Abstract: A method of mounting an electronic component includes applying solder paste to a through-hole of a printed board on which an electronic component is mounted, placing the electronic component on the printed board with a restricting member that restricts a terminal of the electronic component from entering the through-hole, the restricting member being sandwiched between the electronic component and the printed board, performing reflow at a temperature at which the restricting member melts, and welding the terminal in the through-hole with the solder paste.

Abstract: A flexible circuit assembly for accommodating a plurality of power electronic devices, including an insulating cover layer having first openings for power electronic devices, a flexible conductive layer arranged under the insulating cover layer and attached with a first adhesive to the insulating cover layer, an intermediate insulating layer arranged under the flexible conductive layer and attached with a second adhesive to the flexible conductive layer, the intermediate insulating layer having second openings, a plurality of heat-conductive elements arranged inside the second openings, a first thin heat sink layer, the heat-conductive elements arranged to be in contact with an upper surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material; and a second thin heat sink layer, upper surfaces of the power electronic devices arranged to be in contact with a lower surface of the thin heat sink layer and the lower surface of the islands via heat-conductive material.

Abstract: A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.

Abstract: A circuit board structure having electronic components embedded therein and a method of fabricating the same are provided. The circuit board structure includes a substrate having a first circuit layer formed on at least one surface thereof, electronic components electrically connected to the first circuit through a metallic connector, a first dielectric layer formed on the first circuit layer of the substrate and having a plurality of dielectric layer cavities for the first circuit layer to be exposed therefrom and the electronic components to be received therein, a plurality of vias, a second dielectric layer formed on the first dielectric layer and the electronic components and having a plurality of dielectric layer vias for the electronic components to be exposed therefrom and the vias to be formed therein, and a second circuit layer formed on the second dielectric layer and electrically connected to the electronic components through the vias.

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the Z-directed component. A conductive material is then selectively applied to the extruded substrate material and the Z-directed component is formed from the extruded substrate material.

Abstract: A component built-in board of multi-layer structure that has a plurality of unit boards stacked therein and is configured having a plurality of electronic components built in thereto in a stacking direction, wherein the plurality of unit boards include: a double-sided board that includes a first insulating layer, a first wiring layer formed on both surfaces of the first insulating layer, and a first interlayer conductive layer that penetrates the first insulating layer and is connected to the first wiring layer, and that comprises an opening in which the electronic component is housed; and an intermediate board that includes a second insulating layer, a first adhesive layer provided on both surfaces of the second insulating layer, and a second interlayer conductive layer that penetrates the second insulating layer along with the first adhesive layer, and the double-sided board is disposed above and below the intermediate board.

Abstract: A portable electronic device includes: a housing, a processor provided in the housing, a rechargeable power pack provided in the housing in communication with the processor, apertures extending through the housing, insulating portions of the housing being provided between the apertures, a location of the apertures being selected to map out a graphical element, electrical contacts in communication with the battery for charging the battery, the electrical contacts being sized to be received in the apertures and wherein the insulating portions are provided for insulating the electrical contacts from one another.

Abstract: In one embodiment, an apparatus includes a cover panel. An adhesive layer is coupled to the cover panel. A perimeter of the adhesive layer forms at least a portion of a gasket seal extending substantially perpendicular to an inner surface of the cover panel. An inner surface of the gasket seal defines an edge of a channel. The apparatus also includes a substrate coupled to the adhesive layer. The substrate includes an outer surface having disposed thereon a connection pad region and drive or sense electrodes. The drive or sense electrodes are disposed between the substrate and the cover panel. At least a portion of the channel is disposed between the gasket seal and the connection pad region. The apparatus further includes a flexible printed circuit (FPC) electrically coupled by the connection pad region to the drive or sense electrodes. A first portion of the FPC extends through the channel.

Abstract: A heat radiation structure for an electric device includes: at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material.

Abstract: A discrete component assembly includes a discrete component having a central longitudinal axis and having an outer surface with a laterally outermost point positioned at a first radial distance from the central longitudinal axis. The assembly includes a support structure mounted on the discrete component. The assembly also includes a plurality of contact pads electrically connected to the discrete component and mounted on the support structure at radial distances from the central longitudinal axis greater than the first radial distance.

Abstract: A circuit assembly includes a substrate having a substrate electrical circuit, opposite top and bottom substrate surfaces, and a substrate hole extending through the substrate. The circuit assembly also includes a discrete component assembly electrically connected to the substrate electrical circuit and a support member attached to the discrete component. At least a portion of the discrete component is physically mounted in the substrate hole.

Abstract: A component built-in board, wherein at least two layers of a plurality of printed wiring bases are disposed on a rear surface side of an electronic component; the at least two layers of the printed wiring bases include a heat radiation-dedicated wiring pattern that is disposed above the rear surface of the electronic component; the heat radiation-dedicated wiring pattern is formed such that a heat radiation-dedicated wiring line and a signal-dedicated wiring line are continuous; a via includes a plurality of heat radiation-dedicated vias which connects the rear surface of the electronic component and the heat radiation-dedicated wiring pattern; and the heat radiation-dedicated wiring pattern is continuous from a place where connected to the heat radiation-dedicated via to be connected also to another via disposed at an outer peripheral side of the electronic component.

Abstract: A mounting method for a circuit board. The circuit board is formed with pilot holes that are placed onto pilot pins of a tool such that the pilot pins protrude through and beyond the circuit board. Then the tool is displaced toward a circuit board holder of the housing whereupon the pilot pins engage with a form fit in corresponding centering holes of the circuit board holder. After fixing the circuit board in the housing, the tool is withdrawn by detaching the pilot pins from the pilot holes, the circuit board remaining in the circuit board holder. The tool has an upper plate with associated pilot pins and a lower plate with a housing holder for positioning the housing. The circuit board, with the pilot pins engaging the pilot holes, is displaced by moving the upper plate toward the lower plate.

Abstract: A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up insulating layers stacked on or beneath the first insulating layer; upper and lower circuit patterns formed on the build-up insulating layers, respectively; and a plurality of vias connecting the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern.

Abstract: The present invention relates to a circuit board, which can miniaturize a conductor pattern formed around a via and improve current pass characteristics of the via at the same time by including a via passing through an insulating layer to be in contact with an upper conductor pattern and a lower conductor pattern and having a bent portion whose cross-sectional area or diameter changes discontinuously.

Abstract: A printed circuit board with embedded component includes a double-sided printed circuit board, an electronic component, a plurality of conductive paste blocks, an insulating layer and a wiring layer near the first wiring layer, an insulating layer and a wiring layer near the second wiring layer. The double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer. The first wiring layer and the second wiring layer are arranged on opposite sides of the base. The second wiring layer includes a plurality of electrical contact pads. The base defines a number of conductive vias. Each electrical contact pad is aligned with and electrically connected to one corresponding conductive via. The conductive paste blocks are electrically connecting to the conductive vias. The electronic component is electrically connected to the conductive paste blocks. The two insulating layers cover the electronic component and the second wiring layer.

Abstract: A light-emitting device includes a first substrate having a through-hole, a plurality of first light-emitting elements that are arranged on the first substrate, a second substrate that is attached to the first substrate to cover the through-hole of the first substrate, and a second light-emitting element arranged on the second substrate, and electrically connected to wiring of the first substrate.

Abstract: An electronic component embedded substrate and a method of manufacturing an electronic component embedded substrate, The substrate includes a first via passing through a part of an insulating portion of the substrate to an electrode of the electronic component, and a second via passing through a part of the insulating portion to the conductor pattern. The second via has a contact portion with a smaller cross-sectional area than the cross-sectional area of a contact portion of the first via.

Abstract: The present invention relates to an electronic component embedded printed circuit board and a method for manufacturing the same. An electronic component embedded printed circuit board of the present invention includes a core having a cavity; an electronic component inserted in the cavity and having a bonding coating layer on an outer peripheral surface; insulating layers laminated on and under the core and in contact with the bonding coating layer; and circuit patterns provided on the insulating layers.

Abstract: A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion such that the electronic devices are arrayed in the lateral direction of each of the electronic devices, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.

Abstract: The present invention relates to an electronic component embedded substrate including: a cavity formed in at least one insulating layer provided inside the electronic component embedded substrate; an electronic component having at least a portion inserted in the cavity; and a cavity plating portion formed on a surface of the cavity opposite to at least one surface of the electronic component, and can improve electrical connectivity between an external electrode and a via even when the size of the external electrode of the electronic component is reduced than before.

Abstract: A wiring board for a built-in electronic component includes a substrate having a cavity portion, an electronic component accommodated in the cavity portion of the substrate, a filling resin material filling a space formed between the electronic component and an inner wall of the substrate forming the cavity portion, an insulation layer formed on the substrate and the electronic component accommodated in the cavity portion of the substrate, and a via conductor formed in the insulation layer such that the via conductor is connected to a connection terminal of the electronic component. The substrate has projection portions formed on the inner wall of the substrate such that the projection portions project toward the electronic component accommodated in the cavity portion of the substrate.

Abstract: Disclosed herein are a method for manufacturing an electronic component-embedded substrate and an electronic component-embedded substrate. The method includes: inserting an electronic component having an external electrode into a cavity penetrating through a core substrate; forming a multilayer body in which the electronic component is embedded by stacking an insulating layer on upper and lower portions of the core substrate; forming a through-hole exposing the external electrode of the electronic component and penetrating through the multilayer body; and filling the through-hole with a conductive material.

Abstract: Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.

Abstract: A control device for a motor vehicle includes a housing having a housing cover and a housing base, a sealing device between the housing cover and the housing base, at least one circuit carrier having electrically conductive tracks, and at least one electronic component disposed on the circuit carrier. The control device further includes at least one conductor structure extending out of the interior of the housing, and at least one electrically conductive connecting line which connects the electronic component to the conductor structure. A getter layer is thermally sprayed on the inner face of the housing to protect the metal parts, which transmit current or data in the interior of the control device, against corrosive gases. The getter layer has a high specific surface area.

Abstract: The present invention relates to a substrate structure having electronic components and a method of manufacturing a substrate structure having electronic components and can reduce signal loss and internal resistance and improve process efficiency by bringing a first terminal of a first electronic component and a second terminal of a second electronic component in direct contact with each other or in direct contact with each other by solder to minimize a path between the electronic components.

Abstract: An apparatus and method are disclosed for providing monolithic optical packages. An embodiment optical package includes a base made of aluminum-nitride (AlN) that is configured to support an optical component, a plurality of sidewalls made of AlN that are coupled to the base, the sidewalls are configured to surround the optical component, and a feed-through made of AlN that is coupled to one of the sidewalls, wherein the feed-through is configured to feed a plurality of leads through the one sidewall to provide an electrical connection to the optical component, wherein the base, the sidewalls, and the feed-through have a same coefficient of thermal expansion (CTE) for AlN. An embodiment method includes punching and printing AlN tapes to build a base, a plurality of sidewalls joined to the base, and a feed-through coupled to the sidewalls, and attaching a plurality of electrical leads into the feed-through.

Abstract: A wiring substrate includes: a substrate having a first surface and a second surface; a first insulating layer stacked on the first surface; a pad electrode stacked on the first insulating layer; a through electrode connected to the pad electrode; and a second insulating layer disposed between the substrate and the through electrode and between the first insulating layer and the through electrode, wherein a diameter of the through electrode in a connection section between the pad electrode and the through electrode is smaller than a diameter of the through electrode on the second surface side, the first insulating layer, the second insulating layer and the through electrode overlap with each other in a peripheral area of the connection section, when seen from a plan view, and the thickness of the first insulating layer in the area is thinner than the thickness of the first insulating layer in other areas.

Abstract: A semiconductor device package having reduced form factor and a method for forming said semiconductor device are disclosed. In an embodiment, an active die is embedded within a cavity in the core layer of the package substrate, wherein an in-situ electromagnetic shield is formed on the sidewalls of the cavity. In another embodiment, a crystal oscillator is at least partially embedded within the core layer of the package substrate. In another embodiment, a package having a component embedded in the core layer is mounted on a PCB, and a crystal oscillator generating a clock frequency for the package is mounted on the PCB. By embedding components within the core or removing components from the package to be mounted directly on the PCB, the x, y, and z dimensions of a package may be reduced. In addition, in-situ electromagnetic shield may reduce EM noise emitted from the active die.

Abstract: Disclosed herein is an implantable pulse generator feedthru configured to make generally planar electrical contact with an electrical component housed within a can of an implantable pulse generator. The feedthru may include a feedthru housing including a header side and a can side, a core within the feedthru housing, a generally planar electrically conductive interface adjacent the can side, and a feedthru wire extending through the core. The feedthru wire may include an interface end and a header end, wherein the header end extends from the header side and the interface end is at least one of generally flush with the generally planar interface and generally recessed relative to the generally planar interface.

Abstract: An electric element-embedded multilayer substrate, which is a multilayer substrate including an electric element embedded therein and a plurality of base material layers having flexibility, the electric element including a main surface and being embedded in the multilayer substrate to be sandwiched between the base material layers, and a slide member provided between the main surface of the electric element and the base material layer.

Abstract: A method of assembling a semiconductor chip device is provided. The method includes providing a first circuit board that has a plurality of thermally conductive vias. A second circuit board is mounted on the first circuit board over and in thermal contact with the thermally conductive vias. The second circuit board includes first side facing the first circuit board and a second and opposite side.

Abstract: A wiring board has a plurality of wiring layers, a first land, a second land, a first via and a second via. The first land and the second land are formed on at least one wiring layer of the wiring board and are disposed to partially overlap with each other. The first via and the second via are formed in association with the first land and the second land, respectively. The first via and the second via electrically connect a first wiring layer and a second wiring layer of the plurality of wiring layers to each other. The wiring board has a separator that is formed by a hole that separates the first land and the second land from each other.

Abstract: An electronic component is connected to a circuit board by forming a connector pin on the electronic component, the connector pin having a proximate end secured to the electronic component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through-hole is formed on a circuit board having a circuit board thickness greater than a length of the connector pin, with a first portion that is narrower than each of the compliant portion and the fork lock and extends partially through the circuit board and a second portion that extends beyond the first portion and is wider than the first portion. The connector pin is inserted into the first portion of the through-hole and the fork lock is moved beyond the first portion into the second portion of the through-hole.

Abstract: A sheet substrate includes a plurality of substrate regions arranged in a matrix, an integrated circuit disposed in each of the substrate regions, and a first implementation electrode and a second implementation electrode disposed in each of the substrate regions and electrically connected to the integrated circuit. The sheet substrate according to an embodiment of the invention further includes first terminals to each of which the first implementation electrodes arranged in a row of part of the substrate regions are connected in parallel to each other and second terminals to each of which the second implementation electrodes arranged in a column of part of the substrate regions and can activate an arbitrary one of the integrated circuits that is specified by selected ones of the first terminals and the second terminals.

Abstract: A manufacturing method for an electronic component includes arranging, across boundaries of a first substrate region, wires for electrically connecting a piezoelectric resonator element arranged in the first substrate region and a lid arranged in a second substrate regions to a sheet substrate, performing, after arranging the piezoelectric resonator element and the lid in the substrate regions, input and output of a signal to and from the piezoelectric resonator element via the lid connected to the wires, and dividing the sheet substrate in each of the boundaries.

Abstract: A bottom reception pin module 22 which is allowed to stand upright on a bottom reception base part 21 having a magnetic member 21a provided on an upper surface to support a board includes a base part 23 having a magnet member 26 built therein so as to be freely lifted and lowered and fixed to the bottom reception base part 21 by a magnetization force under a state that the magnet member 26 is lowered and a hollow shaft member 24 extended upward from the base part 23 and having an upper end of a top member 25 abutting on the lower surface of the board to support the board. By a vacuum suction from a suction hole 25c, the magnet member 26 is lowered and lifted to fix and unfix the base part 23 relative to the bottom reception base part 21.

Abstract: In a manufacturing method of a package carrier, a substrate having an upper surface, a lower surface, and an opening communicating the two surfaces is provided. An electronic device is disposed inside the opening. A first insulation layer and a superimposed first metal layer are laminated on the upper surface; a second insulation layer and a superimposed second metal layer are laminated on the lower surface. The opening is filled with the first and second insulation layers. First blind holes, second blind holes, and a heat-dissipation channel are formed. A third metal layer is formed on the first and second blind holes and an inner wall of the heat-dissipation channel. A heat-conducting device is disposed inside the heat-dissipation channel and fixed into the heat-dissipation channel via an insulation material. The first and second metal layers are patterned to form a first patterned metal layer and a second patterned metal layer.

Abstract: A wiring board includes a substrate having a cavity, an electronic component positioned in the cavity and having a first-side electrode on one side of the electronic component and a second-side electrode on the opposite side of the electronic component, an insulation layer formed on a surface of the substrate and the electronic component such that the insulation layer covers the electronic component positioned in the substrate, and a conductive layer formed on the surface of the substrate and including linear conductive patterns surrounding an opening of the cavity on the surface of the substrate. The linear conductive patterns include a first linear conductive pattern positioned adjacent to the first-side electrode and a second linear conductive pattern positioned adjacent to the second-side electrode such that the first linear conductive pattern and the second linear conductive pattern are insulated from each other.

Abstract: A flexible film carrier and methods of manufacture, and more particularly, methods and structures to increase interconnect density of modules onto circuit boards is discloses. The structure includes a substrate comprising a plurality of holes and a plurality of contacts having a pitch corresponding to a pitch of I/O connections of a laminate. The structure further includes at least one type of connection provided on the substrate and which is positioned so as to avoid interference with a connection of the laminate to a circuit board. The structure further includes wiring electrically connecting the plurality of contacts to the at least one type of connection.

Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

Abstract: A substrate includes a built-in component that suppresses resin flow occurring in the case of thermocompression bonding in a region where vias and wiring conductors are provided and that reduces the occurrence of via defects and wiring-conductor defects. The resin flow occurring in an outer side portion of a frame-shaped electrode is suppressed in the case of thermocompression bonding by encircling the periphery of a built-in component with the frame-shaped electrode. Because of this structure, the occurrence of defects in vias and wiring conductors arranged in an outer side portion of the frame-shaped electrode may be reduced.

Abstract: A system and method of displaying appliance information to a user is provided. Reverse mount LEDS may be used in a seven segment configuration and correlating to any other icon or indicator. The reverse mount LEDs may be mounted on single sided printed circuit board to form an appliance user display.

Abstract: An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

Abstract: An input device and a manufacturing method of the input device are provided. The input device includes a circuit board and a plurality of mechanical switches. The circuit board has a first surface, a second surface and a plurality of conductive sheets. A plurality of holes are formed on the circuit board and the conductive sheets are disposed at one side of the first surface in pairs around the hole, and the conductive sheets have a coupling section bent toward the first surface along the direction of the second surface. The mechanical switches are detachable from the circuit board and include a plunger and a plurality of pins. Each of the plungers has a positioning column embedded in the hole. One end of the pin is connected to the plunger, and the other end of the pin is attached to the coupling section of the conductive sheets.

Abstract: A feedthrough assembly may include a ferrule defining a ferrule opening, a feedthrough at least partially disposed within the ferrule opening and attached to the feedthrough, and a capacitor array. In some examples, the feedthrough may include a plurality of feedthrough conductive pathways extending between an externally-facing side of the feedthrough and an internally-facing side of the feedthrough. Additionally, the capacitor array may include a printed board and a plurality of capacitors disposed on the printed board. In some examples, respective ones of the plurality of feedthrough conductive pathways are electrically connected to respective ones of the plurality of capacitors.

Abstract: The present invention relates to circuit boards and, more specifically, a process for providing electrical connections with reduced via capacitance on circuit boards. In one embodiment, the present invention provides a method for providing an electrical connection between traces disposed on different layers of a circuit board, the method comprising forming in the circuit board a via hole that interconnects a first electrically conductive trace and a second electrically conductive trace. The via hole includes electrically conductive material thereon. The method further comprises removing a portion of the electrically conductive material from the via hole.