laser slit beam and the second laser slit beam crystallize partial areas at a same location in the respective pixel areas.

Abstract: Systems and methods for laser processing continuously moving sheet material include one or more laser processing heads configured to illuminate the moving sheet material with one or more laser beams. The sheet material may include, for example, an optical film continuously moving from a first roller to a second roller during a laser process. In one embodiment, a vacuum chuck is configured to removably affix a first portion of the moving sheet material thereto. The vacuum chuck controls a velocity of the moving sheet material as the first portion is processed by the one or more laser beams. In one embodiment, a conveyor includes a plurality of vacuum chucks configured to successively affix to different portions of the sheet material during laser processing.

Abstract: An opening radial dimension is set as a radial direction permissible dimension K of the metal coil as expressed by the following equation or lower. K = Yp × Z 2 ? EI ? R 2 ? ( ? - sin ? ? ? ? ? cos ? ? ? ) Wherein: K is a radial direction permissible dimension at the load action point position in mm; Yp is a yield stress of the metal sheet, in kgf/mm2; Z is a section modulus of the metal sheet, in mm3; R=(a metal coil radius r)?½(the plate thickness t of the metal sheet), in mm; E is a Young's modulus of the metal sheet, in kgf/mm2; I is a second moment of area of the metal sheet in mm4; and ? is an angle in radians about the axis of the metal coil from the load action point to the nearest restraining roll along a rewind direction of the metal coil.

Abstract: A thermal cutter for cutting with heat a board mounted upon a table having an internal space includes a plurality of walls and a sound absorbent material. The walls are disposed in the internal space of the table to partition a plurality of exhaust chambers with each of the exhaust chambers having an aperture that opens towards a side on which the board is mounted. The sound absorbent material is provided to at least a portion of at least one of the walls, the sound absorbent material being removably coupled to the table.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam is provided. This laser processing method comprises a displacement acquiring step (S07 to S11) of irradiating an object to be processed with a rangefinding laser beam for measuring a displacement of a main surface of the object while converging the laser beam with a lens and acquiring the displacement of the main surface along a line to cut while detecting reflected light reflected by the main surface in response to the irradiation; and moves the processing objective lens and the object relative to each other along the main surface, while adjusting the gap between the processing objective lens and the surface according to the displacement acquired by the displacement acquiring step, thereby forming the modified region along the line to cut.

Abstract: Apparatus for drilling a via-hole in a printed circuit board (PCB) includes a carbon monoxide laser deliver laser radiation pulses. The pulses have a relatively broad wavelength-range, and slow rising and falling edges. The rising and falling edges of the pulses are clipped using and acousto-optic modulator. A dispersion-compensator compensates for dispersion in the clipped pulses introduced by the AOM. Achromatic focusing optics focus the dispersion-compensated, clipped pulses on the PCB for the via-hole drilling.

Abstract: Provided is a laser irradiation device for use in laser processing, and a laser processing method performed using the same. Provided is a laser irradiation device including: a light source that emits a laser beam; and an irradiation optical system which has one or a plurality of lenses, and is provided for light-guiding and light-converging of the laser beam emitted from the light source to the target substance, in which a birefringent material is used as a material entity of at least one lens of the irradiation optical system. Also provided is a laser processing method. The irradiation optical system may have a beam expander having a first lens that is a concave lens or a convex lens, and a second lens that is a convex lens, in the order along the laser-beam travel direction, the beam expander being configured so as to make the interval between the first lens and the second lens variable, in which a birefringent material may be used as a material entity of the first lens and/or the second lens.

Abstract: A movement control system is provided for cutting and welding applications which uses a laser movement detection system to detect deflection or displacement in a guide rail movement system. A movement controller controls the movement of the cutting or welding operation based on the detected laser beam displacement.

Abstract: Laser cutting processes are provided which are controlled using as a reference signal one or more emission lines which are characteristic of the radiation emitted by a gas or, more generally, by an emitting element present in the volume irradiated by the laser beam focussed by a laser head and adjusting, on the basis of this reference signal, at least one of the following process control parameters: the power of the laser, the frequency and the duty cycle of the laser pulse, the pressure of an assisting gas emitted by a nozzle forming part of the laser head, the relative speed of the laser head with respect to the workpiece, the distance between the laser head and the surface of the workpiece, and the distance between the focal point of the laser beam and the surface of the workpiece. Laser cutting devices are also provided.

Abstract: The invention relates to methods and an apparatus for cutting planar substrates charged with pharmaceutically active agents. In particular, the planar substrates comprise transdermal systems or orally dissolvable films.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

Abstract: A workpiece cutting apparatus includes a laser source, a first suction system, and a first finger configured to guide a workpiece as it moves past the laser source. The first finger includes a first end provided adjacent a point where a laser from the laser source cuts the workpiece, and the first end of the first finger includes an aperture in fluid communication with the first suction system.

Abstract: A relief manufacturing apparatus includes: a laser beam irradiating device configured to irradiate laser beam on an engraving material; a scanning device configured to move at least one of the engraving material and the laser beam irradiating device; a numerical value acquiring device configured to acquire a numerical value including a first inclination angle indicating inclination of the inclined face of the relief; a control device configured to control the scanning device and the laser beam irradiating device so that the laser beam is irradiated on a surface of the engraving material to form an initial inclined face having a second inclination angle smaller than the first inclination angle and thereafter the laser beam is irradiated on the initial inclined face to enlarge the inclination of the inclined face from the second inclination angle to the first inclination angle.

Abstract: The laser welding apparatus includes a welding head and a welding head scanning apparatus. A collimate lens installed on a head body of the welding head is arranged opposite to an end face of optical fibers. The welding head includes only the collimate lens as a lens and the length is shortened. A laser generated by a laser oscillator is introduced into the optical fiber, enters the collimate lens, and then is converted to a parallel beam by the collimate lens. The laser of a parallel beam is irradiated on a surface a welding portion of the welding object through a laser path and the surface of the welding portion is melted. Metallic powder is jetted from powder feed paths formed in a head body to the melted portion and build-up welding is performed on the surface of the welding portion.

Abstract: A laser machining device is provided with a laser light source, a spatial light modulator, a driving unit, a control unit, and a condensing optical system. The control unit selects a basic hologram corresponding to each basic machining pattern included in a whole machining pattern in a workpiece from a plurality of basic holograms stored by the storage unit, and determines a display region of the basic hologram in the spatial light modulator so that the deviation of the value of “I?/n” becomes small for the selected respective basic hologram when the intensity of a laser beam input to a display region of the basic hologram in the spatial light modulator is defined as I, the diffraction efficiency of the laser beam in the basic hologram is defined as ?, and the number of condensing points in a basic machining pattern corresponding to the basic hologram is defined as n.

Abstract: A laser cutting machine capable of producing focal points with the same size comprises a working platform, a pen housing, and a beam expander. The pen housing is movably provided on the working platform for receiving laser beams from a laser tube to cut an article provided on the working platform. The beam expander is provided in a laser beam output path between the laser tube and the pen housing, so that the laser beams are output after passing sequentially through the beam expander and the pen housing, wherein the beam expander is provided movably on the working platform, and the displacement of the beam expander is changed with the displacement of the pen housing, so as to produce focal points with the same size after the laser beams are output.

Abstract: This invention relates to a cutting apparatus for cutting food items conveyed on a conveyor including at least one conveyor belt. A cutter is arranged above a gap extending across the at least one conveyor belt. The cutter is positioned in relation to the gap such that the cutting path of the cutter extends through the food items and the gap and below the surface level of the at least one conveyor belt. The cutter is adapted to be connected to a control mechanism for operating crosswise movement of the cutter along the gap. The gap is formed between adjacent elongated supporting means such as rollers with a fixed internal arrangement, where the adjacent elongated supporting means and the cutter is adapted to be connected to a control mechanism for operating back and forth movement of the adjacent elongated supporting means and the cutter parallel to the conveying direction while maintaining the internal arrangement of the adjacent elongated supporting means and the cutter fixed.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.