Abstract: A structure for magnetically shielded transmission lines for use with high speed integrated circuits having an improved signal to noise ratio, and a method for forming the same are disclosed. At least one magnetic shield structure contains electrically induced magnetic fields generated around a number of transmission lines. The shield material is made of alternating layers of magnetic material and insulating material.
Type:
Grant
Filed:
February 22, 2005
Date of Patent:
December 26, 2006
Assignee:
Micron Technology, Inc.
Inventors:
Salman Akram, Kie Y. Ahn, Leonard Forbes
Abstract: A communication system in which a reception signal can be accurately obtained from a signal transmitted over two-wire type transmission lines without any significant reduction in the communication speed. The communication system utilizing two-wire type transmission lines for transmitting transmission signals in opposite phases has a plurality of nodes connected to the two-wire type transmission lines, and each of the nodes incorporates terminating resistors acting upon the two-wire type transmission lines. A node which includes a reception circuit for receiving a transmission signal has an AC coupling circuit for extracting AC components in a transmission signal input through the transmission lines, a bias circuit for applying a bias voltage to a signal output from the AC coupling circuit and a clip circuit for clipping the level of a signal output from the bias circuit, which are provided at each of the two-wire type transmission lines.
Abstract: A plurality of signal lines are provided on one main surface of a dielectric substrate. A plurality of other signal lines are provided on the other main surface of dielectric substrate. The plurality of signal lines on one main surface and the plurality of other signal lines on the other main surface are provided so as to extend in parallel to one another. A ground pattern having its potential fixed is provided between neighboring signal lines on one main surface, and a ground pattern having its potential fixed is provided between neighboring signal lines on the other surface. According to such a structure, a microstrip line that can include a larger number of signal lines on the main surfaces of the dielectric substrate, without increasing a size of the dielectric substrate is obtained.
Abstract: A slot transmission line patch connector, capable of bridging one or more slot transmission lines is comprised of an elongated dielectric connector body. The dielectric connector body is formed to have one or more slot transmission lines. Each transmission line formed in the dielectric body has first and second ends, each of which mates with corresponding first and second slot transmission lines. Alternate embodiments contemplate a dielectric body to which is attached one or more slot transmission line substrates, each of which supports one or more slot transmission lines. Each of the slot transmission line substrates provide one or more slot transmission lines that each bridge or “patch” together two, separate slot transmission lines together.
Type:
Grant
Filed:
December 23, 2004
Date of Patent:
October 3, 2006
Assignee:
Molex Incorporated
Inventors:
David L. Brunker, Richard A. Nelson, Philip J. Dambach
Abstract: An arrangement of differential pairs in a multi-layer printed circuit board is provided for eliminating crosstalk. The arrangement of differential pairs in the multi-layer printed circuit board includes a first differential pair, and a second differential pair. The first differential pair and the second differential pair may each be a driven pair or a victim pair. By properly arranging the first differential pair and the second differential pair, in accordance with the present invention, the resultant crosstalk on the first differential pair induced by the second differential pair, or vice versa, is substantially zero or negligible.
Type:
Grant
Filed:
February 19, 2004
Date of Patent:
September 5, 2006
Assignees:
Hon Fu Jin Precision Ind. (Shenzhen) Co., Ltd., Hon Hai Percision Ind. Co., Ltd.
Abstract: A pulse modulator includes a circulator which comprises: two ferrite plates; a plurality of mode suppressors for transmitting therethrough an LSM mode electromagnetic wave while shutting off an LSE mode electromagnetic wave; and an impedance matching member mounted on one end face of each of the mode suppressors, wherein a pulse modulation switch having a Schottky barrier diode is mounted on the other end face of any one of the mode suppressors in such a manner that the direction of application of a bias voltage to the Schottky barrier diode coincides with the direction of electric field of the LSM mode electromagnetic wave, and wherein the distance from an edge of the ferrite plates to the Schottky barrier diode is set approximately equal to n?/2. Herein, n is an integer not smaller than 1, and ? is the wavelength of the high frequency signal.
Abstract: A tunable dielectric chip, and method of manufacture therefore, that comprises a dielectric substrate, the dielectric substrate patterned to a critical dimension, a metallized portion integral to the dielectric substrate, and an encapsulant covering an any portion of the dielectric substrate not covered by the metallized portion. A thin titanium layer can be deposited in between the metallized portion and the dielectric substrate to promote adhesion. The dielectric substrate can be a dielectric thick film. The thickness of the titanium can vary from 200A to 500A and the metallized portion integral to the dielectric substrate in a preferred embodiment is gold and varies in thickness from 3 um to several microns depending on the application. Further, in the present preferred embodiment, the encapsulant is a photo-definable encapsulant. The present invention also provides solder pads integral to the metallized portion enabling maximan protection from moisture and other contaminants.
Abstract: A semiconductor device with integrated circuits includes superimposed layers provided at different levels on a substrate, and including a metal strip (3) formed in a reference layer and through which an electric current passes, a metal ground plane (4) formed in a layer situated at a level lower than the reference layer and having a slit (5) which lies below the strip while running alongside it, an electrostatic shield (6) formed in a layer located at a level lower than the ground plane and comprising a multiplicity of spaced out bands (7), made of an electrically-conducting material, that extends across the slit, and conducting junctions (4a, 4b) making it possible to electrically connect the ends of each band to the parts of the ground plane situated on either side of its slit.
Abstract: An electromagnetic (EM) coupler including a first transmission structure having a first geometry, and a second transmission structure having a second geometry and forming an EM coupler with the first transmission structure, the first and second geometries being selected to reduce sensitivity of EM coupling to relative positions of the first and second transmission structures is disclosed.
Type:
Grant
Filed:
March 1, 2001
Date of Patent:
January 17, 2006
Assignee:
Intel Corporation
Inventors:
Nandu J. Marketkar, Thomas F. Knight, Jr., John R. Benham, Rajeevan Amirtharajah
Abstract: A transmission line, includes: a first input electrode located in a first level; a plurality of parallel stripe-shaped signal lines in the first level, one end of the signal lines connected to the first input electrode; a first output electrode connected to another end of the signal lines, facing to the first input electrode; a second input electrode adjacent to the first input electrode in a second level facing the first level; a plurality of stripe-shaped ground lines positioned alternately in between and at outer sides of each of the signal lines in the first level, one end of the ground lines connected to the second input electrode; and a second output electrode adjacent to the first output electrode in the second level and connected to another end of the ground lines.
Abstract: A discontinuity, such as a via, in a signal transmission line can introduce a parasitic element that affects the signal transmission. The method in accordance with embodiments of the present invention are directed to counteracting the transmission line parasitic element discontinuity. The method includes determining the amount of parasitic capacitance or inductance that is introduced at a portion of the transmission line, such as by the via. A suitable amount of delay is introduced to the transmission line by way of correction impedance in order to counteract the affects of the parasitic element. The delay is calculated taking into account at least in part the correction impedance and the parasitic element effect. The correction impedance is suitably added to a portion of the transmission line at which the parasitic element is present.
Type:
Grant
Filed:
August 3, 2004
Date of Patent:
December 27, 2005
Assignee:
Hewlett-Packard Development Company, L.P.
Abstract: A structure for magnetically shielded transmission lines for use with high speed integrated circuits having an improved signal to noise ratio, and a method for forming the same are disclosed. At least one magnetic shield structure formed by atomic layer deposition (ALD) contains electrically induced magnetic fields generated around a number of transmission lines. The shield material is made of alternating layers of magnetic material and insulating material.
Type:
Grant
Filed:
May 22, 2003
Date of Patent:
November 29, 2005
Assignee:
Micron Technology, Inc.
Inventors:
Salman Akram, Kie Y. Ahn, Leonard Forbes
Abstract: In a printed wiring board in which wiring patterns for interconnecting a plurality of integrated circuits (ICs) operating with synchronizing signals, in order to make signal transmission times between a plurality of IC's the same, consecutively formed pairs of an inductance pattern and a capacitive pattern, are constructed at each of wiring patterns for interconnecting a plurality of IC's. By changing the shapes of the inductance pattern and the capacitive pattern, it is possible to adjust signal propagation velocities and signal transmission times.
Abstract: A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
Type:
Grant
Filed:
April 23, 2003
Date of Patent:
July 5, 2005
Assignee:
Micron Technology, Inc.
Inventors:
Brad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
Abstract: A wiring structure for a transmission line has a ground line (2) and a signal line (1). The signal line (1) is disposed so as to face the ground line (2) through a dielectric (3). A surface of the signal line (1) facing the ground line (2) has a groove extending in the transmission direction. A surface of the ground line (2) facing the signal line (1) also has a groove extending in the transmission direction. The grooves restrain that electromagnetic induction is caused in the signal line (1) due to an electromagnetic field generated by other adjacent signal lines (1).
Type:
Grant
Filed:
November 16, 2001
Date of Patent:
July 5, 2005
Assignees:
Oki Electric Industry Co., Ltd., Sanyo Electric Co., Ltd., Sharp Kabushiki Kaisha, Sony Corporation, Kabushiki Kaisha Toshiba, NEC Corporation, Hitachi, Ltd., Fujitsu Limited, Matsushita Electric industrial Co., Ltd., Mitsubishi Denki Kabushiki Kaisha, Rohm Co., Ltd.
Abstract: The present invention relates to magnetic field based power transmission line communication interface controller for subscriber's terminal to receive voice, data and other kinds of electrical signals converted from acoustic wave that is conveyed over the PAN communication network, or to transmit information from the subscriber's terminal to designated destination over the PAN communication network. The interface controller of the present invention is characterized by pumping acoustic wave into the microwave within the magnetic flux envelope generated along the magnetic field based power transmission line(PAN).
Abstract: An apparatus and method is provided that reduces the propagation delay in a conductor carrying an electrical signal from a first area of a circuit to a second area of the circuit. The conductor is fabricated to include a first conductor extending from the first area to the second area. The conductor also includes a second conductor extending substantially parallel and along the first conductor and electrically connected to the first conductor. A third and additional conductors may also be used which extend substantially parallel and along the first conductor and are electrically connected to the first conductor. The additional second conductor (and any additional conductors) reduces the capacitance of the conductor thereby reducing the propagation delay in the conductor (increasing the speed of the signal). The additional conductor(s) effectively “shield” the first conductor from some capacitance that the first conductor would normally “see” without the use of such additional conductors.
Abstract: A structure for magnetically shielded transmission lines for use with high speed integrated circuits having an improved signal to noise ratio, and a method for forming the same are disclosed. At least one magnetic shield structure formed by atomic layer deposition (ALD) contains electrically induced magnetic fields generated around a number of transmission lines. The shield material is made of alternating layers of magnetic material and insulating material.
Type:
Application
Filed:
May 22, 2003
Publication date:
November 25, 2004
Inventors:
Salman Akram, Kie Y. Ahn, Leonard Forbes
Abstract: A low cross talk compensation circuit comprising a first signal pair having a first conductor and a second conductor parallel to the first conductor, and a second signal pair having a third conductor and a fourth conductor parallel to the third conductor, wherein each conductor is attached to a corresponding input signal. A first compensation line attached to the first input signal and a second compensation line attached to the third input signal are intertwined forming a first compensation line assembly with capacitive and inductive coupling parallel to and flanked by the second and third conductors. A third compensation line attached to the fourth input signal and a fourth compensation line attached to the second input signal are intertwined forming a second compensation line assembly with capacitive and inductive coupling parallel to and adjacent to the second conductor.
Abstract: A high-speed router backplane, and method for its fabrication, are disclosed. The backplane uses differential signaling trace pairs on multiple high-speed signaling layers, the high-speed signaling layers separated by ground planes. Plated signaling thru-holes connect the trace pairs to the board surface for connection to external components. The signaling thru-holes pass through clearances in each ground plane. At selected ground planes, a conductive pad is patterned within each high-speed signaling thru-hole clearance, the pad slightly larger than the thru-hole diameter. The pads affect the impedance characteristics of the thru-holes, thus providing a better impedance match to the differential trace pairs, reducing signal reflections, and improving the ability to signal across the backplane at high speeds.
Abstract: A conductive bridge in a second conductive layer may be utilized to join a pair of spaced apart conductive strips in a first conductive layer. A gap between the first and second strips may be bridged by the bridge while isolating both the first and second strips and the bridge itself from another conductor which extends through the gap between the first and second strips.
Abstract: An apparatus is provided for high frequency multiplexed electrical line communication for cable TV, telephone, internet, security and other control applications over the mid and low voltage power lines and directly through the transformers. The apparatus includes a transmitter, a receiver, a modem, a multiplexer and multiple couplers at each of two or more locations along an electrical line. The couplers have capacitive circuits serially connected with an air-core or dielectric-core transformer. The capacitive circuits resonate with the transformer at a preselected frequency. The coupler eliminates noise and is matched to the characteristic impedance of the line at the preselected frequency, which linearizes communication on the line and allows high speed data and voice communication over long distances. Multiple modulators and demodulators are used to produce multiple modulated carrier frequencies.
Abstract: The dielectric constant and loss tangent of a transmission structure is lowered by sandwiching a conductor between two dielectric structures one or both of which have a series of openings. The conductor is formed so that the conductor is formed across each opening of each dielectric structure. The dielectric structures provide structural support while exposing a significant portion of the conductor to air, thereby forming a transmission structure with an largely air-dielectric.
Abstract: A high frequency transmission cable includes one or more propagation channel sets, an inner covering wrapping the propagation channel sets and providing an effect of shield, drain wires and a jacket. Two conductors in each of the propagation channels are joined to each other tightly as a single piece to perform communication of electrical appliances in a way of the conductor pair juxtaposing and being flush with each other surely for avoiding signals transmitted in the conductors becoming not synchronous due to the conductors being in inconsistent length resulting from the cable being bent so as to enhance the frequency width of the transmission cable.
Abstract: A circuit board including a signal transmission channel includes a dielectric substrate and a signal transmission channel which may be formed on the dielectric substrate. The signal transmission channel may include a conductor, a lossy dielectric material which may longitudinally encapsulate the conductor and a conductive material which may longitudinally encapsulate the lossy dielectric.
Abstract: A discontinuity, such as a via, in a signal transmission line can introduce a parasitic element that affects the signal transmission. The method in accordance with embodiments of the present invention are directed to counteracting the transmission line parasitic element discontinuity. The method includes determining the amount of parasitic capacitance or inductance that is introduced at a portion of the transmission line, such as by the via. A suitable amount of delay is introduced to the transmission line by way of correction impedance in order to counteract the affects of the parasitic element. The delay is calculated taking into account at least in part the correction impedance and the parasitic element effect. The correction impedance is suitably added to a portion of the transmission line at which the parasitic element is present.
Type:
Grant
Filed:
October 30, 2003
Date of Patent:
September 14, 2004
Assignee:
Hewlett-Packard Development Company, L.P.
Abstract: Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and increase the bandwidth of the interconnects and also reduce the signal propagation delay, respectively. Ideally, the speed of the electrical signal on the signal line can be reached to speed of the light in the air, and the bandwidth can be reached to closer to the optical fiber. The interconnect systems consists of the signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, and the ground plan. The signal line proposed in this invention could be made any type of signal line configuration for example, microstripline, strip line or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations.
Abstract: A non-uniform transmission line includes at least one patterned conductive layer, a dielectric layer adjacent to the patterned conductive layer(s), and an insulating layer surrounding the patterned conductive layer(s) and the dielectric layer.
Type:
Grant
Filed:
May 28, 2002
Date of Patent:
August 10, 2004
Assignee:
DeCorp Americas, Inc.
Inventors:
Michael W. McCurdy, David Murray, James M. Potter, Robert J. Sexton, Linda Sue Walling
Abstract: An apparatus and method for coupling a test head and probe card in an IC testing system incorporating patterned divider elements disposed between rows of signal conductors to provide matching characteristic impedance values along each row of signal conductors. The divider elements have a patterned conductive layer formed thereon that is electrically connected to ground, and a method for determining a useful pattern is provided.
Type:
Application
Filed:
December 17, 2003
Publication date:
August 5, 2004
Inventors:
Douglas W. Smith, Thornton W. Sargent IV, Stuart F. Daniels
Abstract: A method for decreasing high-frequency attenuation effects in a flexible cable includes communicatively coupling signal-enhancing circuitry to a signal layer of the flexible cable.
Type:
Application
Filed:
February 5, 2003
Publication date:
August 5, 2004
Inventors:
Andrew H. Barr, Jeremy I. Wilson, Robert W. Dobbs
Abstract: A low cross talk compensation circuit comprising a first signal pair having a first conductor and a second conductor parallel to the first conductor, and a second signal pair having a third conductor and a fourth conductor parallel to the third conductor, wherein each conductor is attached to a corresponding input signal. A first compensation line attached to the first input signal and a second compensation line attached to the third input signal are intertwined forming a first compensation line assembly with capacitive and inductive coupling parallel to and flanked by the second and third conductors. A third compensation line attached to the fourth input signal and a fourth compensation line attached to the second input signal are intertwined forming a second compensation line assembly with capacitive and inductive coupling parallel to and adjacent to the second conductor.
Abstract: An RF converter circuit 11 that constitutes a video signal superposing/power deriving unit 100 converts video signals generated from images taken by a surveillance camera 10, which derives a direct current voltage as a driving power from an antenna lead-in wire 6 through a filter circuit (LPF circuit 12), to radio-frequency signals. The radio-frequency signals are transmitted through the antenna lead-in wire 6 to a television receiver 2. Images taken by the surveillance camera 1 can be viewed on the television receiver 2 only by selecting the channel assigned to the surveillance camera 1. Accordingly, the driving power for the surveillance camera 1 is not relied upon a solar battery or secondary batteries, and wiring work therefor may be simplified.
Abstract: A single-die multi-band switch includes a plurality of transmitter ports and a plurality of receiver ports, any one of which is selected to be connected to an antenna port. At least some of these switching topologies use a branched or cascaded switching system in order to reduce signal insertion loss. It is preferred that the individual switching elements be field effect transistors. The switching topologies employed include series-connected groups of transistors and interdigitated FETs.
Abstract: The invention generally relates to tuning arrangements and tuning components for influencing an electric field in a microwave device, in particular in a microwave communication device such a microwave circulator and isolator, comprising a tuning element having a tuning portion which co-operates with the housing of the device in an electrically non-conductive manner.
Type:
Grant
Filed:
May 1, 2002
Date of Patent:
June 15, 2004
Assignee:
Marconi Communications GmbH
Inventors:
Stephan Heisen, Siegbert Martin, Hauke Schuett, Jürgen Ebinger
Abstract: A low cross talk compensation circuit comprising a first signal pair having a first conductor and a second conductor parallel to the first conductor, and a second signal pair having a third conductor and a fourth conductor parallel to the third conductor, wherein each conductor is attached to a corresponding input signal. A first compensation line attached to the first input signal and a second compensation line attached to the third input signal are intertwined forming a first compensation line assembly with capacitive and inductive coupling parallel to and flanked by the second and third conductors. A third compensation line attached to the fourth input signal and a fourth compensation line attached to the second input signal are intertwined forming a second compensation line assembly with capacitive and inductive coupling parallel to and adjacent to the second conductor.
Abstract: A transmission line, includes: a first input electrode located in a first level; a plurality of parallel stripe-shaped signal lines in the first level, one end of the signal lines connected to the first input electrode; a first output electrode connected to another end of the signal lines, facing to the first input electrode; a second input electrode adjacent to the first input electrode in a second level facing the first level; a plurality of stripe-shaped ground lines positioned alternately in between and at outer sides of each of the signal lines in the first level, one end of the ground lines connected to the second input electrode; and a second output electrode adjacent to the first output electrode in the second level and connected to another end of the ground lines.
Abstract: A surface mount crossover component comprising first and second conductor lines electrically isolated from one another by an interposed dielectric layer and capacitively isolated from one another by an interposed ground plane layer. Current flowing through the crossover component via one of the conductor lines encounters no substantial interference from current flowing through the other one of the conductor lines.
Abstract: A system master unit is connected to a 24V AC power source. One or more slave units is connected to the master unit by a power/communication line. Bulk capacitance in the master and slave units stores power during a power source positive half cycle. When the source voltage is higher than the bulk capacitance voltages, power is delivered to the loads, during which time communication cannot take place over the power/communication line. During the power source negative half cycle, the power/communication line is disconnected from the AC power source and is then used for communication between the master and slave units. System power is delivered from the energy stored in the bulk capacitance.
Abstract: An array of carbon nanotube electron sources to make an integrated array of RF (radio frequency) sources in a single vacuum envelope. The RF sources can be printed circuit traveling wave tubes.
Type:
Grant
Filed:
June 27, 2002
Date of Patent:
March 2, 2004
Inventors:
Zvi Yaniv, Richard Fink, Robert J. Espinosa
Abstract: A coplanar stripline is provided, including a dielectric substrate, and first and second strip conductors, which are each formed on the dielectric substrate, parallel to each other and separated by a predetermined distance. The corrugated structure is formed at least on one side of the strip conductors, including a plurality of slits. The slits are formed periodically on the side of each of the strip conductors, which is located in the outside portion thereof and not facing the other confronting strip conductor, so that the length direction of the slit is substantially perpendicular to the direction of the electromagnetic wave transmitted through the coplanar stripline.
Abstract: A high frequency transmission cable includes one or more propagation channel sets, an inner covering wrapping the propagation channel sets and providing an effect of shield, drain wires and a jacket. Two conductors in each of the propagation channels are joined to each other tightly as a single piece to perform communication of electrical appliances in a way of the conductor pair juxtaposing and being flush with each other surely for avoiding signals transmitted in the conductors becoming not synchronous due to the conductors being in inconsistent length resulting from the cable being bent so as to enhance the frequency width of the transmission cable.
Abstract: A high speed switching apparatus comprises first and second parallel balanced lines each directed from an input line end to an output line end and and adapted to receive equal and opposite currents to provide balanced operation. Third and fourth parallel balanced lines are spaced apart one from the other and each directed from an input line end to an output line end and adapted to receive equal and opposite currents to provide balanced operation. A first switch is coupled between the output end of the first line and the input end of the third line, and operative in a first high impedance off state and a second low impedance on state. A second switch is coupled between the output end of the second line and the input end of the fourth line, and operative in a first high impedance off state and a second low impedance on state.
Abstract: A conductive bridge in a second conductive layer may be utilized to join a pair of spaced apart conductive strips in a first conductive layer. A gap between the first and second strips may be bridged by the bridge while isolating both the first and second strips and the bridge itself from another conductor which extends through the gap between the first and second strips.
Abstract: A method for decreasing resonance in a printed circuit board (PCB) uses cuts in a ground plane to slow a signal passing through the ground plane. Cuts in the ground plane may be used alone or in conjunction with the lengthening of signal traces. Slowing the signal passing through the ground plane enables a mismatch between the signal transit time of the ground plane and a signal oscillation period of the circuit board to be obtained. The mismatch results in decreased resonance.
Abstract: A bidirectional bus and data processing system suitable for suppressing cross talk noise are disclosed. The bidirectional bus includes, a first interconnect line driven by a pair of drivers, a first pair of impedance elements connected between the first line and a second line of the bus, and a second pair of impedance elements connected between the first line and a third line of the bus. In one embodiment, the capacitive coupling per unit length between the first line and the second line is approximately equal to k and the impedance of the first pair of impedance elements is approximately equal to (&ugr;k)−1, where &ugr; is the speed of light through a dielectric in which the first and second lines are located. In one embodiment, the impedance of the first driver is approximately equal to (&ugr;c0)−1, wherein c0 is the self-capacitance of the first line.
Type:
Grant
Filed:
November 30, 1999
Date of Patent:
December 9, 2003
Assignee:
International Business Machines Corporation
Abstract: A non-uniform transmission line includes at least one patterned conductive layer, a dielectric layer adjacent to the patterned conductive layer(s), and an insulating layer surrounding the patterned conductive layer(s) and the dielectric layer.
Type:
Application
Filed:
May 28, 2002
Publication date:
December 4, 2003
Inventors:
Michael W. McCurdy, David Murray, James M. Potter, Robert J. Sexton, Linda Sue Walling
Abstract: The invention describes the use of conductive lines having a non-rectangular shaped cross section to reduce line capacitance for a given pitch. Such conductive lines can reduce the height of integrated circuits with multi-level conductive lines without increasing line-to-line capacitance.
Abstract: A high-speed router backplane, and method for its fabrication, are disclosed. The backplane uses differential signaling trace pairs on multiple high-speed signaling layers, the high-speed signaling layers separated by ground planes. Plated signaling thru-holes connect the trace pairs to the board surface for connection to external components. The signaling thru-holes pass through clearances in each ground plane. At selected ground planes, a conductive pad is patterned within each high-speed signaling thru-hole clearance, the pad slightly larger than the thru-hole diameter. The pads affect the impedance characteristics of the thru-holes, thus providing a better impedance match to the differential trace pairs, reducing signal reflections, and improving the ability to signal across the backplane at high speeds.
Abstract: An arrangement for broadband signal and/or energy transmission, between at least two units is disclosed. Said units may be displaced relative to each other along a track. Said arrangement comprises a first unit, which has a symmetrical open circuit arrangement with at least one reflection-free closed end, within which an electromagnetic wave can propagate and at least one second unit with a coupling unit for the coupling and/or decoupling of electrical signals. The invention is characterized in that at least one of the at least one second units has a directional coupler for the coupling and/or decoupling of signals.