Abstract: A lens module with physically stronger foundations and enhanced stability includes a circuit board, an image sensor thereon, a mounting bracket, an optical filter, and a lens unit. The mounting bracket is connected to the surface of the circuit board which has the image sensor. The optical filter is connected to mounting bracket and positioned above the image sensor. The lens unit is connected to the mounting bracket facing away from the circuit board through a frame of adhesive. The surface of the lens unit connected to the mounting bracket has protrusions which are positioned at inner edges of the adhesive layer. The protrusions are taller than the depth of the adhesive layer.

Abstract: A fingerprint sensing chip packaging method and package are provided. The method includes: providing a cover plate, providing a fingerprint sensing chip, where a fingerprint sensing region and contact pads at periphery of the region are arranged on a front surface of the chip, electrically connecting the contact pads to a back surface of the chip, forming a first conductive structure electrically connected to the contact pads on the back surface of the chip, laminating the front surface of the chip with a back surface of the cover plate, providing a flexible printed circuit, where a second conductive structure is arranged on a back surface of the circuit and an opening is arranged in the circuit, laminating a front surface of the circuit with the back surface of the cover plate, and electrically connecting the first conductive structure to the second conductive structure.

Abstract: A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.

Abstract: An optical element package includes: an eyelet including an upper surface and a lower surface opposite to the upper surface; a heat releasing part disposed on the upper surface of the eyelet; a through hole formed through the eyelet to extend from the upper surface of the eyelet to the lower surface of the eyelet; a lead sealed by a certain member provided in the through hole and including a lead portion extending from the lower surface of the eyelet and a lead wiring portion extending from the upper surface of the eyelet; and an insulating substrate disposed between the lead wiring portion and the heat releasing part and comprising a front surface and a back surface opposite to the front surface.

Abstract: A multi-directional fiber optic connector includes a housing defining therein a mating-connection chamber, a mating-connection portion having an insertion hole in communication with the accommodation chamber and a plurality of guide grooves equiangularly spaced around the insertion hole for guiding a fiber optic lead end connector of a fiber optic cable into the insertion hole in one of a series of angular positions and an accommodation chamber located at an opposite side of said mating-connection chamber, said mating-connection portion comprising, and an optical device mounted in the accommodation chamber for optical communication with the inserted fiber optic cable.

Abstract: A light emitting device, has: a light emitting element; a substrate having a first main surface on which the light emitting element is mounted, and recesses on side surfaces adjacent to the first main surface, a cap covering the light emitting element, and having a light-transmissive member and a metal frame that supports the light-transmissive member and has side pieces extending toward the substrate from above the first main surface of the substrate, and tabs that is bended and extend from the side pieces and housed a part thereof in the recesses of the substrate.

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Abstract: An image sensor device, as well as methods therefor, is disclosed. This image sensor device includes a substrate having bond pads. The substrate has a through substrate channel defined therein extending between a front side surface and a back side surface thereof. The front side surface is associated with an optically-activatable surface. The bond pads are located at or proximal to the front side surface aligned for access via the through substrate channel. Wire bond wires are bonded to the bond pads at first ends thereof extending away from the bond pads with second ends of the wire bond wires located outside of an opening of the channel at the back side surface. A molding layer is disposed along the back side surface and in the through substrate channel. A redistribution layer is in contact with the molding layer and interconnected to the second ends of the wire bond wires.

Abstract: The invention relates to a bidirectional wireless communication device which is based on the use of light, including emitting modules, each emitting amplitude- and/or phase-modulated light; and a receiving module made up of: a photodetector illuminated by said modulated light and generating a modulated electrical signal in response to said modulated light; and a processing module for processing the signal generated by said photodetector. The receiving module includes an electronic means positioned between the photodetector and the signal-processing module and capable of matching the impedance of the photodetector to maximize the signal-to-noise ratio of the electrical signal by minimizing distortions of said electronic signal associated with incorrect impedance matching at the output of the photodetector, while maximizing the level of the modulated electrical signal and the throughput of transmitted data.

Abstract: A semiconductor package, e.g., wafer, chip, interposer, etc., includes a multi terminal capacitor within an input output (IO) path. The multi terminal capacitor is electrically attached directly upon a first IO contact of the semiconductor package. There is no inductance between the multi terminal capacitor and a interconnect that electrically connects the first IO contact with a second IO contact of a second semiconductor package and no inductance between the multi terminal capacitor and the first IO contact. The multi terminal capacitor may serve as a power source to cycle the turning on and off of the various circuits within a semiconductor chip associated with the semiconductor package. Because the distance between the multi terminal capacitor and semiconductor chip is reduced, inductance within the system is resultantly reduced. The multi terminal capacitor may be a decoupling capacitor that decouples one part of semiconductor chip from another part of semiconductor chip.

Abstract: A semiconductor package, e.g., wafer, chip, interposer, etc., includes a multi terminal capacitor within an input output (IO) path. The multi terminal capacitor is electrically attached directly upon a first IO contact of the semiconductor package. There is no inductance between the multi terminal capacitor and a interconnect that electrically connects the first IO contact with a second IO contact of a second semiconductor package and no inductance between the multi terminal capacitor and the first IO contact. The multi terminal capacitor may serve as a power source to cycle the turning on and off of the various circuits within a semiconductor chip associated with the semiconductor package. Because the distance between the multi terminal capacitor and semiconductor chip is reduced, inductance within the system is resultantly reduced. The multi terminal capacitor may be a decoupling capacitor that decouples one part of semiconductor chip from another part of semiconductor chip.

Abstract: A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

Abstract: A solid-state imaging device includes a plurality of photoelectric conversion units, a floating diffusion unit that is shared by the plurality of photoelectric conversion units and converts electric charge generated in each of the plurality of photoelectric conversion units into a voltage signal, a plurality of transfer units that are respectively provided in the plurality of photoelectric conversion units and transfer the electric charge generated in the plurality of photoelectric conversion units to the floating diffusion unit, a first transistor group that is electrically connected to the floating diffusion unit and includes a gate and source/drain which are arranged with a first layout configuration, and a second transistor group that is electrically connected to the floating diffusion unit, includes a gate and source/drain arranged with a second layout configuration symmetrical to the first layout configuration, and is provided in a separate area from the first transistor group.

Abstract: Implementations of semiconductor packages may include a die including a first side and a second side opposing the first side, the second side of the die coupled to a layer, a first end of a plurality of wires each bonded to the first side of the die, a mold compound encapsulating the die and the plurality of wires, and a second end of the plurality of wires each directly bonded to one of a plurality of bumps, wherein a surface of the layer is exposed through the mold compound.

Abstract: In an electronic module 30, a groove 3 is disposed in a single side surface A of an electronic device 20 that faces an outer principal surface 33 of a circuit board 31. In the groove 3, an end portion of a mounting electrode 2 near a joining body 21 is located further toward an insulating substrate 1 than an end portion 3 of the groove 3 near the joining body 21. A fillet F of a joining material 41 is disposed in a region of the groove 3 near the joining body 21. Owing to the fillet F, the reliability of connection between the electronic device 20 and the circuit board 31 can be increased.

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demolding and avoiding stray lights.

Abstract: An image sensor chip includes a semiconductor layer intended to receive illumination on a back face and comprising a matrix of pixels on a front face. An interconnection structure is arranged on the front face and a carrier is attached to the interconnection structure with a first face of the carrier facing the front face. An annular trench, arranged on a perimeter of the image sensor chip, extends from a second face of the carrier through an entire thickness of the carrier and into the interconnection structure. A via opening, arranged within the annual trench, extends from the second face of the carrier through the entire thickness of the carrier to reach a metal portion of the interconnection structure. The via opening an annual trench are lined with an insulating layer. The via opening include a metal conductor making an electrical connection to the metal portion.

Abstract: A package integrated with a power source module may be provided. The package including a substrate having an upper surface and a lower surface, a chip on the upper surface of the substrate, a first power supply on the upper surface of the substrate, the first power supply at one side of the chip, an encapsulant encapsulating the chip and the first power supply, a second power supply on the encapsulant, the second power supply electrically connected with the substrate through a connection member, the connection member penetrating through the encapsulant may be provided.

Abstract: The present disclosure relates to an Organic Light-Emitting Diode (OLED) apparatus and a method for manufacturing the same. The OLED apparatus comprises an OLED device, a device packaging layer, an upper flexible substrate, and a lower flexible substrate, wherein an anti-reflection layer is arranged outside the upper flexible substrate, and a layer of inorganic nanoparticles is provided on a surface of the anti-reflection layer. Using the technical solution of the present disclosure, an OLED apparatus which has both waterproof and anti-reflection effects and a small overall thickness is obtained.

Abstract: A light emitting device includes a light emitting element, a wavelength converter, a light transmissive member, a light guider, and a light transmitting layer. The light emitting element has an element upper surface, an element lower surface, and an element side surface. The wavelength converter has a converter lower surface. The wavelength is provided to be connected to the light emitting element such that the converter lower surface faces the element upper surface. The converter lower surface has an exposed region that does not face the element upper surface. The light guider guides light from the light emitting element to the wavelength converter. The light guider covers the element side surface and the exposed region. The wavelength converter has a converter upper surface. The light transmitting layer has a layer lower surface facing the converter upper surface. The converter upper surface is smaller than the layer lower surface.

Abstract: An electro-optic device includes a chip provided with a mirror and a drive element adapted to drive the mirror, a light-transmitting cover adapted to cover the mirror in a planar view, and a spacer having contact with one surface of the chip between the cover and the chip. The entire part of one surface of the chip having contact with the spacer is made of a first material such as silicon oxide film having first thermal conductivity, and the spacer is made of a second material such as a quartz crystal having second thermal conductivity higher than the first thermal conductivity. The cover is made of a third material such as sapphire having third thermal conductivity higher than the second thermal conductivity.

Abstract: A structure by which electric-field concentration which might occur between a source electrode and a drain electrode in a bottom-gate thin film transistor is relaxed and deterioration of the switching characteristics is suppressed, and a manufacturing method thereof. A bottom-gate thin film transistor in which an oxide semiconductor layer is provided over a source and drain electrodes is manufactured, and angle ?1 of the side surface of the source electrode which is in contact with the oxide semiconductor layer and angle ?2 of the side surface of the drain electrode which is in contact with the oxide semiconductor layer are each set to be greater than or equal to 20° and less than 90°, so that the distance from the top edge to the bottom edge in the side surface of each electrode is increased.

Abstract: A chip package includes a chip, a laser stop layer, a first through hole, an isolation layer, a second through hole and a conductive layer. The laser stop layer is disposed above a first surface of the chip, and the first through hole is extended from a second surface to the first surface of the chip to expose the laser stop layer. The isolation layer is below the second surface and in the first through hole, and the isolation layer has a third surface opposite to the second surface. The second through hole is extended from the third surface to the first surface, and the second through hole is through the first through hole to expose the laser stop layer. The conductive layer is disposed below the third surface and extended into the second through hole to contact the laser stop layer.

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Abstract: A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.

Abstract: An array imaging module includes at least two optical lenses and a molded photosensitive assembly, wherein the molded photosensitive assembly includes at least two photosensitive units, a circuit board that electrically couples to the photosensitive units, and a molded base having at least two optical windows. The molded base is integrally coupled at the circuit board at a peripheral portion thereof, wherein the photosensitive units are aligned with the optical windows respectively. The optical lenses are located along two photosensitive paths of the photosensitive units respectively, such that each of the optical windows forms a light channel through the corresponding photosensitive unit and the corresponding optical lens.

Abstract: A camera module, according to one embodiment of the present invention, comprises: a printed circuit board having an image sensor provided thereon; a housing which protects the image sensor and is coupled to the printed circuit board; an actuator unit arranged on the housing; and a conductive pattern formed on a surface of the housing, wherein the actuator unit comes into contact with and is coupled to the upper part of the housing so as to be electrically connected to the printed circuit board through the conductive pattern.

Abstract: Provided is an optical filter integrally provided with a light blocking film capable of suppressing stray light. An optical filter may be used for an imaging apparatus having a built-in image sensing device on which light from a subject or a light source is incident. The optical filter includes: an optical filter main body arranged between the subject or the light source and the image sensing device and having a transmission property for the incident light; and a frame-shaped light blocking film integrally formed on at least one surface of the optical filter main body. The light blocking film satisfies the following condition (1) and/or condition (2). (1) A concavity/convexity is formed on at least a part of an inner peripheral surface of the light blocking film. (2) A thin part is formed on at least a part of an inner edge of the light blocking film.

Abstract: A light-emitting device includes a substrate; a light-emitting element mounted on the substrate; a first light-transmissive member bonded to an upper surface of the light-emitting element via an adhesive; and a second light-transmissive member placed on an upper surface of the first light-transmissive member. In a plan view of the light-emitting device, a peripheral edge of a lower surface of the first light-transmissive member is positioned more inward than a peripheral edge of the upper surface of the light-emitting element. The adhesive extends from the upper surface of the light-emitting element to a lower surface of the second light-transmissive member, the adhesive covers a side surface of the first light-transmissive member, and the adhesive is separated from the substrate.

Abstract: Disclosed is an integrated sensor chip package comprising an integrated sensor chip enveloped in a packaging layer (30), the integrated circuit comprising a substrate (10) having a major surface; and a light sensor comprising a plurality of photodetectors (12a-d) on a region of said major surface; the packaging layer comprising an opening (32) exposing said region, the integrated sensor chip package further comprising a light blocking member (20) over said opening, the light blocking member defining an aperture (22) exposing a first set of photodetectors to light from a first range of directions and exposing a second set of photodetectors to light from a second range of directions, wherein the first range is different to the second range. An apparatus including such an integrated sensor chip package and a method of manufacturing such an integrated sensor chip package are also disclosed.

Abstract: A semiconductor package includes a substrate, an image sensor chip mounted on the substrate, a holder disposed on the substrate and surrounding the image sensor chip, and the holder has an inner surface facing the image sensor chip and an outer surface opposite to the inner surface. The semiconductor package further includes a transparent cover combined with the holder, and the transparent cover is spaced apart from and faces the substrate. The holder includes: a hole penetrating the holder from the inner surface to the outer surface. In addition, the semiconductor package further includes a first stopper disposed in the hole and a second stopper disposed at a position corresponding to the hole on the outer surface of the holder.

Abstract: A spectral filter includes an assembly of filtering cells. Each cell has a same nanostructured pattern and a preferential direction of the pattern. This preferential direction is, for each cell, oriented approximately radially with respect to a single point of the spectral filter. Alternatively, this preferential direction is, for each cell, oriented approximately ortho-radially with respect to the single point of the spectral filter. The single point may be a center point. Alternatively, the single point may correspond to an optical axis of a lens element associated with the spectral filter.

Abstract: The purpose of the present invention is to provide an organic light-emitting element that comprises an internal light extraction layer on a flexible transparent substrate, that has high luminous efficiency by means of light extraction, and that prevents the breakage and partial or complete separation of electrodes when the organic light-emitting element is repeatedly bent. The organic light-emitting element according to the present invention has an internal light extraction layer, a transparent electrode, and an organic light-emitting layer in this order on the flexible transparent substrate, wherein the value of the ratio (D) represented by formula 1 between the elastic modulus (EMI) of the surface of the internal light extraction layer and the elastic modulus (EMS) of the surface of the transparent electrode side of the transparent substrate is within the range of 100±30%. D (%)=(EMI/EMS)×100(%).

Abstract: The embodiment of the present invention relates to an organic light-emitting diode (OLED) device, which comprises a pixel define layer (PDL) and a light-emitting structure. Metal nanoparticles are doped in the PDL. The OLED device improves the luminous efficiency. The embodiment of the present invention further provides a method for manufacturing the OLED device.

Abstract: Some implementations provide a semiconductor device that includes a first die and an optical receiver. The first die includes a back side layer having a thickness that is sufficiently thin to allow an optical signal to traverse through the back side layer. The optical receiver is configured to receive several optical signals through the back side layer of the first die. In some implementations, each optical signal originates from a corresponding optical emitter coupled to a second die. In some implementations, the back side layer is a die substrate. In some implementations, the optical signal traverses a substrate portion of the back side layer. The first die further includes an active layer. The optical receiver is part of the active layer. In some implementations, the semiconductor device includes a second die that includes an optical emitter. The second die coupled to the back side of the first die.

Abstract: An integrated circuit chip is mounted on top of a base wafer, and a protection wafer is mounted on top of the integrated circuit chip. An encapsulation block is formed around the integrated circuit chip and the protection wafer and on a peripheral part of the front face of the base wafer. The encapsulation block includes a first encapsulation ring arranged around the integrated circuit chip and the protection wafer, having an annular beading protruding with respect to the front face of the protection wafer and forming a peripheral groove (24) recessed with respect to this protruding annular beading. A second encapsulation ring of the encapsulation block fills the peripheral groove of the first encapsulation ring.

Abstract: Disclosed is a light emitting device having a wavelength converting layer. The light emitting device comprises a plurality of semiconductor stacked structures; connectors for electrically connecting the plurality of semiconductor stacked structures to one another; a single wavelength converting layer for covering the plurality of semiconductor stacked structures; an electrode electrically connected to at least one of the semiconductor stacked structures; and at least one additional electrode positioned on the electrode, passing through the wavelength converting layer to be exposed to the outside, and forming a current input terminal to the light emitting device or a current output terminal from the light emitting device. Since the single wavelength converting layer covers the plurality of semiconductor stacked structures, the plurality of semiconductor stacked structures can be integrally mounted on a chip mounting member such as a package or a module.

Abstract: An image sensor device includes a top substrate and a subassembly. The top substrate includes a plurality of connection pillars, and the subassembly includes a plurality of connection pads. The connection pillars on the top substrate are bonded to the connection pads in the subassembly. The connection pillars are formed of a first metal and the connection pads are formed of a second metal.

Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.

Abstract: A solid-state imaging apparatus includes: a solid-state imaging device mounted on a substrate; a bonding wire that electrically connects a pad formed on the solid-state imaging device to a lead island formed on the substrate; a frame member that has a frame-like shape and surrounds side portions of the solid-state imaging device; and a light-transmissive optical member so accommodated in the frame member that the optical member faces an imaging surface of the solid-state imaging device, wherein the frame member has a leg portion extending from the side where the optical member is present toward the imaging surface, and the frame member is integrally fixed to the solid-state imaging device with an end of the bonding wire that is connected to the pad covered with the leg portion.

Abstract: Image sensor package structure and method are provided. The method includes: providing first substrate having upper surface on which image sensing areas and pads are formed; providing second substrate having through holes; forming tape film on upper surface of second substrate to seal each through hole; contacting lower surface of second substrate with upper surface of first substrate to make image sensing areas in through holes; removing portions of tape film and second substrate, wherein remained tape film and second substrate form cavities including sidewalls made of second substrate and caps sealing sidewalls and made of tape film, and remained second substrate also covers pads; removing portions of remained second substrate to expose pads; slicing first substrate to form single image sensor chips including image sensing areas and pads; and electrically connecting pads with circuits on third substrate through wires. Pollution or damage to image sensing areas may be avoided.

Abstract: A sensor package structure includes a sensing die, a light-filtering sheet, and an annular pressure-sensitive adhesive sheet. An active surface of the sensing die has a sensing region and a connecting region around the sensing region. The periphery contour of sensing die is greater than or equal to the periphery contour of light-filtering sheet. The pressure-sensitive adhesive sheet has two opposite adhesive surfaces and defines an opening. The adhesive surfaces respectively adhere to the connecting region of the sensing die and the inner surface of the light-filtering sheet, and the sensing region faces the inner surface of the light-filtering sheet via the opening. The sensing region is sealed by the pressure-sensitive adhesive sheet and the light-filtering sheet. Thus, the instant disclosure provides the sensor package structure with low cost, high capacity, and high yield. Moreover, the instant disclosure provides a production apparatus for manufacturing the sensor package structure.

Abstract: The semiconductor device comprises a substrate (1) of semiconductor material, a contact hole (2) reaching from a surface (10) into the substrate, and a contact metallization (12) arranged in the contact hole, so that the contact metallization forms an internal substrate contact (4) on the semiconductor material at least in a bottom area (40) of the contact hole.

Abstract: An electronic device is formed by a stack of an integrated circuit chip and an optical plate. The integrated circuit chip includes integrated circuits (such as optical circuits) formed on or in a semiconductor substrate plate. The optical integrated circuits may form an optical sensor. An electrical connection network is provided on the top side of the semiconductor substrate plate. Electrical connection lugs, which are connected to the electrical connection network through electrical connection vias, are mounted on the back side of the semiconductor substrate plate. The vias are through silicon vias situated at a distance from the periphery of the semiconductor substrate plate. The optical plate is configured to allow light radiation to pass to the optical integrated circuits.

Abstract: According to one embodiment, a semiconductor image pickup device includes a pixel area and a non-pixel area. The device includes a first photoelectric conversion element formed in the pixel area, a first transistor formed in the pixel area and connected to the first photoelectric conversion element, a second photoelectric conversion element formed in the non-pixel area, a second transistor formed in the non-pixel area and connected to the second photoelectric conversion element, a metal wire formed at least in the non-pixel area, a first cap layer formed on the metal wire to prevent diffusion of metal contained in the metal wire, and a dummy via wire formed in the non-pixel area and penetrating the first cap layer.

Abstract: The embodiment of the present invention provides a touch screen, an electronic equipment and a method of preventing light leakage of a touch screen, wherein the touch screen comprises a substrate and a plurality of printing layers, the plurality of printing layers at least include a first printing layer adjacent to the substrate and a second printing layer adjacent to the first printing layer; the touch screen further includes an additional printing layer which covers at least an area of the second printing layer that is not covered by other printing layers of the plurality of printing layers, wherein color of the additional printing layer is the same with that of the first printing layer. The additional printing layer arranged in the touch screen and having the same color with the first printing layer can effectively prevent light leakage of the touch screen, and can avoid occurrence of color difference and enhance display effect.

Abstract: A light collecting module includes a pliable light guide, an inner light source, and a photocell. A surface of the light guide has a first area, a second area, and a third area. The first and second areas face each other, and the third area is adjacent to the first or second area. At least one optical structure is formed in the second area, and the photocell is adjacent to the third area. The optical structure is for redirecting ambient light incident on the first or second area such that the ambient light is guided to the third area by refraction or reflection and incident on the photocell. The optical structure is for redirecting the light from the inner light source such that the light is guided to the surface of the light guide by refraction or reflection and exits the light guide.

Abstract: Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.

Abstract: An image capturing module of a web cam device, and particularly to a thin-type web cam device, includes a circuit board having circuit lines and a through opening. A substrate plate having contacts attaches to the bottom of the circuit board. An image sensor is covered by a transparent shield. The image sensor and the shield are carried by the substrate plate and located within the through opening.