Abstract: A device has a latching mechanism including a catch element having at least two catches, and a pawl configured to engage in a catch interstice between two catches. The catch element is movable in relation to the pawl in a freewheeling direction, and a movement of the catch element in relation to the pawl in a blocking direction may be blocked by means of the pawl. The device further includes a deflectable actuator configured to move the catch element and the pawl relative to each other on a catch-by-catch basis in the freewheeling direction by means of deflection. According to the invention, the device also includes an electric component configured to change its electric property as a function of the catch-wise movement of the catch element in relation to the pawl.

Abstract: A high-sensitivity and ultra-low power consumption magnetic sensor using a magnetoelectric (ME) composite comprising of magnetostrictive and piezoelectric layers. This sensor exploits the magnetically driven resonance shift of a free-standing magnetoelectric micro-beam resonator. Also disclosed is the related method for making the magnetic sensor.

Abstract: A micro-electro-mechanical (MEMS) exhaust valve-based impact attenuating fluid filled cell for use in cushioning impact and decelerating of a wearer's body portion (e.g. head, shoulder, torso, etc.) after an impact. In combination with the use of accelerometers, pressure sensors, location and other electronics supply signals to a microcontroller, the controlled opening/closing of said exhaust valve (resulting in the expelling of said fluids with an optional combination with cell refill means) when certain parameters exceed a threshold.

Abstract: An element of a photoacoustic sensor combines an optomechanical resonator and a photoacoustic cavity. The photoacoustic cavity is formed by a measurement chamber, traversed by a pulsed excitation beam. The optomechanical resonator is formed by an optical resonator, a mechanical element for being set in rapid oscillations, by an optical signal confined in the optomechanical resonator, and in slow oscillations, by an acoustic wave generated in the photoacoustic cavity. A measurement beam is sent into the optical resonator, where it carries out several passages via the mechanical element. The optical properties thereof at the output of the optical resonator are therefore dependent on the oscillations of the mechanical element. A low-frequency-amplitude-modulated high-frequency signal can be obtained, with the amplitude modulation representing the acoustic wave in the measurement chamber. An accurate, low-noise, and highly compact method is enabled for making measurements with a photoacoustic effect.

Abstract: The present invention generally relates to a mechanism for making a MEMS switch that has a robust RF-contact by avoiding currents to run through a thin sidewall in a via from the RF-contact to the underlying RF-electrode.

Abstract: A microelectromechanical resonant switch (“resoswitch”) converts received radio frequency (RF) energy into a clock output. The resoswitch first accepts incoming amplitude- or frequency-shift keyed clock-modulated RF energy at a carrier frequency, filters it, provides power gain via resonant impact switching, and finally envelop detects impact impulses to demodulate and recover the carrier clock waveform. The resulting output derives from the clock signal that originally modulated the RF carrier, resulting in a local clock that shares its originator's accuracy. A bare push-pull 1-kHz RF-powered mechanical clock generator driving an on-chip inverter gate capacitance of 5 fF can potentially operate with only 5 pW of battery power, 200,000 times lower than a typical real-time clock. Using an off-chip inverter with 17.5 pF of effective capacitance, a 1-kHz push-pull resonator would consume 17.5 nW.

Abstract: In described examples, a method for encapsulating a semiconductor device includes the steps of immersing a layer of the semiconductor device in a liquid encapsulation material, irradiating portions of the liquid encapsulation material to polymerize the liquid encapsulation material, and moving the semiconductor device further from a surface of the liquid encapsulation material proximate to the layer. Immersing the semiconductor device is performed to cover a layer of the device in the liquid encapsulation material. Targeted locations of the liquid encapsulation material covering the layer are irradiated to form solid encapsulation material. The semiconductor device is moved from a surface of the liquid encapsulation material so that a new layer of the semiconductor device and/or of the solid encapsulation material can be covered by the liquid encapsulation material.

Abstract: A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.

Abstract: A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.

Abstract: A semiconductor device includes a first chip, a dielectric layer over the first chip, and a second chip over the dielectric layer. A conductive layer is embedded in the dielectric layer and is electrically coupled to the first chip and the second chip. The second chip includes an optical component. The first chip and the second chip are arranged on opposite sides of the dielectric layer in a thickness direction of the dielectric layer.

Abstract: A micromechanical sensor includes a base substrate, a cap substrate, and a MEMS substrate that is connected to each of the base and cap substrates by respective metallic bond connections and that includes a mechanical functional layer including movable MEMS elements, an electrode device for acquiring an indication of a movement of the MEMS elements and fashioned by layer deposition, and a sacrificial layer that is lower than the mechanical function layer, is fashioned by layer deposition, and is omitted in a region underneath the movable MEMS elements.

Abstract: A micro-electro-mechanical systems (MEMS) device and method of fabricating the MEMS device are disclosed. The MEMS device comprises a substrate, one or more suspension structures connected to the substrate, one or more metallized layers on the one or more suspension structures, and one or more sense structures connected to the one or more suspension structures. The one or more metallized layers provide selectively adjusted damping of the one or more suspension structures.

Abstract: A spectrometer including an optomechanical module and a control module is provided. The optomechanical module includes an optomechanical engine and a sampling device. The optomechanical engine and the sampling device are disposed in the optomechanical module. The sampling device is coupled to the optomechanical engine. The sampling device is configured to transfer a sampling light to the optomechanical engine. The sampling device includes a memory device. The memory device is disposed in the sampling device. The memory device is configured to pre-store an optomechanical parameter corresponding to the optomechanical engine. The control module is coupled to the optomechanical module. The control module is configured to read the memory device to obtain the optomechanical parameter. The control module calibrates the optomechanical engine according to the optomechanical parameter.

Abstract: There is provided a fiber-optic pressure sensor (110), which includes a waveguide (112) having an end, an optical deflection unit (301) connected to the end of the waveguide (112), and a sensor body (300) at which an optical resonator (302) is formed by way of a diaphragm (303). The waveguide (112) and/or the deflection unit (301) is/are attached to the sensor body (300) by way of a curable adhesive or a solder connection.

Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a semiconductor chip including a substrate having a first surface and a second surface arranged opposite to the first surface; a stress-sensitive sensor disposed at the first surface of the substrate, wherein the stress-sensitive sensor is sensitive to mechanical stress; a first pair of adjacent stress-decoupling trenches arranged laterally from a first lateral side of the stress-sensitive sensor, where each stress-decoupling trench of the first pair of adjacent stress-decoupling trenches extends partially from the first surface into the substrate towards the second surface although not completely to the second surface; and a first spring structure formed between the first pair of adjacent stress-decoupling trenches such that the first spring structure is arranged laterally from the stress-sensitive sensor and is configured to absorb external stress from an environment.

Abstract: A mobile communication device and associated control system is provided for determining a presence and location of pressure applied to the mobile communication device. The system can replace physical buttons on the mobile communication device. In embodiments, a sealed chamber, such as a tube, is filled with a pressure-transferring medium inside the sidewalls of the frame of the mobile communication device. Two (or more) pressure sensors can be mounted to the chamber to measure the pressure at two different locations in the chamber. In an embodiment, the time difference of the pressure wave arriving between the pressure sensors can indicate the location of the applied force. By knowing where the force is applied, a desired command from a user can be inferred.

Abstract: The disclosed technology generally relates to magnetoresistive devices, and more particularly to a magnetic tunnel junction (MTJ) device formed in an interconnection structure, and to a method of integrating the (MTJ) device in the interconnection structure. According to an aspect, a device includes a first interconnection level including a first dielectric layer and a first set of conductive paths arranged in the first dielectric layer, a second interconnection level arranged on the first connection level and including a second dielectric layer and a second set of conductive paths arranged in the second dielectric layer, and a third interconnection level arranged on the second interconnection level and including a third dielectric layer and a third set of conductive paths arranged in the third dielectric layer.

Abstract: A semiconductor sensor device includes a lead frame flag having a vent hole, an interposer mounted on the flag and having a vent hole in fluid communication with the vent hole of the flag, and a sensor die having an active region. The sensor die is mounted on and electrically connected to the interposer in a flip-chip manner such that the vent hole of the interposer is in fluid communication with the active region of the sensor die. Bond wires electrically connect the interposer to one or more other components of the device. A molding compound covers the sensor die, the interposer, and the bond wires. The sensor die may be a pressure-sensing (P-cell) die, and the device may also include a micro-controller unit (MCU) die and an acceleration-sensing (G-cell) die, for tire pressure monitoring applications.

Abstract: A pressure sensor is for positioning within a structure. The pressure sensor may include a pressure sensor integrated circuit (IC) having a pressure sensor circuit responsive to bending, and a transceiver circuit coupled to the pressure sensor circuit. The pressure sensor may include a support body having a recess therein coupled to the pressure sensor IC so that the pressure sensor IC bends into the recess when the pressure sensor IC is subjected to external pressure.

Abstract: A device structure comprises a patterned substrate comprising a substrate surface and a substrate post protruding from the substrate surface. The substrate post comprises a substrate post material. A component has a component top side and a component bottom side opposite the component top side. The component bottom side is disposed on the substrate post and extends over at least one edge of the substrate post. The component comprises a component material different from the substrate post material and the component comprises a broken (e.g., fractured) or separated component tether.

Abstract: A film bulk acoustic resonator (FBAR) and a method of fabricating the FBAR are disclosed. In the method, formation of several mutually overlapped and hence connected sacrificial material layers above and under a resonator sheet facilitates the removal of the sacrificial material layers. Cavities left after the removal overlap at a polygonal area with non-parallel sides. This reduces the likelihood of boundary reflections of transverse parasitic waves causing standing wave resonance in the FBAR, thereby enhancing its performance in parasitic wave crosstalk. Further, according to the invention, the FBAR is enabled to be integrated with CMOS circuitry and hence exhibits higher reliability.

Abstract: A MEMS microphone includes a substrate having a cavity, a back plate disposed over the substrate, a diaphragm disposed between the substrate and the back plate, a first supporting member surrounding the diaphragm, the first supporting member including first dam portions arranged along a circumference of the diaphragm, and first slit portions between the first dam portion adjacent to each other to be configured to support the diaphragm from a lower face of the substrate, and a second supporting member surrounding the first supporting member, the second supporting member including second dam portions arranged along a circumference of the first dam portions, and second slit portions between the second dam portion adjacent to each other to be configured to further support the diaphragm from the lower face of the substrate. Thus, the MEMS microphone has an increased acoustic resistance.

Abstract: A method of manufacturing a semiconductor structure includes receiving a first substrate including a first dielectric layer disposed over the first substrate and a first conductive structure surrounded by the first dielectric layer; receiving a second substrate including a second dielectric layer disposed over the second substrate and a second conductive structure surrounded by the second dielectric layer; bonding the first dielectric layer with the second dielectric layer; and bonding the first conductive structure with the second conductive structure.

Abstract: The present disclosure relates to a microphone. In some embodiments, the microphone may comprise a substrate, a diaphragm, a backplate, and a sidewall stopper. The substrate has an opening disposed through the substrate. The diaphragm is disposed over the substrate and facing the opening of the substrate. The diaphragm has a venting hole overlying the opening of the substrate. A backplate is disposed over and spaced apart from the diaphragm. A sidewall stopper is disposed along a sidewall of the venting hole of the diaphragm and thus is not limited by a distance between the movable part and the stable part. Also, the sidewall stopper does not alternate the shape of movable part, and thus will less likely introduce crack to the movable part. In some embodiments, the sidewall stopper may be formed like a sidewall stopper by a self-alignment process, such that no extra mask is needed.

Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.

Abstract: A detection device can include a cavity structure forming a Fabry-Perot optical microcavity, an electrostatic trap, and a Brownian motor. The Fabry-Perot optical microcavity has two mirrors extending on each side of a reference plane in a spacer region between the two mirrors. The mirrors are configured to vertically confine radiation in the spacer region, e.g., with respect to a first direction perpendicular to the reference plane. The electrostatic trap is arranged in the spacer region. The trap includes a pit and the cavity structure is generally configured to confine radiation in the pit, laterally (e.g., with respect to a second direction parallel to the reference plane). The Brownian motor structure extends in the spacer region along said reference plane. This structure is adapted to laterally load particles in the pit of the electrostatic trap by moving such particles along the structure, in operation.

Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.

Abstract: An electronic tag including an electronic paper display, a driving circuit, and an energy harvesting device is provided. The electronic paper display is configured to display tag information. The driving circuit is coupled to the electronic paper display and includes a voltage detecting circuit. The energy harvesting device is coupled to the driving circuit and configured to generate a first power signal. The voltage detecting circuit is configured to receive the first power signal. When a voltage value of the first power signal is higher than a threshold voltage value, the voltage detecting circuit outputs the first output power signal so that the driving circuit enables the electronic paper display by the first output power signal. In addition, a driving method of the above electronic tag is also provided.

Abstract: The invention relates to an accelerometer comprising a plurality of proof-masses (M1-M4) moveable along a measurement axis (AB); a respective spring (K1-K4) rigidly attached to each proof-mass, configured to exert an elastic recall on the proof-mass in the measurement axis; a fixed stop (S1-S4) associated with each proof-mass, arranged to intercept the proof-mass when the acceleration in the measurement axis increases by a step; and an electrical contact associated with each stop, configured to be closed when the associated proof-mass reaches the stop. The proof-masses are suspended in series with respect to one another by springs in the measurement axis, the stops being arranged to successively intercept the respective proof-masses for increasing thresholds of acceleration.

Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.

Abstract: A synthetic resin molded article includes an electric element part extending in a distal direction and a primary molded part. The primary molded part has an element covering portion and a body portion. The element covering portion has a distal end surface exposed in the distal direction and a first side surface extending in a proximal direction opposite to the distal direction. The element covering portion covers a proximal portion of the electric element portion, and a distal end portion of the electric element portion projects from the distal end surface in the distal direction. The body portion has an intermediate surface exposed in the distal direction and a second side surface extending in the proximal direction. The body portion is disposed on a side of the element covering portion in the distal direction and is integrally connected to the element covering portion.

Abstract: A MEMS element includes a surface silicon layer on which an element is formed and on which a first electrode and a second electrode as element electrodes and an electrode pad connected to the first electrode and the second electrode are disposed, and in which a first wiring through-hole is disposed at a position overlapping with the electrode pad of the surface silicon layer and a wiring electrode electrically connected to the electrode pad is disposed in the first wiring through-hole, in plan view.

Abstract: A switch assembly includes a case and a direct current (DC) electronic solid-state switch coupled to the case. The case covers the DC electronic solid-state switch, and the DC electronic solid-state switch has an on-state and off-state. The DC electronic solid-state switch blocks between 650 volts and 1200 volts in a single direction in an off-state. The DC electronic solid-state switch continuously carries at least 400 amperes direct current with a voltage drop of less than one volt. The DC electronic solid-state switch also includes a plurality of semiconductor dies each forming a MOSFET. The DC electronic solid-state switch also includes a plurality of signal conductors.

Abstract: A vacuum transistor includes a substrate and a first terminal formed on the substrate. A piezoelectric element has a second terminal formed on the piezoelectric element, wherein the piezoelectric element is provided over the first terminal to provide a gap between the first terminal and the second terminal. The gap is adjusted in accordance with an electrical field on the piezoelectric element.

Abstract: A system and method for providing a packaged electronics module having a dry film battery incorporated therein is disclosed. The packaged electronics module includes a first dielectric layer, at least one electronic component attached to or embedded in the first dielectric layer, a dry film battery formed on the first dielectric layer, and metal interconnects mechanically and electrically coupled to the at least one electronic component and the dry film battery to form electrical interconnections thereto. Electronic components in the form of a MEMS type sensor, semiconductor device and communications device may be included in the module along with the battery to provide a self-powered module capable of communicating with other like packaged electronics modules.

Abstract: A physical quantity sensor has a first movable electrode section which has a portion facing a first fixed electrode section and a second movable electrode section which has a portion facing a second fixed electrode section, and is provided with a movable mass section which is formed in a shape which encloses a first fixed electrode side fixed section, a second fixed electrode side fixed section, a first movable electrode side fixed section, and a second movable electrode side fixed section in planar view.

Abstract: Aspects of the disclosure provide a capacitive pressure sensor. The capacitive pressure sensor can include a first substrate having a first surface and a second surface, a movable plate at a bottom of a first cavity recessed into the substrate from the first surface, and a second substrate bonded to the first substrate over the first surface. A second cavity is formed between the movable plate and the second surface. The second substrate includes a fixed plate disposed over the movable plate to form a capacitor. The second substrate further includes a third cavity between a surface of the fixed plate opposite to the movable plate and a surface of the second substrate opposite to the first substrate.

Abstract: A microphone includes a substrate defining an embedded cavity between a first surface of the substrate and an opposing second surface of the substrate, the first surface defining a first opening into the embedded cavity, a distance between the first surface and the second surface defining a substrate thickness. A cover is disposed over the first surface of the substrate and forms a housing, the cover including a port, the substrate thickness being greater than a height of the cover from the first surface of the substrate. A microelectromechanical systems (MEMS) transducer is disposed in the housing and mounted on the first surface of the substrate over the first opening, and an integrated circuit (IC) is disposed in the housing and electrically coupled to the MEMS transducer. The MEMS transducer and the IC are disposed in a front volume of the housing defined by the cover and the substrate.

Abstract: A method for producing thin MEMS chips on SOI substrate including: providing an SOI substrate having a silicon layer on a front side and having an oxide intermediate layer, producing a layer structure on the front side of the SOI substrate and producing a MEMS structure from this layer structure, capping the MEMS structure and producing a cavity, and etching a back side of the SOI substrate down to the oxide intermediate layer. Also described is a micromechanical component having a substrate, a MEMS layer structure having a MEMS structure in a cavity and a cap element, the MEMS structure and its cavity being enclosed by the substrate underneath and the cap element above, the substrate being made of polycrystalline silicon.

Abstract: A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.

Abstract: A packaged semiconductor device includes a leadframe (LF) having a plurality of laminate-supporting pedestals. A cured first die attach (DA) material is on an outer edge of the pedestals being an ultraviolet (UV)-curing DA material having a photoinitiator or a cured B-stage DA material. A cured thermally-curing DA material is on an area of the pedestals not occupied by the UV-curing DA material. A laminate component having bond pads on a top side is mounted top side up on the plurality of pedestals.

Abstract: A microphone device includes a housing including a substrate having a first surface and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The device also includes a microelectromechanical systems (MEMS) transducer mounted on the substrate and an integrated circuit (IC) mounted on the substrate. The MEMS transducer of the device is electrically connected to the IC, and the IC of the device is electrically connected to a conductor on the substrate. An encapsulating material covers the IC. And an encapsulating material confinement structure is disposed between the MEMS transducer and the IC, wherein the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.

Abstract: A MEMS microphone includes a substrate having a cavity, a back plate provided over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, and spaced apart from the substrate and the back plate, a strut located at outer side of the diaphragm, having a lower surface in contact with an upper surface of the substrate and being integrally formed with the upper insulation layer to support the upper insulation layer to space the upper insulation layer from the diaphragm, and a bending prevention member provided on an upper surface of the back plate for preventing the back plate from being bent.

Abstract: The present disclosure relates to a micro-electromechanical system (MEMs) package. In some embodiments, the MEMs package has a plurality of conductive interconnect layers disposed within a dielectric structure over an upper surface of a first substrate. A heating element is electrically coupled to a semiconductor device within the first substrate by one or more of the plurality of conductive interconnect layers. The heating element is vertically separated from the first substrate by the dielectric structure. A MEMs substrate is coupled to the first substrate and has a MEMs device. A hermetically sealed chamber surrounding the MEMs device is disposed between the first substrate and the MEMs substrate. An out-gassing material is disposed laterally between the hermetically sealed chamber and the heating element.

Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.

Abstract: The present invention provides a MEMS device such as a capacitive MEMS microphone that comprises a new design of air flow restrictor. An air channel includes a first internal wall and a second internal wall for air to flow between. A trench is recessed from the first internal wall, and an insert is extended from the second internal wall and inserted into the trench. The spatial relationship between the insert and the trench can vary or oscillate. Air resistance of the channel may be controlled by the trench depth. The air resistance is higher with a deeper trench. The invention has a significant effect on, for example, keeping the sound frequency response plot more flat on the low frequency part ranging from 20 Hz to 1000 Hz.

Abstract: Systems and methods for providing 3D wafer assembly with known-good-dies are provided. An example method compiles an index of dies on a semiconductor wafer and removes the defective dies to provide a wafer with dies that are all operational. Defective dies on multiple wafers may be removed in parallel, and resulting wafers with all good dies stacked in 3D wafer assembly. In an implementation, the spaces left by removed defective dies may be filled at least in part with operational dies or with a fill material. Defective dies may be replaced either before or after wafer-to-wafer assembly to eliminate production of defective stacked devices, or the spaces may be left empty. A bottom device wafer may also have its defective dies removed or replaced, resulting in wafer-to-wafer assembly that provides 3D stacks with no defective dies.

Abstract: A curved-surface OLED display device with fingerprint identification includes a substrate, a thin film transistor layer, a pixel electrode layer, an OLED display material layer, a common electrode layer, an encapsulation layer, a curved touch detection and fingerprint detection layer and a curved protective layer. The thin film transistor layer includes plural thin film transistors, plural scan lines, and plural data lines. The pixel electrode layer includes plural pixel electrodes. The curved touch detection and fingerprint detection layer includes plural sense electrodes and plural traces for performing the touch detection operation and fingerprint identification operation. A partial area of the curved touch detection and fingerprint detection layer and the curved protective layer exhibits a curved-surface shape.

Abstract: A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, and a biological sensor.