Abstract: A printer includes: a first fixed printhead; a second fixed printhead positioned downstream of the first printhead relative to a media feed direction; a fixed platen for supporting print media; an input roller assembly positioned upstream of the first printhead, the input roller assembly comprising a pair of input rollers having a first nip force N1; an output roller assembly positioned downstream of the second printhead, the output roller assembly comprising a pair of output rollers having a second nip force N2; and an intermediary roller assembly positioned between the first and second printheads, the intermediary roller assembly comprising a pair of intermediary rollers having a third nip force N3. The nip forces satisfy the relationship N1>N2>N3 for optimal printing results.

Abstract: A method of manufacturing a component is disclosed. The method includes depositing a material on a removable form structure having geometry corresponding to an internal space of the component. The material is deposited on the removable form structure by an additive manufacturing technique. The method includes removing the removable form structure to obtain a pre-machined component, and then machining the pre-machined component to manufacture the component having the internal space.

Abstract: Provided are a combined machining apparatus and a combined machining method capable of performing machining with higher accuracy and at a high speed. The apparatus has a stage unit; a mechanical machining unit including a mechanical machining head having a tool configured to machine a workpiece; a laser machining unit including a laser machining head configured to emit laser for machining the workpiece; a moving unit; and a control unit that controls the operation of each unit, in which the laser machining head has a laser turning unit that turns laser relative to the workpiece, and a condensing optical system that focuses the laser turned by the laser turning unit, and a position at which the workpiece is irradiated with the laser is rotated by the laser turning unit.

Abstract: Provided is a glass film ribbon manufacturing device (1), including: a transverse conveyance unit (4), which is configured to convey a glass film ribbon (G) in a transverse direction; and a cleaving unit (5), which is arranged on a conveyance path of the transverse conveyance unit (4), and is configured to cleave the glass film ribbon (G) along a preset cleaving line extending in a longitudinal direction, the transverse conveyance unit (4) including a wrinkle-smoothing unit (14) configured to smooth a wrinkle generated in the glass film ribbon (G) before the glass film ribbon (G) is cleaved by the cleaving unit (5).

Abstract: Provided is a laser processing apparatus provided with: a first optical system including a first prism and a second prism; a second optical system including a third prism and a fourth prism; a condensing optical system that condenses laser light to guide the condensed laser light to a workpiece; a first driving device that rotates the first prism and rotates the second prism synchronously with the first prism; a second driving device that rotates the third prism and rotates the fourth prism synchronously with the third prism; and a controller that controls the first driving device and the second driving device such that the workpiece is irradiated with the laser light while the laser light turns.

Abstract: The present application is directed to a method and apparatus for processing a transparent or semitransparent material with a laser beam resulting in deterministic separation of a single sheet of the material into two or more pieces.

Abstract: There is provided a label preparing device including: a laser cutting section that forms a cutting line, which is an outline of a label piece, on a media by irradiating the media with laser beams; and a print section that applies ink to at least a peripheral part of the label piece after the cutting line is formed. It is preferable that the laser cutting section irradiates the media in an immobile state with laser beams, and the print section applies ink to the media in which the immobile state is maintained.

Abstract: A method of manufacturing a light emitting element includes: providing a wafer including a substrate and a semiconductor layered body formed at an upper surface of the substrate; irradiating the wafer with laser light by performing first and second patterns of scanning; and separating the substrate from the semiconductor layered body. In the first pattern of scanning, the wafer is irradiated with the laser light outwardly from an inner side of the wafer or inwardly from an outer side of the wafer, so that a region irradiated with the laser light enlarges. In the second pattern of scanning, the wafer is irradiated with the laser light so that the laser light intersects with a circumferential edge of the wafer at a plurality of portions.

Abstract: A substrate processing apparatus that performs processing by immersing a substrate into a processing liquid obtained by mixing phosphoric acid with a diluent includes a concentration sensing means for sensing the concentration of the processing liquid by measuring the absorbance characteristics of the processing liquid. The concentration sensing means includes a light-transmitting section that introduces the processing liquid into the inside to let the processing liquid pass therethrough, a light-emitting section that radiates light having a predetermined wavelength to the light-transmitting section, a light-receiving section that receives the light therefrom via the light-transmitting section, a first lens that condenses the light emitted from the light-emitting section to the light-transmitting section, a second lens that condenses the light that has passed through the light-transmitting section to the light-receiving section, and a cooling mechanism that cools at least one of these.

Abstract: A laser processing apparatus includes: a head main body housing an optical system; and a nozzle that is fastened to the head main body by thread fastening and that applies the laser beam to a workpiece. The nozzle has a nozzle hole through which the laser beam passes. A pressure chamber is formed between the head main body and the nozzle. The pressure chamber is a space surrounded by a bottom surface of the head main body, the bottom surface intersecting with a fastening direction in which the head main body and the nozzle are fastened together by thread fastening, and a bottom surface of the nozzle, the bottom surface intersecting with the fastening direction. The pressure chamber is supplied with air or assist gas. The nozzle has a communication hole that provides communication between the pressure chamber and the nozzle hole.

Abstract: According to one aspect, the invention relates to a device (1, 2, 3) for laser nanomachining a sample made of a material having a given transparency band, the device comprising: a focusing module (203, 703) allowing a nondiffracting beam (210, 710) to be generated, along a focusing line generally oriented along the optical axis of the focusing module, from a given incident beam; first means (202, 702) for emitting a first light pulse (I1) of spectral band comprised in the transparency band of said material, able to generate in said material, after focusing by said focusing module, a plasma of free charges along said focusing line via multi-photon absorption, thus forming a “plasma channel”; and second means (202, 702) for emitting at least one second electromagnetic wave (I2) of spectral band comprised in the transparency band of said material, which wave(s) is/are intended to be spatially superposed on said plasma channel in order to heat said material via absorption by the free charges of the plasma.

Abstract: Apparatus related to marking a metal surface are provided. The solution includes a bed for an object including a metal surface, the bed including a total marking area; a cover forming an airtight space over the bed; one or more laser marking units capable of directing a laser beam onto the metal surface located within a unit marking area, wherein the unit marking area is smaller than the total marking area. In the proposed solution control data including information on the marking of a pattern on the metal surface is received; the focus, bandwidth and movement of the one or more laser marking units is controlled on the basis of the control data to produce the pattern defined in the control data on the metal surface.

Abstract: Reliable coupling of a high-power laser beam into a liquid-jet in a liquid-jet guided laser system can be achieved with high lifetime performance of the nozzle and the protection window, through setting the parameters of the liquid-jet guided laser system according to an optimum relationship that links the focus point of the laser, the focus cone angle, the laser beam energy distribution profile and the nozzle geometry.

Abstract: A hexagonal single crystal wafer is produced from a hexagonal single crystal ingot. The depth of the focal point of a laser beam is gradually changed from a shallow position not reaching the depth corresponding to the desired thickness of the wafer to a deep position corresponding to the desired thickness of the wafer in such a manner that a parabola is described by the path of the focal point. When the spot area of the laser beam on the upper surface of the ingot becomes a predetermined maximum value, the deep position of the focal point is maintained.

Abstract: Magnetic components and a method for making them are described. A conducting material may be cut using a high power laser such as, but not limited to, a rare-earth fiber laser such as a Ytterbium fiber laser. Alternatively, a conducting material may be cut using an abrasive water jet. The magnetic components may be planar.

Abstract: Methods of separating a glass web include the step (I) of exposing a path on the glass web to at least one laser beam to produce thermal stress along the path without damaging the glass web. The methods further include the step (II) of creating a defect on the path while the path is under thermal stress produced during step (I), whereupon the glass web spontaneously separates along the path in response to the defect.

Abstract: Method embodiments of wafer dicing for backside metallization are provided. One method includes: applying dicing tape to a front side of a semiconductor wafer, wherein the front side of the semiconductor wafer includes active circuitry; cutting a back side of the semiconductor wafer, the back side opposite the front side, wherein the cutting forms a retrograde cavity in a street of the semiconductor wafer, the retrograde cavity has a gap width at the back side of the semiconductor wafer, and the retrograde cavity has sidewalls with negative slope; depositing a metal layer on the back side of the semiconductor wafer, wherein the gap width is large enough to prevent formation of the metal layer over the retrograde cavity; and cutting through the street of the semiconductor wafer subsequent to the depositing the metal layer.

Abstract: An optical system head of the laser processing machine includes a focusing optical system configured to deflect and condense an incident laser beam so that a target object to be processed is irradiated and a deflecting direction adjusting unit configured to adjust the direction of deflection of the laser beams about at least two axes perpendicular or substantially perpendicular to each other. A nozzle holding head of the laser processing machine includes a cutting nozzle configured to blow a cutting gas at a site of the target object, at which the laser beam is irradiated, and a nozzle position adjusting unit configured to adjust the position of the cutting nozzle in a top plane parallel or substantially parallel to the target object. The optical system head and the nozzle holding head are separately supported by an optical system nozzle support member configured to selectively advance or retract in three axis directions relative to the target object.

Abstract: An electrically safe treatment system for use in treating a patient includes two or more sections coupled with a joint that permits any one section to rotate relative to another coupled section. At least one of the sections includes an electrical component. An electrical contact associated with the joint is designed to maintain an electrical connection between a pair of sections throughout an angular range of motion of one of the sections relative to the other, coupled section. The electrical contact can also maintain a total resistance of a series connection including the two sections and the contact below a specified threshold. Alternatively, one or more insulator joints may be employed to meet safety requirements.

Abstract: The invention relates to a laser cutting method for cutting a stainless steel workpiece using laser beam generation means comprising a silica fiber with an ytterbium-doped core to generate the laser beam. Preferably, the laser beam generated by the ytterbium-based fiber has a wavelength between 1.07 and 1.09 ?m, a quality factor of the laser beam is between 0.33 and 8 mm·mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from O2, CO2, H2 and CH4.

Abstract: A laser processing apparatus includes a beam splitting unit disposed between a pulsed laser beam oscillating unit and a condenser. The beam splitting unit includes a half-wave plate that rotates the plane of polarization of a pulsed laser beam, a birefringent lens that splits the pulsed laser beam that has passed through the half-wave plate into ordinary light and extraordinary light, the birefringent lens being formed by joining two kinds of crystalline bodies to each other across a curved plane of a concave surface and a convex surface, and a splitting angle adjusting unit that moves the birefringent lens in a direction orthogonal to the pulsed laser beam that has passed through the half-wave plate to change the angle of incidence with respect to the curved plane and adjust a beam splitting angle.

Abstract: A method of cutting a glass article includes translating a laser beam relative to a first surface of the glass article. The laser beam includes a beam waist having a center. The center of the beam waist of the laser beam is positioned at or below a second surface of the glass article. The laser beam creates a plurality of defects along a score line in the glass article such that the plurality of defects extends a distance into the glass article, and at least some individual defects of the plurality of defects are non-orthogonal to the first surface of the glass article and are biased in a direction of translation of the laser beam. Glass articles having edge defects are also disclosed.

Abstract: A cell cutting device that cuts a mother substrate for display devices includes a fixing unit configured to move in a state where the mother substrate for display devices is fixed on the fixing unit, a cutter configured to perform a cutting process on the mother substrate for display devices and the cutter faces a surface of the mother substrate during the cutting process, a cutter driving unit driving the cutter in a state where the cutter is fixed thereon, and a buffer member arranged on another surface of the mother substrate to correspond to the cutter. The other surface is opposite the surface facing the cutter.

Abstract: A laser workpiece cutting system for performing a laser cutting operation on a workpiece. The laser workpiece cutting system includes a modular support unit configured to be easily assembled and disassembled. The modular support unit includes a plurality of individual components, which when assembled, are configured to support one or more workpieces for laser cutting. A frame includes siderails configured to support a plurality of support rails, each of which includes a plurality of pins configured to support and align one or more workpiece fixtures. The workpiece fixtures, in different embodiments, are adapted to support a wide variety of different types of workpieces including, glassware, writing instruments, leather products, novelty items, toys, and utensils.

Abstract: A laser system is configured to form laser-induced channels in a substrate at a plurality of spaced apart locations along a process path. The laser system includes a laser delivery assembly that receives the laser beam along a receiving axis and directs the laser beam toward the substrate along an impingement axis that forms an oblique angle with a surface of the substrate. The substrate can be divided into separate first and second portions along a separation surface having a draft angle, thereby facilitating substrate division with a zero-kerf process.

Abstract: A radially expansible annular stent is disclosed. The stent comprises a plurality of stenting turns around a lumen centred on a longitudinal axis. Adjacent turns of the stent are joined by connector struts. The stent annulus has a wall thickness related to the material from which it is formed. The radial thickness of the connector struts is smaller than that of the stent annulus. A method of making such a stent is also disclosed. The method includes cutting the connector struts from a tubular workpiece with a laser beam. The laser beam is aimed so as to be offset from a longitudinal axis of the workpiece to provide the reduced radial thickness of the connector struts.

Abstract: A method for manufacturing a carbon fiber component includes: placing a film with a texture on a first side surface into a mold, where a second side surface of the film abuts against an inner wall of the mold; injecting melted carbon fiber composite plastic into the first side surface through an injection port of the mold to obtain a component in a first shape; and obtaining a component in a second shape from the component in the first shape by using a material removal technique. Compared with the prior art, with the manufacturing method provided in the present invention, on the basis of ensuring a use strength requirement of a component, processing efficiency may be effectively increased. On this basis, the present invention further provides a carbon fiber component manufactured by using this manufacturing method.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: Methods and apparatus are disclosed for the preparation of microscopic samples using light pulses. Material volumes greater than 100 ?m3 are removed. The methods include inspecting an object with a scanning electron microscope (SEM) or a focused ion beam (FIB). The inspection includes recording an image of the object. The methods also includes delineating within the object a region to be investigated, and delineating a laser-machining path based on the image of the object so that a sample can be prepared out of the object. The methods further include using laser-machining along the delineated laser-machining path to remove a volume that is to be ablated, and inspecting the object with the scanning electron microscope (SEM) or a focused ion beam (FIB).

Abstract: A method and apparatus is described that allows accurate control of the width of fine line structures ablated by lasers in thin films on substrates when using scanner and focussing lens systems. The method provides dynamic compensation for optical distortions introduced by the scan lens at off axis points by increasing the laser power or energy in the beam in order to overcome the reduction in power or energy density.

Abstract: A system, apparatus, and method for releasing laser cut work pieces from a sheet of metal are provided. The system includes a support structure supporting a sheet of metal. A work piece is laser cut within the sheet of metal without completely cutting the work piece from the sheet of metal. At least one bracing member is connected to the support structure, whereby the bracing member partially inhibits movement of the sheet of metal when the sheet of metal experiences vibrations. A vibration device is engaged with the sheet of metal. Vibrating the sheet of metal causes the work pieces to separate from the sheet of metal.

Abstract: A control device has a monitoring section that monitors an amount of electric energy of a first machine, and a power supply controller that controls power supply of a second machine in accordance with an amount of electric energy of the first machine and schedule information indicative of an operation schedule of each of the first machine and the second machine.

Abstract: A laser beam combining device includes: a plurality of shaping optical units which emit circular laser beams which are different from each other in a change amount of an outer diameter per unit travel distance, wherein the plurality of shaping optical units are placed in such a manner that the circular laser beams emitted from the shaping optical units have a concentric shape.

Abstract: Described herein are an apparatus and a method for direct engraving an elastomeric printing plate by multiple laser beams simultaneously. In one embodiment, an elastomeric printing plate or sleeve is positioned on an imaging drum for direct engraving. The imaging drum is rotatable around its longitudinal axis. Such rotation defines a circumferential direction, also called the transverse direction. The axis of rotation defines an axial direction, also called the longitudinal direction. The printing plate has an body and a surface made of an elastomer (made of polymer or rubber). A drive mechanism provides relative motion between a plurality of laser beams and the plate in both the transverse and longitudinal directions.

Abstract: A machine for flatbed cutting of pieces from a strip of material (3) wound in a coil and moving continuously. The cutting zone (ZD) comprises a cutting head (17) supported by a mobile support (20) translatably mounted on a stationary longitudinal beam (18) disposed parallel to the direction of movement (A) of the strip of material. It is coupled to a first actuator (Mx) for moving the cutting head (17) linearly along a longitudinal axis (X) parallel to the beam and comprises a variable-geometry mechanism (21-24) coupled to a second actuator (My) for moving the cutting head (17) linearly along a transverse axis (Y), perpendicular to the longitudinal axis (X). A central control unit (9) controls the actuators to move the cutting head (17) in the cutting zone (ZD) along a path determined by the contour of the pieces (2) to be cut and the speed of the material (3).

Abstract: A workpiece cutting apparatus includes a cutting table with a workpiece receiving surface, at least two longitudinally-extending rails extending longitudinally on opposed sides of the cutting table and substantially parallel to one another, a bridge with an elongated cutting assembly support and engagement arms at opposed ends thereof, and at least two driving assemblies. Each one of the engagement arms includes a bridge engagement member engageable with a corresponding one of the at least two longitudinally-extending rails, from below. Each one of the driving assemblies operatively connects each one of the engagement arms to the corresponding one of the at least two longitudinally-extending rails. The at least two driving assemblies are actuable to translate the engagement arms along the at least two longitudinally-extending rails. A method of cutting a workpiece using the workpiece cutting apparatus and a method for assembling a workpiece cutting apparatus are also provided.

Abstract: A method for detecting drilling progress in laser drilling is provided. The method includes sensing a process condition during the drilling of an airfoil, and sensing a change in the process condition indicative of a breakthrough of a laser from the laser drill through a near wall of the airfoil. The method additionally includes continuing to sense the process condition subsequent to the sensed change in the process condition to improve the accuracy of the breakthrough detection.

Abstract: Lawn mower utilizing a work device having a plurality of blades for performing lawn mowing work. A power device is configured to transmit rotational power to each of the plurality of blades, and be capable of optionally changing the rotation number of the rotational power transmitted to each of the plurality of blades. A blade speed detection unit is configured to detect respective speeds of the plurality of blades to a ground. A control device is configured to perform energy-saving control of increasing and decreasing the rotation number of the rotational power transmitted to each of the plurality of blades in accordance with increase and reduction in the detected speed of each of the plurality of blades.

Abstract: A method for evaluating a trajectory function to be followed by a physical system includes providing the trajectory function; determining a set of sampling points by sampling a trajectory based on the trajectory function in the time domain; associating a cell to each of the sampling points; assessing at least one cell metric for each of the cells; aggregating the at least one cell metric of the cells to obtain an aggregated metric measure; and evaluating the trajectory as determined by the provided trajectory function depending on the one or more aggregated metric measures.

Abstract: A light emitting device having improved light extraction is provided. The light emitting device can be formed by epitaxially growing a light emitting structure on a surface of a substrate. The substrate can be scribed to form a set of angled side surfaces on the substrate. For each angled side surface in the set of angled side surfaces, a surface tangent vector to at least a portion of each angled side surface in the set of angled side surfaces forms an angle between approximately ten and approximately eighty degrees with a negative of a normal vector of the surface of the substrate. The substrate can be cleaned to clean debris from the angled side surfaces.

Abstract: A device for directing radiation in the direction of an optical element of an image sensing device of a vehicle. The device includes a central area for directing at least one portion of a first incident radiation onto the optical element. The device also includes at least one border area for directing at least one portion of at least one second incident radiation onto the optical element. The at least one second incident radiation runs in the opposite direction or at an obtuse angle with respect to the first incident radiation.

Abstract: Exemplary embodiments of apparatus, system, computer-accessible medium, procedure and method are provided which can be used for providing laser steering and focusing for, e.g., incision, excision and/or ablation of tissue in minimally-invasive surgery. For example, the exemplary apparatus can include at least one optical element which can be configured to refract and/or diffract light provided in a structure which can be configured to be inserted into a body, where at least one of the optical element(s) is structured to receive the light at a first angle and generate a refracted and/or diffracted light at a second angle which can be different from the first angle relative to an optical axis. For example, an actuating arrangement can be provided, which can be configured to control the optical element(s), can be provided and situated at least partially within the at least one structure.

Abstract: A processing information acquisition system in a processing machine which feeds a processing point energy or material, the processing information acquisition system provided with a position information acquisition unit which acquires position information of a feed unit of energy or material, a feed rate control unit which receives a feed condition command of energy or material, converts the feed condition command to a control command which controls a feed of energy or material, and uses the converted control command to control a feed rate of energy or material from the feed unit, a feed rate estimation unit which acquires the control command from the feed rate control unit and calculates an estimated feed rate of energy or material which is fed to a processing point based on the control command, and an output unit which outputs the position information which the position information acquisition unit acquired and the estimated feed rate which the feed rate estimation unit calculated when the feed unit is locat

Abstract: An apparatus for mounting and removing a component includes: a light source configured to radiate light toward a component supported by solder; a light sensor configured to sense displacement of the component; and a member mounted on the component, the member including a hole in a portion to be irradiated with the light of the light source.

Abstract: According to one aspect of the disclosed subject matter, a method for forming a monolithically isled back contact back junction solar cell is provided. Emitter and base contact regions are formed on a backside of a semiconductor wafer having a light receiving frontside and a backside opposite said frontside. A first level contact metallization is formed on the wafer backside and an electrically insulating backplane is attached to the semiconductor wafer backside. Isolation trenches are formed in the semiconductor wafer patterning the semiconductor wafer into a plurality of electrically isolated isles and the semiconductor wafer is thinned. A metallization structure is formed on the electrically insulating backplane electrically connecting the plurality of isles.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.

Abstract: A singulation apparatus and method including: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device with members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device with members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being configured and arranged for cutting the workpiece.

Abstract: A laser marker/pointer for projecting size-adjustable circular or elliptical laser beam patterns onto a target surface such as a portion of a presentation screen or to assist in the aiming of a firearm, comprises a handheld shell body in which is mounted a laser light source, a rotating wedge prism driven by an electric motor through a belt pulley or a gear system, two convex lenses, a DC power unit, and a mechanical and electric control unit. The rotating wedge prism is placed between the two convex lenses to refract the laser beam into an opening-angle adjustable hollow light cone. The projection of the hollow light cone onto a target surface generates circular or elliptical tracing patterns. The mechanical and electric control unit controls the laser pattern generation and its size adjustment through driving the wedge prism rotation around the emitted laser beam direction and its linear movement along the beam direction.

Abstract: A method of singulating a plurality of semiconductor dies includes providing a carrier substrate and joining a semiconductor substrate to the carrier substrate. The semiconductor substrate includes a plurality of devices. The method also includes forming a mask layer on the semiconductor substrate, exposing a predetermined portion of the mask layer to light, and processing the predetermined portion of the mask layer to form a predetermined mask pattern on the semiconductor substrate. The method further includes forming the plurality of semiconductor dies, each of the plurality of semiconductor dies being associated with the predetermined mask pattern and including one or more of the plurality of devices and separating the plurality of semiconductor dies from the carrier substrate.

Abstract: A highly elastic stent is made of an alloy that exhibits superelasticity at body temperature. At least a part of the highly elastic stent has such a property that load increases with displacement without exhibiting a distinct yield on a load-displacement curve obtained by a compression test and a bending test.