Abstract: A capacitor with low inductance connection terminals and having a first surface, includes a first electrode of porous metal, a dielectric layer formed on the porous metal, a second electrode formed on the dielectric layer, and a plurality of connection terminals electrically coupled to the first electrode on the first surface and a plurality of connection terminals electrically coupled to the second electrode on the first surface.

Abstract: In a laminated ceramic electronic component such as a laminated ceramic capacitor, an improvement in the electric connection between an inner conductive layer and an outer conductor formed by baking with a conductive paste is achieved. The metal powder contained in the conductive paste which is used in order to form the outer conductor has a mean diameter is below double of thickness of the conductive inner layer.

Abstract: A multilayer capacitor whose equivalent series inductance is reduced includes a capacitor main body having a generally rectangular parallelpiped shape with two principal surfaces in a face-to-face relationship with each other and four side surfaces connecting the principal surfaces. A capacitor unit is formed in the capacitor main body by a respective pair of first and second internal electrodes disposed in the main body in a face-to-face relationship with a dielectric material layer interposed therebetween. At least three first external electrodes are located on respective ones of the side surfaces of the capacitor main body, with at least one of the first external electrodes being located on each of at least three of the side surfaces. The first internal electrode has at least three first lead electrodes, each of which extends to and is electrically coupled to a respective one of the first external electrodes.

Abstract: The present invention provides an electronic component provided with the terminal electrode having a three layer structure comprising a first layer, a second layer and a third layer successively formed on each end face of the main electronic component, the second layer being a porous structure to advantageously absorb the stress caused by expansion and shrinkage of the wiring board, thereby preventing the main electronic component from suffering the stress, and the non-porous first layer maintaining good electrical continuity with the inner electrode while the non-porous third layer serving for preventing permeation of the solder liquid along with maintaining good electrical continuity to the outside, thereby preventing the ceramic component from being mechanically damaged due to expansion and shrinkage applied from the wiring board when the ceramic electronic component is packaged on the wiring board.

Abstract: A multilayer capacitor whose equivalent series inductance is reduced includes a capacitor main body having a generally rectangular parallelpiped shape with two principal surfaces in a face-to-face relationship with each other and four side surfaces connecting the principal surfaces. A capacitor unit is formed in the capacitor main body by a respective pair of first and second internal electrodes disposed in the main body in a face-to-face relationship with a dielectric material layer interposed therebetween. At least three first external electrodes are located on respective ones of the side surfaces of the capacitor main body, with at least one of the first external electrodes being located on each of at least three of the side surfaces. The first internal electrode has at least three first lead electrodes, each of which extends to and is electrically coupled to a respective one of the first external electrodes.

Abstract: A standing axial-leaded surface mount capacitor is formed of a dielectric chip capacitor sandwiched between first and second blocks. The end blocks have profiles to match the profile of said chip capacitor. The end blocks are conductive at least on their outer surfaces and serve as leads to attaching to metallic surface traces of a printed circuit. In one preferred embodiment, the end blocks are ceramic cubes with metallic surfaces on its faces. The metallized cubes give the device rotational symmetry about its long axis, so that the capacitor will have identical performance in any orientation. This feature makes it possible to automatically pick and place the device onto a circuit board. Preferably, the dielectric chip has a square profile of the same dimension as the ceramic cubes. The profile of the cubes and the chip can be 20 to 25 mils to match the width of a typical printed circuit trace. The capacitors can be of any typical value, i.e., between 0.05 and 300 pf.

Abstract: A thin-film component, for example a capacitor, a resistor and a coil, as well as combinations thereof. A substrate of an electrically insulating material (preferably glass), is provided with two U-shaped side contacts and with an electrical structure which is electrically connected to both side contacts. A flexible layer (preferably polyimide) is situated between the substrate and at least one of both legs of each of the U-shaped side contacts, which flexible layer is provided directly on the substrate surface, and in that the modules of elasticity of the material of the layer is below 50 GPa. By virtue of this measure, it is achieved that the components demonstrate a better resistance to standard bending tests. As a result, the product-failure percentage is reduced if these components are employed in flexible PCBs or in PCBs which are subjected to a vibration.

Abstract: In a mounting structure for a ceramic electronic part in which a terminal member formed of a metal plate is connected to a terminal formed on a ceramic electronic component, thermal effects caused by a substrate are to be suppressed to prevent mechanical damage to the ceramic electronic component, such as cracking. For this purpose, a length of an intermediate portion between the ceramic electronic component and the substrate, measured along the length of the terminal member, is at least 5 mm.

Abstract: Provided is a conductive paste, including a metal powder, glass frit and SiO2 dispersed in an organic vehicle in which the compounding ratio of SiO2 is in the range of 0.3 to 1.5% by weight. The conductive paste can prevent scattering of a solder plating film formed on a thick film electrode during surface mounting of a ceramic electronic part including a thick film electrode (an external electrode) which is formed by coating the ceramic electronic part with the conductive paste and baking.

Abstract: A multilayer capacitor whose equivalent series inductance is reduced includes a capacitor main body having a generally rectangular parallelpiped shape with two principal surfaces in a face-to-face relationship with each other and four side surfaces connecting the principal surfaces. A capacitor unit is formed in the capacitor main body by a respective pair of first and second internal electrodes disposed in the main body in a face-to-face relationship with a dielectric material layer interposed therebetween. At least three first external electrodes are located on respective ones of the side surfaces of the capacitor main body, with at least one of the first external electrodes being located on each of at least three of the side surfaces. The first internal electrode has at least three first lead electrodes, each of which extends to and is electrically coupled to a respective one of the first external electrodes.

Abstract: A multi-capacitor module carries vertically-oriented surface mount tantalum capacitors. The module provides at least one conductor for coupling to the, substrate capacitor terminals that are distal thereto. The module occupies less space, when mounted to a circuit board substrate, than individually mounting the bases of the surface mount capacitors to the substrate. This allows more efficient use of volume within an implantable cardiac rhythm management device, reducing its size, or alternatively, increasing its implanted longevity.

Abstract: A capacitor element having a terminal, an electric insulating material installed to cover the capacitor element, a wire connected to the terminal, and a reinforcing structure installed at the junction for connecting the terminal and the wire. In this constitution, the junction of the terminals and wires maintains mechanical strength and electrical insulation and is enhanced in reliability for a long period against mechanical stress or vibration to the capacitor from outside. Still more, invasion of moisture or dust into the capacitor can be prevented. As a result, the life of the excellent mechanical strength and electrical insulation is enhanced, and the capacitor having a stable reliability for a long time may be obtained.

Abstract: A high voltage ceramic capacitor includes a capacitor device, which is connected to a pair of metal terminals and which is housed in a ceramic housing. A first resin layer and a second resin layer separated by a space in the connecting direction of the two metal terminals are arranged such that the capacitor device and the contact portions between the capacitor device and the metal terminals are sealed airtight.

Abstract: A projection 23 is formed on a connecting terminal part 22 opposing to a side surface 16 of a ceramic electronic component main body 12 in a terminal member 19 by processing the metal plate which provides this terminal member 19. This projection 23 is made to project toward the side surface 16 of the ceramic electronic component main body 12. The interval more than the predetermined dimension is reliably formed between the connecting terminal part 22 and the side surface 16 of the ceramic electronic component main body 12 by the projection 23. This prevents the solder from reaching even to the ceramic electronic component main body 12.