Abstract: Disclosed are a semiconductor stack structure and a manufacturing method of a semiconductor stack structure. In one embodiment, the semiconductor stack structure includes a first semiconductor element, a second semiconductor element side-by-side bonded to the first semiconductor element through a direct bonding manner and a third semiconductor element, wherein the first semiconductor element and the second semiconductor element are bonded on the third semiconductor element.

Abstract: A battery cell having first cell connectors, a galvanic cell and a first switching unit electrically coupled to the first cell connectors and the galvanic cell for electrically coupling the galvanic cell to the first cell connectors depending on a switching state of the first switching unit. The battery cell has second cell connectors electrically separated from the first cell connectors and a second switching unit electrically coupled to the second cell connectors and the galvanic cell for electrically coupling the galvanic cell to the second cell connectors depending on a switching state of the second switching unit.

Abstract: A method for preparing a semiconductor device structure includes forming a first fin structure and a second fin structure over a semiconductor substrate, forming an isolation structure over the semiconductor substrate, partially removing the first fin structure and the second fin structure to form a recessed portion of the first fin structure and a recessed portion of the second fin structure, epitaxially growing a first source/drain (S/D) structure over the recessed portion of the first fin structure and a second S/D structure over the recessed portion of the second fin structure, partially removing the isolation structure through the first opening to form a second opening, and forming a contact etch stop layer (CESL) over the first S/D structure and the second S/D structure such that an air gap is formed and sealed in the first opening and the second opening.

Abstract: A semiconductor device includes: an inter-layer dielectric layer over a substrate including a cell region, a first peripheral region, and a second peripheral region; a capping layer over the inter-layer dielectric layer; a capacitor capped by the inter-layer dielectric layer in the cell region; a contact plug penetrating the inter-layer dielectric layer in the first peripheral region; a metal interconnection formed over the contact plug through the capping layer; and a through electrode penetrating the capping layer and the inter-layer dielectric layer and extending into the substrate in the second peripheral region.

Abstract: Disclosed are a semiconductor structure and method of forming the structure. The semiconductor structure includes an extended drain metal oxide semiconductor field effect transistor (EDMOSFET). The EDMOSFET includes, in the semiconductor layer, a body well, which has a source region therein, and a drain drift well, which abuts the body well and has a drain region therein. A trench gate structure is within the drain drift well positioned laterally between the body-drain drift junction and an internal shallow trench isolation (STI) region and the internal STI region is between the trench gate structure and the drain region. A primary gate structure is on the top surface of the semiconductor layer traversing the body-drain drift junction and optionally extending over the trench gate structure. Gate dielectric material physically separates gate conductor materials of the primary and trench gate structures. Optionally, the EDMOSFET includes more than one trench gate structure.

Abstract: A method includes forming a semiconductor fin protruding higher than top surfaces of isolation regions. The isolation regions extend into a semiconductor substrate. The method further includes etching a portion of the semiconductor fin to form a trench, filling the trench with a first dielectric material, wherein the first dielectric material has a first bandgap, and performing a recessing process to recess the first dielectric material. A recess is formed between opposing portions of the isolation regions. The recess is filled with a second dielectric material. The first dielectric material and the second dielectric material in combination form an additional isolation region. The second dielectric material has a second bandgap smaller than the first bandgap.

Abstract: A microelectronic device with a trench structure is formed by forming a trench in a substrate, forming a seed layer in the trench, the seed layer including an amorphous dielectric material; and forming semi-amorphous polysilicon on the amorphous dielectric material. The semi-amorphous polysilicon has amorphous silicon regions separated by polycrystalline silicon. Subsequent thermal processes used in fabrication of the microelectronic device may convert the semi-amorphous polysilicon in the trench to a polysilicon core. In one aspect, the seed layer may be formed on sidewalls of the trench, contacting the substrate. In another aspect, a polysilicon outer layer may be formed in the trench before forming the seed layer, and the seed layer may be formed on the polysilicon layer.

Abstract: An integrated circuit (IC) including a semiconductor surface layer of a substrate including functional circuitry having circuit elements formed in the semiconductor surface layer configured together with a Metal-Insulator-Metal capacitor (MIM) capacitor on the semiconductor surface layer for realizing at least one circuit function. The MIM capacitor includes a multilevel bottom capacitor plate having an upper top surface, a lower top surface, and sidewall surfaces that connect the upper and lower top surfaces (e.g., a bottom plate layer on a three-dimensional (3D) layer or the bottom capacitor plate being a 3D bottom capacitor plate). At least one capacitor dielectric layer is on the bottom capacitor plate. A top capacitor plate is on the capacitor dielectric layer, and there are contacts through a pre-metal dielectric layer to contact the top capacitor plate and the bottom capacitor plate.

Abstract: A semiconductor device includes: a conductive semiconductor substrate in which a trench is formed on the first main surface; a plurality of conductive layers, each of which is either a first conductive layer or a second conductive layer, which are laminated on one another along a surface normal direction of a side surface of the trench; and dielectric layers arranged between a conductive layer closest to the side surface of the trench among the plurality of conductive layers and the side surface of the trench, and between the plurality of corresponding conductive layers. The first conductive layer is electrically insulated from the semiconductor substrate, and the semiconductor substrate that electrically connects to the second conductive layer inside the trench electrically connects to the second electrode.

Abstract: An image sensor may include a semiconductor substrate having a light receiving surface thereon and a plurality of spaced-apart semiconductor photoelectric conversion regions at adjacent locations therein. A grating structure is provided on the light receiving surface. This grating structure extends opposite each of the plurality of spaced-apart photoelectric conversion regions. An optically-transparent layer is provided on the grating structure. This grating structure includes a plurality of spaced-apart grating patterns, which can have the same height and the same width. In addition, the grating patterns may be spaced apart from each other by a uniform distance. The grating structure is configured to selectively produce ±1 or higher order diffraction lights to the photoelectric conversion regions, in response to light incident thereon.

Abstract: A silicon carbide device includes a stripe-shaped trench gate structure extending from a first surface into a silicon carbide body. The gate structure has a gate length along a lateral first direction. A bottom surface and an active first gate sidewall of the gate structure are connected via a first bottom edge of the gate structure. The silicon carbide device further includes at least one source region of a first conductivity type. A shielding region of a second conductivity type is in contact with the first bottom edge of the gate structure across at least 20% of the gate length.

Abstract: A semiconductor device structure includes an isolation structure disposed in a semiconductor substrate. The semiconductor device structure also includes a gate electrode and a resistor electrode disposed in the semiconductor substrate. The isolation structure is disposed between the gate electrode and the resistor electrode, and the isolation structure is closer to the resistor electrode than the gate electrode. The semiconductor device structure further includes a source/drain (S/D) region disposed in the semiconductor substrate and between the gate electrode and the isolation structure. The S/D region is electrically connected to the resistor electrode.

Abstract: Systems, methods and apparatus are provided for forming layers of a first dielectric material, a semiconductor material, and a second dielectric material in repeating iterations vertically to form a vertical stack and forming a vertical opening using an etchant process to expose vertical sidewalls in the vertical stack. A seed material that is selective to the semiconductor material is deposited over the vertical stack and the vertical sidewalls in the vertical stack and the seed material is processed such that the seed material advances within the semiconductor material such that it transforms a crystalline structure of a portion of the semiconductor material.

Abstract: Some embodiments include an integrated capacitor assembly having a conductive pillar supported by a base, with the conductive pillar being included within a first electrode of a capacitor. The conductive pillar has a first upper surface. A dielectric liner is along an outer surface of the conductive pillar and has a second upper surface. A conductive liner is along the dielectric liner and is included within a second electrode of the capacitor. The conductive liner has a third upper surface. One of the first and third upper surfaces is above the other of the first and third upper surfaces. The second upper surface is at least as high above the base as said one of the first and third upper surfaces. Some embodiments include memory arrays having capacitors with pillar-type first electrodes.

Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first testing area, a word line structure positioned in the first testing area and arranged parallel to a first axis, a first column of capacitor contact structures positioned in the first testing area and arranged parallel to a second axis perpendicular to the first axis, a second column of capacitor contact structures positioned adjacent to the first column of capacitor contact structures and arranged parallel to the first column of capacitor contact structures, and a first testing structure including a first drain portion extended along the second axis and a first source portion extended along the second axis. The first drain portion is positioned on the first column of capacitor contact structures and the first source portion is positioned on the second column of capacitor contact structures.

Abstract: A semiconductor structure can include: a semiconductor substrate having a first region, a second region, and an isolation region disposed between the first region and the second region; an isolation component located in the isolation region; and where the isolation component is configured to recombine first carriers flowing from the first region toward the second region, and to extract second carriers flowing from the second region toward the first region.

Abstract: Present disclosure relates to IC devices with thermal mitigation structures in the form of metal structures provided in a semiconductor material of a substrate on which active electronic devices are integrated (i.e., front-end metal structures). In one aspect, an IC device includes a substrate having a first face and a second face, where at least one active electronic device is integrated at the first face of the substrate. The IC device further includes at least one front-end metal structure that extends from the first face of the substrate into the substrate to a depth that is smaller than a distance between the first face and the second face. Providing front-end metal structures may enable improved cooling options because such structures may be placed in closer vicinity to the active electronic devices, compared to conventional thermal mitigation approaches.

Abstract: A decoupling capacitor includes a first insulating layer extending in a horizontal direction, a storage plate arranged on the first insulating layer, a top plate facing the storage plate, a second insulating layer interposed between the storage plate and the top plate and having a plurality of through holes, a capacitor block including a plurality of capacitor structures in the plurality of through holes, a wiring structure covering the top plate, a first conductive pad arranged on the wiring structure and configured to be electrically connected to the storage plate through a first conductive path of the wiring structure, and a second conductive pad spaced apart from the first conductive pad in the horizontal direction in the same plane as the first conductive pad and configured to be electrically connected to the top plate through a second conductive path of the wiring structure.

Abstract: A method includes forming an opening in a first dielectric layer. A region underlying the first dielectric layer is exposed to the opening. The method further includes depositing a dummy silicon layer extending into the opening, and depositing an isolation layer. The isolation layer and the dummy layer include a dummy silicon ring and an isolation ring, respectively, in the opening. The opening is filled with a metallic region, and the metal region is encircled by the isolation ring. The dummy silicon layer is etched to form an air spacer. A second dielectric layer is formed to seal the air spacer.

Abstract: The present application relates to the technical field of semiconductor manufacturing, in particular to a device integrated with a three-dimensional MIM capacitor and a method for manufacturing the same. The device comprising: a first dielectric layer, a first conductive metal structure being formed in the first dielectric layer; and a second dielectric layer, plurality of MIM capacitors being formed in the second dielectric layer, the bottom of each of the MIM capacitors being connected to the first conductive metal structure, and the plurality of three-dimensional MIM capacitors being arranged as array in a two-dimensional plane presented by the second dielectric layer; wherein each of the three-dimensional MIM capacitors sequentially comprises an upper electrode, a dielectric layer covering the bottom sides of the upper electrode, and a lower electrode layer covering an outer surface of the dielectric layer; the lower electrode layer is connected to the first conductive metal structure.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a conductive pattern, a first conductive layer, and a dielectric layer. The conductive pattern extends upwardly from the substrate. The conductive pattern has a hollow structure. The first conductive layer covers the conductive pattern. The dielectric layer at least covers the first conductive layer.

Abstract: A semiconductor structure and a fabrication method are provided. The fabrication method includes forming a first dielectric layer on a base substrate, the first dielectric layer containing an opening exposing a surface portion of the base substrate; forming an initial gate dielectric layer on the surface portion of the base substrate and on a sidewall surface of the opening in the first dielectric layer; forming a gate dielectric layer by removing a portion of the initial gate dielectric layer from the sidewall surface of the opening, such that a top surface of the gate dielectric layer on the sidewall surface is lower than a top surface of the first dielectric layer; forming a gate electrode on the gate dielectric layer to fill the opening, a portion of the gate electrode being formed on a portion of the sidewall surface of the first dielectric layer; and forming a second dielectric layer on the gate electrode and on the first dielectric layer.

Abstract: A semiconductor device includes an inter-metal dielectric layer, a first conductive line, and a first ferroelectric random access memory (FRAM) structure. The first conductive line is embedded in the inter-metal dielectric layer and extends along a first direction. The first FRAM structure is over inter-metal dielectric layer and includes a bottom electrode layer, a ferroelectric layer, and a top electrode layer. The bottom electrode layer is over the first conductive line and has an U-shaped when viewed in a cross section taken along a second direction substantially perpendicular to the first direction. The ferroelectric layer is conformally formed on the bottom electrode. The top electrode layer is over the ferroelectric layer.

Abstract: Processing methods comprising exposing a substrate to a first reactive gas comprising an ethylcyclopentadienyl ruthenium complex or a cyclohexadienyl ruthenium complex and a second reactive gas comprising water to form a ruthenium film are described.

Abstract: In a first cell region of a semiconductor substrate, a first semiconductor element is formed. In a second cell region of semiconductor substrate, a second semiconductor element is formed. First semiconductor element includes a first electrode and a first p region. Second semiconductor element includes a second electrode and a second p region. First electrode and second electrode are separated from each other. First p region and second p region are separated from each other.

Abstract: A semiconductor device includes: semiconductor layer having surface and rear surface; insulating film formed on the surface; first and second surface electrode layers formed on the insulating film; rear electrode layer formed on the rear surface; active region set in region of the surface covered with the first surface electrode layer; capacitor region set in region of the surface covered with the second surface electrode layer; first trench formed in the active region; first insulating film formed on inner surface of the first trench; first embedded electrode embedded in the first trench and controlling ON/OFF of current flowing between the first surface electrode layer and the rear electrode layer; second trench formed in the capacitor region; second insulating film formed on inner surface of the second trench; and second embedded electrode embedded in the second trench and electrically connected to the first surface electrode layer.

Abstract: A method of fabricating air gaps in advanced semiconductor devices for low capacitance interconnects. The method includes exposing a substrate to a gas pulse sequence to deposit a material that forms an air gap between raised features.

Abstract: An electrode is included in a base substrate. A trench is produced in the base substrate. The trench is filled with an annealed amorphous material to form the electrode. The electrode is made of a crystallized material which includes particles that are implanted into a portion of the electrode that is located adjacent the front-face side of the base substrate.

Abstract: The present application discloses a semiconductor device structure and a method for preparing the semiconductor device structure. The semiconductor device structure includes a first fin structure and a second fin structure disposed over a semiconductor substrate, and a first word line disposed across the first fin structure and the second fin structure. The semiconductor device structure also includes a first source/drain (S/D) structure disposed over the first fin structure and adjacent to the first word line, and a second S/D structure disposed over the second fin structure and adjacent to the first word line. The first S/D structure and the second S/D structure have an air gap therebetween.

Abstract: A method of manufacturing a low temperature polysilicon thin film includes: forming a buffer layer on a substrate; forming a first silicon layer on the buffer layer; forming a second silicon layer on the first silicon layer, and forming a substrate impurity barrier interface between the first silicon layer and the second silicon layer, wherein the second silicon layer is thicker than the first silicon layer; and annealing the first silicon layer and the second silicon layer to form a polysilicon layer.

Abstract: A method of manufacturing semiconductor devices includes: forming source regions of a first conductivity type in a SiC-based semiconductor substrate, wherein dopants are introduced selectively through first segments of first mask openings in a first dopant mask and wherein a longitudinal axis of the first mask opening extends into a first horizontal direction; forming pinning regions of a complementary second conductivity type, wherein dopants are selectively introduced through second segments of the first mask openings and wherein the first and second segments alternate along the first horizontal direction; and forming body regions of the second conductivity type, wherein dopants are selectively introduced through second mask openings in a second dopant mask, wherein a width of the second mask openings along a second horizontal direction orthogonal to the first horizontal direction is greater than a width of the first mask openings.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a plurality of lower interconnect layers disposed within a lower dielectric structure over a substrate. A lower insulating structure is over the lower dielectric structure and has sidewalls extending through the lower insulating structure. A bottom electrode is arranged along the sidewalls and an upper surface of the lower insulating structure. The upper surface of the lower insulating structure extends past outermost sidewalls of the bottom electrode. A data storage structure is disposed on the bottom electrode and is configured to store a data state. A top electrode is disposed on the data storage structure. The bottom electrode has interior sidewalls coupled to a horizontally extending surface to define a recess within an upper surface of the bottom electrode. The horizontally extending surface is below the upper surface of the lower insulating structure.

Abstract: A memory structure including a substrate, a first transistor, a second transistor, and a trench capacitor is provided. The trench capacitor is disposed in the substrate and is connected between the first transistor and the second transistor.

Abstract: A semiconductor memory device includes a semiconductor substrate, bit line structures, storage node contacts, and isolation structures. The bit line structures, the storage node contacts, and the isolation structures are disposed on the semiconductor substrate. Each bit line structure is elongated in a first direction, and the bit line structures are repeatedly disposed in a second direction. Each storage node contact and each isolation structure are disposed between two of the bit line structures adjacent to each other in the second direction. Each storage node contact is disposed between two of the isolation structures disposed adjacent to each other in the first direction. Each isolation structure includes at least one first portion elongated in the first direction and partially disposed between one of the bit line structures and one of the storage node contacts adjacent to the isolation structure in the second direction.

Abstract: A semiconductor device includes a semiconductor substrate having first and second main surfaces, a first region formed in a surface layer of the first main surface, a drift layer disposed adjacent to the first region, a charge accumulation region having a higher concentration than the drift region, and a trench gate including a trench penetrating the first region and the charge accumulation region, and a gate electrode formed in the trench. The trench gate includes a main trench having a gate electrode to which a gate voltage is applied, and a dummy trench having a gate electrode to which a voltage different from the main trench is applied. The main trench and the dummy trench sandwiches the charge accumulation region, and a contact area S1 between the dummy trench and the charge accumulation region is larger than a contact area S2 between the main trench and the charge accumulation region.

Abstract: A method of forming an array of cross point memory cells comprises using two, and only two, masking steps to collectively pattern within the array spaced lower first lines, spaced upper second lines which cross the first lines, and individual programmable devices between the first lines and the second lines where such cross that have an upwardly open generally U-shape vertical cross-section of programmable material laterally between immediately adjacent of the first lines beneath individual of the upper second lines. Arrays of cross point memory cells independent of method of manufacture are disclosed.

Abstract: A novel storage device is provided. The storage device includes a first wiring, a second wiring, and a first memory cell. The first memory cell includes a first transistor and a first magnetic tunnel junction device. One of a source or a drain of the first transistor is electrically connected to a first wiring. The other of the source or the drain of the first transistor is electrically connected to one terminal of the first magnetic tunnel junction device. Another terminal of the first magnetic tunnel junction device is electrically connected to the second wiring. The first transistor includes an oxide semiconductor in its channel formation region.

Abstract: A method for forming a semiconductor structure is provided. The method includes forming a seed layer over a substrate and forming a first mask layer over the seed layer. The method also includes forming a first trench and a second trench in the first mask layer and forming a first conductive material in the first trench and the second trench. The method further includes forming a second mask layer in the first trench and over the first conductive material, and forming a second conductive material in the second trench and on the first conductive material. A first conductive connector is formed in the first trench with a first height, a second conductive connector is formed in the second trench with a second height, and the second height is greater than the first height.

Abstract: After forming a laterally contacting pair of a semiconductor fin and a conductive strap structure overlying a deep trench capacitor embedded in a substrate and forming a gate stack straddling a body region of the semiconductor fin, source/drain regions are formed in portions the semiconductor fin located on opposite sides of the gate stack by ion implantation. Next, a metal layer is applied over the source/drain region and subsequent annealing consumes entire source/drain regions to provide fully alloyed source/drain regions. A post alloyzation ion implantation is then performed to introduce dopants into the fully alloyed source/drain regions followed by an anneal to segregate the implanted dopants at interfaces between the fully alloyed source/drain regions and the body region of the semiconductor fin.

Abstract: Structures and methods for making vertical transistors in the Embedded Dynamic Random Access Memory (eDRAM) scheme are provided. A method includes: providing a bulk substrate with a first doped layer thereon, depositing a first hard mask over the substrate, forming a trench through the substrate, filling the trench with a first polysilicon material, and after filling the trench with the first polysilicon material, i) growing a second polysilicon material over the first polysilicon material and ii) epitaxially growing a second doped layer over the first doped layer, where the grown second polysilicon material and epitaxially grown second doped layer form a basis for a strap merging the second doped layer and the second polysilicon material.

Abstract: Some embodiments include an assembly having bitlines extending along a first direction. Semiconductor pillars are over the bitlines and are arranged in an array. The array includes columns along the first direction and rows along a second direction which crosses the first direction. Each of the semiconductor pillars extends vertically. The semiconductor pillars are over the bitlines. The semiconductor pillars are spaced from one another along the first direction by first gaps, and are spaced from one another along the second direction by second gaps. Wordlines extend along the second direction, and are elevationally above the semiconductor pillars. The wordlines are directly over the first gaps and are not directly over the semiconductor pillars. Gate electrodes are beneath the wordlines and are coupled with the wordlines. Each of the gate electrodes is within one of the second gaps. Shield lines may be within the first gaps.

Abstract: A method for electroplating a nonmetallic grating including providing a nonmetallic grating; performing an atomic layer deposition (ALD) reaction to form a seed layer on the nonmetallic grating; and electroplating a metallic layer on the seed layer such that the metallic layer uniformly and conformally coats the nonmetallic grating. An apparatus including a silicon substrate having gratings with an aspect-ratio of at least 20:1; a atomic layer deposition (ALD) seed layer formed on the gratings; and an electroplated metallic layer formed on the seed layer, wherein the electroplated metallic layer uniformly and conformally coats the gratings.

Abstract: The present disclosure relates to isolation structures for semiconductor devices and, more particularly, to dual trench isolation structures having a deep trench and a shallow trench for electrically isolating integrated circuit (IC) components formed on a semiconductor substrate. The semiconductor isolation structure of the present disclosure includes a semiconductor substrate, a shallow trench isolation (STI) disposed over the semiconductor substrate, a deep trench isolation (DTI) with sidewalls extending from a bottom surface of the STI and terminating in the semiconductor substrate, a multilayer dielectric lining disposed on the sidewalls of the DTI, the multilayer dielectric lining including an etch stop layer positioned between inner and outer dielectric liners, and a filler material disposed within the DTI.

Abstract: A semiconductor device including a silicon-on-insulator (SOI) wafer comprising a doped silicon substrate, a buried oxide layer on the doped silicon substrate, and a silicon device layer on the buried oxide layer. An inner electrode and a node dielectric layer of a capacitor are disposed in a trench of the SOI wafer. The inner electrode and the node dielectric layer penetrate through the buried oxide layer and extend into the doped silicon substrate. At least a select transistor is disposed on the buried oxide layer. The select transistor includes a source doping region and a drain doping region, a channel region between the source doping region and the drain doping region, and a gate over the channel region. At least an embedded contact is disposed atop the capacitor to electrically couple the drain doping region of the select transistor with the inner electrode of the capacitor.

Abstract: Methods and apparatuses for thin film transistors and related fabrication techniques are described. The thin film transistors may access two or more decks of memory cells disposed in a cross-point architecture. The fabrication techniques may use one or more patterns of vias formed at a top layer of a composite stack, which may facilitate building the thin film transistors within the composite stack while using a reduced number of processing steps. Different configurations of the thin film transistors may be built using the fabrication techniques by utilizing different groups of the vias. Further, circuits and components of a memory device (e.g., decoder circuitry, interconnects between aspects of one or more memory arrays) may be constructed using the thin film transistors as described herein along with related via-based fabrication techniques.

Abstract: A memory cell includes a first electrode and a second electrode. A select device and a programmable device are in series with each other between the first and second electrodes. The select device is proximate and electrically coupled to the first electrode. The programmable device is proximate and electrically coupled to the second electrode. The programmable device includes a radially inner electrode having radially outer sidewalls. Ferroelectric material is radially outward of the outer sidewalls of the inner electrode. A radially outer electrode is radially outward of the ferroelectric material. One of the outer electrode or the inner electrode is electrically coupled to the select device. The other of the outer electrode and the inner electrode is electrically coupled to the second electrode. Arrays of memory cells are disclosed.

Abstract: An integrated circuit device includes a conductive region on a substrate and a lower electrode structure including a main electrode part spaced apart from the conductive region and a bridge electrode part between the main electrode part and the conductive region. A dielectric layer contacts an outer sidewall of the main electrode part. To manufacture the integrated circuit device, a preliminary bridge electrode layer is formed in a hole of a mold pattern on the substrate, and the main electrode part is formed on the preliminary bridge electrode layer in the hole. The mold pattern is removed to expose a sidewall of the preliminary bridge electrode layer, and a portion of the preliminary electrode part is removed to form the bridge electrode part. The dielectric layer is formed to contact the outer sidewall of the main electrode part.

Abstract: Methods of operating semiconductor memory devices with floating body transistors, using a silicon controlled rectifier principle are provided, as are semiconductor memory devices for performing such operations.

Abstract: According to an embodiment, a non-volatile storage device includes a first layer, a second layer formed on the first layer, a stacked body including a plurality of conductive films stacked on the second layer, and a semiconductor pillar which penetrates the stacked body and the second layer and reaches the first layer. The semiconductor pillar includes a semiconductor film formed along an extending direction of the semiconductor pillar, and a memory film which covers a periphery of the semiconductor film. The memory film includes a first portion formed between the stacked body and the semiconductor film and a second portion formed between the second layer and the semiconductor film. An outer periphery of the second portion in a plane perpendicular to the extending direction is wider than an outer periphery of the first portion on a second layer side of the stacked body.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, an insulating film, and a photo sensitive film. The substrate includes a semiconductor chip region and a scribe line region disposed along an edge of the semiconductor chip region. The insulating film includes a first portion disposed on the semiconductor chip region, a second portion disposed on the scribe line region and connected with the first portion, and a third portion disposed on the scribe line region and protruded in a first direction from the second portion. The photo sensitive film is disposed on the insulating film and has a sidewall exposed on the second portion of the insulating film. A first width of the third portion in a second direction perpendicular to the first direction decreases as a distance from the semiconductor chip region increases.