Abstract: A portable electronic device includes: a housing, a processor provided in the housing, a rechargeable power pack provided in the housing in communication with the processor, apertures extending through the housing, insulating portions of the housing being provided between the apertures, a location of the apertures being selected to map out a graphical element, electrical contacts in communication with the battery for charging the battery, the electrical contacts being sized to be received in the apertures and wherein the insulating portions are provided for insulating the electrical contacts from one another.

Abstract: The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced.

Abstract: A metal core circuit board assembly includes a circuit board having a through hole in an embodiment. A shaft for a pin is inserted in the through hole such that cap of the pin abuts a foil layer on the circuit board. The shaft diameter is sufficiently smaller than the through hole diameter such that the shaft is electrically isolated from a metal core for the circuit board. The cap is undercut about the through hole to further isolate the pin from the non-electrically isolated portion of the metal core circuit board.

Abstract: A multi-turn coil device comprising a flexible circuit board and a plurality of serially electrically coupled coils coupled to both sides of the flexible circuit board. The coils are formed such that when the circuit board is folded in an accordion manner, the coils are substantially aligned and have the same direction of current flow. The coils are serially coupled sequentially from front to back and back to front wherein the coupling of the coils is through a plated through hole in the flexible circuit board.

Abstract: A component-incorporated wiring substrate is provided. Some embodiments include a plate-like component incorporated in a core substrate and a build-up layer having an insulation layer and a conductor layer disposed in alternating layers. The component has terminal electrodes formed at its opposite ends having a side surface and a main surface. An insulation layer disposed on the main surface of the component has via conductors formed therein which are connected to the side surfaces and the main surfaces of the respective terminal electrodes. The via conductors are tapered, such that their via diameter decreases in a direction toward the terminal electrode, and their via diameter at a position where they connect to the main surface is greater than a length of the main surface. Accordingly, the area of connection between the via conductors and the corresponding terminal electrodes is increased, improving connection reliability through enhancement of tolerance for positional deviation.

Abstract: A method for mounting a component to an electric circuit board (10), comprising: providing at least one cavity in the electric circuit board; arranging the component in the at least one cavity; and generating in the at least one cavity mechanical and/or electrical connections simultaneously to at least two locations of the component. A method for making an electric circuit board arrangement comprising at least one electric circuit board, comprising: providing at least one cavity and/or through-hole in the at least one electric circuit board; arranging the component in the at least one cavity and/or in a through-hole, the component being mechanically and/or electrically connectable by contact in the at least one cavity and/or through-hole; and stacking one or more electric circuit boards on top of the at least one electric circuit board and coupling the electric circuit boards by solderable terminal pads of the component.

Abstract: A method for manufacturing a wafer scale heat slug system includes: dicing an integrated circuit from a semiconductor wafer; forming a heat slug blank equivalent in size to the semiconductor wafer; dicing the heat slug blank to produce a heat slug equivalent in size to the integrated circuit; attaching the integrated circuit to a substrate; attaching the heat slug to the integrated circuit; and encapsulating the integrated circuit.

Abstract: An electronic device is provided. The electronic device includes a mechanism, a circuit module and a fixing element. The circuit module is disposed inside the mechanism. The circuit module includes a circuit board and a fan. The circuit board has at least one edge and a fixing hole. The fan has a first lateral side and a second lateral side. The first lateral side has a first hook buckled on the edge. The second lateral side has at least one screwed board, wherein the screwed board has a screwed hole. The fixing element is screwed on the screwed hole and the fixing hole to screw the fan on the circuit board.

Abstract: A multichip module includes an arithmetic element that is a semiconductor element that executes arithmetic processing and a memory element that is arranged opposite the arithmetic element and that is a semiconductor element that stores therein data. Then, the multichip module includes the arithmetic element mounted thereon and includes a package board that includes, on a surface on which the arithmetic element is mounted, an external terminal that connects another part. Furthermore, the multichip module includes a reinforcing part on a surface at the opposite side from the surface of the package board on which the external terminal and that is arranged such that the reinforcing part covers an area from outside the peripheral portion of the arithmetic element to a predetermined position located on the central side of the package board.

Abstract: A method of manufacturing a wiring board with a built-in electronic component including providing a first base material having a support body and a first metal foil detachably adhered on the support body, forming a connection terminal for mounting an electronic component on the first metal foil of the first base material by an additive method, mounting an electronic component to the connection terminal such that the electronic component is electrically connected to the connection terminal and mounted on the first base material, covering the electronic component with an insulative material structure having a hollow portion such that the electronic component is accommodated in the hollow portion of the insulative material structure after the mounting and detaching the support body from the first metal foil such that a substrate having the first base material and the insulative material structure is formed.

Abstract: Methods and systems for removably mounting a Solid State Drive (SSD) to a Printed Circuit Board (PCB) device without use of a tool. An exemplary system comprises a top portion and at least two flexible legs. Each leg comprises a vertical member attached to the top portion, and a tab for insertion into the PCB, the tab restricting the motion of the drive enclosure with respect to the PCB when inserted into the PCB, thereby allowing for removable attachment of the enclosure to the PCB without use of a tool. The drive enclosure itself is adapted to receive the SSD and adapted to align the SSD for physical coupling with a connector for the PCB.

Abstract: The present invention provides a device for conditioning semiconductor chips and a corresponding test method. The device comprises a chip temperature control means for receiving a semiconductor chip or a plurality of semiconductor chips and comprises a base body which can be flushed with a fluid for temperature control and which comprises a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip bonding pedestals which are inserted, in thermal contact with the base body, into the recesses which comprise a chip receiving region on the front face and a wiring means on the inside which is constructed for supplying electrical signals from and/or to the semiconductor chip inserted in the respective chip receiving region; and a motherboard attached to the rear face in such a way that the wiring means of the chip bonding pedestals is electrically connected to a wiring means of the motherboard.

Abstract: A step portion for mounting a row bar is provided at a table stepping down from the face of the table, and by lowering a pair of hooks crossing over the step portion in its width direction, a row bar held by the hooks is mounted on the step portion. While interposing the row bar mounted on the step portion between a pair of hooks and a side face of the step portion, the side in longitudinal direction of the row bar and the bottom face thereof are butted to the bottom face and the standing up side face of the step portion to position two axes of the row bar among XYZ directions, successively, positioning of the row bar in one remaining direction along longitudinal direction of the row bar mounted on the step portion is performed by moving the table in the one remaining axial direction.

Abstract: Methods, systems, and apparatuses provide power from multiple input power sources to adjacent outputs efficiently and reliably. Aspects of the disclosure provide a power distribution unit (PDU) that includes a number of power outputs including first and second adjacent power outputs. The PDU includes a printed circuit board having a first conducting layer electrically interconnected to a first power input connection and the first power output, a second conducting layer that is at least partially above the first conducting layer and in facing relationship thereto. The second conducting layer is electrically insulated from the first conducting layer and electrically interconnected with a second power input connection and the second power output, the first and second power outputs thereby connected to different power inputs.

Abstract: An electrical connector can be provided having a plurality of connector pins, and an electrically conductive connector housing with a bottom wall and a receiving opening for receiving a counter-connector. A plurality of pin receiving openings formed in the bottom wall accommodate a dielectric insert. At least one of the connector pins extends through the dielectric insert and is fastened by the dielectric insert within the respective pin receiving opening. A slide-in module can be provided with such an electrical connector, and a method for producing such an electrical connector may also be provided.

Abstract: A micro pin hybrid interconnect array includes a crystal anode array and a ceramic substrate. The array and substrate are joined together using an interconnect geometry having a large aspect ratio of height to width. The joint affixing the interconnect to the crystal anode array is devoid of solder.

Abstract: An electro device embedded printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, a printed circuit board embedded with an electro device, in which a pair of electrodes are formed on either end, includes: a core substrate in which a first cavity is formed; a first passive device embedded in the first cavity and being thinner than the core substrate; and a second passive device stacked on an upper side of the first passive device such that the second passive device is embedded in the first cavity. The first passive device and the second passive device are stacked to cross each other.

Abstract: The invention relates to a method for applying a connection material with a specified shape on at least one surface of at least one workpiece, wherein the connection material and the surface have complementary wetting or wettable properties, and wherein the connection material (3) is deposited on at least one of the surfaces (2) and a shaping device (10, 10?) is arranged at least for the period of a flowable state of the connection material adjacent to the connection material as well as at least partially surrounding this material on the surface (2), wherein this device has a surface (11, 12) that is non-wettable with respect to the wetting properties of the connection material and that is designed for the forced guidance of the flow of the still flowable connection material in the region of the non-wettable surface that thus assumes a specified shape; and the shaped connection material is hardened.

Abstract: A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes a circuit board comprising at least one device region, a plurality of electrode regions, at least one first thermal via exposed through upper and lower surfaces of the at least one device region, and a plurality of second thermal vias exposed through upper and lower surfaces of the plurality of electrode regions; at least one first thermal pad bonded to the upper surface of the at least one device region and connected to the first thermal via; at least one LED mounted on the at least one first thermal pad; a plurality of first electrode pads bonded to the upper surface of the electrode region and connected to the second thermal vias; and a plurality of wires to connect the at least one LED with the plurality of first electrode pads.

Abstract: A wiring substrate includes a structure in which a plurality of wiring layers are stacked through insulating layers intervening therebetween, and which has a first surface side and a second surface side, the first surface side where a semiconductor element is to be mounted, the second surface side being located at an opposite side to the first surface side, an interposer buried in an outermost one of the insulating layers located at the first surface side, and electrically connected to the semiconductor element to be mounted, and a sheet-shaped member buried in an outermost one of the insulating layers located at the second surface side, wherein, the interposer and the sheet-shaped member are disposed at symmetrical positions symmetrical each other.

Abstract: A circuit board includes an insulation layer having a first surface and a second surface on the opposite side of the first surface, an electronic component positioned in the insulation layer and having a terminal, a conductive pattern formed on the second surface of the insulation layer and electrically connected to the terminal, and an insulative film formed on the second surface of the insulation layer and on the conductive pattern. The terminal of the electronic component has a protruding portion which protrudes from the second surface of the insulation layer.

Abstract: A terminal insertion apparatus having a connector housing holding unit, a terminal insertion unit, and a control unit. The connector housing holding unit holds a connector housing movably in horizontal and vertical directions. The terminal insertion unit inserts a terminal attached to an electric wire into a terminal accommodating chamber of the connector housing. After the terminal insertion unit has inserted an end of the terminal into the terminal accommodating chamber, the control unit controls a movable supporting unit of the connector housing holding unit so as to move a holding jig by amounts of movement in horizontal and vertical directions so that the terminal is not caught on an inner surface of the terminal accommodating chamber, and then the terminal is completely inserted in the terminal accommodating chamber.

Abstract: An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity.

Abstract: For each of electric current path units each including series-connected resistor elements, one end is electrically connected with power supply terminal Vcc, the other end is electrically connected with ground terminal GND, and connection portion between the resistor elements is electrically connected with output terminals Vo1-Vo4. Resistor element constituting each of the electric current path units is a magnetoresistance effect element formed of magnetoresistance effect film, the power supply terminal and ground terminal are each shared among all the electric current path units. All the electric current path units are formed to contact one surface of insulating film; and with use of conductive film disposed to contact the other surface of the insulating film, power supply connection wiring for sharing the power supply terminal and ground connection wiring for sharing the ground terminal are formed.

Abstract: A wiring board including an insulative substrate having a cavity portion, an electronic device positioned in the cavity portion of the insulative substrate, an interlayer insulation layer made of an insulative material and formed on the insulative substrate and on the electronic device, and a conductive layer having a conductive pattern and formed on the interlayer insulation layer. The insulative substrate has a gap formed with respect to the electronic device in the cavity portion, the gap between the electronic device in the cavity portion and the insulative substrate is filled with an insulator made of the insulative material derived from the interlayer insulation layer, and the conductive pattern of the conductive layer has an enlarged-width portion across and directly over the gap.

Abstract: Provided is an electronic device of high reliability having an exposed functional portion. An electronic device 10 comprises an electronic element 11 having an exposed functional portion 11a on a first surface, a frame member 12 having a first penetration hole 12a, and a board 13 having a second penetration hole 13a. The frame member 12 is provided on the first surface of the electronic element 11 such that the first penetration hole 12a faces at least a part of the functional portion 11a. The electronic element 11 is mounted on the board 13 such that at least a part of the functional portion 11a faces the second penetration hole 13a. The frame member 12 does not contact with the board 13.

Abstract: An apparatus includes a first printed circuit defining an aperture and configured for conductive communication between a first plurality of electronic components, and a second printed circuit configured for conductive communication between a second plurality of electronic components. The second printed circuit is fixed to the first printed circuit such that the second plurality of electronic components pass through the aperture, and the second plurality of electronic components are in conductive communication with the first plurality of electronic components.

Abstract: A multi-turn coil device comprising a flexible circuit board and a plurality of serially electrically coupled coils coupled to both sides of the flexible circuit board. The coils are formed such that when the circuit board is folded in an accordion manner, the coils are substantially aligned and have the same direction of current flow. The coils are serially coupled sequentially from front to back and back to front wherein the coupling of the coils is through a plated through hole in the flexible circuit board.

Abstract: Cylindrical packages are provided. The cylindrical package includes a cylindrical substrate having a hollow region therein and at least one semiconductor chip mounted on an outer circumference of the cylindrical substrate. Related electronic products and related fabrication methods are also provided.

Abstract: A light emitting diode (LED) package for high temperature operation which includes a printed wire board and a heat sink. The LED package may include a formed heat sink layer, which may be thermally coupled to an external heat sink. The printed wire board may include apertures that correspond to the heat sink such that the heat sink is integrated with the printed wire board layer. The LED package may include castellations for mounting the package on a secondary component such as a printed wire board. The LED package may further comprise an isolator disposed between a base metal layer and one or more LED die. The LED package may include a PWB assembly having a stepped cavity, in which one or more LED die are disposed.

Abstract: A wiring board unit includes a connector having a plurality of terminals; and a wiring board on which the connector is mounted. The wiring board includes a first wiring pattern provided on a first wiring layer, a second wiring pattern provided on a second wiring layer at a position shallower than the first wiring layer, a first via formed in a first recess having a first depth, the first via being in contact with the first wiring pattern, and a second via formed in a second recess having a second depth that is smaller than the first depth, the second via being in contact with the second wiring pattern.

Abstract: The present invention relates to connector tools for seating connectors on a substrate such as a printed circuit board (PCB). The connector tool is a machined structure having a plurality of walls that define intersecting slots that mate with an array of male connector pins and include one or more ribs to reduce damage if the tool is dropped on the floor. The ribbed walls strengthen the connector tool, but do not interfere with the mating array of male connector pins. The connector tool also includes push shoulders to contact the connector apart from the array of male connector pins so as to seat the connector onto the PCB without connector tool and connector damage.

Abstract: A metallized ceramics substrate including: a ceramics body; a wiring pattern formed on one surface of the ceramics body; and a lead electrically-connected to the wiring pattern. The ceramics body has a through-hole, the lead penetrates the through-hole and sticks out from another surface of the ceramics body, and the lead is fixed by filling an electroconductive filler between the lead and the through-hole for keeping airtightness. The metallized ceramics substrate does not cause a problem of interlayer peeling and is excellent in airtightness and electric conductivity.

Abstract: An interconnect assembly including a resilient material with a plurality of through holes extending from a first surface to a second surface. A plurality of discrete, free-flowing conductive particles is located in the through holes. The conductive particles are preferably substantially free of non-conductive materials. A plurality of first contact tips are located in the through holes adjacent the first surface and a plurality of second contact tips are located in the through holes adjacent the second surface. The resilient material provides the required resilience, while the conductive particles provide a conductive path substantially free of non-conductive materials.

Abstract: In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C.

Abstract: An object of the invention is to provide a method for fabricating a printed wiring board that can suppress warping of the printed wiring board and can improve the yield of semiconductor chip mounting and enhance the reliability of a semiconductor package. The printed wiring board fabrication method according to the invention is a method for fabricating a printed wiring board having a through-hole in a core layer, wherein the printed wiring board fabrication method includes the step of applying a laser from one side of the core layer to a position where the through-hole is to be formed in the core layer and the step of applying a laser to the same position from the opposite side of the core layer.

Abstract: A hearing aid includes a shell (104) manufactured by a rapid prototyping process, so as to include a first part customized to adapt it to the shape of the ear canal of a user, and a second part that defines an aperture; an electronics module; and a plug (200) with means for retaining it in a fixed position in the shell. The shell has guideways (212) for guiding lateral portions of the plug to support the plug in the aperture. The shell is adapted to receive by the aperture the electronics module; and the electronics module is adapted to engage a lip (206) of the plug to secure it in the shell. The invention further provides a method of assembling a part of a hearing aid.

Abstract: A method of making a self-supporting field director structure for use in heating an article in a microwave oven comprises in any operative order, the steps of folding a first and a second elongated vane blank along a central fold line to form at least two V-shaped vane doublets; inserting each of the vane doublets into a slotted annular support member so that each vane in each vane doublet extends through an adjacent slot in the annular support member; and attaching the vane doublets at their vertices to define a vane array.

Abstract: One or more decoupling capacitors are coupled to a low inductance mount that is connected to the bottom layer of a printed circuit board (PCB) on which a semiconductor module is mounted. The low inductance mount includes a magnetic planar structure with vias that are coupled to the one or more decoupling capacitors and to like vias positioned on the PCB.

Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board.

Abstract: A surface-mountable magnetic field sensor (1) with a semiconductor chip (4), a magnetic field measuring device (30), and in a method for producing and populating a circuit board (24) having a magnetic field sensor (1), the magnetic field sensor (1) has a semiconductor chip (4), which is arranged on a flat-conductor substrate (5). At least three flat-conductor electrodes (6 to 9), which protrude out of a plastic housing side (10), are electrically connected to the semiconductor chip (4). The flat-conductor substrate (5) and the semiconductor chip (4) are embedded in a plastic housing (11). The plastic housing (11) can be inserted with the embedded semiconductor chip (4) into a magnetic field gap (12), with the flat-conductor electrodes (6 to 9) protruding, wherein the flat-conductor electrodes (6 to 9) have bends (13 to 16) at a distance from the plastic housing side (10), the bends being surface-mountable on a circuit board.

Abstract: A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered.

Abstract: An electrical power module (2) to be mounted on a printed circuit board (1), comprising a first side (21) to be mounted on a surface of a heat sink (3), wherein, in a mounted position of the electrical power module (2) on the heat sink (3), the first side (21) is arranged substantially parallel to the heat sink (3), and a second side (22) provided with electrical connection elements (23), wherein the electrical connection elements (23) are adapted to electrically connect the electrical power module (2) to the printed circuit board (1).

Abstract: A card-edge connector has a housing that includes a housing body, and a plurality of electrical contacts carried by the housing body. The housing is devoid of mounting ears that would extend out from the housing body. Rather, the housing includes opposing mounting guides carried by opposed housing side walls that are configured to receive a complimentary circuit board that the card-edge connector is mounted to.

Abstract: The liquid ejection head for ejecting liquid from nozzles includes: pressure chambers connecting to the nozzles; a common liquid chamber which is connected to the pressure chambers, is arranged across the pressure chambers from the nozzles, and is defined by at least a multi-layer wiring substrate which has a recess-shaped structure including a base section forming one of a ceiling and a floor of the common liquid chamber and a projecting section forming a side wall of the common liquid chamber; electrical wires which are formed at least partially inside the multi-layer wiring substrate; and a connection electrode which is provided in a top of the projecting section of the multi-layer wiring substrate.

Abstract: A method for manufacturing a silicon chip package for a circuit board assembly is provided with a package substrate having a silicon chip and an array of contact pads provided by conductive material. A plurality of conductive springs are affixed to the array of contact pads for providing conductive contact with the corresponding array of contacts on a circuit board assembly.

Abstract: A wiring substrate includes: a substrate having a first surface and a second surface; a first insulating layer stacked on the first surface; a pad electrode stacked on the first insulating layer; a through electrode connected to the pad electrode; and a second insulating layer disposed between the substrate and the through electrode and between the first insulating layer and the through electrode, wherein a diameter of the through electrode in a connection section between the pad electrode and the through electrode is smaller than a diameter of the through electrode on the second surface side, the first insulating layer, the second insulating layer and the through electrode overlap with each other in a peripheral area of the connection section, when seen from a plan view, and the thickness of the first insulating layer in the area is thinner than the thickness of the first insulating layer in other areas.

Abstract: A method of manufacturing an image drum includes fixing a control circuit board inside the drum body so that a plurality of terminals of the control circuit board are located in the slot formed longitudinally on the drum body, forming an insulation layer to the entire external surface of the drum body, forming connection parts by removing parts of the insulation layer where the terminals of the control circuit board are formed, forming electrode forming grooves including the insulation layer as a base on the external surface of the drum body comprising the connection parts thereon, and forming a plurality of ring electrodes to be connected to respective terminals among the plurality of the terminals, respectively, through the connection parts.

Abstract: One embodiment includes an apparatus that includes an implantable device housing, a capacitor disposed in the implantable device housing, the capacitor including a dielectric comprising CaCu3Ti4O12 and BaTiO3, the dielectric insulating an anode from a cathode and pulse control electronics disposed in the implantable device housing and connected to the capacitor.