With Window Means Patents (Class 257/434)
  • Patent number: 11462419
    Abstract: Various embodiments of fanout packages are disclosed. A method of forming a microelectronic assembly is disclosed. The method can include bonding a first surface of at least one microelectronic substrate to a surface of a carrier using a direct bonding technique without an intervening adhesive, the microelectronic substrate having a plurality of conductive interconnections on at least one surface of the microelectronic substrate. The method can include applying a molding material to an area of the surface of the carrier surrounding the microelectronic substrate to form a reconstituted substrate. The method can include processing the microelectronic substrate. The method can include singulating the reconstituted substrate at the area of the surface of the carrier and at the molding material to form the microelectronic assembly.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: October 4, 2022
    Assignee: INVENSAS BONDING TECHNOLOGIES, INC.
    Inventor: Belgacem Haba
  • Patent number: 11406299
    Abstract: A sensor comprises a microfabricated chip having a surface with one or more cavities formed thereon, the cavities including sensing components, one or more lids, each covering said surface so as to close at least one of said cavities, the lids contacting rims that delimit said cavities on said surface. Electric circuit portions join, each, a respective one of the lids, to allow the lids to be partly dissolved, electrochemically, responsive to being exposed to an electrochemical solution. In addition, masking material portions cover peripheral regions of the lids at the level of the rims, so as to seal the lids and shield such peripheral regions from said electrochemical solution, in operation. Related apparatuses and sensing methods may be provided.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: August 9, 2022
    Assignee: International Business Machines Corporation
    Inventors: Patrick Ruch, Jonas Weiss
  • Patent number: 11342375
    Abstract: Implementations of image sensor packages may include an image sensor chip, a first layer including an opening therethrough coupled to a first side of the image sensor chip, and a optically transmissive cover coupled to the first layer. The optically transmissive cover, the first layer, and the image sensor chip may form a cavity within the image sensor. The image sensor package may also include at least one electrical contact coupled to a second side of the image sensor chip opposing the first side and an encapsulant coating an entirety of the sidewalls of the image sensor package.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: May 24, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Shou-Chian Hsu
  • Patent number: 11251174
    Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: February 15, 2022
    Assignee: Industrial Technology Research Institute
    Inventors: Sheng-Tsai Wu, Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen, Shin-Yi Huang
  • Patent number: 11201251
    Abstract: A photodiode has a substrate. A mesa structure is formed on the substrate, wherein the mesa structure has an n region containing an n type dopant formed on the substrate, an intermediate region positioned on the n region and a p region formed on the intermediate region and containing a p type dopant. A contact is formed on a top surface of the mesa and attached to the p region. The contact is formed around an outer perimeter of the mesa. The mesa has a diameter of 30 um or less.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: December 14, 2021
    Assignee: OEPIC SEMICONDUCTORS, INC.
    Inventors: Yi-Ching Pao, Majid Riaziat, Ta-Chung Wu
  • Patent number: 11163216
    Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: November 2, 2021
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Nan Guo, Zhen Huang, Duanliang Cheng, Liang Ding, Feifan Chen, Heng Jiang
  • Patent number: 11139233
    Abstract: A method for forming a semiconductor package is disclosed herein. The method includes forming a package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate includes a recess region below the first major surface defined with a die region and a non-die region surrounding the die region. A semiconductor die is disposed in the die region within the recess region. A dam structure is disposed within the recess region. The dam structure surrounds the semiconductor die and extends upwardly to a height below the first major surface of the package substrate. The method also includes dispensing a liquid encapsulant material into the recess region. The liquid encapsulant material is surrounded by the dam structure and extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: October 5, 2021
    Assignee: UTAC Headquarters Pte. Ltd.
    Inventors: Hua Hong Tan, Wilson Poh Leng Ong, Kriangsak Sae Le, Saravuth Sirinorakul, Somsak Phukronghin, Paweena Phatto
  • Patent number: 11107742
    Abstract: An electronic device includes a carrier wafer having a front side and a back side, with an electrical connection network configured to connect the front side to the back side. An electronic chip is mounted on the front side of the carrier wafer and electrically connected to front pads of the electrical connection network. A sheet of a thermally conductive graphite or a pyrolytic graphite is added to the back side of the carrier wafer. The sheet includes apertures which leave back pads of the electrical connection network uncovered.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: August 31, 2021
    Assignee: STMicroelectronics (Grenoble 2) SAS
    Inventor: Didier Campos
  • Patent number: 11032629
    Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: June 8, 2021
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS (MALTA) LTD
    Inventors: Roberto Brioschi, Paul Anthony Barbara
  • Patent number: 10978537
    Abstract: An organic light emitting diode display includes a substrate, a plurality of pixels disposed on the substrate, a plurality of transmissive windows spaced apart from the pixels, and a light blocking member disposed between one of the pixels and one of the transmissive windows. The pixels display an image, and light is transmitted through the transmissive windows. Each pixel includes a transistor including a plurality of electrode members disposed in different layers on the substrate. The light blocking member includes a plurality of light blocking sub-members respectively disposed in the same layers as the plurality of electrode members.
    Type: Grant
    Filed: May 1, 2017
    Date of Patent: April 13, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Kohei Ebisuno, Yong Ho Yang, Jun Hee Lee, Nak Cho Choi
  • Patent number: 10978347
    Abstract: A device chip for mounting on a board is provided. The device chip includes a top surface, an undersurface located on an opposite side from the top surface and having a larger area than the top surface, a slope inclined with respect to the top surface and the undersurface and exposed to the top surface side, a circuit portion on the top surface side, the circuit portion including an electronic circuit, and a wiring portion on which wiring electrically connecting the circuit portion and the board to each other is to be formed, the wiring portion including the slope in a part of the wiring portion.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: April 13, 2021
    Assignee: DISCO CORPORATION
    Inventor: Devin Martin
  • Patent number: 10958816
    Abstract: A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: March 23, 2021
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhen Huang, Nan Guo
  • Patent number: 10914943
    Abstract: A camera device with anti-ghosting and anti-flare properties includes a printed circuit board; an image sensor mounted on the printed circuit board; and a supporting bracket fixed on the printed circuit board. The supporting bracket includes a supporting plate and perpendicular side wall. The supporting plate and the side wall together form a receiving room covering the image sensor, the supporting plate is opened to form a step portion. The step portion comprises a matte top bearing surface, and a protecting sheet fixed on the matte top bearing surface.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: February 9, 2021
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Shuai-Peng Li, Shin-Wen Chen, Kun Li, Long-Fei Zhang
  • Patent number: 10891459
    Abstract: There is provided a fingerprint sensor module comprising a fingerprint sensor device comprising a sensing array and at least one connection pad for electrically connecting the fingerprint sensor device to external circuitry, the sensing array and connection pad being located on a first side of the fingerprint sensing device; at least one electrically conductive via connection arranged adjacent to the fingerprint sensor device and in electrical contact with the connection pad via at least one conductive trace located in the same plane as the connection pad; a mold layer arranged to cover a backside of the fingerprint sensor device and to fill a volume between the fingerprint sensor device and the via connection, wherein an end portion of the via connection is exposed for connecting the fingerprint sensor module to external circuitry. There is also provided a method for manufacturing such a fingerprint sensor module.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: January 12, 2021
    Assignee: FINGERPRINT CARDS AB
    Inventor: Karl Lundahl
  • Patent number: 10892373
    Abstract: There are disclosed herein various implementations of a photodiode including a silicon substrate, and an N type germanium region situated over the silicon substrate, the N type germanium region being a cathode of the photodiode. In addition, the photodiode includes a P type germanium region situated over the N type germanium region, the P type germanium region being an anode of the photodiode. The photodiode also includes a P type silicon cap over the P type germanium region, an anode contact of the photodiode situated on the P type silicon cap, and one or more cathode contacts of the photodiode electrically connected to the N type germanium region.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: January 12, 2021
    Assignee: Newport Fab, LLC
    Inventors: Difeng Zhu, Edward Preisler
  • Patent number: 10825971
    Abstract: A light-emitting device includes a light-emitting element mounted on a base substrate, a reflective member that is formed on the base substrate and surrounds the light-emitting element, a transparent member that has a flat upper surface and is placed to cover above the light-emitting element, and a DBR film placed on the upper surface of the transparent member. A relation between an incident angle of light emitted from the light-emitting element and input into the DBR film and a transmittance of the light to pass through the DBR film is obtained such that a peak of the transmittance is in a range of the incident angle greater than 0°.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: November 3, 2020
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Masaki Oya, Takashi Mizobuchi
  • Patent number: 10700110
    Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: June 30, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hyun Lim, Yoon Seok Seo, Kyung Moon Jung, Eun Jin Kim
  • Patent number: 10699907
    Abstract: An organic thin film transistor comprises a base material, a gate electrode, a gate insulating layer, an organic semiconductor layer, a source electrode, and a drain electrode, and further comprises charge injection layers which are provided between the source electrode and a base material side layer of the source electrode and between the drain electrode and a base material side layer of the drain electrode and have a thickness that decreases in a direction opposite to a direction in which the source electrode and the drain electrode face each other on a side of the source electrode facing the drain electrode and a side of the drain electrode facing the source electrode, and is manufactured by scanning a metal layer with a laser so as to form the source electrode and the drain electrode, and dropwise-adding a solution which becomes the charge injection layers to a laser-scanned portion.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: June 30, 2020
    Assignee: FUJIFILM Corporation
    Inventor: Yoshiki Maehara
  • Patent number: 10694084
    Abstract: An imaging apparatus includes a lens barrel unit, an image sensor substrate having an image sensor, a metal plate to which an image sensor substrate is fixed, a lens barrel holder made of a metal material and configured to support the lens barrel unit, a third cover member made of a heat-conductive resin material fixed to the lens barrel holder and configured to cover the circumferential surface of the lens barrel unit, and a heat-conductive member configured to conduct heat of an image sensor sheet metal to the lens barrel holder. At least a part of the lens barrel holder is disposed inside the third cover member.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: June 23, 2020
    Assignee: Canon Kabushiki Kaisha
    Inventor: Kazuki Fujii
  • Patent number: 10676345
    Abstract: A temperature-stabilized MEMS device in which heat is generated by ohmic heating as an electric current passes through at least part of one of the structural layers of the device. Various implementation options are disclosed in which the heating occurs in a device layer (25) of the device, either in an outer frame (2) or within the area of an active structure (3), or where heating occurs within a substrate (1) or a cover (8) of the device. One application of particular relevance is a gyroscope device.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: June 9, 2020
    Assignee: Y-SENSORS LTD.
    Inventor: Yishay Netzer
  • Patent number: 10680719
    Abstract: The invention relates to a bidirectional wireless communication device which is based on the use of light, including emitting modules, each emitting amplitude- and/or phase-modulated light; and a receiving module made up of: a photodetector illuminated by said modulated light and generating a modulated electrical signal in response to said modulated light; and a processing module for processing the signal generated by said photodetector. The receiving module includes an electronic means positioned between the photodetector and the signal-processing module and capable of matching the impedance of the photodetector to maximise the signal-to-noise ratio of the electrical signal by minimising distortions of said electronic signal associated with incorrect impedance matching at the output of the photodetector, while maximising the level of the modulated electrical signal and the throughput of transmitted data.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: June 9, 2020
    Assignee: Garmin Switzerland GmbH
    Inventors: Franck Aveline, Emilie Bialic, Nicolas Chaumont
  • Patent number: 10681256
    Abstract: An image sensor module includes an interposer substrate having a first surface and a second surface opposite to the first surface, the interposer substrate being light-transmissive and having a plurality of through-holes; an image sensor located to face the first surface of the interposer substrate, the image sensor having a light receiving surface on a side of the interposer substrate, a plurality of photoelectric conversion elements being located at the light receiving surface, the image sensor being connected with an external circuit via electrodes provided in the plurality of through-holes; and a lens unit located to face the second surface of the interposer substrate.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: June 9, 2020
    Assignee: DAI NIPPON PRINTING Co., Ltd.
    Inventors: Yoshiaki Tsuruoka, Masaaki Asano, Shinji Maekawa
  • Patent number: 10670946
    Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: June 2, 2020
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang, Duanliang Cheng, Liang Ding, Feifan Chen, Heng Jiang, Zhenyu Chen
  • Patent number: 10672937
    Abstract: An optical sensor module and a sensor chip thereof are provided. The optical sensor module includes a substrate, a sensor chip and a passive chip. The sensor chip is disposed on the substrate, and the sensor chip includes a chip body having an active region located at a top side thereof and a recess portion depressed from a top surface of the chip body. The passive chip is accommodated in the recess portion, and a depth of the recess portion is greater than a thickness of the passive chip.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: June 2, 2020
    Assignee: PIXART IMAGING INC.
    Inventor: Chi-Chih Shen
  • Patent number: 10665684
    Abstract: A structure by which electric-field concentration which might occur between a source electrode and a drain electrode in a bottom-gate thin film transistor is relaxed and deterioration of the switching characteristics is suppressed, and a manufacturing method thereof. A bottom-gate thin film transistor in which an oxide semiconductor layer is provided over a source and drain electrodes is manufactured, and angle ?1 of the side surface of the source electrode which is in contact with the oxide semiconductor layer and angle ?2 of the side surface of the drain electrode which is in contact with the oxide semiconductor layer are each set to be greater than or equal to 20° and less than 90°, so that the distance from the top edge to the bottom edge in the side surface of each electrode is increased.
    Type: Grant
    Filed: November 5, 2018
    Date of Patent: May 26, 2020
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Kengo Akimoto, Daisuke Kawae
  • Patent number: 10580812
    Abstract: A fan-out sensor package includes: a first interconnection member having a through-hole; a sensor disposed in the through-hole of the first interconnection member and having an active surface having connection pads and microlenses disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the active surface or the inactive surface of the sensor; and a second interconnection member disposed on the first interconnection member and the inactive surface or the active surface of the sensor. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the sensor. A camera module includes the fan-out sensor package.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: March 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae Sung Jeong, Ju Ho Kim
  • Patent number: 10567625
    Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket is connected to the surface of the circuit board which has the image sensor. The optical filter is connected to mounting bracket and positioned above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board through a frame of adhesive. The surface of the lens unit connected to the mounting bracket has protrusions which are positioned at inner edges of the adhesive layer. The protrusions are taller than the depth of the adhesive layer.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: February 18, 2020
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
    Inventors: Shin-Wen Chen, Xiao-Mei Ma, Ke-Hua Fan, Long-Fei Zhang
  • Patent number: 10497728
    Abstract: A fingerprint sensing chip packaging method and package are provided. The method includes: providing a cover plate, providing a fingerprint sensing chip, where a fingerprint sensing region and contact pads at periphery of the region are arranged on a front surface of the chip, electrically connecting the contact pads to a back surface of the chip, forming a first conductive structure electrically connected to the contact pads on the back surface of the chip, laminating the front surface of the chip with a back surface of the cover plate, providing a flexible printed circuit, where a second conductive structure is arranged on a back surface of the circuit and an opening is arranged in the circuit, laminating a front surface of the circuit with the back surface of the cover plate, and electrically connecting the first conductive structure to the second conductive structure.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: December 3, 2019
    Assignee: China Wafer Level CSP Co., Ltd.
    Inventors: Zhiqi Wang, Yuanfei Liu, Hongjun Liu
  • Patent number: 10440247
    Abstract: A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: October 8, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhen Huang, Nan Guo
  • Patent number: 10389084
    Abstract: An optical element package includes: an eyelet including an upper surface and a lower surface opposite to the upper surface; a heat releasing part disposed on the upper surface of the eyelet; a through hole formed through the eyelet to extend from the upper surface of the eyelet to the lower surface of the eyelet; a lead sealed by a certain member provided in the through hole and including a lead portion extending from the lower surface of the eyelet and a lead wiring portion extending from the upper surface of the eyelet; and an insulating substrate disposed between the lead wiring portion and the heat releasing part and comprising a front surface and a back surface opposite to the front surface.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: August 20, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Yasuyuki Kimura
  • Patent number: 10379294
    Abstract: A multi-directional fiber optic connector includes a housing defining therein a mating-connection chamber, a mating-connection portion having an insertion hole in communication with the accommodation chamber and a plurality of guide grooves equiangularly spaced around the insertion hole for guiding a fiber optic lead end connector of a fiber optic cable into the insertion hole in one of a series of angular positions and an accommodation chamber located at an opposite side of said mating-connection chamber, said mating-connection portion comprising, and an optical device mounted in the accommodation chamber for optical communication with the inserted fiber optic cable.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: August 13, 2019
    Assignee: SOLTEAM OPTO, INC.
    Inventors: Chin-Feng Chen, Po-Kai Wang, Chang-Ming Lee
  • Patent number: 10283679
    Abstract: A light emitting device, has: a light emitting element; a substrate having a first main surface on which the light emitting element is mounted, and recesses on side surfaces adjacent to the first main surface, a cap covering the light emitting element, and having a light-transmissive member and a metal frame that supports the light-transmissive member and has side pieces extending toward the substrate from above the first main surface of the substrate, and tabs that is bended and extend from the side pieces and housed a part thereof in the recesses of the substrate.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: May 7, 2019
    Assignee: NICHIA CORPORATION
    Inventor: Takashi Murayama
  • Patent number: 10274694
    Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: April 30, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang, Zhongyu Luan, Fengsheng Xi, Feifan Chen, Liang Ding
  • Patent number: 10269853
    Abstract: An image sensor device, as well as methods therefor, is disclosed. This image sensor device includes a substrate having bond pads. The substrate has a through substrate channel defined therein extending between a front side surface and a back side surface thereof. The front side surface is associated with an optically-activatable surface. The bond pads are located at or proximal to the front side surface aligned for access via the through substrate channel. Wire bond wires are bonded to the bond pads at first ends thereof extending away from the bond pads with second ends of the wire bond wires located outside of an opening of the channel at the back side surface. A molding layer is disposed along the back side surface and in the through substrate channel. A redistribution layer is in contact with the molding layer and interconnected to the second ends of the wire bond wires.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: April 23, 2019
    Assignee: Invensas Corporation
    Inventor: Rajesh Katkar
  • Patent number: 10263710
    Abstract: The invention relates to a bidirectional wireless communication device which is based on the use of light, including emitting modules, each emitting amplitude- and/or phase-modulated light; and a receiving module made up of: a photodetector illuminated by said modulated light and generating a modulated electrical signal in response to said modulated light; and a processing module for processing the signal generated by said photodetector. The receiving module includes an electronic means positioned between the photodetector and the signal-processing module and capable of matching the impedance of the photodetector to maximize the signal-to-noise ratio of the electrical signal by minimizing distortions of said electronic signal associated with incorrect impedance matching at the output of the photodetector, while maximizing the level of the modulated electrical signal and the throughput of transmitted data.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: April 16, 2019
    Assignee: SUNPARTNER TECHNOLOGIES
    Inventors: Franck Aveline, Emilie Bialic, Nicolas Chaumont
  • Patent number: 10225635
    Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: March 5, 2019
    Assignees: STMicroelectronics S.r.l., STMicroelectronics (Malta) Ltd
    Inventors: Roberto Brioschi, Alex Gritti, Kevin Formosa, Paul Anthony Barbara
  • Patent number: 10224273
    Abstract: A semiconductor package, e.g., wafer, chip, interposer, etc., includes a multi terminal capacitor within an input output (IO) path. The multi terminal capacitor is electrically attached directly upon a first IO contact of the semiconductor package. There is no inductance between the multi terminal capacitor and a interconnect that electrically connects the first IO contact with a second IO contact of a second semiconductor package and no inductance between the multi terminal capacitor and the first IO contact. The multi terminal capacitor may serve as a power source to cycle the turning on and off of the various circuits within a semiconductor chip associated with the semiconductor package. Because the distance between the multi terminal capacitor and semiconductor chip is reduced, inductance within the system is resultantly reduced. The multi terminal capacitor may be a decoupling capacitor that decouples one part of semiconductor chip from another part of semiconductor chip.
    Type: Grant
    Filed: October 28, 2017
    Date of Patent: March 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Arvin, Jean Audet, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof
  • Patent number: 10224274
    Abstract: A semiconductor package, e.g., wafer, chip, interposer, etc., includes a multi terminal capacitor within an input output (IO) path. The multi terminal capacitor is electrically attached directly upon a first IO contact of the semiconductor package. There is no inductance between the multi terminal capacitor and a interconnect that electrically connects the first IO contact with a second IO contact of a second semiconductor package and no inductance between the multi terminal capacitor and the first IO contact. The multi terminal capacitor may serve as a power source to cycle the turning on and off of the various circuits within a semiconductor chip associated with the semiconductor package. Because the distance between the multi terminal capacitor and semiconductor chip is reduced, inductance within the system is resultantly reduced. The multi terminal capacitor may be a decoupling capacitor that decouples one part of semiconductor chip from another part of semiconductor chip.
    Type: Grant
    Filed: October 28, 2017
    Date of Patent: March 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Charles L. Arvin, Jean Audet, Brian W. Quinlan, Charles L. Reynolds, Brian R. Sundlof
  • Patent number: 10197890
    Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: February 5, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Takehiko Tanaka, Nan Guo, Zhen Huang, Duanliang Cheng, Liang Ding, Feifan Chen, Heng Jiang
  • Patent number: 10186533
    Abstract: A solid-state imaging device includes a plurality of photoelectric conversion units, a floating diffusion unit that is shared by the plurality of photoelectric conversion units and converts electric charge generated in each of the plurality of photoelectric conversion units into a voltage signal, a plurality of transfer units that are respectively provided in the plurality of photoelectric conversion units and transfer the electric charge generated in the plurality of photoelectric conversion units to the floating diffusion unit, a first transistor group that is electrically connected to the floating diffusion unit and includes a gate and source/drain which are arranged with a first layout configuration, and a second transistor group that is electrically connected to the floating diffusion unit, includes a gate and source/drain arranged with a second layout configuration symmetrical to the first layout configuration, and is provided in a separate area from the first transistor group.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: January 22, 2019
    Assignee: Sony Corporation
    Inventors: Nanako Kato, Toshifumi Wakano, Atsuhiko Yamamoto
  • Patent number: 10177074
    Abstract: Implementations of semiconductor packages may include a die including a first side and a second side opposing the first side, the second side of the die coupled to a layer, a first end of a plurality of wires each bonded to the first side of the die, a mold compound encapsulating the die and the plurality of wires, and a second end of the plurality of wires each directly bonded to one of a plurality of bumps, wherein a surface of the layer is exposed through the mold compound.
    Type: Grant
    Filed: October 4, 2017
    Date of Patent: January 8, 2019
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Atapol Prajuckamol, Soon Wei Wang, Hoe Kit Liew How Kat Ley
  • Patent number: 10168499
    Abstract: In an electronic module 30, a groove 3 is disposed in a single side surface A of an electronic device 20 that faces an outer principal surface 33 of a circuit board 31. In the groove 3, an end portion of a mounting electrode 2 near a joining body 21 is located further toward an insulating substrate 1 than an end portion 3 of the groove 3 near the joining body 21. A fillet F of a joining material 41 is disposed in a region of the groove 3 near the joining body 21. Owing to the fillet F, the reliability of connection between the electronic device 20 and the circuit board 31 can be increased.
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: January 1, 2019
    Assignee: KYOCERA CORPORATION
    Inventor: Youhei Aikou
  • Patent number: 10171716
    Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: January 1, 2019
    Assignee: Ningbo Sunny Opotech Co., Ltd.
    Inventors: Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng
  • Patent number: 10147748
    Abstract: An image sensor chip includes a semiconductor layer intended to receive illumination on a back face and comprising a matrix of pixels on a front face. An interconnection structure is arranged on the front face and a carrier is attached to the interconnection structure with a first face of the carrier facing the front face. An annular trench, arranged on a perimeter of the image sensor chip, extends from a second face of the carrier through an entire thickness of the carrier and into the interconnection structure. A via opening, arranged within the annual trench, extends from the second face of the carrier through the entire thickness of the carrier to reach a metal portion of the interconnection structure. The via opening an annual trench are lined with an insulating layer. The via opening include a metal conductor making an electrical connection to the metal portion.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: December 4, 2018
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventors: Laurent Gay, Francois Guyader
  • Patent number: 10109602
    Abstract: A package integrated with a power source module may be provided. The package including a substrate having an upper surface and a lower surface, a chip on the upper surface of the substrate, a first power supply on the upper surface of the substrate, the first power supply at one side of the chip, an encapsulant encapsulating the chip and the first power supply, a second power supply on the encapsulant, the second power supply electrically connected with the substrate through a connection member, the connection member penetrating through the encapsulant may be provided.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: October 23, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Maohua Du
  • Patent number: 10079367
    Abstract: The present disclosure relates to an Organic Light-Emitting Diode (OLED) apparatus and a method for manufacturing the same. The OLED apparatus comprises an OLED device, a device packaging layer, an upper flexible substrate, and a lower flexible substrate, wherein an anti-reflection layer is arranged outside the upper flexible substrate, and a layer of inorganic nanoparticles is provided on a surface of the anti-reflection layer. Using the technical solution of the present disclosure, an OLED apparatus which has both waterproof and anti-reflection effects and a small overall thickness is obtained.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: September 18, 2018
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Rui Li, Jilong Li, Cheng Chen, Dezhi Xu
  • Patent number: 9947841
    Abstract: A light emitting device includes a light emitting element, a wavelength converter, a light transmissive member, a light guider, and a light transmitting layer. The light emitting element has an element upper surface, an element lower surface, and an element side surface. The wavelength converter has a converter lower surface. The wavelength is provided to be connected to the light emitting element such that the converter lower surface faces the element upper surface. The converter lower surface has an exposed region that does not face the element upper surface. The light guider guides light from the light emitting element to the wavelength converter. The light guider covers the element side surface and the exposed region. The wavelength converter has a converter upper surface. The light transmitting layer has a layer lower surface facing the converter upper surface. The converter upper surface is smaller than the layer lower surface.
    Type: Grant
    Filed: January 11, 2017
    Date of Patent: April 17, 2018
    Assignee: NICHIA CORPORATION
    Inventors: Daisuke Sato, Atsushi Hashizume, Toshiki Nishihama, Shimpei Maeda
  • Patent number: 9933614
    Abstract: An electro-optic device includes a chip provided with a mirror and a drive element adapted to drive the mirror, a light-transmitting cover adapted to cover the mirror in a planar view, and a spacer having contact with one surface of the chip between the cover and the chip. The entire part of one surface of the chip having contact with the spacer is made of a first material such as silicon oxide film having first thermal conductivity, and the spacer is made of a second material such as a quartz crystal having second thermal conductivity higher than the first thermal conductivity. The cover is made of a third material such as sapphire having third thermal conductivity higher than the second thermal conductivity.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: April 3, 2018
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Suguru Uchiyama, Kosuke Takahashi
  • Patent number: 9847396
    Abstract: A structure by which electric-field concentration which might occur between a source electrode and a drain electrode in a bottom-gate thin film transistor is relaxed and deterioration of the switching characteristics is suppressed, and a manufacturing method thereof. A bottom-gate thin film transistor in which an oxide semiconductor layer is provided over a source and drain electrodes is manufactured, and angle ?1 of the side surface of the source electrode which is in contact with the oxide semiconductor layer and angle ?2 of the side surface of the drain electrode which is in contact with the oxide semiconductor layer are each set to be greater than or equal to 20° and less than 90°, so that the distance from the top edge to the bottom edge in the side surface of each electrode is increased.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: December 19, 2017
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Kengo Akimoto, Daisuke Kawae
  • Patent number: 9831185
    Abstract: A chip package includes a chip, a laser stop layer, a first through hole, an isolation layer, a second through hole and a conductive layer. The laser stop layer is disposed above a first surface of the chip, and the first through hole is extended from a second surface to the first surface of the chip to expose the laser stop layer. The isolation layer is below the second surface and in the first through hole, and the isolation layer has a third surface opposite to the second surface. The second through hole is extended from the third surface to the first surface, and the second through hole is through the first through hole to expose the laser stop layer. The conductive layer is disposed below the third surface and extended into the second through hole to contact the laser stop layer.
    Type: Grant
    Filed: April 26, 2016
    Date of Patent: November 28, 2017
    Assignee: XINTEC INC.
    Inventors: Shih-Yi Lee, Ying-Nan Wen, Chien-Hung Liu, Ho-Yin Yiu