Abstract: In a lead-free solder, a semiconductor package and a method of manufacturing the semiconductor package, the lead-free solder includes about 3.5 percent by weight to about 6 percent by weight of silver, about 0.05 percent by weight to about 0.5 percent by weight of copper and a remainder of tin. The lead-free solder is employed in the semiconductor package. The lead-free solder has high impact resistance and high heat resistance to reduce failures of the semiconductor package.

Abstract: A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.

Abstract: A method for assembling a direct injection fuel rail of an internal combustion engine includes the steps of: designing a fuel distribution tube having a first radius, mating a fuel rail component having a second radius that is different from the first radius with the fuel distribution tube, forming at least one projection point where the fuel rail component contacts the fuel distribution tube, consuming the at least one projection point during a resistance welding process, and forming a temporary bond between the fuel rail component and the fuel distribution tube. By intentionally mismatching the radii of fuel rail components, projection points are created that can be consumed during a resistance welding process. As the projection points are consumed, a temporary bond is formed between the fuel distribution tube and the fuel rail component, and a braze joint gap is optimized, which enables formation of a high quality braze joint.

Abstract: A method is provided for forming a metallic overlay having enhanced toughness. The metallic overlay may be a weld, a metallic coating, or similar application. The method includes applying a glass forming metallic alloy to a substrate while the alloy is in a molten or semi-molten state. At the interface of the metallic alloy overlay and the substrate the substrate metal becomes at least partially molten and combines with the alloy to form metallurgical bonds. When the metallic alloy cools it experiences a high relative degree of thermal contraction. The metallurgical bonds between the substrate and the alloy constrain the contraction of the alloy at the interface with the substrate. This results in the inducement of compressive stresses in the metallic alloy overlay. The induced compressive stresses inhibit the formation of cracks in the overlay and/or mitigation of the effects of any cracks in the overlay.

Abstract: The invention relates to a method of producing and joining superalloy balls by means of brazing and to objects produced with such joints. According to the invention, an alloy powder covered with a brazing solder is bonded to a spherical core and subsequently transformed into a continuous alloy layer by means of brazing.

Abstract: A method for brazing a first metal member, on which an oxide forms during brazing, and a second metal member, in which a high-wettability metal having a wettability with a brazing filler metal that is higher than that of the oxide is applied to at least a brazing surface of the first metal member. The first metal member and the second metal member are then joined by heating the brazing filler metal to melt the brazing filler metal. The oxide covering film is formed on the portion of the surface of the first metal member to which the high-wettability metal was not applied.

Abstract: A method is provided for the removal of tin or tin alloys from substrates such as the removal of residual tin solder from the molds used in the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-known C4NP interconnect technology and uses an etchant composition comprising cupric ions and HCl. Cupric chloride and cupric sulfate are preferred. A preferred method regenerates cupric ions by bubbling air or oxygen through the etchant solution during the cleaning process.

Abstract: A method of mounting a conductive ball according to the present invention includes the steps of, disposing a mask on a substrate including connection pads, the mask having opening portions corresponding to the connection pad, supplying conductive balls on the mask, arranging the conductive balls on the connection pad of the substrate through the opening portions of the mask by moving the conductive balls to one end side of the mask by ball moving member (a brush), and removing excess conductive balls remaining on a region of the mask where the opening portions are provided, by bonding the excess conductive balls to a ball removal film (adhesive film).

Abstract: Certain examples disclosed herein are directed to devices that include a substrate and conductor disposed on the substrate. In some examples, each of the conductor and the substrate may include materials that are mutually insoluble in each other. In other examples, the conductor may further comprise a substantially pure metal. In certain examples, the disposed conductor may be configured to pass adhesion tape test ASTM D3359-02. Methods of forming the conductors are also provided.

Abstract: When different paste solder materials are printed to circuit patterns on a substrate, a plurality of metal masks corresponding to kinds of solder materials are used so as to perform printing in a manner corresponding to each of the solder materials, so that the particular solder materials are supplied to particular components in the same flat surface. One of the metal mask is provided with a depression so that the mask does not contact the solder material which has already been printed, and the metal mask is further provided with another depression to reduce an amount of the solder material supplied.

Abstract: There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each of conductive balls on each of the plurality of pads, the plurality of ball mounting through holes being arranged to oppose to the plurality of pads; and a conductive ball supplying unit for moving or removing the conductive balls on the conductive ball mounting mask by sucking an air on an upper surface side of the conductive ball mounting mask. The conductive ball mounting mask includes through portions formed to block passing of the conductive balls.

Abstract: A liquid-cooled armature bar end fitting-to-strand brazed connection. The end fitting is comprised of a main body and a cover, and defines a cavity, a bottom wall of which is defined in part by the cover. An armature winding bar strand package including solid strands and hollow strands arranged in a tiered array extends into the end fitting so that at least the free ends of the hollow strands extend beyond the bottom wall, into the cavity. The side wall of the cavity is spaced from the hollow strands. A braze alloy joins the strands to each other and to the end fitting. The braze alloy forms an isolation layer over the free ends of the solid strands and over the said bottom wall of the cavity to a depth above a horizontal junction between the main body and the cover.

Abstract: A brazing material including about 20 to about 60 percent by weight silver, about 1 to about 4 percent by weight aluminum, about 20 to about 65 percent by weight copper, about 3 to about 18 percent by weight titanium and about 1 to about 4 percent by weight nickel.

Abstract: A brazing product for low temperature fluxless brazing comprises a filler metal-forming composition which melts in the range from about 380-575° C. The filler metal-forming composition comprises zinc optionally in combination with aluminum and/or silicon, and further comprises at least one braze promoter selected from nickel, cobalt, iron and palladium. The filler metal-forming composition may comprise a single layer or may comprise a number of distinct layers. The brazing product may take the form of a brazing preform or a brazing sheet or casting in which the filler metal-forming composition is deposited on a non-consumable substrate. The substrate may preferably comprise aluminum or an aluminum alloy, but may instead be comprised of one or more metals other than aluminum.

Abstract: A current collector plate, also called a bipolar plate, for a fuel cell includes two facing metal sheets with fluid channels for the fuel (often hydrogen) on the non-facing side of one sheet and fluid channels for air on the non-facing side of the other sheet. Such a plate is made by applying a patterned coating of particles of a soft and reactive metal to at least one of the sheets and rolling them together so that the soft metal particles deform and interact with the facing sheets to selectively join them at the patterned areas. Pressurized fluid is introduced between the sheets to expand non-bonded portions and define the fluid channels.

Abstract: A brazing material including about 20 to about 60 percent by weight gold, about 6 to about 16 percent by weight nickel, about 16 to about 60 percent by weight copper and about 6 to about 16 percent by weight titanium.

Abstract: Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member and positioning openings The positioning openings are arranged corresponding to the pattern so that the balls are inserted therein. The another surface of the arrangement member is opposite to the one surface of the base unit. The arrangement member has two or more line members whose core axes are substantially aligned. The transfer device is arranged so that the line members are substantially in a horizontal position to contact with the balls, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.

Abstract: A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced.

Abstract: Disclosed is a method of joining electronic package parts, comprising the steps of: reflowing lead-free solders containing alloy elements on top of each of the electronic package parts having a surface treated with copper or nickel; and mounting the surface treated electronic parts on the lead-free solders then reflowing the lead-free solders to generate intermetallic compound between the lead-free solders and the surface treated portion of each of the electronic parts.

Abstract: In one embodiment, a solder preform includes a solder matrix having microparticles secured with the solder matrix. The microparticles are constructed so as to be capable of arranging during a solder bonding process so as to provide a uniform separation between opposing soldered surfaces. The microparticles may be shaped to inhibit stacking of the microparticles while self arranging during the solder bonding. The solder preform may have an amount of microparticles with respect to the solder matrix to inhibit stacking of the microparticles during the solder bonding process. Microparticles may be spheres, powders, polyhedrons, crystalline particles, nanostructures, or the like, which may be capable of conducting electric current, or may be dielectric material; for example glass, plastic, metal, or semiconductor material.

Abstract: A method for welding/brazing a tube to a member. The tube has an axially-extending first portion and has a tube form which extends transversely from the first portion. A filler material is obtained. The tube, the member and the filler material are positioned such that the filler material contacts the tube form and the member. A resistance current path is created through the tube, the filler material and the member which melts at least some of the filler material creating a weld/braze zone which includes at least some of the tube, at least some of the member, and at least some of the filler material.

Abstract: A method for metal ornamentation, particularly for making granulated metal ornaments, is used to arrange single and single line granulated arrangements or patterns and to set gemstones within a workpiece. The method places pre-formed spherical granules in seats defined on a surface of the workpiece. The seats permit the granules to stay in position on the workpiece and allow adhesive to cover more contact surface area between the granules and the workpiece. Since the amount of fusion will increase due to the increased contact area, the granules are strong enough to be used to set gemstones. In addition, this method facilitates using small round stones in lieu of metal granules to form unique granulated patterns.

Abstract: The present invention relates to a method of brazing articles of stainless steel, which method comprises the following steps: step (i) applying an iron-based brazing filler material to parts of stainless steel; step (ii) optionally assembling the parts; step (iii) heating the parts from step (i) or step (ii) to a temperature of at least about 1000° C. in a non-oxidizing atmosphere, a reducing atmosphere, vacuum or combinations thereof, and heating the parts at the temperature of at least about 1000° C. for at least about 15 minutes; step (iv) providing articles having an average hardness of less than about 600 HV1 of the obtained brazed areas. The present invention relates also to brazed articles of stainless steel.

Abstract: A heat pipe housing assembly (22) includes a pair of silicon housing pieces (24, 26) and a bond joint (42) between the housings (24, 26), with the bond joint (42) preferably including a eutectic layer (43).

Abstract: Brazing filler metal compositions have excellent wettability to nickel/cobalt/iron-based base metals and produce braze joints with high strength and heat/corrosion resistance. The iron-based braze filler metal includes chromium in amounts between about 20 to 35 percent by weight, silicon in amounts between about 3 to 12 percent by weight, phosphorus in amounts between about 3 to 12 percent by weight; and 0 to about 0.2 weight percent of one or more of calcium, yttrium and misch metal, the balance being iron. These filler metals are suitable for the manufacture of several different types of heat exchangers and catalytic converters at a significantly lower cost compared to currently known braze filler metal compositions.

Abstract: A device for soldering contacts on semiconductor chips. A chip is held on a chip mount by a chuck and is heated from a side facing away from the wafer by means of a radiation source, so that a solder applied to a side facing the wafer is melted. A flushing device, having a plate with a window, a gas channel, and a gas outlet opening for a forming gas, is arranged at the window, is fitted parallel to the wafer. The chip is moved vertically in relation to the wafer, pressed onto the wafer through the window, and soldered on by means of isothermal solidification.

Abstract: In order to provide a brazing sheet having excellent workability, a powder of a brazing filler metal composition is obtained from a single type of powder or by mixing two or more powders to form the brazing filler metal composition. By powder roll compaction of the powder, the powder is formed into a sheet shape.

Abstract: Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a substrate/component combination into a reflow oven; directing the substrate/component combination to the heating zone of said reflow oven; and vibrating the substrate/component combination while said substrate/component combination is in said heating zone. The vibrating of the substrate/component combination occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is stimulated without displacing said substrate and said component relative to each other.

Abstract: Methods are described for applying braze filler material onto a component part interface having a uniform thickness regardless of the interface contour using cold spray deposition technology.

Abstract: According to one embodiment of the invention, a method for sealing one or more vias comprises providing a first substrate having vias, forming an adhesion layer on an inner surface of the vias, sandwiching a solder layer between the first substrate and a second substrate, and elevating of the first substrate, second substrate, and solder layer to a temperature above a eutectic point and below a melting point of the solder layer. The act of elevating the solder layer to a temperature above the eutectic point and below the melting point causes the solder layer to flow into the vias in a generally consistent manner.

Abstract: Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure.

Abstract: A seal for a gas supply system of metal, in particular for sealing an airbag conduit, wherein, during operation, the gas supply system has a gas-conducting cross-section and a wall of metal, wherein in the area which seals the cross-section of the gas supply system, a layer of a plastically deformable material is at least partially inserted and the area with the plastically deformable material present therein is sealed in a gas-tight manner, wherein the area of the seal and the plastically deformable material present therein are mechanically interlaced one with the other.

Abstract: A method for mounting a semiconductor package onto PCB includes a semiconductor package comprising a plurality of outer terminals exposed out of an encapsulant. A PCB having a surface with a plurality of contact pads is provided. Each contact pad has a first exposed side, a second exposed side and a center between the exposed sides. A plurality of first pre-solders and second pre-solders are formed on the surface to cover the first and second exposed sides of the contact pads respectively, the centers of the contact pads between the first and second pre-solders being exposed. Then the first and second pre-solders are reflowed and the semiconductor package is mounted on the PCB. When the outer terminals are connected to the contact pads, each first pre-solder and second pre-solder are flowed toward the centers of the contact pad to prevent the fine pitch contact pads from bridging.

Abstract: Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities.

Abstract: A method of fabricating a substrate placing stage includes the step of providing a plate-shaped ceramic base having a substrate placing surface on a side of the ceramic base. The method includes the step of providing a plate-shaped ceramic base formed of a composite material containing components of a ceramic material and an aluminum alloy. The method includes the step of inserting a joint material including an aluminum alloy layer between the ceramic base and the cooling member. The method includes the step of heating the joint material at a temperature in a range from TS ° C. to (TS-30) °C. (TS °C.: a solidus temperature of the aluminum alloy). The method includes the step of pressing substantially normally joint surfaces of the ceramic base and the cooling member, thereby joining the ceramic base and the cooling member via the joint material to obtain a joint layer including the aluminum alloy layer having a thickness in a range from 50 ?m to 200 ?m after joining.

Abstract: A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.

Abstract: Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.

Abstract: Bonding of flip-chip mounted light emitting devices having an irregular configuration is provided. Light emitting diodes having a shaped substrate are bonded to a submount by applying forces to the substrate an a manner such that shear forces within the substrate do not exceed a failure threshold of the substrate. Bonding a light emitting diode to a submount may be provided by applying force to a surface of a substrate of the light emitting diode that is oblique to a direction of motion of the light emitting diode to thermosonically bond the light emitting diode to the submount. Collets for use in bonding shaped substrates to a submount and systems for bonding shaped substrates to a submount are also provided.

Abstract: Method of tying two or more components together using a fastener. Each component is provided with a hole and the components are placed so that the holes overlap one another in order to receive the fastener in the holes. The fastener is placed in the holes and mechanically pressure-loaded and heated in order to deform the fastener to tie the components together. The fastener is heated essentially only during the fastener deformation phase in order to minimize the heat transfer from the fastener to the components being tied.

Abstract: There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. A molten metal is caused to contact both sides of a ceramic substrate 10 to be cooled and solidified. Thus, a circuit forming metal plate 12 having a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate 10, and a metal base plate 14 is bonded to the other side thereof.

Abstract: In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.

Abstract: A method of making an article that is comprised of a metal foam in contact with a base metal by an intermediate braze composition, in particular, a method of brazing a metal foam to a base metal via a braze composition. In one preferred method, a polymeric foam is coated with a powdered metal composition and thermally-treated to volatilize the polymeric foam and form an open-cell metal foam. A second polymeric foam is coated with a braze composition. The second coated polymeric foam is thermally-treated to volatilize the polymeric foam. The metal foam is surrounded by the second coated polymeric foam to form a composite metal foam. The composite metal foam is placed in contact with a base metal to form an article. The article is thermally-treated to a brazing temperature to form a brazed metal article.

Abstract: A brazing material including about 40 to about 60 percent by weight gold, about 5 to about 16 percent by weight nickel and about 35 to about 55 percent by weight copper.

Abstract: A housing for microelectronic devices requiring an internal vacuum for operation, e.g., an image detector, is formed by tape casting and incorporates leads between interior and exterior of said housing where said leads are disposed on a facing surface of green tape layers. Adjacent green tape layers having corresponding apertures therein are stacked on a first closure member to form a resulting cavity and increased electrical isolation or channel sub-structures are achievable by forming adjacent layers with aperture dimension which vary non-monotonically. After assembly of the device within the cavity, a second closure member is sealed against an open face of the package in a vacuum environment to produce a vacuum sealed device.

Abstract: A method and system for efficiently self-aligning parts of a MEMS during manufacturing, as well as controlling distance between these parts, are disclosed. According to the invention each MEMS part comprises at least one pad that is aligned so as to form a pair of pads. In a preferred embodiment, each part comprises three pads. The pad shape of two pairs of pads is rectangular, one pair being rotated of an angle approximately equal to 90° from the other, and the pad shape of the third pair is annular. Therefore, one of the pair of pads allows alignment according to a first direction, a second pair of pads allows alignment according to a second direction, and the third pair of pads allows rotational alignment.

Abstract: A brazing material including about 2 to about 30 percent by weight gold, about 4 to about 14 percent by weight nickel, about 25 to about 65 percent by weight copper, about 1 to about 3 percent by weight aluminum and about 20 to about 55 percent by weight silver.

Abstract: A reinforced solder bump connector structure is formed between a contact pad arranged on a semiconductor chip and a ball pad arranged on a mounting substrate. The semiconductor chip includes at least one reinforcing protrusion extending upwardly from a surface of an intermediate layer. The mounting substrate includes at least one reinforcing protrusion extending upwardly from a ball pad, the protrusions from both the chip and the substrate being embedded within the solder bump connector. In some configurations, the reinforcing protrusions from the contact pad and the ball pad are sized and arranged to have overlapping upper portions. These overlapping portions may assume a wide variety of configurations that allow the protrusions to overlap without contacting each other including pin arrays and combinations of surrounding and surrounded elements. In each configuration, the reinforcing protrusions will tend to suppress crack formation and/or crack propagation thereby improving reliability.

Abstract: A printed wiring board has a circuit substrate 6 having a conductor circuit 5 and a through hole 60, and also has a joining pin 1 inserted into the through hole. The joining pin is manufactured by using a material unmelted at a heating temperature in joining the joining pin to an opposite party pad 81. The joining pin is constructed by a joining head portion 11 having a greater diameter than an opening diameter of the through hole. The joining pin forms a joining portion for joining and connection to the opposite party pad. The joining pin has a leg portion 12 having a diameter smaller than the through hole. The leg portion is inserted into the through hole and is joined to the through hole by a conductive material such as a soldering material 20, etc. In lieu of a joining pin, a joining ball approximately having a spherical shape can be joined to the through hole by the conductive material.

Abstract: A brazed joint between an armature winding bar strand package and a hydraulic header clip end fitting including: a plurality of solid strands and a plurality of hollow strands arranged in a tiered array and forming the strand package, the plurality of hollow strands having free ends that extend axially beyond corresponding free ends of solid strands; a cavity in the end fitting into which extents the free ends of the hollow strands and solid strands, and an essentially phosphorous-free silver braze alloy joining the free ends of the plurality of hollow strands and said corresponding free ends of solid strands to each other and to interior surfaces of the end fitting, wherein said braze alloy forms an isolation layer over the free ends of the solid strands.

Abstract: A brazed joint between an armature bar strand package and an end fitting includes a plurality of strands arranged in a tiered array and forming the strand package; a cavity in the end fitting, free ends of the plurality of strands extending through opening in the end fitting and received in the cavity; and an essentially phosphorous-free copper-silver braze alloy joining the free ends of the plurality of strands to each other and to interior surfaces of the end fitting.