Abstract: A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein in a non-symmetrical manner relative to a virtual line defined to bisect the substrate portion. The semiconductor device includes a gate electrode level region including a number of conductive features defined to extend in only a first parallel direction. Adjacent ones of the number of conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a size that is substantially equal across the gate electrode level region and is minimized to an extent allowed by a semiconductor device manufacturing capability. The gate electrode level region includes conductive features defined along at least four different virtual lines of extent in the first parallel direction.

Abstract: A cell of a semiconductor device is disclosed to include a diffusion level including a plurality of diffusion regions separated by inactive regions. The cell also includes a gate electrode level including a number of conductive features defined to extend in only a first parallel direction. Adjacent ones of the number of conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a size that is substantially equal across the gate electrode level region and is minimized to an extent allowed by a semiconductor device manufacturing capability. The gate electrode level includes conductive features defined along at least four different virtual lines of extent in the first parallel direction. The cell also includes a number of interconnect levels formed above the gate electrode level.

Abstract: A cell of a semiconductor device is disclosed to include a diffusion level including a plurality of diffusion regions separated by inactive regions. The cell also includes a gate electrode level including a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level is fabricated from a respective originating rectangular-shaped layout feature. The gate electrode level includes conductive features defined along at least four different virtual lines of extent in the first parallel direction. The cell also includes a number of interconnect levels formed above the gate electrode level.

Abstract: A semiconductor device includes: a semiconductor layer including silicon carbide, which has been formed on a substrate; a semiconductor region 15 of a first conductivity type defined on the surface of the semiconductor layer 10; a semiconductor region 14 of a second conductivity type, which is defined on the surface 10s of the semiconductor layer so as to surround the semiconductor region 15 of the first conductivity type; and a conductor 19 with a conductive surface 19s that contacts with the semiconductor regions 15 and 14 of the first and second conductivity types. On the surface 10s of the semiconductor layer, the semiconductor region 15 of the first conductivity type has at least one first strip portion 60 that runs along a first axis i. The width C1 of the semiconductor region 15 of the first conductivity type as measured along the first axis i is greater than the width A1 of the conductive surface 19s as measured along the first axis i.

Abstract: A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein in a non-symmetrical manner relative to a virtual line defined to bisect the substrate portion. The semiconductor device includes a gate electrode level region including a number of conductive features defined to extend in only a first parallel direction. Adjacent ones of the conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features separated by an end-to-end spacing having a size that is substantially equal across the gate electrode level region and is minimized to an extent allowed by a semiconductor device manufacturing capability. Conductive features are defined along at least four different virtual lines of extent in the first parallel direction. A width of the conductive features is less than a wavelength of light used in a photolithography process for their fabrication.

Abstract: A layout of a cell of a semiconductor device is disclosed to include a diffusion level layout including a plurality of diffusion region layout shapes, including p-type and n-type diffusion regions. The layout of the cell also includes a gate electrode level layout defined to include a number of linear-shaped layout features placed to extend in only a first parallel direction. Each of the number of the linear-shaped layout features within the gate electrode level layout of the restricted layout region is rectangular-shaped. Linear-shaped layout features within the gate electrode level layout extend over one or more of the p-type and/or n-type diffusion regions to form PMOS and NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the cell is greater than or equal to eight.

Abstract: A semiconductor device includes a substrate portion including a plurality of diffusion regions defined in a non-symmetrical manner relative to a virtual bisecting line. A gate electrode level region above the substrate portion includes a number of conductive features that extend in only a first parallel direction. Adjacent conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features separated by an equal and minimal sized end-to-end spacing. Conductive features are defined along at least four different virtual lines of extent in the first parallel direction. A width of the conductive features within a photolithographic interaction radius is less than a wavelength of light of 193 nanometers as used in a photolithography process for their fabrication. The photolithographic interaction radius is five times the wavelength of light used in the photolithography process.

Abstract: A semiconductor device includes: a semiconductor layer 10; a semiconductor region 15s of a first conductivity type defined on the surface 10s of the semiconductor layer; a semiconductor region 14s of a second conductivity type defined on the surface 10s of the semiconductor layer to surround the semiconductor region 15s; and a conductor 19 with a conductive surface 19s to contact with the semiconductor regions 15s and 14s. The semiconductor layer 10 includes silicon carbide. At least one of the semiconductor region 15s and the conductive surface 19s is not circular. The semiconductor region 15s and the conductive surface 19s are shaped such that as the degree of misalignment between the conductive surface 19s and the semiconductor region 15s increases from zero through one-third of the width of the conductive surface 19s, a portion of the profile of the conductive surface 19s that crosses the semiconductor region 15s has smoothly changing lengths.

Abstract: Shared contact holes SC1 and SC2 reach both gate electrode layers GE1 and GE2 and a drain region PIR. In a planar view, a sidewall E2 of gate electrode layers GE1 and GE2 is shifted toward a side of a sidewall E4 from a virtual extended line E1a of the sidewall E1. In a planar view, a center line of a line width D1 in a portion that shared contact holes SC1 and SC2 of gate electrode layers GE1 and GE2 reach is located while shifted with respect to a center line of a line width D2 in a portion located on channel formation regions CHN1 and CHN2 of gate electrode layers GE1 and GE2. Therefore, a semiconductor device and a photomask that can suppress an opening defect of the shared contact hole are obtained.

Abstract: A method and apparatus for connecting multiple cores to form a multi core processor. Each processor is connected to at least two other processors, each of which is a mirror image of the first processor. The processors are connected to form a two dimensional matrix connected by one drop busses.

Abstract: A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein. The semiconductor device includes a gate electrode level region including a number of conductive features defined to extend in only a first parallel direction. Adjacent ones of the number of conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a size that is substantially equal across the gate electrode level region and is minimized to an extent allowed by a semiconductor device manufacturing capability. Some of the conductive features within the gate electrode level region extend over the plurality of diffusion regions to form PMOS or NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the gate electrode level region.

Abstract: A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein. The semiconductor device includes a gate electrode level region including a number of conductive features defined to extend in only a first parallel direction. Adjacent ones of the number of conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a size that is substantially equal across the gate electrode level region and is minimized to an extent allowed by a semiconductor device manufacturing capability. Some of the conductive features within the gate electrode level region extend over the plurality of diffusion regions to form PMOS or NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the gate electrode level region is greater than or equal to eight.

Abstract: A semiconductor device for electrostatic discharge (ESD) protection includes a silicon controlled rectifier (SCR) including a semiconductor substrate, a first well formed in the substrate, a second well formed in the substrate, a first p-type region formed in the first well to serve as an anode, and a first n-type region partially formed in the second well to serve as a cathode, a p-type metal-oxide-semiconductor (PMOS) transistor formed in the first well including a gate, a first diffused region and a second diffused region separated apart from the first diffused region, a second n-type region formed in the first well electrically connected to the first diffused region of the PMOS transistor, and a second p-type region formed in the substrate electrically connected to the second diffused region of the PMOS transistor.

Abstract: An improved integrated circuit cell architecture is provided for configurability between a memory cell or logic elements. The cell architecture is configured on variable layers above a first layer of metal, with the first layer of metal and layers therebelow reserved as fixed layers. By coupling a maximum of two layout cells together, a single-port or dual-port memory cell is realized. Likewise, by interconnecting transistors within a single cell or transistors among two or more cells, a logic device is realized. Within each cell, the bit lines are arranged on a layer separate from the wordlines, and extend orthogonal to each other.

Abstract: An electrical fuse comprises first, second, and third thick oxide NMOS transistors and a thin oxide NMOS transistor. The first thick oxide NMOS transistor has a gate connected to a first input signal, and the thin oxide NMOS transistor has a drain connected to the source of the first thick oxide NMOS transistor and a gate shorted to its source. The second thick oxide transistor has a gate connected to a power up signal, a drain connected to the source of the thin oxide NMOS transistor, and a source connected to a reference voltage. The third thick oxide transistor has a gate connected to the second input signal, a drain connected to a high voltage, and a source connected to the drain of the thin oxide NMOS transistor. The first input signal and the second input signal are complementary.

Abstract: A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein. A gate electrode level region is formed above the substrate portion to include conductive features defined to extend in only a first parallel direction. Adjacent ones of the conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a substantially equal and minimum size across the gate electrode level region. A width of the conductive features is less than a wavelength of light used in a photolithography process for their fabrication. Some of the conductive features extend over the plurality of diffusion regions to form PMOS or NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the gate electrode level region is greater than or equal to eight.

Abstract: A restricted layout region in a layout of a semiconductor device is disclosed to include a diffusion level layout including a plurality of diffusion region layout shapes. The plurality of diffusion region layout shapes are defined in a non-symmetrical manner relative to a centerline defined to bisect the diffusion level layout. A gate electrode level layout is defined to include linear-shaped layout features placed to extend in only a first parallel direction. Adjacent linear-shaped layout features that share a common line of extent in the first parallel direction are separated from each other by an end-to-end spacing that is substantially equal across the gate electrode level layout and that is minimized to an extent allowed by a semiconductor device manufacturing capability. The gate electrode level layout includes linear-shaped layout features defined along at least four different lines of extent in the first parallel direction.

Abstract: A cell layout of a semiconductor device includes a diffusion level layout including a plurality of diffusion region layout shapes, including p-type and n-type diffusion regions. The cell layout also includes a gate electrode level layout defined to include linear-shaped layout features placed to extend in only a first parallel direction. Adjacent linear-shaped layout features that share a common line of extent in the first parallel direction are separated from each other by an end-to-end spacing that is substantially equal across the gate electrode level layout and that is minimized to an extent allowed by a semiconductor device manufacturing capability. Linear-shaped layout features within the gate electrode level layout extend over one or more of the p-type and/or n-type diffusion regions to form PMOS and NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the cell is greater than or equal to eight.

Abstract: A restricted layout region includes a diffusion level layout including a number of diffusion region layout shapes to be formed within a substrate portion of a semiconductor device. The diffusion region layout shapes define at least one p-type diffusion region and at least one n-type diffusion region. A gate electrode level layout is defined above the substrate portion to include linear-shaped layout features placed to extend in only a first parallel direction. Adjacent linear-shaped layout features that share a common line of extent in the first parallel direction are separated from each other by an end-to-end spacing that is substantially equal across the gate electrode level layout and that is minimized to an extent allowed by a semiconductor device manufacturing capability. A total number of the PMOS transistor devices and the NMOS transistor devices in the restricted layout region of the semiconductor device is greater than or equal to eight.

Abstract: A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein. A gate electrode level region is formed above the substrate portion to include conductive features defined to extend in only a first parallel direction. Adjacent ones of the conductive features that share a common line of extent are fabricated from respective originating layout features separated from each other by an end-to-end spacing of substantially equal and minimum size across the gate electrode level region. A width of the conductive features within a 5 wavelength photolithographic interaction radius is less than a 193 nanometer wavelength of light used in a photolithography process for their fabrication. Some conductive features extend over the plurality of diffusion regions to form PMOS or NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the gate electrode level region.

Abstract: A restricted layout region includes a diffusion level layout including diffusion region layout shapes that define at least one p-type diffusion region and at least one n-type diffusion region separated by a central inactive region. A gate electrode level layout is defined above the substrate portion to include linear-shaped layout features placed to extend in only a first parallel direction. Adjacent linear-shaped layout features that share a common line of extent in the first parallel direction are separated from each other by an end-to-end spacing that is substantially equal across the gate electrode level layout and that is minimized to an extent allowed by a semiconductor device manufacturing capability. A total number of PMOS and NMOS transistor devices in the restricted layout region is greater than or equal to eight. The restricted layout region corresponds to an entire gate electrode level of a cell layout.

Abstract: A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein. A gate electrode level region is formed above the substrate portion to include conductive features defined to extend in only a first parallel direction. Adjacent ones of the conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a substantially equal and minimum size across the gate electrode level region. A width of the conductive features is less than a wavelength of light used in a photolithography process for their fabrication. Some of the conductive features extend over the plurality of diffusion regions to form PMOS or NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the gate electrode level region.

Abstract: A transistor device structured such that the bulk, gate, drain, and source are all accessible from all four edges of the device and such that current distribution is uniform over the device is provided. The transistor is created with a four-metal CMOS process. A bulk connection can be made with Metal 1, which is all around the device. A gate connection can be made with Metal 2, which is all around the device. Additionally, a drain/source connection can be made with Metal 3, which is all around the device. A source/drain connection can be made with Metal 4, which is all around the device. Source/drain connections are made with two or more evenly distributed via stripes to connect the source/drain parts of the transistor fingers. The transistor structure may be used to create an array of transistors for a high power output stage, with the transistors arranged in a checkerboard pattern. The connections of each transistor are automatic by abutting edges of the transistors.

Abstract: A semiconductor device includes a substrate portion that includes a plurality of diffusion regions that include at least one p-type diffusion region and at least one n-type diffusion region. A gate electrode level region is formed above the substrate portion to include a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level region is fabricated from a respective originating rectangular-shaped layout feature. Within a five wavelength photolithographic interaction radius within the gate electrode level region, a width size of the conductive features is less than 193 nanometers, which is the wavelength of light used in a photolithography process to fabricate the conductive features. A total number of the PMOS transistor devices and the NMOS transistor devices in the gate electrode level region is greater than or equal to eight.

Abstract: A vertical pillar semiconductor device may include a substrate, a group of channel patterns, a gate insulation layer pattern and a gate electrode. The substrate may be divided into an active region and an isolation layer. A first impurity region may be formed in the substrate corresponding to the active region. The group of channel patterns may protrude from a surface of the active region and may be arranged parallel to each other. A second impurity region may be formed on an upper portion of the group of channel patterns. The gate insulation layer pattern may be formed on the substrate and a sidewall of the group of channel patterns. The gate insulation layer pattern may be spaced apart from an upper face of the group of channel patterns. The gate electrode may contact the gate insulation layer and may enclose a sidewall of the group of channel patterns.

Abstract: A standard cell, placed between a power rail and a ground rail in an integrated circuit, has active areas with connecting arms that extend beneath the power rail and ground rail. The connecting arms conduct current between the power and ground rails and the source regions of transistors in the active areas. The connecting arms include segments extending from these source regions to points beneath the power and ground rails, and segments running longitudinally beneath the power and ground rails. The connecting arms replace metal wiring that would otherwise be required, enabling the size of the standard cell to be reduced.

Abstract: A semiconductor device includes a substrate portion that includes a plurality of diffusion regions that include at least one p-type diffusion region and at least one n-type diffusion region. A gate electrode level region is formed above the substrate portion to include a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level region is fabricated from a respective originating rectangular-shaped layout feature. Some of the conductive features within the gate electrode level region extend over the p-type diffusion regions to form respective PMOS transistor devices. Also, some of the conductive features within the gate electrode level region extend over the n-type diffusion regions to form respective NMOS transistor devices. A total number of the PMOS transistor devices and the NMOS transistor devices in the gate electrode level region is greater than or equal to eight.

Abstract: A gate in a semiconductor device is formed to have a dummy gate pattern that protects a gate. Metal lines are formed to supply power for a semiconductor device and transfer a signal. A semiconductor device includes a quad coupled receiver type input/output buffer. The semiconductor device is formed with a gate line that extends over an active region, and a gate pad located outside of the active region. The gate line and the gate pad are adjoined such that the gate line and a side of the gate pad form a line. Dummy gates may also be applied. The semiconductor device includes a first metal line patterns supplying power to a block having a plurality of cells, a second metal line pattern transferring a signal to the cells, and dummy metal line patterns divided into in a longitudinal direction.

Abstract: An improved integrated circuit cell architecture is provided for configurability between a memory cell or logic elements. The cell architecture is configured on variable layers above a first layer of metal, with the first layer of metal and layers therebelow reserved as fixed layers. By coupling a maximum of two layout cells together, a single-port or dual-port memory cell is realized. Likewise, by interconnecting transistors within a single cell or transistors among two or more cells, a logic device is realized. Within each cell, the bit lines are arranged on a layer separate from the wordlines, and extend orthogonal to each other.

Abstract: According to an aspect of the present invention, there is provided a semiconductor IC that includes a plurality of standard cells arranged in a first direction on a semiconductor substrate, and a first diffusion layer connected to a first power source and a second diffusion layer connected to a second power source in the each standard cell, wherein the first diffusion layers as well as the second diffusion layers of neighboring standard cells are integrally formed.

Abstract: A nonvolatile memory device includes an active region defined by a device isolation layer in a semiconductor substrate, a word line passing over the active region and a charge storage region defined by a crossing of the active region and the word line and disposed between the active region and the word line. The charge storage region is disposed at an oblique angle with respect to the word line.

Abstract: A semiconductor device includes a substrate portion having a plurality of diffusion regions defined in a non-symmetrical manner relative to a virtual line defined to bisect the substrate portion. A gate electrode level region is formed above the substrate portion to include a number of conductive features defined to extend in only a first parallel direction and fabricated from a respective originating rectangular-shaped layout feature. The gate electrode level region includes conductive features defined along at least four different virtual lines of extent in the first parallel direction. A width size of the conductive features within the gate electrode level region is measured perpendicular to the first parallel direction. Within a five wavelength photolithographic interaction radius within the gate electrode level region, the width size of the conductive features is less than 193 nanometers, which is the wavelength of light used in a photolithography process to fabricate the conductive features.

Abstract: A semiconductor device includes a substrate portion that includes a plurality of diffusion regions that include at least one p-type diffusion region and at least one n-type diffusion region. A gate electrode level region is formed above the substrate portion to include a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level region is fabricated from a respective originating rectangular-shaped layout feature. Each of the conductive features within the gate electrode level region has a width less than a wavelength of light used in a photolithography process to fabricate the conductive features. Conductive features within the gate electrode level region form respective PMOS transistor devices and respective NMOS transistor devices. A total number of the PMOS transistor devices and the NMOS transistor devices in the gate electrode level region is greater than or equal to eight.

Abstract: A semiconductor device having plural active and passive elements on one semiconductor substrate is manufactured in the following cost effective manner even when the active and passive elements include double sided electrode elements. When the semiconductor substrate is divided into plural field areas, an insulation separation trench that penetrates the semiconductor substrate surrounds each of the field areas, and each of the either of the plural active elements or the plural passive elements. Further, each of the plural elements has a pair of power electrodes for power supply respectively disposed on each of both sides of the semiconductor substrate to serve as the double sided electrode elements.

Abstract: A semiconductor device is disclosed as having a substrate portion that includes a plurality of diffusion regions that include at least one p-type diffusion region and at least one n-type diffusion region. A gate electrode level region is formed above the substrate portion to include a number of conductive features defined to extend in only a first parallel direction. Each of the conductive features within the gate electrode level region is fabricated from a respective originating rectangular-shaped layout feature. Some of the conductive features within the gate electrode level region extend over the p-type diffusion regions to form respective PMOS transistor devices. Also, some of the conductive features within the gate electrode level region extend over the n-type diffusion regions to form respective NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the gate electrode level region.

Abstract: In a semiconductor memory device which includes a shared sense amplifier portion, a pair of memory cell portions disposed on opposite sides of the shared sense amplifier portion, a pair of transfer gates between the pair of memory cell portions and the shared sense amplifier portion, and bit lines constituting a plurality of bit line pairs and connecting the pair of memory cell portions to each other through the pair of transfer gates and the shared sense amplifier portion, the bit lines in a bit line pair of the plurality of bit line pairs are twisted at a substantial center between the pair of transfer gates on the opposite sides.

Abstract: An integrated circuit includes a plurality of signal lines. A first signal line layer includes a plurality of first signal lines. A second signal line layer includes a plurality of second signal lines arranged on top of and insulated from the first signal line layer. A third signal line layer includes a plurality of third signal lines arranged on top of and insulated from the second signal line layer. A contact extends through the second signal line layer and connects at least one of the plurality of third signal lines to at least one of the first signal lines. At least one of the second signal lines further extends in a second direction to bend around the contact such that a predetermined distance separates the plurality of second signal lines from the contact.

Abstract: Under one aspect, a nonvolatile nanotube diode includes: a substrate; a semiconductor element disposed over the substrate, the semiconductor element having an anode and a cathode and capable of forming an electrically conductive pathway between the anode and the cathode; a nanotube switching element disposed over the semiconductor element, the nanotube switching element including a conductive contact and a nanotube fabric element capable of a plurality of resistance states; and a conductive terminal disposed in spaced relation to the conductive contact, wherein the nanotube fabric element is interposed between and in electrical communication with the conductive contact and the conductive contact is in electrical communication with the cathode, and wherein in response to electrical stimuli applied to the anode and the conductive terminal, the nonvolatile nanotube diode is capable of forming an electrically conductive pathway between the anode and the conductive terminal.

Abstract: A restricted layout region includes a diffusion level layout that includes a number of diffusion region layout shapes to be formed within a portion of a substrate of a semiconductor device. The diffusion region layout shapes define at least one p-type diffusion region and at least one n-type diffusion region. The restricted layout region includes a gate electrode level layout defined to include rectangular-shaped layout features placed to extend in only a first parallel direction. Some of the rectangular-shaped layout features form gate electrodes of respective PMOS transistor devices, and some of the rectangular-shaped layout features form gate electrodes of respective NMOS transistor devices. A total number of the PMOS transistor devices and the NMOS transistor devices in the restricted layout region of the semiconductor device is greater than or equal to eight. Additionally, the restricted layout region corresponds to an entire gate electrode level of a cell layout.

Abstract: The semiconductor device includes first and second common source semiconductor layers respectively extending in a first direction, first and second logic gate circuits respectively composed of at least one three-dimensional P-type FET and a three-dimensional N-type FET. The sources of the three-dimensional P-type FETs in the first and second logic gate circuits are joined to the first common source semiconductor layer. The sources of the three-dimensional N-type FETs in the first and second logic gate circuits are joined to the second common source semiconductor layer. The semiconductor layers of the three-dimensional P-type and N-type FETs in the first logic gate circuit are joined in their drain side, and The semiconductor layers of the three-dimensional P-type and N-type FETs in the second logic gate circuit are joined in their drain side. The dissipation of the FinFET can be improved.

Abstract: A substrate portion of a semiconductor device is formed to include a plurality of diffusion regions that are defined in a non-symmetrical manner relative to a virtual line defined to bisect the substrate portion. A gate electrode level region is formed above the substrate portion to include a number of conductive features defined to extend in only a first parallel direction. Each of the number of conductive features within the gate electrode level region is fabricated from a respective originating rectangular-shaped layout feature. The conductive features within the gate electrode level region are defined along at least four different virtual lines of extent in the first parallel direction. A width size of the conductive features within the gate electrode level region is measured perpendicular to the first parallel direction and is less than a wavelength of light used in a photolithography process to fabricate the conductive features.

Abstract: According to one embodiment of the present invention, a MOS transistor includes a semiconductor layer including a source region, a drain region, and a channel region disposed between the source region and the drain region. A gate structure is arranged above the channel regions. A source wiring structure is arranged above the source region and is connected to the source region. A drain wiring structure is arranged above the drain region and is connected to the drain region. The width of the source wiring structure is larger than the width of the drain wiring structure, and the height of the source wiring structure is smaller than the height of the drain wiring structure, or vice versa.

Abstract: The invention provides a reduced complexity layout style based on applying a limited set of changes to an underlying repeated base template. With the templates properly defined in accordance with the characteristic features disclosed, the invention enables efficient implementation of logic circuitry, with a dramatic reduction in the pattern complexity (or number of unique layout patterns at each mask level) for realistically sized designs. This reduction in pattern complexity that the invention provides is particularly important for advanced and emerging semiconductor processes, because it enables effective use of SMO and full-chip mask optimization.

Abstract: The collector, emitter, and base of a bipolar transistor circuit are connected to a high side power supply terminal, the drain of a level shift transistor, and a floating power supply terminal, respectively. When a high side output transistor is on, the floating power supply terminal is at the potential of a high potential power supply terminal. The high side power supply terminal is at a potential higher than the potential of the floating power supply terminal by a constant voltage. Turning the level shift transistor on, its drain potential drops below the potential of the floating power supply terminal; The base current flows through the bipolar transistor circuit and the drain potential of the level shift transistor is clamped near the potential of the floating power supply terminal; The bipolar transistor circuit is turned on and its collector current supplies the drain current of the level shift transistor.

Abstract: A semiconductor includes a channel region in a semiconductor substrate, a gate dielectric film on the channel region, and a gate on the gate dielectric film. The gate includes a doped metal nitride film, formed from a nitride of a first metal and doped with a second metal which is different from the first metal, and a conductive polysilicon layer formed on the doped metal nitride film. The gate may further include a metal containing capping layer interposed between the doped metal nitride film and the conductive polysilicon layer.

Abstract: Cooking appliance having an external and control panel equipped with one or more regulating valves, where the rotary regulator organ is equipped with various peripheral openings for supplying a flow Q. According to two embodiments of the cooking appliance, for the supply of one or another type of gas, NG or LPG, either the control knob or a bezel disk in the external panel are interchangeable on the appliance, being chosen between two different available units, one and the other permitting two different angular position limits A2, A3 of the regulator organ for the supply of a constant flow Qmin through one or another opening with calibrated sections, respectively for NG or LP gas. An appendix in the control knob guided in a slide groove on the control panel of the appliance, or a tongue on the bezel disk stopping the rotation of the control knob, determines the travel limit A2 for the supply of Qmin of NG.

Abstract: A semiconductor device with improved transistor operating and flicker noise characteristics includes a substrate, an analog NMOS transistor and a compressively-strained-channel analog PMOS transistor disposed on the substrate. The device also includes a first etch stop liner (ESL) and a second ESL which respectively cover the NMOS transistor and the PMOS transistor. The relative measurement of flicker noise power of the NMOS and PMOS transistors to flicker noise power of reference unstrained-channel analog NMOS and PMOS transistors at a frequency of 500 Hz is less than 1.

Abstract: A restricted layout region includes a diffusion level layout that includes a number of diffusion region layout shapes to be formed within a portion of a substrate of a semiconductor device. The diffusion region layout shapes define at least one p-type diffusion region and at least one n-type diffusion region. The restricted layout region includes a gate electrode level layout defined to pattern conductive features within a gate electrode level above the portion of the substrate. The gate electrode level layout includes rectangular-shaped layout features placed to extend in only a first parallel direction. Some of the rectangular-shaped layout features form gate electrodes of respective PMOS transistor devices, and some of the rectangular-shaped layout features form gate electrodes of respective NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the restricted layout region of the semiconductor device.

Abstract: A layout of a cell of a semiconductor device is disclosed to include a diffusion level layout including a plurality of diffusion region layout shapes to be formed within a portion of a substrate, including a p-type diffusion region layout shape and an n-type diffusion region layout shape separated by a central inactive region. The layout of the cell also includes a gate electrode level layout defined to include a number of linear-shaped layout features placed to extend in only a first parallel direction. Each of the number of the linear-shaped layout features within the gate electrode level layout of the restricted layout region is rectangular-shaped. The gate electrode level layout includes linear-shaped layout features defined along at least four different lines of extent in the first parallel direction. The gate electrode level layout corresponds to an entire gate electrode level of the cell.

Abstract: An integrated circuit biases the substrate and well using voltages other than those used for power and ground. Tap cells inside the standard cell circuits are removed. New tap cells used to bias the substrate and well reside outside the standard cell circuits. The location of the new voltage power rails is designated prior to placement of the tap cells in the integrated circuit. The tap cells are then strategically placed near the power rails such that metal connections are minimized. Circuit density is thus not adversely impacted by the addition of the new power rails. Transistors are also placed inside the tap cells to address electrostatic discharge issues during fabrication.