Abstract: A laser machining apparatus is provided with: a workpiece support unit; a machining head; and a machining head moving unit. The workpiece support unit includes: an end support part that supports a width end of a workpiece; and an inside support part that supports an inside portion of the workpiece in a width direction. The end support part is movable in a longitudinal direction independently from the inside support part in response to a movement of the machining head.

Abstract: Methods of forming scribe vents in a strengthened glass substrate having a compressive surface layer and an inner tension layer are provided. In one embodiment, a first and second defect is formed to partially expose the inner tension layer. A first scribe vent may be generated in a first scribing direction by translating a laser beam and a cooling jet on a surface of the strengthened glass substrate at a first scribing speed. A second scribe vent intersecting the first scribe vent may be generated in a second scribing direction by translating the laser beam and the cooling jet on the surface of the strengthened glass substrate at a second scribing speed that is greater than the first scribing speed. The defects may be perpendicular to the scribing directions. In another embodiment, the first scribe vent may be fused at an intersection location prior to generating the second scribe vent.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.

Abstract: Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measureable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.

Abstract: A machine for machining workpieces by a laser beam. The optical fiber terminates at an optical output head (27) that defines the optical axis of the laser light beam, which vaporizes the material. The optical output head (27) is rigidly attached to the frame (49) or to the casing of the laser head so that said optical output head remains integrally fastened to said frame or casing during the rotation of the laser head about the horizontal pivot axis (B). The polluted gases generated in the machining area by the evaporation of material are collected by a suction nozzle (37) which is driven with the laser machining head during its rotation about the horizontal axis (B). A stream of clean dry gas is injected into the machining area by an injection nozzle (35) which is also driven with the laser machining head (8) during its rotation about the horizontal axis (B).

Abstract: The invention relates to methods and systems for keyhole-free fusion cutting of a workpiece, wherein the workpiece is melted by a laser beam along a cutting joint and the molten mass produced is expelled from the produced cutting joint, e.g., by a gas jet at high pressure. According to the new methods at least one laser beam follows the laser beam in the cutting direction and influences the molten mass in such a manner that at least one of the two cutting flanks of the workpiece has a better cutting quality than when cutting without the trailing laser beam.

Abstract: Disclosed herein is a cutting frame including a plurality of cutters for cutting one or more kinds of rectangular unit pieces having a relatively small size from a rectangular base material at a predetermined inclination, the cutters being mounted or formed in the cutting frame such that the cutters correspond to the rectangular unit pieces, wherein the cutters are mounted or formed in the cutting frame based on the array structure of the rectangular unit pieces such that a large majority of the remaining rectangular unit pieces, excluding the uppermost row rectangular unit pieces and the lowermost row rectangular unit pieces, are arranged while being adjacent to different rectangular unit pieces at four sides of each rectangular unit piece, and at least some combinations of adjacent four rectangular unit pieces form an island-type residue in the center thereof.

Abstract: Methods, systems, and devices for establishing a wear state of a cutting nozzle of a laser processing machine. An actual state of the cutting nozzle shape is established by a three-dimensional evaluation performed by a nozzle shape sensor and an associated controller. The established actual state of the cutting nozzle shape is compared to a desired state of the cutting nozzle shape, and the wear state of the cutting nozzle is established based on a result of the comparison.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: Provided are a machining device (10), a machining unit, and a machining method that irradiate a workpiece (8) with a laser beam to perform cutting or boring machining of the workpiece (8). The invention has a laser output device (12), a guiding optical system (14) that guides a laser beam, and an irradiating head (16) that guides a laser beam and irradiates the workpiece (8) with the laser beam. The irradiating head (16) integrally rotates a first prism (52) and a second prism (54) with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece (8) while rotating the position of irradiation to the workpiece.

Abstract: A nozzle holder for a nozzle changer that is configured for at least one of mounting nozzles to and demounting nozzles from a processing head of a laser processing machine includes a nozzle storage chamber that widens along a nozzle removal direction to a nozzle removal opening. The nozzle storage chamber includes at least two nozzle storage seats that are offset in steps from each other and that store respective nozzles. A nozzle changer includes such several nozzle holders, and a laser processing machine includes such a nozzle changer.

Abstract: A material handling system for feeding sheet material to a laser cutting system. The material handling system including a shuttle having a number of roller pairs corresponding to a number of material coils. Each roller pair holding a leading end of one of the material coils. The shuttle translating the leading end of a selected material coil to a location at which sheet material from the selected material is fed to the laser cutting system.

Abstract: A pulse laser machining apparatus and method generates a clock signal, emits a pulse laser beam in synchronization with the clock signal, scans the pulse laser beam in synchronization with the clock signal only in a one-dimensional direction, moves a stage in a direction perpendicular to the one-dimensional direction, passes or cuts off the pulse laser beam in synchronization with the clock signal, and controls the passing or cutting off of the pulse laser beam based on the number of light pulses of the pulse laser beam.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: An optical system head of the laser processing machine includes a focusing optical system configured to deflect and condense an incident laser beam so that a target object to be processed is irradiated and a deflecting direction adjusting unit configured to adjust the direction of deflection of the laser beams about at least two axes perpendicular or substantially perpendicular to each other. A nozzle holding head of the laser processing machine includes a cutting nozzle configured to blow a cutting gas at a site of the target object, at which the laser beam is irradiated, and a nozzle position adjusting unit configured to adjust the position of the cutting nozzle in a top plane parallel or substantially parallel to the target object. The optical system head and the nozzle holding head are separately supported by an optical system nozzle support member configured to selectively advance or retract in three axis directions relative to the target object.

Abstract: A laser cutting machine includes a platform and a motion system. The motion system includes a first prismatic joint facilitating a first motion of the platform along a first direction and a second prismatic joint facilitating a second motion of the platform along a second direction. A galvano arranged on the platform, such that a motion of the platform causes a motion of the galvano, the galvano including a first mirror, wherein a third motion of the first mirror positions the laser beam along a third direction, and a second mirror, wherein a fourth motion of the second mirror positions the laser beam along a fourth direction. A control module controls concurrently the motion system and the galvano, such that a position of the laser beam on the workpiece is a vector sum of the first motion, the second motion, the third motion, and the fourth motion.

Abstract: The present invention relates to a cutting system for high precision cutting of substantially flat elements (1, 11), comprising a support plane (40) for said substantially flat elements (1, 11), a first axle (Xa) of motion and a second axle (Ya) of motion, perpendicular to the first axle (Xa) and parallel to the support plane (40), and a support (7) for a cutting device, placeable along such axles; the support plane (40) is moveable, independently from the support (7), along a third axle (Xw) of movement, parallel to the first axle (Xa), so as the relative movement of the support (7) in respect with the support plane (40) results in a first component corresponding to the sum of the movements along the first axle (Xa) and the third axle (Xw), and in a second component corresponding to the sum of the movements along the second axle (Ya).

Abstract: A capsule type reconfigurable multifunctional machining apparatus is disclosed. A capsule type reconfigurable multifunctional machining apparatus includes a rotating frame in which a plurality of processing modules may be installed to face an object to be machined disposed in a capsule type body and whose machining position and pose are controlled by rotation, a top frame for rotatably supporting the rotating frame, a bottom frame that is combined with the top frame under the top frame to support the top frame and in which vibration proof members are installed in positions where the bottom frame contacts the top frame, and a stage unit fixedly inserted into the internal center of the top frame to settle the object to be machined so that the height of the settled object to be machined may be controlled and in which an X-Y stage or a rotary stage may be selectively mounted.

Abstract: A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

Abstract: A laser cutting device for cutting an original product includes a laser device which is movable along a first direction and a second direction perpendicular to the first direction, and rotatable reflecting mirrors. The original product includes a stub bar, optical lenses, and connection portions corresponding to the optical lenses. The rotatable reflecting mirrors correspond to the connection portions and are positioned above the original product and aligned with the connection portions. At least two rotatable reflecting mirrors are arranged in a straight line. The laser device is located on the straight line and is configured for emitting laser beams. Each of the rotatable reflecting mirrors is configured for reflecting laser beams from the laser device toward the corresponding connection portion and is configured for rotating so as to allow the laser beams from the laser device to reach the next rotatable reflecting mirror on the straight line.

Abstract: It is intended to enable a substrate made of a thick plate material with a high laser beam absorption rate to be easily processed by means of boring or so forth in a short time. The present device includes a work table (2) on which a substrate is disposed, a laser beam output section (15), a rotation unit, a beam focusing unit and a scan unit. The laser beam output section (15) is configured to output a laser beam, having a wavelength with an absorption rate of 50% or greater, onto the substrate. The rotation unit is configured to rotate the laser beam emitted from the laser beam output section (15) with a predetermined rotation radius. The beam focusing unit is configured to focus the laser beam from the rotating unit onto a depth position included within the substrate, the depth position is located closer to one substrate surface disposed on a laser beam irradiation side than to the other substrate surface.

Abstract: Methods, devices and systems for detecting an incomplete cutting action when cutting a workpiece with a high-energy beam are disclosed. In one aspect, a method includes taking an image of a region of the workpiece to be monitored, the region including an interaction region of the high-energy beam with the workpiece, evaluating the image taken in order to detect pooled slag at an end of the interaction region opposite a cutting front, and detecting whether a related cutting action is incomplete based on an occurrence of detection of pooled slag.

Abstract: The invention is to a device and method, for cutting a can blank in which case an end section of the can blank is severed. The can blank is moved by means of a conveyor arrangement at a constant speed about a first axis of rotation. Preferably, a laser beam is used as the cutting means. A deflecting arrangement deflects the laser beam to a focal point where the side surface of the can blank is located. Due the rotation of the can blank about its longitudinal axis, the axial end section of said can blank is severed. The focal point of the laser beam does not change relative to the longitudinal axis of the can blank during the laser cutting operation.

Abstract: A stent manufacturing device and methods for making intravascular stents and other medical devices. The stent manufacturing device may include a base, a laser or other cutting device coupled to the base, a horizontal motor coupled to the base, and a rotary motor coupled to the horizontal motor. A workpiece can be attached to the cutting device, for example adjacent the rotary motor, and the workpiece can be cut with the cutting device.

Abstract: A laser scribing installation for the treatment of grain oriented magnetic sheets, as strip in longitudinal movement, comprising a laser generator for a laser beam, a cylindrical telescopic optical group with varying focal distance for the formation of a laser beam with elliptic section having varying ellipticity as function of the focal distances and a rotating mirror scanner for scanning the laser beam according to a pre-defined angle. The scribing installation further comprises a parabolic reflector extended transversally to the strip for receiving the scanned laser beam and focusing the beam on the strip, as a greatly lengthened elliptic spot, along a treatment path, and wherein the telescopic group is adjustable for modifying the length of one of the axes in the elliptic section of the laser beam incident on the strip.

Abstract: Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measurable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.

Abstract: A laser cutting method and a laser cutting apparatus cut a metallic work with a laser beam of a one-micrometer waveband. The method and apparatus carry out the laser cutting of the work with a ring beam RB passed through a focus position of a condenser lens 13 and having inner and outer diameters that tend to expand. The outer diameter of the ring beam is in a range of 300 ?m (micrometers) to 600 ?m, an inner diameter ratio of the same is in a range of 30% to 70%, and a focal depth of the condenser lens is in a range of 2 mm to 5 mm.

Abstract: A welding arrangement and a welding process for forming a weld seam between two edge portions, wherein the edge portions form a Y joint having a root portion and a bevel portion, said root portion being welded by a hybrid laser electric arc welding process including directing a laser beam and an electric arc in a single interaction zone of plasma and molten metal. A hybrid laser electric arc welding head and welding submerged arc welding head are arranged on a common carrier structure for welding the Y joint.

Abstract: An apparatus for laser scribing two transparent electrically conductive layers (72A,B; 73A,B) deposited on opposite surfaces of a transparent substrate (71A; 71B) comprising; a laser beam (74A), one or more lenses (75A, 76A, 77A) configured and positioned for adjusting the focal spot (78A; 78B) of the laser beam between a first position (78A) and a second position (78B), means for holding a substrate in a plane between the first and second position and means for moving the relative positions of the substrate (71A; 71B) and laser beam (74A) in two dimensions within the plane or a plane parallel to it, wherein in use, the first and second positions (78A; 78B) coincide with or are adjacent to exposed surfaces of the two transparent electrically conducting layers (72A,B; 73A,B).

Abstract: A calibration assembly has a base and mounting elements to mount the base to a laser. The base has a front, middle and rear portions that are used to align the calibration assembly to the laser to cleave optical fibers with the laser. The front portion has a channel to receive the optical fibers, the middle portion has openings to confirm alignment of the laser; and the rear portion has a rear opening used to adjust the pitch and roll of the laser.

Abstract: An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.

Abstract: A laser machining device with a proximity-warning function in relation to a workpiece being machined includes a laser element and a position feedback unit. The laser element includes a laser head for emitting a focused laser beam and a movable member for moving the laser head. The position feedback unit is positioned on the movable member and connected to an alerting circuit. When an elastic contacting member in the position feedback unit is compressed because the distance between the laser head and the workpiece is less than a minimum permitted distance the alerting circuit issues an alert.

Abstract: Cutting equipment is used to cut an object. The object includes at least two preformed products. The cutting equipment includes a support device and a cutting device. The support device supports the object. The cutting device includes a laser emitter configured for emitting a first laser beam, and an optical splitter configured for splitting the first laser beam into at least two second laser beams. Each second laser beam is configured for cutting the object to separate one of the at least two preformed products from the object.

Abstract: Systems and methods for improving the cutting efficiency and cut profile of stent strut is provided. A means for altering the energy distribution of a laser beam is provided, along with various ways of controlling a laser to provide for improved strut configurations are provided. A method for improved cutting speeds using a combination of laser sources is also provided.

Abstract: A laser cutting device is configured for cutting an original product. The original product includes a stub bar and an optical element. The laser cutting device includes a support member and a cutting member. The original product is moveably placed on the support member. The cutting member includes a checking unit and a laser cutting unit, and defines a cutting area. The checking unit checks whether the original product moves in the cutting area. The laser cutting unit cuts the original product, thereby separating the stub bar from the optical element if the original product moves in the cutting area.

Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

Abstract: A method of operating a plasma arc torch system includes placing a work piece to be cut on a table of the plasma arc torch system, wherein at least a portion of the work piece has a planer surface facing away from the table. A plasma arc torch is positioned adjacent the planer surface of the work piece using a positioning apparatus, wherein the positioning apparatus has at least five degrees of freedom about which it can move the plasma arc torch relative the work piece for cutting the work piece on the table. The method further includes angling the torch relative the planer surface of the work piece such that the torch is held at an angle of between about 1 and about 4 degrees from perpendicular with the planer surface to back burn a produced kerf such that a kerf edge is perpendicular relative the planer surface of the work piece. Additionally, the planer surface of the work piece is calculated by contacting the work piece with the torch at least three times.

Abstract: A laser processing apparatus includes a chuck table for holding a workpiece. A laser beam is applied to the workpiece. A laser beam oscillating unit oscillates the laser beam and a processing head having a focusing lens focuses the laser beam. A dust collecting unit collects debris generated by the application of the laser beam. The dust collecting unit includes a suction passage having an opening for allowing passage of the laser beam to be focused onto the workpiece by the focusing lens. The suction passage extends symmetrically with respect to the opening, and a vacuum source draws the debris. The suction passage has a first end and a second end selectively connected to the vacuum source.

Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.

Abstract: A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

Abstract: A laser machining apparatus that includes an interferometric height position detection unit, a condensing point position adjustment unit, and a confocal optical height position detection unit. A controller of the laser machining apparatus specifies, as a correction value, the difference between the two height positions of the upper face of the workpiece, one detected by the confocal optical height position detection unit and the other detected by the interferometric height position detection unit. The controller controls the condensing point position adjustment unit based on the height position obtained by correcting the height position of the upper face of the workpiece detected by the interferometric height position detection unit using the correction value.

Abstract: The invention relates to a system and method for forming sleeved containers. The system includes a conveyor for transporting a row of containers, a sleeving unit for arranging sleeves around containers and a heat oven for attaching the sleeve around the container by heat shrinking. The conveyed containers are provided with a sleeve and the sleeved container is transported in the oven to allow the sleeve to shrink. According to the invention, part of the sleeve is removed using a removal unit. The part is removed after heat shrinking. Removing the part allows to uncover part of the container otherwise covered by sleeve.

Abstract: A laser beam machining apparatus includes a height position detecting unit configured to detect the height position of an upper surface of a workpiece to be machined which is held on a chuck table, and a controller configured to control a condensing point position adjusting unit on the basis of a detection signal from the height position detecting unit. The height position detecting unit includes a detection laser beam oscillating unit configured to oscillate a detection laser beam having a wavelength different from the wavelength of the machining laser beam, and a reflected beam analyzing unit which analyzes a reflected beam generated upon reflection of the detection laser beam on the upper surface of the workpiece and which sends an analytical results to the controller. The laser beam machining apparatus further includes a condensing point position displacing unit configured to displace the condensing point position of the detection laser beam and the condensing point position of the machining laser beam.

Abstract: A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.

Abstract: A machining process and apparatus capable of increasing removal rates achievable when machining titanium and its alloys. The process includes heating a portion of a workpiece with a laser beam, cryogenically cooling a cutting tool with a cryogenic fluid without flowing the cryogenic fluid onto the workpiece, and machining the heated portion of the workpiece with the cutting tool. The apparatus includes a cutting tool, a device for heating a portion of a workpiece with a laser beam prior to being machined with the cutting tool, and a device for cryogenically cooling the cutting tool with a cryogenic fluid without flowing the cryogenic fluid onto the workpiece. The cryogenic fluid is circulated around the cutting tool to achieve a temperature differential between the workpiece and the cutting tool that is capable of improving removal rates and extending tool life at cutting speeds of, for example, above 100 m/min.

Abstract: A laser blanking system for cutting material stock includes a first series of conveyor lanes that include a plurality of support conveyors which are situated in parallel, generally spaced apart relationships. A second series of conveyor lanes is situated downstream from the first series. The second series includes a plurality of support conveyors situated in parallel, generally spaced apart relationships with respect to each other. The laser blanking system further includes a multiple-axis gantry system. The multiple-axis gantry includes a moveable transverse-axis component is supported by and moveable along a longitudinal-axis component that is situated adjacent to a longitudinal edge of the first and second series. A moveable laser head is supported by the transverse-axis component. A controller operatively controls movements of each one conveyor of the first and second lanes, the transverse-axis component, and the laser head as stock material is indexed downstream and supported by the system.

Abstract: A laser system including various optical components providing for beam alignment and process monitoring of a stent cutting process is described. The various aspects of the invention provide for monitoring of a beam of laser light reflected from the surface of a stent tube so as monitor the properties of the cutting beam, location of the beam, system cleanliness, optical defects in the system, and cutting efficiency of the laser.

Abstract: An apparatus and a method using a laser beam to produce a substantially vertical edge on a workpiece using a laser beam. The apparatus comprises a galvanometer for directing the laser beam and at least one substantially straight minor disposed in a substantially vertical position. The substantially straight mirror being positioned to redirect the laser beam on the workpiece at a selected incline, the incline being sufficient to produce the substantially vertical edge.

Abstract: A telecentric F-theta lens is added to the optical chain of a laser used to cut stent patterns into a stent tube to facilitate positioning and alignment of the laser beam and to compensate for lateral and angular shift of the beam spot.