Abstract: A laser ablation nozzle including a main pressure chamber centered on an area of a substrate to be ablated and arranged to push a stream of gas through the main pressure chamber onto the substrate. A vacuum chamber surrounds the main pressure chamber and is arranged to vacuum away the process gas and ablation debris. To attempt to address uneven pressure and flow, flow restrictors can be provided at one or both of the process gas inlet and the vacuum chamber. The vacuum flow restrictor is intended to create constriction in a channel to generate a uniform vacuum induced flow around substantially the entire circumference of the nozzle opening. Similarly, the process gas flow restrictor is intended to generate substantially uniform gas flow into the main pressure chamber.

Abstract: A wafer dividing apparatus for dividing a wafer along a plurality of crossing streets in the condition where the wafer is attached to the upper surface of a dicing tape supported to an annular frame and the strength of the wafer is reduced along the streets. The wafer dividing apparatus includes a frame holding unit for holding the annular frame, a wafer holding table having a holding surface for holding the wafer through the dicing tape supported to the annular frame held by the frame holding unit, a tape expanding unit for relatively moving the frame holding unit and the wafer holding table in a direction perpendicular to the holding surface of the wafer holding table to thereby expand the dicing tape, and a vibration generating unit for applying vibration to the holding surface of the wafer holding table.

Abstract: A cutting machine includes a suction duct that is movable with a cutting head of the cutting machine, using a common drive. The suction duct is disposed beneath the workpiece support and coupled to the motion unit supporting the cutting head so that it moves with the motion unit while an opening of the suction duct remains positioned below the cutting head during a cutting operation. The suction duct removes cutting debris and dust, and protects underlying machine components from beam damage.

Abstract: Methods for separating glass articles from glass substrate sheets are described herein. In one embodiment, a method includes focusing a laser beam on at least one surface of the glass substrate sheet such that the laser beam has an asymmetrical intensity distribution at the at least one surface of the glass substrate sheet. The method further includes translating the laser beam on the at least one surface of the glass substrate sheet along a desired groove line to form at least one groove on the at least one surface of the glass substrate sheet. The at least one groove extends partially through a thickness of the glass substrate sheet along the desired groove line and has bevelled or chamfered walls. The glass article may be separated from the glass substrate sheet along the at least one groove.

Abstract: Laser machining systems and methods may include debris removal systems to remove debris generated by the machining process and/or outgassing or filtration systems to remove harmful gases and filter and recycle air within the system. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost.

Abstract: Disclosed is a pole sheet laser cutting machine. It comprises a base frame component, a laser cutting device, a cutting manipulator component for driving the laser cutting device, a control system, and at least one sheet feeding assembly; the sheet feeding assembly comprises a material grabbing manipulator component, a fixed length feeding component and a material releasing component, with both the cutting manipulator component and the material grabbing manipulator component being mounted on the base frame component, the fixed length feeding component being arranged between the material grabbing manipulator component and the material releasing component, and the control system being connected to the cutting manipulator component, the material grabbing manipulator component and the fixed length feeding component.

Abstract: Laser processing machines (LM), in particular laser cutting machines with long-wave laser radiation (in particular CO2 laser), including at least one laser processing head (1), having interior (2) and nozzle (3) with nozzle orifice (4) for allowing a primary beam (5), in particular a focused laser working beam, to pass through and onto a work piece (6) and to align a gas current enveloping the beam, and an alignment device (15) with several sensors (13) for centering the primary beam (5), in particular a focused laser working beam, and the nozzle orifice (4) relative to each other. At least one conversion unit (9), in particular a conversion edge, is provided in the area of the nozzle orifice (4) for converting the primary beam (5) contacting it or impacting on it into one or more secondary electromagnetic heat beams (10) along at least one propagation direction (10A) in direction of the sensors (13).

Abstract: Methods of dicing substrates having a plurality of ICs. A method includes forming a multi-layered mask comprising a first mask material layer soluble in a solvent over the semiconductor substrate and a second mask material layer, insoluble in the solvent, over the first mask material layer. The multi-layered mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then plasma etched through the gaps in the patterned mask to singulate the IC with the second mask material layer protecting the first mask material layer for at least a portion of the plasma etch. The soluble material layer is dissolved subsequent to singulation to remove the multi-layered mask.

Abstract: Methods of dicing substrates by both laser scribing and plasma etching. A method includes laser ablating material layers, the ablating leading with a first irradiance and following with a second irradiance, lower than the first. Multiple passes of a beam adjusted to have different fluence level or multiple laser beams having various fluence levels may be utilized to ablate mask and IC layers to expose a substrate with the first fluence level and then clean off redeposited materials from the trench bottom with the second fluence level. A laser scribe apparatus employing a beam splitter may provide first and second beams of different fluence from a single laser.

Abstract: A system and method for removing material in a workpiece is provided. The system includes a laser system that melts a portion of the workpiece by heating the workpiece. The system includes a wire feeder system that feeds a wire to the workpiece to remove molten metal from the workpiece by using the wire. The wire is configured such that the molten metal adheres to the wire when the wire makes contact with the molten metal. The melting by the laser system includes a cutting or a gouging of the workpiece. In some embodiments, the system includes a hot wire power supply that supplies heating current through a length of the wire to heat the length of the wire to a desired temperature. The heating of the wire facilitates the adherence of the molten metal to the wire.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.

Abstract: Locations in a pattern of a part are evaluated to determine if the locations are interior or exterior to a feature of the pattern. The pattern is used to cut the feature from a material by a laser cutting machine. A location in the feature is rendered into an array stored in a memory so that a value stored at an address in the array corresponding to coordinates of the location is either odd or even as determined by a counting process of the rendering. Then, the location is identified as being interior if the value is odd, and as being exterior if the value is even. The rendering can use modified forms of either rasterization or ray casting.

Abstract: Methods for separating glass articles from strengthened glass substrate sheets and strengthened glass substrate sheets are provided. In one embodiment, a method includes forming at least one groove on at least one surface of the glass substrate sheet and strengthening the glass substrate sheet by a strengthening process. The groove defines the glass article and partially extends through a thickness of the glass substrate sheet. The method further includes generating an initiation defect on the groove at an initiation location to cause a through crack to self-propagate through the glass substrate sheet along the groove, thereby separating the glass article from the glass substrate sheet. In another embodiment, a strengthened glass substrate sheet includes a strengthened glass having a glass article groove and an initiation groove on a surface, the glass article groove defining a glass article.

Abstract: An apparatus comprises a table, a source emitting polarized laser light, a source emitting laser light, a plate changing the polarization direction of the laser light, a plate splitting the laser light into a laser light having polarization in an X direction and a laser light component having polarization in a Y direction, a plate orienting the polarization direction of the laser light to the X direction, a lens converging the laser light components, a lens arranged in parallel with the lens along the X direction and converges the laser light component, a control section controlling a device such that a converging point of the laser light component is located at a predetermined position with reference to a front face by detecting a reflected light, and a control section moving the table along a line while making the X direction substantially coincide with the line.

Abstract: A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table, a processing-feed means, an indexing-feed means, a processing-feed amount detection means for detecting the amount of feed, an indexing-feed amount detection means, and a control means, wherein the condenser constituting the laser beam application means comprises an elliptic spot forming means for forming a focal spot into an elliptic shape and a focal spot turning means for turning the elliptic focal spot on an optical axis at the center thereof; and the control means comprises a storage means for storing the X, Y coordinate values of a processing line formed on the workpiece, obtains the X, Y coordinate values of the current position of a laser beam application position based on detection signals from the processing-feed amount detection means and the indexing-feed amount detection means, and controls the focal spot turning means to ensure that the long axis of the focal

Abstract: A transport apparatus including an endless conveyor belt which is drivable by drive means, of which conveyor belt at least the outer side is embodied in a material which can withstand irradiation by the infrared laser radiation used to cut flat, thin materials such as textile, non-woven, sandpaper, cardboard, plastic film material present on the active upper part of the conveyor belt and carried along by this part. The invention further relates to a cutting device, comprising said transport apparatus. The transport apparatus is also used in a method for cutting flat, thin materials such as textile, non-woven, sandpaper, cardboard, plastic film material.

Abstract: There is provided high power laser systems, high power laser tools, and methods of using these tools and systems for cutting, sectioning and removing structures objects, and materials, and in particular, for doing so in difficult to access locations and environments, such as offshore, underwater, or in hazardous environments, such as nuclear and chemical facilities. Thus, there is also provided high power laser systems, high power laser tools, and methods of using these systems and tools for removing structures, objects, and materials located offshore, under bodies of water and under the seafloor.

Abstract: An apparatus can include a first beam cropper configured to crop a portion of a radiation pulse having a first spot size to form an intermediate cropped radiation pulse having an intermediate cropped spot with an intermediate cropped spot size less than the first spot size; and a second beam cropper configured to crop the intermediate cropped spot to form a second cropped radiation pulse having a second cropped spot with a second cropped spot size less the intermediate cropped spot size.

Abstract: A method for cutting off an edge portion of a workpiece includes applying a laser to the workpiece to form multiple individual severing cuts in the edge portion such that the edge portion is cut off from the workpiece, the multiple individual severing cuts being arranged together along the edge portion. Applying the laser to the workpiece to form the multiple individual severing cuts includes, for each individual severing cut, translating a laser cutting head and/or the workpiece relative to one another, and detecting, at an end of each severing cut, an edge of the workpiece, in which the translation of the laser cutting head or the workpiece continues at least until the edge is detected.

Abstract: The invention provides a method of laser processing that includes the steps of: generating a sequence of RF pulses corresponding to a sequence of laser pulses having a laser pulse repetition rate, the RF pulses including transmitting RF pulses at transmitting RF frequencies and non-transmitting RF pulses at non-transmitting RF frequencies for causing the sequence of laser pulses to be deflected in respective transmitting and non-transmitting directions, each RF pulse comprising an RF frequency, an RF amplitude and a duration; controlling each RF pulse such that the sequence of RF pulses provides a modulated RF drive signal that is modulated to provide a balanced thermal loading on the acousto-optic deflector; applying the modulated RF drive signal to the acousto-optic deflector; and deflecting at least one laser pulse with the acousto-optic deflector using the modulated RF drive signal to irradiate a selected target position with a predetermined pulse energy.

Abstract: What is described is: a method for cutting leaf-like or plate-like objects, in particular electrodes and/or separators for constructing an electrochemical energy store or parts of such electrodes or separators, wherein the cutting method has the following steps: (S1) leading the objects to be cut (1) up to a laser cutting apparatus (2), (S2) cutting the objects (1) with the laser cutting apparatus (2), and (S3) performing processing operations at the cutting edges (3) in order to reduce micro-short-circuits. The step (S3) of performing operations at the cutting edges (3) for reducing micro-short-circuits can comprise (S3a) structuring of the cutting edges (3) and/or application of support materials to the cutting edges (3).

Abstract: A method for cutting a sheet of material having a thickness of at most 400 ?m using an electromagnetic wave beam (EWB) such as a laser. The method comprises forming a surface initiation defect and irradiating the sheet along a predetermined path within a short distance from the initiation defect a scanning EWB, such that the sheet is heated and cooled to allow for the propagation of the initiation defect into the predetermined path, and further along the predetermined path to result in a separation of the sheet along the predetermined irradiation path. This method can be advantageously used to cut glass sheets having a thin thickness to result in high-quality edge substantially free of major defects carried over from the initiation defect.

Abstract: The present invention includes methods for treating laser-processed materials having an odor generated during the laser processing. The present method includes treating the laser-processed materials with heat to dissipate the odor from the material. The laser processed material may be secured to avoid curling during the heating process. The method can also include a cooling step after heating of the laser-processed material. Multiple cycles of heating and cooling may also be performed to substantially reduce or eliminate the odor from the laser-processed material. The invention also includes articles made according to the method and apparatus for producing laser processed materials having substantially reduced odor.

Abstract: A method for producing an energy cell, in particular an energy storage cell or battery, having the steps of: arranging a plurality of films of the energy cell at a processing location, and cutting the plurality of films in one operation, wherein the cutting of the films is carried out by a laser beam, and wherein the laser beam is guided in a liquid. Also an apparatus for producing an energy cell.

Abstract: The present invention includes methods for treating a laser-processed material that produces an odor due to the laser processing. The present method includes treating the laser-processed material with heat to dissipate the odor from the material. The method can also include a cooling step after heating of the laser-processed material. Multiple cycles of heating and cooling may also be performed to substantially reduce or eliminate the odor from the laser processed material. The invention also includes an article made according to the method and apparatus for laser processing with the produced article having substantially reduced odor.

Abstract: A laser machining apparatus comprising jet liquid, a laser beam, and a laminar flow forming channel for supplying jet liquid to a nozzle. The channel includes a distribution channel formed by a cavity, an interconnecting channel disposed to communicate with said channel downstream in an axial direction of the nozzle and formed by an annular cavity around the axis of the nozzle to provide a narrower flow passage, and a liquid reservoir chamber. Said chamber has an outer peripheral edge communicating with the interconnecting channel over an entire circumference of the annular shape. An outer peripheral surface and an outer peripheral surface of the chamber form a continuous surface and an inner peripheral wall surface and an inner peripheral surface of the channel are both formed as an inclined inward surface that is downstream, the inner peripheral surface and the inner peripheral wall surface forming a planar continuous surface.

Abstract: A display device is provided with a touch panel includes: a base substrate; a first transparent electrode layer located on the base substrate; an ultrasonic wave guiding layer located on the first transparent electrode layer; a second transparent electrode layer located on the ultrasonic wave guiding layer; an ultrasonic wave transmitting unit and an ultrasonic wave receiving unit located on the second transparent electrode layer; and a protecting layer located on the second transparent electrode layer.

Abstract: An apparatus may comprise a nondestructive evaluation system and a cutting system. The nondestructive evaluation system may be configured to inspect a processed portion of a structure. The nondestructive evaluation system may be configured to determine whether an inconsistency is present in the processed portion. The nondestructive evaluation system may also be configured to generate information about a location of the inconsistency. The cutting system may be configured to cut a number of parts out of the processed portion of the structure in which the inconsistency may be at least substantially excluded from the number of parts.

Abstract: A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.

Abstract: A method for producing an RFID transponder. An RFID chip is attached onto a conductive sheet. A portion of an antenna element is cut from the conductive sheet using a laser beam after the RFID chip has been attached to the conductive sheet.

Abstract: A light irradiation device and method for irradiating converged light with an object include a light source configured to output a light, a phase-modulating spatial light modulator, a controller, and a converging optical system. The phase-modulating spatial light modulator is configured to input the light outputted from the light source and to display a hologram modulating a phase of the light at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated light. The controller is configured to cause the spatial light modulator to display a hologram such that the light outputted from the spatial light modulator is converged at a plurality of converging positions. The controller causes the spatial light modulator to display a first hologram and performs a feedback of the first hologram so as to modify the first hologram. The modifying of the first hologram is performed by measuring intensity of the light converged.

Abstract: A system for fabricating vias in SiC and CVD diamond substrates through controlled laser ablation using short pulse lengths and short wavelengths.

Abstract: An optical device includes: a beam splitter by which a laser beam emitted from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.

Abstract: Embodiments of the present invention generally provide methods and apparatus for material removal using lasers in the fabrication of solar cells. In one embodiment, an apparatus is provided that removes portions of a dielectric layer deposited on a solar cell substrate according to a desired pattern. In certain embodiments, methods for removing a portion of a material via a laser without damaging the underlying substrate are provided. In one embodiment, the intensity profile of the beam is adjusted so that the difference between the maximum and minimum intensity within a spot formed on a substrate surface is reduced to an optimum range. In one example, the substrate is positioned such that the peak intensity at the center versus the periphery of the substrate is lowered. In one embodiment, the pulse energy is improved to provide thermal stress and physical lift-off of a desired portion of a dielectric layer.

Abstract: The present invention provides an apparatus and a system for improving depth of focus (DOF), wherein an optical lens for optical processing is actuated to vibrate whereby the DOF of the optical processing is increased due to the variation of focal point. In the embodiment of the present invention, an actuator is coupled to the optical lens for providing vibration energy wherein the optical lens is actuated by the vibration energy so as to vibrate on an optical axis thereof so as to increase the DOF during the optical processing, thereby improving the quality and efficiency of optical processing.

Abstract: Method and system for laser cutting is disclosed. Using a novel dual-focus optical conversion unit. The dual-focus optical conversion unit may comprise a beam splitter and a convex mirror. The beam splitter may be insensitive to the polarization of an incident beam. The convex mirror may be placed beyond and parallel to the beam splitter, wherein the surface of the convex mirror may be coated with a reflective phase-retarder coating.

Abstract: A combined machine for punching and laser cutting of a flat sheet metal includes a fixed base, a fixed punching head, a laser cutting head and a manipulator for the movement of the sheet metal on a Cartesian plane. The laser cutting head is carried by a variable-aperture compass structure, which is mobile along a linear guide.

Abstract: The invention relates to a method for processing a movable substrate by means of laser, wherein the processing results in the release of material separated from the substrate, wherein during processing of the substrate a higher pressure prevails on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate, and to a device for performing such a processing, wherein the device comprises guide means for guiding the substrate and laser processing means adapted to cast onto the substrate a laser spot which processes the substrate in a laser processing zone, and comprises means for generating a higher pressure on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate.

Abstract: A method for monitoring the quality of laser-machining processes (500), in particular laser-cutting or laser-welding processes, including the operations of: acquiring via sensor means (540), in particular optical sensors, a machining-process signal (Xp) and calculating from said signal representing the process (Xp) parameters (E1, E2, DC) that represent the machining quality during the laser-machining process; and making available (130) corresponding reference parameters (E1r, E2r, DCr) representing a given machining quality, which are calculated from a process reference signal (Xr) acquired via said sensor means (540).

Abstract: In a device for material processing by means of laser radiation, said device comprising a source of laser radiation emitting pulsed laser radiation for interaction with the material; optics focusing the pulsed processing laser radiation to a center of interaction in the material; a scanning unit shifting the positions of the center of interaction within the material, wherein each processing laser pulse interacts with the material in a zone surrounding the center of interaction assigned to said laser pulse so that material is separated in the zones of interaction; and a control unit which controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction, it is envisaged that the control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a ?10 ?m from each other.

Abstract: Provided is a repair machine based glass substrate re-marking method, including (1) providing a repair machine and a digital micro-mirror device, in which the repair machine includes a main body, a carrier panel, a control unit, a storage unit, and a laser head; (2) mounting the digital micro-mirror device to the laser head and electrically connecting the digital micro-mirror device to the control unit; (3) placing a glass substrate to be marked on the carrier panel, the glass substrate having a photo-resist layer; (4) operating the control unit to retrieve a corresponding template pattern document from the storage unit and transmitting a template pattern signal of the template pattern document to the digital micro-mirror device; and (5) operating the laser head to emit a laser beam, which is projected by the digital micro-mirror device to the glass substrate to effect exposure of the photo-resist layer on the glass substrate.

Abstract: This disclosure provides apparatus and methods for scribing a substrate. In one aspect, an apparatus includes optics for focusing a scribe beam onto a substrate and a beam focus adjustment mechanism for adjusting the optics. A triangulation-based distance sensor determines a distance between the triangulation-based distance sensor and the substrate, with the triangulation-based distance sensor being positioned at a location offset from the scribe beam. Reflecting elements are positioned to reflect an incident beam from the triangulation-based distance sensor's source to the substrate and then back to the triangulation-based distance sensor's detector. The beam focus adjustment mechanism adjusts the optics based on the distance between the triangulation-based distance sensor and the substrate so that the scribe beam is focused at a desired position on the substrate.

Abstract: A device for cutting a structure including nanotubes, including: a mechanism to polarize linearly laser pulses emitted in a direction of the structure, wherein a duration of the laser pulses is roughly between 1 femtosecond and 300 femtoseconds; and a mechanism to focus the linearly polarized laser pulses on the structure.

Abstract: The apparatus and method for controlling laser cutting through surface plasma monitoring provides real-time monitoring and control of laser cutting quality. Laser cutting of a workpiece is controlled through monitoring of surface plasma generation, particularly during a laser gas-assisted cutting process. The apparatus includes a Langmuir probe positioned adjacent the impingement point of the laser beam on the workpiece. The Langmuir probe is in communication with a signal analyzer for measuring electrical voltage generated by plasma generated by the cutting of the workpiece. A controller is provided for comparing the measured electrical voltage with a desired threshold voltage. Control signals are generated to selectively adjust output power of the laser responsive to the compared measured electrical voltage and the desired threshold voltage to minimize plasma generation.

Abstract: The present invention is directed to a method for forming a metal mask. The method includes mounting a metal frame to a periphery of a supporting structure of a worktable, next placing a thin metal plate in a flat manner on a top surface constructed by the metal frame and the supporting structure, next forming a prototype mask by welding the thin metal plate with the metal frame, next forming multiple mesh holes in the thin metal plate by performing a laser drilling process to the prototype mask using a laser drilling apparatus.

Abstract: This invention provides two variations of methods of separating a surface layer (307) of the semi-conductor crystal (101). In the first variation of the method, a focused laser beam (102) is directed onto the crystal (101) in such a way that focus is placed in the layer separation plane (304) perpendicular to the axis (103) of said beam (102), the laser beam (102) is moved with scanning the layer separation plane (304) with focus in the direction from the open side surface of the crystal (101) deep into the crystal with forming a continuous slit width of which is increased with every pass of the laser beam (102), the previous operation is performed up to separation of the surface layer (307).

Abstract: A laser processing apparatus including a workpiece holding unit for holding a workpiece and a laser beam applying unit for applying a laser beam to the workpiece held by the workpiece holding unit. The laser beam applying unit includes a laser oscillator for oscillating a laser beam, a focusing unit for focusing the laser beam oscillated by the laser oscillator onto the workpiece held by the workpiece holding unit, and an optical system provided between the laser oscillator and the focusing unit for transmitting the laser beam oscillated by the laser oscillator. The laser beam applying unit further includes a wavelength converting mechanism provided between the optical system and the focusing unit for converting the wavelength of the laser beam oscillated by the laser oscillator into a short wavelength.

Abstract: A laser cutting apparatus includes a galvo scanner system and a nozzle assembly. The galvo scanner system includes an outlet. The nozzle assembly includes a nozzle and a sleeve threadedly connected to each other, the sleeve mounted on the outlet of the galvo scanner system, the nozzle defining an air entrance. A gas supply is connected to the air entrance, and flows out of the nozzle.

Abstract: A laser cutting system including a chamber configured to provide a controlled environment while the laser is being used to cut a pattern into a material to reduce or eliminate heat and oxygen related changes to the mechanical characteristics of the material. A system for providing a gas to the controlled environment within the chamber, as well as a means for exhausting gas and cutting debris from the chamber is also described. A cutting mandrel that provides for flow of a shielding gas and also provides a means for dispersing a laser beam before it can produce unwanted damage to a section of tubing is also described.

Abstract: When forming a micromachined part by water jet guided laser machining at a machine component 20, a point for forming a micromachined part is machined while moving a laser head 7 side and machine component 20 side so as to obtain a desired shape of a micromachined part.