Abstract: A method of fabricating an FBAR filter device including an array of resonators, each resonator comprising a single crystal piezoelectric film sandwiched between a first metal electrode and a second metal electrode, wherein the first electrode is supported by a support membrane over an air cavity, the air cavity embedded in a silicon dioxide layer over a silicon handle, with through-silicon via holes through the silicon handle and into the air cavity, the side walls of said air cavity in the silicon dioxide layer being defined by perimeter trenches that are resistant to a silicon oxide etchant.

Abstract: A vibrator device includes a circuit element, which has a first terminal and is a quadrangle in plan view, a vibrator, which is disposed on an active surface and is a quadrangle in plan view, a base, on which the circuit element is disposed and which has a second terminal, and a wire which connects the first terminal and the second terminal together. In plan view of the circuit element, at least one side of the vibrator is disposed along a direction where the one side intersects each of two adjacent sides of the circuit element, and the vibrator does not overlap the first terminal.

Abstract: An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.

Abstract: A crystal vibrator according to the present invention includes a crystal blank generating thickness shear vibration, a pair of excitation electrodes on both surfaces of the crystal blank, and a pair of extraction electrodes respectively extracted from the excitation electrodes. The crystal blank includes a region provided with a plurality of hill parts which are covered by an excitation electrode. Due to hill parts, it is possible to increase adhesion to the excitation electrodes and to provide a highly reliable crystal vibrator.

Abstract: Embodiments of an adhesive containment structure are provided herein. The suspension includes a base portion that includes a metal support layer, an insulation layer including an insulating material on the metal support layer, and a signal conductor layer. The suspension includes a gimbaled portion, a microactuator adhered to the support layer. The suspension also includes an adhesive containment structure, the adhesive containment structure includes a first portion of the insulating material, a second portion of the insulating material, and a third portion of the insulating material, the first and second portions of the insulating material being separated by a gap, and the third portion of the insulating material disposed within the gap. Adhesive is disposed within the gap of the adhesive containment structure, the adhesive adhering the microactuator to the third portion of the insulating material.

Abstract: The disclosed computer-implemented method may include an apparatus having a support structure of a wearable device and a transducer coupled to the support structure. The transducer may be configured to generate movements in response to an audio input signal. The apparatus may also have a movement-conducting element coupled to the transducer. The movement-conducting element may be configured to apply the generated movements to a top portion of a user's ear. The movement-conducting element may maintain contact with the top portion of the user's ear so that the generated movements are consistently conducted to the user's ear regardless of which portion of the movement-conducting element contacts the top portion of the user's ear. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1?A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

Abstract: An AT-cut crystal element is provided for reducing unnecessary vibration and for improving impedance of a resonator. Two side surfaces intersecting with a Z?-axis of a crystallographic axis of crystal are constituted of three surfaces of a first surface as an m-surface of quartz crystal, a second surface that intersects with the first surface and is other than the m-surface, and a third surface that intersects with the second surface and is other than the m-surface. Moreover, the second surface is a surface corresponding to a surface obtained by rotating a principal surface of the AT-cut crystal element by ?74±3° having an X-axis of crystal as a rotation axis, and the third surface is a surface corresponding to a surface obtained by rotating the principal surface by ?56±3° having the X-axis of the crystal as the rotation axis.

Abstract: There are provided a laminated piezoelectric element in which a stress applied to an interface between a cover layer and a stacked body is reduced, and an injection device and a fuel injection system provided with the laminated piezoelectric element. A laminated piezoelectric element includes a stacked body in which piezoelectric layers and internal electrode layers are alternately laminated; and a cover layer disposed so as to surround a side face of the stacked body, and the cover layer has a two-layer structure with an annular boundary when viewed in a section perpendicular to a stacking direction of the stacked body.

Abstract: A vibrator device has a base that has a first terminal, a circuit element that is disposed on the base and has a second terminal, a vibrator that includes a vibrator element and a vibrator element package, and is positioned between the first terminal and the second terminal in plan view of the base, a wiring unit that is disposed on the vibrator, a first wire that electrically connects the first terminal and the wiring unit together, and a second wire that electrically connects the wiring unit and the second terminal together.

Abstract: A directional microphone is provided which includes a substrate having a cavity that penetrates therethrough, a resonator array of at least one resonator, and a cover member. Each of the resonator array and the cover member covers covering at least a part of the cavity.

Abstract: There is provided a power generating element which is capable of converting vibration energy in various directions into electric energy without waste and less likely to be damaged even upon application of excessive vibration. Made available is a main generating structure (MGS) in which a first layer (100), a second layer (200) and a third layer (300) are laminated. The second layer (200) has a plate-like bridge portion (210), a central plate-like portion (220), a left-hand side plate-like portion (230) and a right-hand side plate-like portion (240), each of which is flexible, and the third layer (300), that is a weight body, formed in the “U” letter shape is joined with the lower surface thereof. The plate-like bridge portion (210) is protected by the weight body (300) circumference thereof.

Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.

Abstract: Micro-electromechanical switch (MEMS) devices can be fabricated using integrated circuit fabrication techniques and materials. Such switch devices can provide cycle life and insertion loss performance suiting for use in a broad range of applications including, for example, automated test equipment (ATE), switching for measurement instrumentation (such as a spectrum analyzer, network analyzer, or communication test system), and uses in communication systems, such as for signal processing. MEMS devices can be vulnerable to electrical over-stress, such as associated with electrostatic discharge (ESD) transient events. A solid-state clamp circuit can be incorporated in a MEMS device package to protect one or more MEMS devices from damaging overvoltage conditions. The clamp circuit can include single or multiple blocking junction structures having complementary current-voltage relationships, such as to help linearize a capacitance-to-voltage relationship presented by the clamp circuit.

Abstract: A vibration element includes a detection signal electrode provided in a detection vibrating arm, a detection signal terminal which is provided in a support portion and electrically connected to the detection signal electrode, and a detection ground terminal provided in the support portion, and the detection ground terminal is disposed between a first connection portion which is a connection portion with a beam portion of the support portion and a second connection portion which is a connection portion with a beam portion, and is provided to extend to the outside of the first connection portion, and the detection signal terminal is provided between the detection ground terminal and an end portion of the support portion.

Abstract: A resonator may include a first dielectric member, a second dielectric member, a composite member, a first sealer, and a second sealer. The first dielectric member may have a first cavity. The second dielectric member may have a second cavity. The composite member may include a piezoelectric layer and may be positioned between the first cavity and the second cavity. The first sealer may be positioned between two portions of the first dielectric member. The first cavity may be positioned between the first sealer and the composite member. The second sealer may be positioned between two portions of the second dielectric member. The second cavity may be positioned between the second sealer and the composite member.

Abstract: A method for manufacturing a piezoelectric resonator unit by forming a via conductor in a through hole of a ceramic substrate, forming a connection electrode foundation layer connected to the via conductor, and forming a sealing frame foundation layer in a substantially frame shape. The ceramic substrate is then fired together with the via conductor, the connection electrode foundation layer, and the sealing frame foundation layer. The surface of the connection electrode foundation layer and the surface of the sealing frame foundation layer are flattened by pressing the ceramic substrate from a first main surface side and a second main surface side thereof. A plating treatment is carried out to form a connecting electrode and a sealing frame. A piezoelectric resonator is electrically connected to the connection electrode.

Abstract: Piezoelectric actuator apparatus and methods for providing tactile feedback are described herein. An example piezoelectric actuator assembly includes a support plate having a recessed well and conductive contact disposed within the recessed well of the support plate. A piezoelectric element has a first layer composed of an electrically conductive material and a second layer adjacent the first layer composed of a piezoelectric material. The piezoelectric element is disposed within the recessed well so that the first layer directly engages the conductive contact and the second layer is to be electrically coupled to a ground via a flexible conductive lead.

Abstract: To reduce interference between wiring patterns at an oscillator that outputs a plurality of oscillation signals. An oscillator includes an IC configured to output a plurality of oscillation signals using a crystal resonator, and a base plate connected to the IC. The base plate includes a crystal resonator land and a crystal resonator land that are electrically connected to the crystal resonator, a power source land electrically connected to a power source, and a first output land positioned between the crystal resonator land and the power source land to output a first oscillation signal from the IC to an outside, and a wiring pattern from the first output land passes through between the crystal resonator land and the crystal resonator land.

Abstract: An electronic device includes: a container including first and second projections disposed on a bottom plate; and a vibration element having an end on a third surface side of the vibration element placed in a container via a connector so that the first and second projections, and a first surface face each other with a void therebetween, and the first and second projection portions partially overlap the first surface on a fourth surface side of the vibration element, and are aligned along the direction intersecting the longitudinal direction of the vibration element. In addition, a relationship of L1>L2>L3 is satisfied when an interval between ends in the intersecting direction is L1, an interval between the first and second projections is L2, and an interval between ends in the intersecting direction of an electrode film is L3.

Abstract: The crystal element includes: a mesa-shaped crystal piece in a substantially rectangular shape in a plan view including an oscillation section having a first protruded section and a second protruded section; excitation electrodes provided on both main surfaces of the oscillation section; leading sections provided side by side along a prescribed side of the crystal piece; and a wiring section connecting between the excitation electrodes and the leading sections. The first protruded section and the second protruded section include sloping side faces. The side face of the first protruded section located on the +X-side overlaps with the side face of the second protruded section located on the +X side, and the side face of the first protruded section located on the ?X-side overlaps with the side face of the second protruded section located on the ?X side.

Abstract: A piezoelectric transformer includes a piezoelectric element. Two primary side electrodes exist on the primary side of the piezoelectric element. The primary side electrodes are coupled by a resistor formed from a conductive coating. A discharge current is discharged via the resistor to protect a semiconductor component from the discharge current. Since neither a short-circuit terminal nor conductive jig is required, electrostatic discharge damage to a semiconductor component can be prevented by a low-cost arrangement.

Abstract: An electronic component package includes: a first side surface terminal provided on a first side surface; a first external connection terminal provided on a mounting surface (rear surface); a first recess electrode provided in a first recess and electrically connected with the first external connection terminal; and a first branch wiring disposed on a front surface of a middle plate and including a first end exposed in the first side surface between the first side surface terminal and the first recess electrode. The relation: L11>L12 is satisfied, where L11 is the distance between the first end and the first recess electrode and L12 is the distance between the first end and the first side surface terminal.

Abstract: The present disclosure relates to the field of semiconductor technologies, and discloses a method for manufacturing a semiconductor apparatus. The method includes: forming a water film on a bottom surface of a top wafer and a top surface of a bottom wafer; after the water film is formed, attaching the bottom surface of the top wafer to the top surface of the bottom wafer; disposing the attached top wafer and bottom wafer in a vacuum environment; and performing a thermal annealing process, so that the bottom surface of the top wafer is fusion-bonded to the top surface of the bottom wafer. The disclosed methods can reduce bubble voids existing between the bonded wafers.

Abstract: A packaged module for use in a wireless communication device has a substrate supporting a crystal assembly and a first die that implements at least a portion of a radio frequency baseband subsystem. The crystal assembly, positioned between the first die and the substrate, includes a crystal, an input terminal configured to receive a first signal, an output terminal configured to output a second signal, a conductive pillar, and an enclosure configured to enclose the crystal, where the conductive pillar is formed at least partially within a side of the enclosure and extends from a top surface to a bottom surface of the enclosure. The conductive pillar conducts a third signal distinct from the first and second signals.

Abstract: An electronic device includes a base material, a first metal film disposed on the base material and containing nitrogen and chromium, and a second metal film disposed on the first metal film and containing gold. In the first metal film, the number of nitrogen atoms may be between 20% to 100% of the number of chromium atoms. Further, the distribution of nitrogen atoms in the first metal film is larger in a third region sandwiched between a first region on the base material side of the first metal film and a second region on the second metal film side than in the first region and in the second region.

Abstract: Functional element units and a connection line electrically connecting the functional element units are formed on one principal surface of a piezoelectric motherboard. A resin support layer enclosing the functional element units is formed on the one principal surface of the motherboard. An elastic wave device with the functional units is obtained by dividing a multilayer body including the motherboard, the functional element units, and the support layer into a plurality of sections along a dicing line. The connection line includes a line main body positioned on the dicing line, and a connection unit in which the line main body and the functional element units are electrically connected. Prior to dividing the multilayer body, a retaining member made of resin which straddles the line main body in the width direction of the line main body is formed separate from the support layer on the motherboard.

Abstract: A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and a frequency deviation with respect to a frequency at a time point when power supply starts is within a range of ±8 ppb at a time point when 10 seconds elapse from when the power supply starts, within a range of ±10 ppb at a time point when 20 seconds elapse from when the power supply starts, and within a range of ±10 ppb at a time point when 30 seconds elapse from when the power supply starts.

Abstract: A system includes a flat panel display having a panel resonant frequency response corresponding to a composition, shape, and structure of the flat panel display; and an actuator having an actuator resonant frequency response corresponding to a composition, size, and shape of the actuator; in which the actuator is mechanically-coupled to the flat panel display at a mechanical drive point, in which a coupled resonant frequency response of the system is lower than the panel resonant frequency response of the flat panel display.

Abstract: There is provided a method of manufacturing a piezoelectric vibrator element capable of preventing the piezoelectric vibrator element from being damaged when segmentallizing the piezoelectric vibrator element. The method of manufacturing a piezoelectric vibrator element includes the steps of providing the wafer with the piezoelectric plate and a frame part adapted to support the piezoelectric plate via a connection part, providing a pair of excitation electrodes to the piezoelectric plate, and forming a pair of extending electrodes extending from the piezoelectric plate to the frame part through the connection part and electrically connected respectively to the pair of excitation electrodes, and segmentallizing the piezoelectric plate by cutting the connection part. In the step of providing the pair of excitation electrodes, the pair of extending electrodes are formed on a side surface of the connection part.

Abstract: A oscillator includes a substrate having a first surface and a second surface, a first wiring layer and a second wiring layer disposed respectively on the first and second surfaces, and a plurality of through holes electrically connecting the first and second wiring layers to each other, a resonator disposed above the first surface of the substrate, and having a resonator element, a pair of electrodes sandwiching the resonator element, and a pair of terminals adapted to electrically connect the pair of electrodes to the first electrode layer, and at least one semiconductor device disposed on the second surface of the substrate, adapted to generate an oscillation signal, and having first and second terminals electrically connected respectively to the pair of terminals of the resonator via the second wiring layer and the first wiring layer, and a third terminal supplied with a digital control signal, wherein a distance between each of the first and second terminals and the pair of terminals of the resonator is

Abstract: An apparatus for an atomic clock includes first and second distinctive substrates, each having at least a planar surface substantially parallel therebetween. The apparatus also includes a medium having particles capable of undergoing energetic transition between at least two energy levels, said medium being located in the space defined between the planar surfaces. It further includes a magnetic device arranged to the first substrate and generating at least in the volume of the medium a predetermined static magnetic field B the direction of which is substantially parallel or perpendicular to the planar surfaces and an excitation device arranged to the second substrate and generating an excitation magnetic field H at, at least an excitation frequency, the direction of said excitation magnetic field H in the volume of the medium being substantially orthogonal to said direction of the static magnetic field B.

Abstract: A piezoelectric resonator unit that includes a piezoelectric resonator, a substrate including a protruding portion, and a cap joined to the protruding portion. The piezoelectric resonator unit has a first relation of (W1+T1)?w1<(W1+2T1), where, in a long-side sectional view, w1 is a width of an inside of an opening in the cap, T1 is a width of the protruding portion, and W1 is a width of the upper surface of the substrate between parts of the protruding portion; and has a second relation of (W2+T2)?w2<(W2+2T2), where, in a short-side sectional view, w2 is a width of the inside of the opening in the cap, T2 is a width of the protruding portion, and W2 is a width of the upper surface of the substrate between parts of the protruding portion.

Abstract: A crystal oscillator package includes a crystal piece configured to vibrate in response to an electrical signal, a first vibrating part protruding from an upper surface of the crystal piece, a second vibrating part protruding from a lower surface of the crystal piece, a first exciting electrode disposed on the first vibrating part, a second exciting electrode disposed on the second vibrating part, and protrusions extending from an end portion of the lower surface of the crystal piece. The protrusions include two or more stages.

Abstract: Formation methods of a chip package are provided. The method includes bonding a first chip structure and a second chip structure over a substrate. The method also includes forming a release film to cover top surfaces of the first chip structure and the second chip structure. The method further includes forming a package layer to surround the first chip structure and the second chip structure after the formation of the release film. In addition, the method includes removing the release film such that the top surface of the first chip structure, the top surface of the second chip structure, and a top surface of the package layer are exposed.

Abstract: A microelectronic device, possibly a packaged microelectronic device, contains a magnetic sensor component and magnetizable structural features. Magnetic moments of the magnetizable structural features are aligned parallel to each other. The microelectronic device is formed by applying a magnetic field so as to align magnetic moments of the magnetizable structural features with the applied magnetic field. Application of the magnetic field is subsequently discontinued. The magnetic moments of the magnetizable structural features remain aligned parallel to each other after the applied magnetic field is discontinued.

Abstract: An electromechanical actuator includes an oscillation resonator having the shape of a rod. The oscillation resonator is divided by a dividing plane that is not parallel to the longitudinal direction of the oscillation resonator into a first resonator portion and a second resonator portion. At least the first resonator portion includes electromechanical means which, when activated, are configured to generate a 3-dimensional acoustic bulk wave are with a mode shape asymmetric with respect to the dividing plane.

Abstract: Printed circuit boards (PCBs) are configured with an athermalized mounting suitable for securing and positioning and the PCBs within an inertial measurement unit (IMU). The PCBs include integrated circuit (IC) components, such as accelerometers and/or gyroscopes, which require relative positional stability within the IMU environment in order to provide accurate results. The athermalized mounting configuration of the PCB enables the PCBs to experience thermal expansion within the IMU without causing significant displacement of the IC relative to the IMU environment.

Abstract: A resonator and/or a magnetometer has a resonating structure which is naturally resonant in at least one resonant mode, the resonating structure being significantly wider at a free end thereof than it is at a fixed end thereof, the resonating structure having at least one pair of sense electrodes disposed on opposing major surfaces of the resonating structure and having a conductive path formed as a loop, the loop being disposed near or at edges of the resonating structure so that the loop follows a path which is significantly wider at the free end of the resonating structure than it is at the fixed end of the resonating structure and wherein the at least one pair of sense electrodes are formed inwardly of the edges of the resonating structure and also inwardly of the path of the loop.

Abstract: A crystal oscillation device in which crystal unit is mounted on a package board as a package material and the package board is joined to a mounting board by conductive joining materials. Moreover, a gap is provided between the package board and the mounting board other than portions joined by the conductive joining material and the conductive joining material.

Abstract: A triple-axial force measurement sensor is disclosed in the invention. The triple-axial force measurement sensor includes a first sensing unit and a second sensing unit. The first sensing unit includes a first electrode, a plurality of second electrodes and a plurality of third electrodes. The first electrode includes an electrode main body, a plurality of first extension columns, a plurality of second extension columns, a plurality of first electrode columns and a plurality of second electrode columns. The first extension columns and the second extension columns are connected to the electrode main body. The first electrode columns are connected to the first extension columns. The second electrode columns are connected to the second extension columns.

Abstract: A piezoelectric quartz tuning fork resonator having a pair of tines formed from a common quartz plate, with a middle electrode and two outer electrodes being disposed at or on top and bottom surfaces of each of the pair of tines and interconnected such that the outer electrodes at or on the top and bottom surfaces of a first one of the pair of tines are connected in common with the middle electrodes on the top and bottom surfaces of a second one of the pair of tines and further interconnected such that the outer electrodes at or on the top and bottom surfaces of the second one of the pair of tines are connected in common with the middle electrodes on the top and bottom surfaces of the first one of the pair of tines.

Abstract: A crystal unit is provided with a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along the outer circumferential edge of the upper surface and which is provided on the lower surface of the substrate by joining joining terminals provided along the outer circumferential edge of the lower surface of the substrate and its joining pads, a crystal element which is mounted on electrode pads which are provided on the upper surface of the substrate in a region surrounded by the frame, a thermosensitive element which is mounted on connection pads which are provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: A crystal vibrating device that includes a crystal resonator mounted on a substrate by a first conductive adhesive layer and a second conductive adhesive layer, and, when the first conductive adhesive layer and the second conductive adhesive layer are viewed in a plan view, the first conductive adhesive layer and the second conductive adhesive layer each have a) a planar shape in which two circles or ellipses are partly superimposed upon each other, b) two conductive adhesive layer portions that are separated from each other, or c) a length direction and an aspect ratio, which is a ratio between a maximum size in the length direction and a maximum size in a width direction that is orthogonal to the maximum size in the length direction, is in a range of 1.5 to 3.0.

Abstract: An acoustic wave device includes: a first substrate; a first acoustic wave filter located on a first surface of the first substrate; a pad that is located on the first surface and electrically separated from the first acoustic wave filter in the first surface; a ground pattern that is located on the first surface, and is located between the pad and the first acoustic wave filter in the first surface; and a second acoustic wave filter that is electrically connected to the pad, and at least partially overlaps with the first acoustic wave filter in plan view.

Abstract: An ultrasonic wave generation apparatus that includes an ultrasonic wave generation element having an inner space formed by bonding first and second vibrators so as to close off a through-hole or a groove provided in a frame body, and a connecting member that is bonded to the second vibrator supports the ultrasonic wave generation element and is electrically connected to at least one of the first and second vibrators. A ventilation hole that opens into a first side surface of the frame body and that allows the inner space to communicate with the exterior is provided in the frame body. When a direction parallel to the first main surface or the second main surface is a lengthwise direction, an outer side end portion of the ventilation hole in the lengthwise direction and an inner side end portion in the lengthwise direction of the connecting member do not match.

Abstract: This invention prevents an adhesive portion between a piezoelectric element and a conducting member of a small vibrator from peeling off. In a vibrator, a conducting member includes at least one first adhesive portion adhered to an electrode, at least one second adhesive portion adhered to an elastic member, and a feed portion electrically connected to means for applying an external voltage. In the conducting member, a path length from the feed portion to the first adhesive portion is longer than a path length from the feed portion to the second adhesive portion.

Abstract: A multi-axis piezoelectric stress-sensing device, a multi-axis piezoelectric stress-sensing device polarization method, and a piezoelectric sensing detection system thereof are disclosed. The piezoelectric sensing detection system is used for a machining tool. The multi-axis piezoelectric stress-sensing device includes a piezoelectric sensing film, a first electrode, a second electrode, a third electrode, and a fourth electrode. The piezoelectric sensing film has four corners. The first electrode, the second electrode, the third electrode and the fourth electrode are located at the four corners of the piezoelectric sensing film, and at least one electrode is used to polarize another electrode according to at least one polarization direction.

Abstract: Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.

Abstract: A rectangular quartz crystal blank having long sides substantially parallel to a Z? axis of the quartz crystal blank, and short sides substantially parallel to an X axis of the quartz crystal blank. The quartz crystal blank includes a first center region, a second region and a third region that are adjacent to the first region along a long-side direction, and a fourth region and a fifth region that are adjacent to the first region along a short-side direction. A thickness of the second region and a thickness of the third region are smaller than the thickness of the first region, and/or a thickness of the fourth region and a thickness of the fifth region are smaller than the thickness of the first region, and 16.18?W/T?16.97, where W is a length of a short side and T is a thickness.