Abstract: Low melting point metal such as Zn is sprayed onto a flat surface (3a) of an aluminum flat tube (3) to form a sprayed metal coating (15) thereon inmediately after extrusion of the flat tube. Inmediately thereafter, a brazing foil (11) is integrally adhered onto the sprayed metal coating (15). The obtained flat tube (3) with the brazing foil is combined with a corrugated fin (4) to form a temporary assembly. Then, the temporary assembly is heated at a predetermined temperature to braze the tube (3) and the fin (4) to thereby form a heat exchanger core. The low melting point metal may be sprayed on both the flat surface (3a) of the flat tube and the surface of the brazing foil (11). Thus, it becomes possible to obtain a lightweight thin fin and to decrease material costs.
Abstract: A method for forming a miniaturized shaped component. Bulk superplastic material is contacted with a flat rotating surface of a rotating tool to frictionally heat the bulk superplastic material with the bulk superplastic material positioned between the flat rotating surface of the tool and a microfabricated tool die. The bulk superplastic material is forced into the microfabricated die once the bulk superplastic material is heated to a temperature between a glass transition temperature and a crystallization temperature.
Abstract: To provide a strip connecting apparatus and a method therefor which are less costly, short in welding time and high in welding quality. A strip connecting apparatus is provided with: a surface coating removing device for removing insulative surface coating of end portions, to be welded, of a leading strip and a trailing strip before cutting the strips; a cutting device for cutting the end portions, to be welded, of the leading strip and the trailing strip; and a welding device for overlapping the cut end portions of the leading strip and the trailing strip and seam welding the cut end portions with each other.
Type:
Grant
Filed:
May 25, 2000
Date of Patent:
October 21, 2003
Assignee:
Mitsubishi Denki Kabushiki Kaisha
Inventors:
Akimichi Takeda, Keiji Sodeno, Masaru Yoshida
Abstract: A method for joining a first part to a second part wherein the first part comprises machine cast iron and the second part comprises case-hardened steel comprises abrading a surface on each of the parts which are to be welded together with a groove, fitting the abraded surfaces together to form a welding groove and high-energy beam welding within austenitic welding wire for joining the parts together.
Type:
Grant
Filed:
April 24, 2001
Date of Patent:
July 8, 2003
Assignee:
Steyr-Daimler-Puch Fahrzeugtechnik AG & Co. KG
Abstract: During manufacture of certain hollow profiles suitable for use in car body construction the welded profiles are subjected to a further deformation process, namely hydroforming. At present the corresponding welding machines are charged manually. The invention relates to a method and a device for transferring hollow-profile blanks, characterized in that during transfer the positioned fusion faces of the blanks are pressed against each other at least in the area of the weld.
Abstract: A band saw strip manipulator is arranged to receive a toothed metal strip for welding from a cut to length machine. The strip is moved into the band saw strip manipulator by powered rollers. The strip extends between a first edge detector at one side of the manipulator and a second edge detector at the opposite side of the manipulator. First and second end clamps are located to either side of a carriage mounted for vertical movement. When the strip has been approximately centrally located in the manipulator the carriage moves upwardly thereby pulling the strip upwardly until the edge detectors detect the ends of the strip. The first and second end clamps are then closed and pivoted about first and second guide rollers so that the two ends of the strip are located in close proximity for welding together.
Abstract: The present invention relates to a solder ball shaping tool and a method for using the tool. In a substrate there is formed a series of depressions. The tool is pressed onto a ball grid array and the ball grid array is realigned either with simple pressure or pressure assisted by heating. Where a solder ball may have been deposited upon a die or a chip package in a diameter that exceeds that of the designed diameter, a corral tool is used to substantially conform the solder ball to design dimensions and a design location. As the corral tool is pressed against the solder ball, portions of the solder ball will reflow both into the substrate depression and into the corral. Where the total volume of the solder ball does not exceed that of both the corral and the substrate depression, the corral tool is adequate to achieve a designed solder ball height.
Abstract: An apparatus and method for forming slotted wire screens is provided. According to one embodiment, the method involves the steps of (1) providing support ring material; (2) positioning a wire on the support ring material; (3) joining the wire and the support ring material; and (4) bending the support ring material to form a ring of a radius. The steps of joining and bending are performed at substantially the same time. According to another embodiment, the apparatus includes a device for pushing support ring material; a device for providing the support ring material with an adhesive, such as a brazing compound; a device for positioning a wire on the support ring material; a heating zone for heating the support ring material and the wire; and a device for bending the support ring material.
Abstract: Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic material. A sputtering insert includes a substantially cylindrical side wall and is concentrically received within, and bonded to, the outer shell. The sputtering insert is composed of a relatively high purity metallic material as used for depositing a thin layer or film onto a desired substrate.
Type:
Grant
Filed:
April 9, 2001
Date of Patent:
July 16, 2002
Assignee:
Tosoh SMD, Inc.
Inventors:
Melvin K. Holcomb, William E. Barnes, Steven L. Bardus
Abstract: The present invention relates to a new type of lining with two layers, one of which, obtained by welding deposit, can be used for the protection of internal surfaces of chemical equipment capable of abide pressures lower than 100 MPa, in processes for the direct synthesis of urea. The present invention also relates to an original method for the preparation and installation of this lining, by the assembly of laminar elements with two layers, obtained by welding deposit on relatively thin stainless steel plates, so as to avoid significant distorsion effects on the plate itself.
Abstract: A method and article of fabrication is described featuring a solder layer having a serpentine, interrupted, or interdigitated boundary. The non-planar design of the boundary layer increases the fatigue life of the solder joint by limiting the damage caused by micro-cracking. This irregularity of the solder boundary constrains the propagation of cracks by creating obstacles along the crack path, redirecting the crack away from the intermetallic layer, or by increasing the path along which the crack propagates.
Type:
Grant
Filed:
November 1, 1999
Date of Patent:
February 19, 2002
Assignee:
International Business Machines Corporation
Inventors:
Seungbae Park, Sanjeev Sathe, Aleksander Zubelewicz
Abstract: A method for making wire of brittle alloys including coating rods of the brittle alloy with refractory fluoride and organic polymer, loading the coated rods into a container, filling the container with metallic powder, sealing the container, heating the filled and sealed container, extruding the filled container into a diminished diameter and elongated length bar filled with reduced diameter wires, removing the container from the wires, and separating the wires. Alternatively continuously passing brittle alloy wire through a clamshell furnace, a liquid gas quench, roll reduction process, cleaning and polishing process, and final storage process.
Abstract: A device for precision X-irradiation of the macular region of the retina of a patient's eye has a mounting plate mounted to a linear accelerator collimator. A housing extends from the mounting plate, and a secondary collimator is positioned in the housing. An elongate aperture extends through the secondary collimator and is in linear alignment with an axis of an X-ray beam emanating from the linear accelerator collimator. A support member extends outwardly from a side of the housing, and an elongate, hollow, sight tube is mounted on the support member. The longitudinal axis of the sight tube aligns with the axis of the X-ray beam so that the axis of the sight tube and the axis of the X-ray beam intersect each other. A light beam is transmitted down the sight tube. The light beam impinges on a cornea of a patient's eye. Light reflected from the cornea is transmitted up the sight tube so that impingement of the light beam on the cornea can be observed through an upper end of the sight tube.
Abstract: A method for producing rotational-symmetrical sheet metal articles with double-curved shape and varying thickness, particularly rocket nozzles, in which a number of sheet metal part-blanks in flat condition are cut to partially circular ring-like shape, whereupon said part-blanks are bent to the desired curvature and welded together to form a blank of the article for final machining.
Abstract: The invention relates to a method for manufacturing an electrode wire for an electrical discharge machining apparatus, which is composed of a core wire formed of Cu or Cu-alloy and a covering layer formed of brass. A brass tape is longitudinally applied around a core wire to provide a pipe, a seam formed by butting longitudinal edges of the brass tape is continuously welded to provide a composite wire, area-reduction process of reduction rate less than 65% is applied to the brass pipe by means of a squeezing die, a heat treatment at a temperature higher a recrystallization one of brass is applied to the composite pipe, and thereafter the composite wire is processed to be reduced in area through plural reducing dies step by step.
Abstract: The present invention relates to a solder ball shaping tool and a method for using the tool. In a substrate there is formed a series of depressions. The tool is pressed onto a ball grid array and the ball grid array is realigned either with simple pressure or pressure assisted by heating. Where a solder ball may have been deposited upon a die or a chip package in a diameter that exceeds that of the designed diameter, a corral tool is used to substantially conform the solder ball to design dimensions and a design location. As the corral tool is pressed against the solder ball, portions of the solder ball will reflow both into the substrate depression and into the corral. Where the total volume of the solder ball does not exceed that of both the corral and the substrate depression, the corral tool is adequate to achieve a designed solder ball height.
Abstract: A plate link (1), for attaching a clasp link (5) to the end of an ornamental chain (4), is provided for welding electrically at point (2) to constitute an unopenable ring, at one side of which is attached the end (3) of the ornamental chain (4) and at the other side of the clasp link (5) of a normal type. The novel method of attaching the end of a chain to a clasp link by means of the plate link involves the use of electrically welding the plate link and is carried out in the absence of any weld material.
Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a moving mechanism is provided for relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing glade. A method for bonding is characterized by bonding metal plates by using the above apparatus.