Abstract: A pedestal on which a beveled blank is mounted is provided with a recess portion and an edge portion. The recess portion is provided in a central part of a surface of a pedestal body of the pedestal. The edge portion is adjacent to the recess portion to which the blank is fixed. The recess portion has a length in the short side direction of the pedestal body longer than that of the short side of the blank.

Abstract: An elastic wave device includes an elastic wave element including a piezoelectric substrate with a first main surface and a second main surface that face each other, an IDT electrode disposed on the second main surface of the piezoelectric substrate, a support disposed on the second main surface of the piezoelectric substrate so as to surround the IDT electrode in plan view, and a cover that is disposed on the support and seals the IDT electrode together with the support and the piezoelectric substrate, a mounting substrate above which the elastic wave element is mounted, and a sealing resin that is disposed on the side of the side of the upper surface of the mounting substrate and seals the elastic wave element. A thickness of the mounting substrate is less than a thickness of the sealing resin that corresponds to a distance from a surface of the sealing resin in contact with the upper surface of the mounting substrate to a surface of the sealing resin on an opposite side of the mounting substrate.

Abstract: A quartz crystal resonator that includes an AT-cut quartz crystal blank that is plate-shaped and that is rectangular when viewed in a direction normal to a main surface thereof; and a first outer electrode and a second outer electrode disposed on the main surface and arranged in a short-side direction of the main surface. Long sides of the main surface are substantially parallel to a Z? axis of the quartz crystal blank. The short sides of the main surface are substantially parallel to an X axis of the quartz crystal blank. A frequency of a main vibration of the quartz crystal blank is in a range of 20.0 MHz to 60.0 MHz, and 0.050?P??0.0047×F+1.728, where P (mm) is a distance between the first outer electrode and the second outer electrode in the short-side direction, and F (MHz) is the frequency of the main vibration.

Abstract: A piezoelectric vibration device is provided that includes a piezoelectric transformer, a flexible board and a case. The flexible board includes an element-mounting terminal connected to an outer electrode of the piezoelectric transformer, and an external connection terminal connected to a wiring board. The case has a securing member that secures the case to the wiring board and a ceiling. When the piezoelectric vibration device is mounted on the wiring board, the securing member defines a space between the ceiling and the wiring board to accommodate the piezoelectric transformer and the flexible board. Moreover, the piezoelectric transformer is suspended to the ceiling of the case by a holding member. This configuration provides a piezoelectric vibration device with which degradation of characteristics due to causes such as displacement of the piezoelectric vibrator or fluctuations in the pressing force applied by lead terminals is minimized.

Abstract: An artificial cochlea device for processing audio signals by electro-mechanical amplitude changes may be provided. The device comprises a micro-electro-mechanical system (MEMS) microphone comprising a membrane, an electro-mechanical feedback loop embedded in the MEMS microphone. Thereby, the electro-mechanical feedback loop comprises a piezo-electric actuator acting on the MEMS microphone by influencing the membrane's way to swing, such that an electro-mechanical amplitude change of an output signal is achieved.

Abstract: An integrated circuit device includes a first pad and a second pad electrically coupled to one end and the other end of a resonator, an oscillation circuit that is electrically coupled to the first pad and the second pad and generates an oscillation signal by causing the resonator to oscillate, and an output circuit that outputs a clock signal based on the oscillation signal. The oscillation circuit is disposed along a first side of the integrated circuit device among the first side, a second side that intersects the first side, a third side that is an opposite side of the first side, and a fourth side that is an opposite side of the second side. The first pad and the second pad are disposed in the oscillation circuit along the first side in a plan view, and the output circuit is disposed along the second side.

Abstract: A display apparatus may include: a display panel including: a display area configured to display an image, and a non-display area, an optical module on a rear surface of the display panel, at least one first sound generator on a rear surface of the optical module, and at least one second sound generator in the non-display area and between the display panel and the optical module.

Abstract: A family of resonators and other devices which employ virtual electrodes using pixel based projection across a gap onto a material. In many embodiments, the pixel is projected onto a piezoelectric material, such as quartz crystal, by an integrated circuit die placed opposite a face of the crystal. The die projects a single pixel of electromagnetic energy onto the crystal, which vibrates and produces its own electromagnetic energy which is received by the pixel. Pixel projection onto other materials, including non-resonant materials, is also disclosed. The pixel based projected electrodes may be used in combination with, or in lieu of, conventional metal electrodes. The single pixel may be controlled in gain and phase in order to achieve specific desired resonator response characteristics. Many types of devices using pixel based electrode projection are disclosed—including resonators having one or more single-pixel virtual electrodes, and other types of devices.

Abstract: A piezoelectric vibrator includes a piezoelectric vibrating element, and a base member having a mounting surface to which the piezoelectric vibrating element is mounted, and a mount surface positioned on the opposite side to the mounting surface. The base member includes an electrode pattern formed at the mount surface that includes a ground electrode and a signal electrode that is electrically connected to the piezoelectric vibrating element. Moreover, the mount surface is a rectangular shape, the signal and ground electrodes are arranged in a region of the mount surface closer to any one side thereof, with the one side defining part of outer edges of the mount surface, and a distance from an outer edge of the signal electrode to the one side of the mount surface is longer than a distance from an outer edge of the ground electrode to the one side of the mount surface.

Abstract: A resonator with stabilized resonant frequency that includes a lower electrode, a plurality of upper electrodes, and a piezoelectric film disposed between the lower electrode and the plurality of upper electrodes. Moreover, an upper lid having a first and second opposing surfaces is provided so that the first surface faces and seals a first surface of the resonator. In addition, a lower lid having a first and second opposing surfaces is provided so that the first surface faces and seals a second surface of the resonator. The resonator further includes a power terminal electrically connected to the upper electrodes and a ground terminal provided on the second surface of the upper lid. The lower electrode is electrically connected to the ground terminal by the upper lid.

Abstract: A piezoelectric resonator unit that includes a piezoelectric resonator; a substrate that includes a mounting surface, an electrode pattern on the mounting surface; and a cap joined to the mounting surface of the substrate by a joining material such that the piezoelectric resonator is hermetically sealed. The electrode pattern includes a connection electrode to which the piezoelectric resonator is connected, and an extended electrode that is extended from the connection electrode towards an outer edge of the mounting surface. A joining region on the mounting surface is provided over an entire periphery and surrounds the connection electrode. An insulating material is in the joining region such that at least part of the electrode pattern is exposed therefrom.

Abstract: An acoustic wave device includes a supporting substrate, an acoustic reflection film the supporting substrate, a piezoelectric thin film on the acoustic reflection film, and an interdigital transducer electrode the piezoelectric thin film. The acoustic reflection film includes acoustic impedance layers including therein first, second, third, and fourth low acoustic impedance layers and first, second, and third high acoustic impedance layers. The acoustic reflection film includes a first acoustic impedance layer and a second acoustic impedance layer, the first and second acoustic impedance layers each being one of the acoustic impedance layers, and the second acoustic impedance layer has an arithmetic average roughness different from that of the first acoustic impedance layer.

Abstract: An optical scanning device includes: a pair of twist beams arranged on both sides of a mirror along a predetermined axis and configured to swing the mirror around the axis; a pair of connection beams connected to the respective twist beams; a piezoelectric sensor formed on the connection beams and configured to detect a displacement of the connection beams caused by a swing of the mirror around the axis; wherein the piezoelectric sensor includes a lower electrode; a piezoelectric thin film stacked on the lower electrode; and an upper electrode stacked on or above the piezoelectric thin film, wherein a bottom surface and a side surface of the piezoelectric thin film form a tilt angle ?, and wherein the tilt angle is greater than 0° and less than or equal to 50°.

Abstract: Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing having an inner surface and an outer surface, a dielectric substrate having a first major surface and a second major surface, and a dielectric bonding ring disposed between the first major surface of the dielectric substrate and the housing, where the dielectric bonding ring is hermetically sealed to both the first major surface of the dielectric substrate and the housing. The package further includes an electronic device disposed on the first major surface of the dielectric substrate, and a power source disposed at least partially within the housing and electrically connected to the electronic device.

Abstract: A resonator includes a vibration portion with upper and lower electrodes with a piezoelectric film disposed therebetween. Moreover, a protective film is provided to face the piezoelectric film with the upper electrode interposed therebetween and is exposed in a first region in the vibration portion. A conductive film is provided to face the piezoelectric film with the protective film interposed therebetween and is exposed in a second region that is adjacent to the first region in the vibration portion. A connection electrode is formed in the protective film to electrically connect the conductive film to the lower electrode. The upper electrode is formed such that an area of a region overlapping the conductive film is equal to or smaller than half of a total area of the conductive film and/or avoids the region overlapping the conductive film.

Abstract: A system includes a flat panel display having a panel resonant frequency response corresponding to a composition, shape, and structure of the flat panel display; and an actuator having an actuator resonant frequency response corresponding to a composition, size, and shape of the actuator; in which the actuator is mechanically-coupled to the flat panel display at a mechanical drive point, in which a coupled resonant frequency response of the system is lower than the panel resonant frequency response of the flat panel display.

Abstract: Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a surface of a base, the second conductor pattern including a second plurality of contact pads. Each pad of the first plurality of contact pads is directly bonded to a respective pad of the second plurality of contact pads. A ring-shaped seal is form between a perimeter of the piezoelectric plate and a perimeter of the base.

Abstract: A vibration device including a vibrator, a circuit component, a relay substrate disposed between the vibrator and the circuit component, a package that accommodates the vibrator, the circuit component, and the relay substrate, a first metal bump that joins the circuit component to the package, a second metal bump that joins the relay substrate to the circuit component, and a third metal bump that joins the vibrator to the relay substrate.

Abstract: A bulk acoustic wave resonator includes a substrate including a first via and a second via, a lower electrode connection member, a lower electrode, a piezoelectric layer, an upper electrode, and an upper electrode connection member spaced apart from the lower electrode connection member. The lower electrode, the piezoelectric layer, and the upper electrode constitute a resonant portion. The lower electrode connection member electrically connects the lower electrode to the first via and supports a first edge portion of the resonant portion. The upper electrode connection member electrically connects the upper electrode to the second via and supports a second edge portion of the resonant portion. Either one or both of the upper electrode connection member and the lower electrode connection member includes a respective extension portion connected to a respective one of the first via and the second via that is disposed below the resonant portion.

Abstract: A method of fabricating an FBAR filter device including an array of resonators, each resonator comprising a single crystal piezoelectric film sandwiched between a first metal electrode and a second metal electrode, wherein the first electrode is supported by a support membrane over an air cavity, the air cavity embedded in a silicon dioxide layer over a silicon handle, with through-silicon via holes through the silicon handle and into the air cavity, the side walls of said air cavity in the silicon dioxide layer being defined by perimeter trenches that are resistant to a silicon oxide etchant.

Abstract: A vibrator device includes a circuit element, which has a first terminal and is a quadrangle in plan view, a vibrator, which is disposed on an active surface and is a quadrangle in plan view, a base, on which the circuit element is disposed and which has a second terminal, and a wire which connects the first terminal and the second terminal together. In plan view of the circuit element, at least one side of the vibrator is disposed along a direction where the one side intersects each of two adjacent sides of the circuit element, and the vibrator does not overlap the first terminal.

Abstract: An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.

Abstract: A crystal vibrator according to the present invention includes a crystal blank generating thickness shear vibration, a pair of excitation electrodes on both surfaces of the crystal blank, and a pair of extraction electrodes respectively extracted from the excitation electrodes. The crystal blank includes a region provided with a plurality of hill parts which are covered by an excitation electrode. Due to hill parts, it is possible to increase adhesion to the excitation electrodes and to provide a highly reliable crystal vibrator.

Abstract: Embodiments of an adhesive containment structure are provided herein. The suspension includes a base portion that includes a metal support layer, an insulation layer including an insulating material on the metal support layer, and a signal conductor layer. The suspension includes a gimbaled portion, a microactuator adhered to the support layer. The suspension also includes an adhesive containment structure, the adhesive containment structure includes a first portion of the insulating material, a second portion of the insulating material, and a third portion of the insulating material, the first and second portions of the insulating material being separated by a gap, and the third portion of the insulating material disposed within the gap. Adhesive is disposed within the gap of the adhesive containment structure, the adhesive adhering the microactuator to the third portion of the insulating material.

Abstract: The disclosed computer-implemented method may include an apparatus having a support structure of a wearable device and a transducer coupled to the support structure. The transducer may be configured to generate movements in response to an audio input signal. The apparatus may also have a movement-conducting element coupled to the transducer. The movement-conducting element may be configured to apply the generated movements to a top portion of a user's ear. The movement-conducting element may maintain contact with the top portion of the user's ear so that the generated movements are consistently conducted to the user's ear regardless of which portion of the movement-conducting element contacts the top portion of the user's ear. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: An AT-cut crystal element is provided for reducing unnecessary vibration and for improving impedance of a resonator. Two side surfaces intersecting with a Z?-axis of a crystallographic axis of crystal are constituted of three surfaces of a first surface as an m-surface of quartz crystal, a second surface that intersects with the first surface and is other than the m-surface, and a third surface that intersects with the second surface and is other than the m-surface. Moreover, the second surface is a surface corresponding to a surface obtained by rotating a principal surface of the AT-cut crystal element by ?74±3° having an X-axis of crystal as a rotation axis, and the third surface is a surface corresponding to a surface obtained by rotating the principal surface by ?56±3° having the X-axis of the crystal as the rotation axis.

Abstract: There are provided a laminated piezoelectric element in which a stress applied to an interface between a cover layer and a stacked body is reduced, and an injection device and a fuel injection system provided with the laminated piezoelectric element. A laminated piezoelectric element includes a stacked body in which piezoelectric layers and internal electrode layers are alternately laminated; and a cover layer disposed so as to surround a side face of the stacked body, and the cover layer has a two-layer structure with an annular boundary when viewed in a section perpendicular to a stacking direction of the stacked body.

Abstract: A vibrator device has a base that has a first terminal, a circuit element that is disposed on the base and has a second terminal, a vibrator that includes a vibrator element and a vibrator element package, and is positioned between the first terminal and the second terminal in plan view of the base, a wiring unit that is disposed on the vibrator, a first wire that electrically connects the first terminal and the wiring unit together, and a second wire that electrically connects the wiring unit and the second terminal together.

Abstract: A directional microphone is provided which includes a substrate having a cavity that penetrates therethrough, a resonator array of at least one resonator, and a cover member. Each of the resonator array and the cover member covers covering at least a part of the cavity.

Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.

Abstract: There is provided a power generating element which is capable of converting vibration energy in various directions into electric energy without waste and less likely to be damaged even upon application of excessive vibration. Made available is a main generating structure (MGS) in which a first layer (100), a second layer (200) and a third layer (300) are laminated. The second layer (200) has a plate-like bridge portion (210), a central plate-like portion (220), a left-hand side plate-like portion (230) and a right-hand side plate-like portion (240), each of which is flexible, and the third layer (300), that is a weight body, formed in the “U” letter shape is joined with the lower surface thereof. The plate-like bridge portion (210) is protected by the weight body (300) circumference thereof.

Abstract: Micro-electromechanical switch (MEMS) devices can be fabricated using integrated circuit fabrication techniques and materials. Such switch devices can provide cycle life and insertion loss performance suiting for use in a broad range of applications including, for example, automated test equipment (ATE), switching for measurement instrumentation (such as a spectrum analyzer, network analyzer, or communication test system), and uses in communication systems, such as for signal processing. MEMS devices can be vulnerable to electrical over-stress, such as associated with electrostatic discharge (ESD) transient events. A solid-state clamp circuit can be incorporated in a MEMS device package to protect one or more MEMS devices from damaging overvoltage conditions. The clamp circuit can include single or multiple blocking junction structures having complementary current-voltage relationships, such as to help linearize a capacitance-to-voltage relationship presented by the clamp circuit.

Abstract: A vibration element includes a detection signal electrode provided in a detection vibrating arm, a detection signal terminal which is provided in a support portion and electrically connected to the detection signal electrode, and a detection ground terminal provided in the support portion, and the detection ground terminal is disposed between a first connection portion which is a connection portion with a beam portion of the support portion and a second connection portion which is a connection portion with a beam portion, and is provided to extend to the outside of the first connection portion, and the detection signal terminal is provided between the detection ground terminal and an end portion of the support portion.

Abstract: A resonator may include a first dielectric member, a second dielectric member, a composite member, a first sealer, and a second sealer. The first dielectric member may have a first cavity. The second dielectric member may have a second cavity. The composite member may include a piezoelectric layer and may be positioned between the first cavity and the second cavity. The first sealer may be positioned between two portions of the first dielectric member. The first cavity may be positioned between the first sealer and the composite member. The second sealer may be positioned between two portions of the second dielectric member. The second cavity may be positioned between the second sealer and the composite member.

Abstract: A method for manufacturing a piezoelectric resonator unit by forming a via conductor in a through hole of a ceramic substrate, forming a connection electrode foundation layer connected to the via conductor, and forming a sealing frame foundation layer in a substantially frame shape. The ceramic substrate is then fired together with the via conductor, the connection electrode foundation layer, and the sealing frame foundation layer. The surface of the connection electrode foundation layer and the surface of the sealing frame foundation layer are flattened by pressing the ceramic substrate from a first main surface side and a second main surface side thereof. A plating treatment is carried out to form a connecting electrode and a sealing frame. A piezoelectric resonator is electrically connected to the connection electrode.

Abstract: Piezoelectric actuator apparatus and methods for providing tactile feedback are described herein. An example piezoelectric actuator assembly includes a support plate having a recessed well and conductive contact disposed within the recessed well of the support plate. A piezoelectric element has a first layer composed of an electrically conductive material and a second layer adjacent the first layer composed of a piezoelectric material. The piezoelectric element is disposed within the recessed well so that the first layer directly engages the conductive contact and the second layer is to be electrically coupled to a ground via a flexible conductive lead.

Abstract: To reduce interference between wiring patterns at an oscillator that outputs a plurality of oscillation signals. An oscillator includes an IC configured to output a plurality of oscillation signals using a crystal resonator, and a base plate connected to the IC. The base plate includes a crystal resonator land and a crystal resonator land that are electrically connected to the crystal resonator, a power source land electrically connected to a power source, and a first output land positioned between the crystal resonator land and the power source land to output a first oscillation signal from the IC to an outside, and a wiring pattern from the first output land passes through between the crystal resonator land and the crystal resonator land.

Abstract: An electronic device includes: a container including first and second projections disposed on a bottom plate; and a vibration element having an end on a third surface side of the vibration element placed in a container via a connector so that the first and second projections, and a first surface face each other with a void therebetween, and the first and second projection portions partially overlap the first surface on a fourth surface side of the vibration element, and are aligned along the direction intersecting the longitudinal direction of the vibration element. In addition, a relationship of L1>L2>L3 is satisfied when an interval between ends in the intersecting direction is L1, an interval between the first and second projections is L2, and an interval between ends in the intersecting direction of an electrode film is L3.

Abstract: The crystal element includes: a mesa-shaped crystal piece in a substantially rectangular shape in a plan view including an oscillation section having a first protruded section and a second protruded section; excitation electrodes provided on both main surfaces of the oscillation section; leading sections provided side by side along a prescribed side of the crystal piece; and a wiring section connecting between the excitation electrodes and the leading sections. The first protruded section and the second protruded section include sloping side faces. The side face of the first protruded section located on the +X-side overlaps with the side face of the second protruded section located on the +X side, and the side face of the first protruded section located on the ?X-side overlaps with the side face of the second protruded section located on the ?X side.

Abstract: A piezoelectric transformer includes a piezoelectric element. Two primary side electrodes exist on the primary side of the piezoelectric element. The primary side electrodes are coupled by a resistor formed from a conductive coating. A discharge current is discharged via the resistor to protect a semiconductor component from the discharge current. Since neither a short-circuit terminal nor conductive jig is required, electrostatic discharge damage to a semiconductor component can be prevented by a low-cost arrangement.

Abstract: The present disclosure relates to the field of semiconductor technologies, and discloses a method for manufacturing a semiconductor apparatus. The method includes: forming a water film on a bottom surface of a top wafer and a top surface of a bottom wafer; after the water film is formed, attaching the bottom surface of the top wafer to the top surface of the bottom wafer; disposing the attached top wafer and bottom wafer in a vacuum environment; and performing a thermal annealing process, so that the bottom surface of the top wafer is fusion-bonded to the top surface of the bottom wafer. The disclosed methods can reduce bubble voids existing between the bonded wafers.

Abstract: An electronic component package includes: a first side surface terminal provided on a first side surface; a first external connection terminal provided on a mounting surface (rear surface); a first recess electrode provided in a first recess and electrically connected with the first external connection terminal; and a first branch wiring disposed on a front surface of a middle plate and including a first end exposed in the first side surface between the first side surface terminal and the first recess electrode. The relation: L11>L12 is satisfied, where L11 is the distance between the first end and the first recess electrode and L12 is the distance between the first end and the first side surface terminal.

Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals.

Abstract: An electronic device includes a base material, a first metal film disposed on the base material and containing nitrogen and chromium, and a second metal film disposed on the first metal film and containing gold. In the first metal film, the number of nitrogen atoms may be between 20% to 100% of the number of chromium atoms. Further, the distribution of nitrogen atoms in the first metal film is larger in a third region sandwiched between a first region on the base material side of the first metal film and a second region on the second metal film side than in the first region and in the second region.

Abstract: Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.

Abstract: A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and a frequency deviation with respect to a frequency at a time point when power supply starts is within a range of ±8 ppb at a time point when 10 seconds elapse from when the power supply starts, within a range of ±10 ppb at a time point when 20 seconds elapse from when the power supply starts, and within a range of ±10 ppb at a time point when 30 seconds elapse from when the power supply starts.

Abstract: A system includes a flat panel display having a panel resonant frequency response corresponding to a composition, shape, and structure of the flat panel display; and an actuator having an actuator resonant frequency response corresponding to a composition, size, and shape of the actuator; in which the actuator is mechanically-coupled to the flat panel display at a mechanical drive point, in which a coupled resonant frequency response of the system is lower than the panel resonant frequency response of the flat panel display.

Abstract: There is provided a method of manufacturing a piezoelectric vibrator element capable of preventing the piezoelectric vibrator element from being damaged when segmentallizing the piezoelectric vibrator element. The method of manufacturing a piezoelectric vibrator element includes the steps of providing the wafer with the piezoelectric plate and a frame part adapted to support the piezoelectric plate via a connection part, providing a pair of excitation electrodes to the piezoelectric plate, and forming a pair of extending electrodes extending from the piezoelectric plate to the frame part through the connection part and electrically connected respectively to the pair of excitation electrodes, and segmentallizing the piezoelectric plate by cutting the connection part. In the step of providing the pair of excitation electrodes, the pair of extending electrodes are formed on a side surface of the connection part.

Abstract: A oscillator includes a substrate having a first surface and a second surface, a first wiring layer and a second wiring layer disposed respectively on the first and second surfaces, and a plurality of through holes electrically connecting the first and second wiring layers to each other, a resonator disposed above the first surface of the substrate, and having a resonator element, a pair of electrodes sandwiching the resonator element, and a pair of terminals adapted to electrically connect the pair of electrodes to the first electrode layer, and at least one semiconductor device disposed on the second surface of the substrate, adapted to generate an oscillation signal, and having first and second terminals electrically connected respectively to the pair of terminals of the resonator via the second wiring layer and the first wiring layer, and a third terminal supplied with a digital control signal, wherein a distance between each of the first and second terminals and the pair of terminals of the resonator is