Abstract: An oscillator includes: an outer package having an accommodation space; an inner package accommodated in the accommodation space and fixed to the outer package via a heat insulating member; a vibration element accommodated in the inner package; a heat generation element accommodated in the accommodation space and fixed to the inner package; an oscillation circuit configured to oscillate the vibration element; a control circuit disposed outside the accommodation space and configured to control the heat generation element; and a conductive wire electrically coupling the outer package and the inner package.

Abstract: A board has a first main surface and a second main surface. A first electronic component is mounted on a board so that one surface on which an electrical functional unit is formed faces a first main surface. A second electronic component is mounted on the board so that one surface on which an electrical functional unit is formed faces a second main surface. At least a portion of the first electronic component and at least a portion of the second electronic component overlap each other in a plan view. The other surface of the first electronic component is exposed from a mold resin. The other surface of the second electronic component is exposed from a mold resin.

Abstract: A device includes an optical integrated circuit device mounted over an upper surface of a support substrate. The optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material. A discrete semiconductor block, made of a second semiconductor material, is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array. The first and second semiconductor materials have substantially matched coefficients of thermal expansion. A parallelpipedal-shaped optical filter is mounted over an upper surface of the discrete semiconductor block and extends over the optical sensor array. One or more edges/corners of the parallelpipedal-shaped optical filter cantilever over the optical sensor array without any provided support.

Abstract: An acoustic resonator device is formed using a wafer-to-wafer bonding process by etching recesses into a first surface of a piezoelectric substrate, a depth of the recesses greater than a target piezoelectric membrane thickness; then wafer-to-wafer bonding the first surface of the piezoelectric substrate to a handle wafer using a releasable bonding method. The piezoelectric substrate is then thinned to the target piezoelectric membrane thickness to form a piezoelectric plate and at least one conductor pattern is formed on the thinned piezoelectric plate. The side of the thinned piezoelectric plate having the conductor pattern is bonded to a carrier wafer using a metal-to-metal wafer bonding process and the handle wafer is removed.

Abstract: A method for manufacturing a vibrator that includes forming excitation electrodes, lead-out electrodes, and first sealing frames on the main surfaces of a crystal piece; forming second sealing frames on the main surfaces of a base part and a lid part; and sealing a crystal vibration element by bonding the first sealing frames to the second sealing frames. The first sealing frames each include a first Ti or Cr base layer 110, and a first Au surface layer. The first Ti or Cr base layers are thinner than the first Au surface layers. The second sealing frames each include a second Ni base layer, and a second AuSn surface layer. The second Ni base layers are thicker than the second AuSn surface layers. The sealing is carried out by alloying the first Au surface layers and the second AuSn surface layers to each other.

Abstract: An acoustic wave device includes a piezoelectric substrate, functional elements, an outer peripheral support layer, a cover portion, and a protective layer covering the cover portion. A hollow space is defined by the piezoelectric substrate, the outer peripheral support layer, and the cover portion, and the functional elements are disposed in the hollow space. The acoustic wave device further includes an under bump metal layer, a wiring pattern, and a through-electrode that connects these elements. In the protective layer, a through-hole to be filled with a conductor to electrically connect a solder ball and the under bump metal layer is provided. The outer peripheral support layer includes a protruding portion protruding to the hollow space. When the acoustic wave device is seen in plan view, at least a portion of the through-hole overlaps the hollow space, and an end portion of the protruding portion overlaps an inner region of the through-hole.

Abstract: A semiconductor packaging method, a semiconductor assembly and an electronic device comprising the semiconductor assembly are described herein. The semiconductor packaging method comprises providing at least one semiconductor device and a carrier board. A plurality of first alignment solder parts are formed on an active surface of each semiconductor device in addition to connection terminals. A plurality of second alignment solder parts are formed on a surface of the carrier board.

Abstract: A crystal quartz element includes a main face provided with a plurality of polarity inverted regions and a polarity non-inverted region, the plurality of polarity inverted regions are spaced apart from each other via the polarity non-inverted region, and the main face is a plane face. A method for manufacturing a crystal quartz element includes: preparing a crystal quartz body including a first main face which is a plane face, and a first pressing jig including a first pressing face on which a plurality of first projections are provided; and forming a plurality of polarity inverted regions corresponding to the plurality of first projections in the crystal quartz body by heating and pressing the first main face by the first pressing face.

Abstract: A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Abstract: A piezoelectric device includes a container and an AT-cut crystal element. The AT-cut crystal element has at least one side surface intersecting with a Z?-axis of the crystallographic axis of the crystal constituted of three surfaces. The first surface is a surface equivalent to a surface formed by rotating the principal surface by 4°±3.5° with an X-axis of the crystal as a rotation axis. The second surface is a surface equivalent to a surface formed by rotating the principal surface by ?57°±5° with the X-axis. The third surface is a surface equivalent to a surface formed by rotating the principal surface by ?42°±5° with the X-axis. When two corner portions on a side of a second side opposed to the first side of the AT-cut crystal element are viewed in plan view, each of the two corner portions have an approximately right angle.

Abstract: A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.

Abstract: An electrical connection structure for connecting a piezoelectric element and an electrical circuit to each other with a conductive adhesive is described. The electrical connection structure includes an epoxy, a conductive component surrounded by the epoxy, and a trace feature implemented on top of the electrical connection structure. At least one depression feature can be implemented on top of the electrical connection structure to constrain the epoxy and the at least one conductive component.

Abstract: An acoustic wave device includes a piezoelectric substrate that includes first and second main surfaces, an IDT electrode on the first main surface, a support having a rectangular or substantially rectangular frame shape and including a cavity, first and second sides, and a first corner portion connected to the first and second sides, and the support being provided on the first main surface such that the cavity surrounds the IDT electrode, and a cover on the support and covering the cavity. A straight or substantially straight grinding trace is provided on the second main surface. The grinding trace leads to the first corner portion as viewed in plan. One of an angle between the first side and the grinding trace and an angle between the second side and the grinding trace as viewed in plan is about 9.5° or less.

Abstract: A method of manufacturing a power generation element includes a first step of disposing a support unit that supports a vibration unit in one end portion of the vibration unit in one direction, and disposing a weight unit in the other end portion of the vibration unit in the one direction in a substrate including the vibration unit capable of vibrating, a second step of disposing a piezoelectric unit that generates power due to vibration in a portion of the vibration unit on an opposite side from the support unit side in a thickness direction of the substrate after the support unit and the weight unit are disposed in the vibration unit, and a third step of extracting a power generation element from the substrate by cutting an outer edge of the vibration unit in the thickness direction of the substrate after the piezoelectric unit is disposed in the vibration unit.

Abstract: A microelectromechanical system includes an enclosure defining a cavity and an opening communicating with the cavity; a membrane mounted at the opening; a cantilever located within the cavity, the at least one cantilever comprising a first end, a second end and a fulcrum located between the first end and the second end; a plunger positioned between the membrane and the cantilever and configured to transfer displacement of the membrane to the first end of the cantilever; and a sensing member connected to the second end of the cantilever. The distance between the first end and the fulcrum is less than that between the second end and the fulcrum. The microelectromechanical system has the advantages of high SNR, small package size and high sensitivity. The membrane has a stiffness order of magnitude higher than a conventional membrane, which avoids mechanical collapse and large DC deformation under 1 atm.

Abstract: An MEMS microphone includes a substrate including a back volume provided inside the substrate and an opening provided at an upper surface of the substrate to communicate the back volume; a sensing device provided at an inner side wall of the back volume; a first cantilever provided inside the back volume and including end portions coupling with the sensing device; a first membrane provided at the opening; a second membrane provided inside the back volume; and second cantilevers, each of which includes a first end mechanically supporting the first cantilever, and a second end connected to the second membrane. By suspending the first cantilever on the second cantilevers, the end portions of the first cantilever always couple with a preset position of the sensing device. Thus, the DC offset of the displacement of the membrane can be prevented.

Abstract: A vibrator device includes a base, a vibrator element attached to the base, and a lid housing the vibrator element between the base and itself and bonded to the base. The base has a semiconductor substrate including a first surface bonded to the lid and a second surface in a front-back relationship with the first surface, a first insulating layer placed on the first surface, first, second internal terminals placed on the first insulating layer and electrically coupled to the vibrator element, a second insulating layer placed on the second surface, and first, second external terminals placed on the second insulating layer and electrically coupled to the first, second internal terminals. The second insulating layer has a first external terminal region in which the first external terminal is placed and a second external terminal region separated from the first external terminal region, in which the second external terminal is placed.

Abstract: A vibrator, a manufacturing method thereof, a haptical sensation reproduction apparatus and a vibration waveform detection method, and relates to the technical field of display. The vibrator comprises a substrate, and a piezoelectric component and a light-emitting component located on the substrate, wherein the piezoelectric component comprises an inverse piezoelectric unit, the light-emitting component comprises a direct piezoelectric unit and a light-emitting unit, and the inverse piezoelectric unit is in contact and connected with the direct piezoelectric unit. The vibrator of this solution may be disposed in a touch-control reproduction screen, the inverse piezoelectric unit in the vibrator is driven to deform to generate vibrations, and the direct piezoelectric unit in contact and connection therewith is driven to deform to generate a current to drive the light-emitting unit to emit light.

Abstract: A sound transducer, in particular, for an ultrasonic sensor, includes a functional group, the functional group including a diaphragm cup and at least one electroacoustic transducer element. The sound transducer also includes a housing. The diaphragm cup includes a vibratory diaphragm and a circumferential wall, and at least one electroacoustic transducer element, the transducer element being configured to stimulate the diaphragm to vibrate and/or to convert vibrations of the diaphragm into electrical signals. The diaphragm cup is formed from a plastic material, the at least one transducer element being integrated into the vibratory diaphragm, in particular without an additional adhesive layer, the transducer element including a piezoceramic element.

Abstract: An apparatus may include an ultrasonic sensor system having a first layer stack and a second layer stack. The first layer stack may include a first ultrasonic transmitter and the second layer stack may include a second ultrasonic transmitter. The first layer stack and/or the second layer stack may include an ultrasonic receiver. A frequency splitting layer may reside between the first layer stack and the second layer stack.

Abstract: A passband filter includes a first and second microelectromechanical resonator system, each including a resonating beam, a drive electrode, and a sense electrode. An AC input signal is coupled to the drive electrode of the first and second microelectromechanical resonator system. A differential-to-single ended amplifier has a first input and second input respectively coupled to the sense electrodes of the first and second microelectromechanical resonator systems. An output of the differential-to-single ended amplifier is an output of the passband filter that provides a bandpass filtered signal of the AC input signal. A DC bias signal is coupled to the resonating beams of the first and second microelectromechanical resonator systems.

Abstract: A quartz crystal unit comprising a quartz crystal resonator having a base portion, and first and second tuning fork arms connected to the base portion, the base portion having a length less than 0.5 mm and greater than a spaced-apart distance between the first and second tuning fork arms, each of the first and second tuning fork arms having a width less than 0.1 mm and a length less than 1.56 mm, and a plurality of different widths including a first width and a second width greater than the first width, at least one groove being formed in at least one of opposite main surfaces of each of the first and second tuning fork arms so that a length of the at least one groove is within a range of 0.3 mm to 0.79 mm, the quartz crystal resonator being housed in a case, and a lid being connected to the case.

Abstract: A bulk acoustic resonator architecture is fabricated by epitaxially forming a piezoelectric film on a top surface of post formed from an underlying substrate. In some cases, the acoustic resonator is fabricated to filter multiple frequencies. In some such cases, the resonator device includes two different resonator structures on a single substrate, each resonator structure configured to filter a desired frequency. Including two different acoustic resonators in a single RF acoustic resonator device enables that single device to filter two different frequencies in a relatively small footprint.

Abstract: A bulk-acoustic wave resonator includes: a substrate; a membrane layer forming a cavity with the substrate; a lower electrode disposed on the membrane layer; an insertion layer disposed to cover at least a portion of the lower electrode; a piezoelectric layer disposed on the lower electrode to cover the insertion layer; and an upper electrode at least partially disposed on the piezoelectric layer, wherein the upper electrode includes a reflection groove disposed on the insertion layer.

Abstract: MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

Abstract: The invention relates to a component comprising a first part, a second part, a housing body, and a first electrode, wherein the housing body encloses the first electrode in lateral directions at least in some regions. The first electrode has a front face and a rear face facing away from the front face, and the front and rear faces are free of a cover produced by a material of the housing body at least in some regions. The first part is arranged on the front face, and the second part is arranged on the rear face, and both the first and second parts are connected to the first electrode in an electrically conductive manner. The first electrode is designed to be continuous and is arranged between the first part and the second part in the vertical direction. Also described is a method for producing the component.

Abstract: Aspects of the embodiments are directed to systems and devices that include a piezo-electric element comprising a top-side electrode and a bottom-side electrode; a metal contact pad electrically connected to the bottom-side electrode; an electrode electrically connected to the top-side electrode; and an encasement encasing the piezo-electric element. The piezo-electric element can be prepared to include steps and metallization for use in one or more types of packaging.

Abstract: A vibrator device including a vibrator element, an IC substrate including a semiconductor substrate configured of a semiconductor having a first conductive type and a circuit electrically coupled to the vibrator element, the first conductive type being any one of an N-type and a P-type, and a lid directly bonded to the semiconductor substrate and configured of a semiconductor having the first conductive type.

Abstract: A vibrator device includes a base, a vibrator element attached to the base, and a lid housing the vibrator element between the base and itself and bonded to the base. The base has a semiconductor substrate including a first surface bonded to the lid and a second surface in a front-back relationship with the first surface, a first insulating layer placed on the first surface, first, second internal terminals placed on the first insulating layer and electrically coupled to the vibrator element, a second insulating layer placed on the second surface, and first, second external terminals placed on the second insulating layer and electrically coupled to the first, second internal terminals. The second insulating layer has a first external terminal region in which the first external terminal is placed and a second external terminal region separated from the first external terminal region, in which the second external terminal is placed.

Abstract: In a piezoelectric resonator device according to an embodiment, an internal space is formed by bonding a first sealing member to a crystal resonator plate and bonding a second sealing member to the crystal resonator plate. The internal space hermetically seals a vibrating part including a first excitation electrode and a second excitation electrode of the crystal resonator plate. Seal paths that hermetically seal the vibrating part of the crystal resonator plate are formed to have an annular shape in plan view. A plurality of external electrode terminals is formed on a second main surface of the second sealing member to be electrically connected to an external circuit board. The external electrode terminals are respectively disposed on and along an external frame part surrounding the internal space in plan view.

Abstract: A display device includes a light source, a support structure, and a scanning mirror system. The scanning mirror system includes a mirror, a first anchor located at a first lateral side of the scanning mirror system, a second anchor located at a second lateral side of the scanning mirror system, and a flexure. A first portion of the flexure extends from the first anchor toward a first longitudinal end and turns to meet a first end of the mirror. A second portion extends from the second anchor toward a second longitudinal end and turns to meet to a second end of the mirror opposite the first end. An actuator system is configured to actuate the flexure to thereby vary a scan angle of the mirror.

Abstract: A sputtering target formed from a potassium sodium niobate sintered body to which a dopant has been added; as a dopant, the sputtering target includes one or more types among Li, Mg, Ca, Sr, Ba, Bi, Sb, V, In, Ta, Mo, W, Cr, Ti, Zr, Hf, Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Cu, Zn, Ag, Mn, Fe, Co, Ni, Al, Si, Ge, Sn, and Ga; and a variation coefficient of a dopant concentration in a plane of the sputtering target is 0.12 or less. In terms of suppressing the generation of particles, provided is a sputtering target which is formed from a sintered body that includes potassium sodium niobate and to which a dopant has been added.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece and a container. The piezoelectric vibrating piece has a rectangular planar shape and has a portion of a first side secured to the container. The piezoelectric vibrating piece has a second side opposing the first side and includes a projecting portion that projects outward from the second side in at least one of proximity of both ends of the second side along the second side.

Abstract: A quartz crystal device includes a crystal element, a container, a conductive adhesive having flexibility, first pillow portions, and a second pillow portion. The first pillow portions hold the crystal element floated from an inner bottom surface of the container at the proximities of the two positions. The second pillow portion opposes the crystal element at a proximity of a second side. The second side opposes the first side of the crystal element. A height of the first pillow portion is represented as h and a length of the first pillow portion in a direction perpendicular to the first side is represented as X1, where the h is 20 ?m to 50 ?m and the X1 is 150 ?m or less. The conductive adhesive covers at least a top surface and a side surface of the first pillow portion. The side surface is in a center side of the crystal element.

Abstract: The invention relates to an ultrasonic sensor device (2) for a motor vehicle, having an ultrasonic sensor (3) which has a diaphragm (8) for emitting and/or receiving an ultrasonic signal, and having an attachment device which is configured, in a correct installation position of the ultrasonic sensor device (2) on an exterior panelling part (6) of the motor vehicle, to press the diaphragm (8) against an inner side (7) of the exterior panelling part (6) with a prestressing force, wherein the attachment device has a securing apparatus (5) and a cover apparatus (4), wherein the securing apparatus (5) can be arranged on the inner side (7) of the exterior panelling part (6) and has an opening (22) in which the diaphragm (8) is arranged, and wherein the cover apparatus (4) has a receptacle (24) in which a rear side (23), lying opposite the diaphragm (8), of the ultrasonic sensor (3) is secured, and wherein the cover apparatus (4) and the securing apparatus (5) are connected in a positively locking fashion.

Abstract: The present application discloses a mobile terminal, which comprises a flexible screen, a middle frame matched with the flexible screen to form an accommodation space, an exciter fixed on the middle frame, a support layer clamped between the flexible screen and the middle frame, and a steel sheet at least covering a sound generation area, wherein an area, in which the support layer is not arranged, on the flexible screen forms the sound generation area; and the exciter is fixed on the steel sheet to drive the sound generation area to generate sound through vibration. The sound generation area of the flexible screen is driven by the exciter to generate the sound, so that the mobile terminal provided by the present invention has a better sound generation effect compared with the related art.

Abstract: An elastic wave device includes an elastic wave element mounted on a mounting substrate, with the elastic wave element being sealed by a sealing resin layer. The elastic wave element is bonded to electrode lands on the mounting substrate using bumps. Recessed portions are provided on a surface of the sealing resin layer on a side opposite to the side facing the mounting substrate. A ratio D/H between a depth of the recessed portions, and a distance of a portion of the sealing resin layer from the surface to a second main surface of a piezoelectric substrate, is no less than about 1/3.

Abstract: A PZT microactuator such as for a hard disk drive has a restraining layer bonded on its side that is opposite the side on which the PZT is mounted. The restraining layer comprises a stiff and resilient material such as stainless steel. The restraining layer can cover most or all of the top of the PZT, with an electrical connection being made to the PZT where it is not covered by the restraining layer. The restraining layer reduces bending of the PZT as mounted and hence increases effective stroke length, or reverses the sign of the bending which increases the effective stroke length of the PZT even further. The restraining layer can be one or more active layers of PZT material that act in the opposite direction as the main PZT layer. The restraining layer(s) may be thinner than the main PZT layer.

Abstract: A pedestal on which a beveled blank is mounted is provided with a recess portion and an edge portion. The recess portion is provided in a central part of a surface of a pedestal body of the pedestal. The edge portion is adjacent to the recess portion to which the blank is fixed. The recess portion has a length in the short side direction of the pedestal body longer than that of the short side of the blank.

Abstract: An elastic wave device includes an elastic wave element including a piezoelectric substrate with a first main surface and a second main surface that face each other, an IDT electrode disposed on the second main surface of the piezoelectric substrate, a support disposed on the second main surface of the piezoelectric substrate so as to surround the IDT electrode in plan view, and a cover that is disposed on the support and seals the IDT electrode together with the support and the piezoelectric substrate, a mounting substrate above which the elastic wave element is mounted, and a sealing resin that is disposed on the side of the side of the upper surface of the mounting substrate and seals the elastic wave element. A thickness of the mounting substrate is less than a thickness of the sealing resin that corresponds to a distance from a surface of the sealing resin in contact with the upper surface of the mounting substrate to a surface of the sealing resin on an opposite side of the mounting substrate.

Abstract: A quartz crystal resonator that includes an AT-cut quartz crystal blank that is plate-shaped and that is rectangular when viewed in a direction normal to a main surface thereof; and a first outer electrode and a second outer electrode disposed on the main surface and arranged in a short-side direction of the main surface. Long sides of the main surface are substantially parallel to a Z? axis of the quartz crystal blank. The short sides of the main surface are substantially parallel to an X axis of the quartz crystal blank. A frequency of a main vibration of the quartz crystal blank is in a range of 20.0 MHz to 60.0 MHz, and 0.050?P??0.0047×F+1.728, where P (mm) is a distance between the first outer electrode and the second outer electrode in the short-side direction, and F (MHz) is the frequency of the main vibration.

Abstract: A piezoelectric vibration device is provided that includes a piezoelectric transformer, a flexible board and a case. The flexible board includes an element-mounting terminal connected to an outer electrode of the piezoelectric transformer, and an external connection terminal connected to a wiring board. The case has a securing member that secures the case to the wiring board and a ceiling. When the piezoelectric vibration device is mounted on the wiring board, the securing member defines a space between the ceiling and the wiring board to accommodate the piezoelectric transformer and the flexible board. Moreover, the piezoelectric transformer is suspended to the ceiling of the case by a holding member. This configuration provides a piezoelectric vibration device with which degradation of characteristics due to causes such as displacement of the piezoelectric vibrator or fluctuations in the pressing force applied by lead terminals is minimized.

Abstract: An artificial cochlea device for processing audio signals by electro-mechanical amplitude changes may be provided. The device comprises a micro-electro-mechanical system (MEMS) microphone comprising a membrane, an electro-mechanical feedback loop embedded in the MEMS microphone. Thereby, the electro-mechanical feedback loop comprises a piezo-electric actuator acting on the MEMS microphone by influencing the membrane's way to swing, such that an electro-mechanical amplitude change of an output signal is achieved.

Abstract: An integrated circuit device includes a first pad and a second pad electrically coupled to one end and the other end of a resonator, an oscillation circuit that is electrically coupled to the first pad and the second pad and generates an oscillation signal by causing the resonator to oscillate, and an output circuit that outputs a clock signal based on the oscillation signal. The oscillation circuit is disposed along a first side of the integrated circuit device among the first side, a second side that intersects the first side, a third side that is an opposite side of the first side, and a fourth side that is an opposite side of the second side. The first pad and the second pad are disposed in the oscillation circuit along the first side in a plan view, and the output circuit is disposed along the second side.

Abstract: A display apparatus may include: a display panel including: a display area configured to display an image, and a non-display area, an optical module on a rear surface of the display panel, at least one first sound generator on a rear surface of the optical module, and at least one second sound generator in the non-display area and between the display panel and the optical module.

Abstract: A family of resonators and other devices which employ virtual electrodes using pixel based projection across a gap onto a material. In many embodiments, the pixel is projected onto a piezoelectric material, such as quartz crystal, by an integrated circuit die placed opposite a face of the crystal. The die projects a single pixel of electromagnetic energy onto the crystal, which vibrates and produces its own electromagnetic energy which is received by the pixel. Pixel projection onto other materials, including non-resonant materials, is also disclosed. The pixel based projected electrodes may be used in combination with, or in lieu of, conventional metal electrodes. The single pixel may be controlled in gain and phase in order to achieve specific desired resonator response characteristics. Many types of devices using pixel based electrode projection are disclosed—including resonators having one or more single-pixel virtual electrodes, and other types of devices.

Abstract: A piezoelectric vibrator includes a piezoelectric vibrating element, and a base member having a mounting surface to which the piezoelectric vibrating element is mounted, and a mount surface positioned on the opposite side to the mounting surface. The base member includes an electrode pattern formed at the mount surface that includes a ground electrode and a signal electrode that is electrically connected to the piezoelectric vibrating element. Moreover, the mount surface is a rectangular shape, the signal and ground electrodes are arranged in a region of the mount surface closer to any one side thereof, with the one side defining part of outer edges of the mount surface, and a distance from an outer edge of the signal electrode to the one side of the mount surface is longer than a distance from an outer edge of the ground electrode to the one side of the mount surface.

Abstract: A resonator with stabilized resonant frequency that includes a lower electrode, a plurality of upper electrodes, and a piezoelectric film disposed between the lower electrode and the plurality of upper electrodes. Moreover, an upper lid having a first and second opposing surfaces is provided so that the first surface faces and seals a first surface of the resonator. In addition, a lower lid having a first and second opposing surfaces is provided so that the first surface faces and seals a second surface of the resonator. The resonator further includes a power terminal electrically connected to the upper electrodes and a ground terminal provided on the second surface of the upper lid. The lower electrode is electrically connected to the ground terminal by the upper lid.

Abstract: A piezoelectric resonator unit that includes a piezoelectric resonator; a substrate that includes a mounting surface, an electrode pattern on the mounting surface; and a cap joined to the mounting surface of the substrate by a joining material such that the piezoelectric resonator is hermetically sealed. The electrode pattern includes a connection electrode to which the piezoelectric resonator is connected, and an extended electrode that is extended from the connection electrode towards an outer edge of the mounting surface. A joining region on the mounting surface is provided over an entire periphery and surrounds the connection electrode. An insulating material is in the joining region such that at least part of the electrode pattern is exposed therefrom.

Abstract: An acoustic wave device includes a supporting substrate, an acoustic reflection film the supporting substrate, a piezoelectric thin film on the acoustic reflection film, and an interdigital transducer electrode the piezoelectric thin film. The acoustic reflection film includes acoustic impedance layers including therein first, second, third, and fourth low acoustic impedance layers and first, second, and third high acoustic impedance layers. The acoustic reflection film includes a first acoustic impedance layer and a second acoustic impedance layer, the first and second acoustic impedance layers each being one of the acoustic impedance layers, and the second acoustic impedance layer has an arithmetic average roughness different from that of the first acoustic impedance layer.