Abstract: An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 ?m or more.

Abstract: A capacitor structure includes first and second sets of electrodes and a plurality of line plugs. The first set of electrodes has a first electrode and a second electrode formed in a first metallization layer among a plurality of metallization layers, wherein the first electrode and the second electrode are separated by an insulation material. The second set of electrodes has a third electrode and a fourth electrode formed in a second metallization layer among the plurality of metallization layers, wherein the third electrode and the fourth electrode are separated by the insulation material. The line plugs connect the second set of electrodes to the first set of electrodes.

Abstract: Multilayer ceramic electronic component includes: a ceramic body including dielectric layers and having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first internal electrode including a capacitance forming portion having an overlap region for forming capacitance and a first lead-out portion extended from the capacitance forming portion to be exposed to the first side surface; a second internal electrode alternately stacked with the first internal electrode, having the dielectric layer interposed therebetween, insulated from the first internal electrode, and having a second lead-out portion extended from the capacitance forming portion to be exposed to the first side surface; first and second external electrodes connected to the first and second lead-out portions, respectively; an insulation layer.

Abstract: There are provided a multilayer ceramic capacitor and a manufacturing method thereof, the multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes; first and second external electrodes; and a first insulating layer.

Abstract: A multilayer ceramic electronic component to be embedded in a board includes: a ceramic body including dielectric layers; first and second internal electrodes formed in the ceramic body; and first-polarity external electrodes connected to the first internal electrodes, and second-polarity external electrodes connected to the second internal electrodes, wherein the number of the first-polarity external electrodes and the number of the second-polarity external electrodes may be two or more, the first-polarity and second-polarity external electrodes may include first-polarity and second-polarity base electrodes and first-polarity and second-polarity terminal electrodes formed on the first-polarity and second-polarity base electrodes, respectively, when L denotes a length of the ceramic body and W denotes a width thereof, W/L?0.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are laminated; a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein when it is defined that a thickness of a band of the first and second external electrodes is T1 and a thickness of the ceramic body is T2, a ratio (T1/T2) of the thickness of the band of the first or second external electrode to the thickness of the ceramic body is equal to or less than 0.18.

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes covering end portions of the ceramic body in length direction; an active layer in which the internal electrodes are disposed in opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in thickness direction, the lower cover layer thicker than the upper cover layer.

Abstract: One object is to provide a porous capacitor having increased insulation reliability. In accordance with one aspect, the porous capacitor includes: a first conductor layer and a second conductor layer opposed to each other at a predetermined distance; a dielectric layer made of an oxidized valve metal and disposed between the first conductor layer and the second conductor layer; a large number of holes formed through the dielectric layer and oriented substantially orthogonal to the first conductor layer and the second conductor layer; and first electrodes and second electrodes formed of a conductive material filled in the holes; and insulation parts insulating the first electrodes from the second conductor layer and insulating the second electrodes from the first conductor layer. The thicknesses of the first conductor layer and the second conductor layer are equal to or greater than half of the inner diameter of the holes.

Abstract: There are provided a conductive paste composition for an internal electrode, a multilayer ceramic electronic component including the same, and a method of manufacturing the same, the conductive paste composition including: a metal powder; and an additive including at least one selected from glutamic acid, amino acids, thiols, and hydrocarbons.

Abstract: A multilayer ceramic electronic component includes a hexahedral ceramic body including dielectric layers and having first and second main surfaces opposing each other in a thickness direction, first and second end surfaces opposing each other in a length direction, and first and second side surfaces opposing each other in a width direction; first and second internal electrodes stacked to have the dielectric layer interposed therebetween within the ceramic body and alternately exposed through the first and second end surfaces; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, and including first and second head parts formed on the first and second end surfaces, wherein width of the first and second head parts is less than width of the ceramic body, and when length, width and thickness of the ceramic body are defined as L, W, and T, respectively, T/W>1.0 is satisfied.

Abstract: There is provided a multilayer ceramic electronic component including a ceramic body including dielectric layers, and first and second internal electrodes formed within the ceramic body and disposed to face each other having the respective dielectric layers interposed therebetween, wherein in a cross-section of the ceramic body in a length-thickness (L-T) direction, when an area of non-electrode regions in cover part internal electrodes among the first and second internal electrodes is defined as Acover and an area of non-electrode regions in center part internal electrodes among the first and second internal electrodes is defined as Acenter, a ratio of Acenter to Acover satisfies 0.33?Acenter/Acover?0.95.

Abstract: A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.

Abstract: A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively.

Abstract: A printed wiring board includes a core substrate having a penetrating hole, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, a first electronic component having an electrode and accommodated in the hole such that the electrode faces the first surface, a first structure on the first surface and including a pad for mounting a second electronic component on the first structure and a via conductor connected to the electrode, and a second structure on the second surface. The electrode has an upper surface facing toward the first surface, the first layer has an upper surface facing away from the first surface, and the first component is positioned in the hole such that the upper surface of the electrode forms a gap with the upper surface of the first layer.

Abstract: There is provided a multilayered ceramic electronic component including: a multilayered body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on the dielectric layers so as to be alternately exposed through end surfaces; a minimum margin indicating part formed on an L-direction margin part on which the first or second internal electrode is not formed on the dielectric layer and indicating a minimum size of the L-direction margin part, the L-direction minimum margin indicating part being inserted on the ceramic sheet, whereby a multilayered ceramic electronic component having high capacitance while reducing a defect and having excellent reliability may be implemented.

Abstract: Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes a laminate which has a plurality of laminated ceramic layers and internal electrodes formed along at a plurality of specific interface between the ceramic layers and having an Al/Ti alloy as a component; and an external electrode formed on the outer surface of the laminate. The Al/Ti ratio of the Al/Ti alloy is 91/9 or more.

Abstract: Provided is a laminated ceramic electronic component having excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and internal electrodes at a plurality of specific interfaces between the ceramic layers and having an Al/Ni alloy as a component; and an external electrode formed on the outer surface of the laminate, wherein the Al/Ni ratio of the Al/Ni alloy is 85/15 or more.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having dielectric layers and first and second internal electrodes alternately stacked therein; and first and second external electrodes electrically connected to the first and second internal electrodes and formed at both ends of the ceramic body, wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof, so that the multilayer ceramic electronic component can have excellent reliability by reducing defects such as electrode spreading, cracks, delamination and the like.

Abstract: There is provided a multilayer ceramic capacitor, and a method of manufacturing the same, the multilayer ceramic capacitor including: a ceramic body; a first internal electrode; a second internal electrode; a first external electrode; a second external electrode; and an insulating layer.

Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0?t1 ?(?)t0 is satisfied, where to is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.

Abstract: There are provided a conductive paste composition for an internal electrode, a multilayer ceramic capacitor having the same, and a fabrication method thereof. The conductive paste composition for an internal electrode includes a binder, a solvent, and metal powder for an internal electrode, including a nickel particle coated with a nickel nitride.

Abstract: A multilayer ceramic electronic component includes a ceramic main body having internal electrodes laminated therein; and external electrodes formed on ends of the ceramic main body in a length direction, wherein each external electrode includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is thickness of a cover layer, Te is thickness of the internal electrode, Td is distance between neighboring internal electrodes, L1 is length from either end of the ceramic main body in the length direction in a region in which the cover layer adjoins a margin part of the ceramic main body to an end of the first layer formed on an upper or lower surface of the ceramic main body, and Lm is length of the margin part, Tc?70 ?m and L1<Lm+Tc×cot 50° are satisfied.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic main body having internal electrodes laminated therein; and external electrodes formed on both ends of the ceramic main body in a length direction thereof, wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is a thickness of a cover layer of the ceramic main body, L1 is a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, T1 is a thickness of the first layer, and T2 is a thickness of the second layer, Tc?70 ?m, T2?(1.5)T1, and L1<(1.5)Tc are satisfied, thus providing excellent reliability.

Abstract: An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.

Abstract: There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA1/CA1) of MA1 to CA1 is between 0.07 and 0.20, wherein CA1 represents an area of the multilayer body in a cross section of the multilayer body taken in a length and thickness direction, and MA1 represents an area of a first margin part in the cross section of the multilayer body taken in the length and thickness direction, the first margin part being a portion of the multilayer body, other than a first capacitance forming part thereof in which the first and second inner electrodes overlap in the thickness direction.

Abstract: There is provided a multilayered ceramic electronic component having a reduced thickness and exhibiting hermetic sealing. In multilayered ceramic electronic component, an external electrode includes two layers, that is, first and second layers, and the first and second layers contain glass with different compositions, respectively. Therefore, the multilayered ceramic electronic component having high reliability, such as strong adhesion between the external electrode and the internal electrode, prevention of glass exudation, or the like, may be obtained.

Abstract: There is provided an embedded multilayer ceramic electronic component including a ceramic body including dielectric layers, having first and second main surfaces, first and second side surfaces, and first and second end surfaces, and having a thickness of 250 ?m or less, first and second internal electrodes alternately exposed to the first or second side surface, and first and second external electrodes formed on the first and second side surfaces, wherein the first external electrode includes a first electrode layer and a first metal layer, the second external electrode includes a second electrode layer and a second metal layer, the first and second external electrodes are extended onto the first and second main surfaces, and widths of the first and second external electrodes formed on the first and second main surfaces are different from each other.

Abstract: A capacitor forming unit according to one embodiment includes a dielectric plate with a plurality of through holes; a first conductor film formed on an upper surface of the dielectric plate; a first insulator film formed on the front end portion of the upper surface of the dielectric plate; a second conductor film formed on a lower surface of the dielectric plate; a second insulator film formed on the rear end portion of the lower surface of the dielectric plate; first electrode rods disposed in some of the through holes; and second electrode rods disposed in the remaining through holes where the first electrode rods are not disposed. The first electrodes are electrically connected to the first conductor film and electrically insulated from the second conductor film. The second electrode rods are electrically connected to the second conductor film and are electrically insulated from the first conductor film.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05?A/B?0.6 is satisfied.

Abstract: A laminated ceramic capacitor having high electrostatic capacitance and excellent lifetime characteristics, even when in a high electric field intensity employs a dielectric ceramic including crystal grains and crystal grain boundaries which contains, as its main constituent, a perovskite-type compound including Ba, Ca, and Ti, and further contains Mg, R (Y, La, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and/or Yb), and Zr, such that when the laminated body is dissolved, the contents in terms of parts by mol are Ca: 3 to 15 parts by mol, Mg: 0.01 to 0.09 parts by mol, R: 2.5 to 8.4 parts by mol, and Zr: 0.05 to 3.0 parts by mol with respect to 100 parts by mol of Ti, and there is Ca at least at the centers of the crystal grains.

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

Abstract: There is provided a chip type laminated capacitor, including: a ceramic body including a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 ?m or less; first and second outer electrodes formed on both ends of the ceramic body in a length direction; first and second band parts formed to extend inwardly of the ceramic body in the length direction on a length-width (L-W) plane from the first and second outer electrodes and having different lengths; and third and fourth band parts formed to extend inwardly of the ceramic body in the length direction on a length-thickness (L-T) plane from the first and second outer electrodes and having different lengths.

Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0?t1?(?)t0 is satisfied, where t0 is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.

Abstract: A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.

Abstract: There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; and a plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surfaces of the body parts to be exposed through one surface of the ceramic element, respectively, wherein inside connection portions between the body parts and the first and second lead parts are curvedly formed, and have a curvature radius of 30 to 100 ?m.

Abstract: In a ceramic capacitor, first and second electrode terminals each include a bonded-to-substrate portion, a first bonded-to-electrode portion bonded to a first edge of one of first and second external electrodes, a second bonded-to-electrode portion bonded to a second edge of the one of first and second external electrodes and disposed at a distance from the first bonded-to-electrode portion in the first directions, and a connecting portion connecting the first and second bonded-to-electrode portions and the bonded-to-substrate portion. W1/W0 is about 0.3 or more, and h/L is about 0.1 or more.

Abstract: An interconnection component includes a first support portion has a plurality of first conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent a first surface and a second end adjacent a second surface. A second support portion has a plurality of second conductive vias extending therethrough substantially perpendicular to surfaces thereof such that each via has a first end adjacent the first surface and a second end adjacent the second surface. A redistribution layer is disposed between the second surfaces of the first and second support portions, electrically connecting at least some of the first vias with at least some of the second vias. The first and second support portions can have a coefficient of thermal expansion (“CTE”) of less than 12 parts per million per degree, Celsius (“ppm/° C.”).

Abstract: An electronic component includes a ceramic sintered body, and a plurality of first and second inner electrodes alternately arranged inside the ceramic sintered body to be opposed to each other in a third direction with a ceramic layer interposed between the adjacent first and second inner electrodes. The first and second inner electrodes are each arranged to be exposed to a third or fourth surface without being exposed to fifth and sixth surfaces. Heterogeneous regions, which include solid solutions of metals included in the first and second inner electrodes and the ceramic sintered body, are arranged continuously in opposite end portions of the ceramic sintered body in a first direction to extend from one side end to an opposite side end of a region where the first and second inner electrodes are disposed in a third direction.

Abstract: A multilayer ceramic electronic component that is small, that has high electrical strength, and that is resistant to separation between ceramic layers includes a ceramic sintered body having a substantially rectangular parallelepiped shape and a plurality of first and second internal electrodes. The plurality of first and second internal electrodes are alternately arranged so as to face each other. The first and second internal electrodes are parallel or substantially parallel to first and second major surfaces. The first and second internal electrodes are exposed to at least one of the fifth and sixth surfaces and are not exposed to the third or fourth surface. No bends exist in any of the ends of each of the first and second internal electrodes adjacent to the third and fourth surfaces.

Abstract: There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.

Abstract: There is provided an embedded multilayer ceramic electronic component, including a ceramic body including dielectric layers, first internal electrodes and second internal electrodes disposed to face each other with the dielectric layers interposed therebetween, a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes, and a conductive paste layer formed on the first external electrode and the second external electrode, wherein the first and second external electrodes include a first conductive metal and glass, and the conductive paste layers include a second conductive metal.

Abstract: A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.

Abstract: There are provided a ceramic sheet product for a ceramic electronic component, a multilayer ceramic electronic component using the same, and a method of manufacturing the multilayer ceramic electronic component. The ceramic sheet product for a ceramic electronic component includes a ceramic layer; a metal layer formed on the ceramic layer; and metal nanostructures contacting the metal layer and protruding from the metal layer to an inner portion of the ceramic layer. With the multilayer ceramic electronic component using the ceramic sheet product for a ceramic electronic component, an interval between electrodes is reduced to thereby allow for the increase of capacitance, whereby a multilayer ceramic electronic component having high capacitance may be provided.

Abstract: In an electronic component and a substrate module, a laminated body includes a first capacitor conductor and a second capacitor conductor embedded therein, which define a capacitor. First and second external electrodes are connected to the first capacitor conductor and the second capacitor conductor through extraction conductors, respectively. Third and fourth external electrodes are connected to the first capacitor conductor through extraction conductors. Fifth and sixth external electrodes are connected to the second capacitor conductor through extraction conductors. On a first side surface, no external electrode having an electrical potential different from the electrical potential of the third external electrode is provided between a first end surface and the third external electrode.

Abstract: Substrates having power planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a first power plane and a second power plane. The at least one noise suppression structure may include a first power plane extension that extends from the first power plane generally toward the second power plane, and a second power plane extension that extends from the second power plane generally toward the first power plane. Methods for suppressing noise in at least one of the first power plane and second power plane include providing such noise suppression structures between the power planes.

Abstract: A capacitor having a stem that is designed to be inserted into a single, large-diameter via hole drilled in a printed circuit board is provided, wherein the stem may have conductive rings for making the positive and negative connections to the printed circuit board power distribution planes. Inside the capacitive stem, current, or at least a portion thereof, may be carried to the main body of the capacitor through low-inductance plates that are interleaved to maximize their own mutual inductance and, therefore, minimize the connection inductance. Alternatively, the capacitor may include a coaxial stem that forms a coaxial transmission line with the anode and cathode terminals forming the inner and outer conductors.

Abstract: There are provided a ceramic electronic component and a method of manufacturing the same. The ceramic electronic component includes: a ceramic element; and an internal electrode layer formed within the ceramic element, having a thickness of 0.5 ?m or less, and including a non-electrode region formed therein, wherein an area ratio of the non-electrode region to an electrode region of the internal electrode layer, in a cross section of the internal electrode layer is between 0.1% and 10%, and the non-electrode region includes a ceramic component.

Abstract: A printed wiring board includes a capacitor including a dielectric body having a first surface and a second surface, a first electrode provided on the first surface of the dielectric body, and a second electrode provided on the second surface of the dielectric body. The first electrode has an area facing and being smaller than the first surface of the dielectric body, and the second electrode has an area facing and being larger than the second surface of the dielectric body.

Abstract: A method of manufacturing an embedded passive device for a microelectronic application comprises steps of providing a substrate (110, 210, 310), nanolithographically forming a first section (121, 221, 321) of the embedded passive device over the substrate, and nanolithographically forming subsequent sections (122, 222, 322) the embedded passive device adjacent to the first section. The resulting embedded passive device may contain features less than approximately 100 nm in size.