Abstract: A heat-dissipating assembly of a computer housing with airways includes a casing. The casing is provided with a first partition and a second partition thereon. The first partition has a recessed space. The first partition is provided thereon with a plurality of penetrating troughs. The second partition is provided with a plurality of air-introducing ports thereon. The positions of the air-introducing ports and the positions of the penetrating troughs of the first partition are staggered respectively. Finally, the back and top of the casing are provided at least one fan respectively. Via this arrangement, after the external air enters the recessed space through the plurality of air-introducing ports, the external air is drawn into the casing by the fan on the first partition to perform an air-cooling effect and the heat dissipation. Finally, the air is drawn out of the casing by the fans provided on the top and back of the casing.

Abstract: A fluidic cooling assembly for removing heat from electrical equipment includes operational diversity features in which multiple fluid moving devices are mounted in a single housing. The assembly may include a first fluid baffle and a second fluid baffle disposed within the housing so as to define a first and a second control compartment. A first fan and a second fan may be disposed within the first control compartment and the second control compartment, respectively. A first sensor and a second sensor may be configured to sense changes in operation of the first fluid moving device and the second fluid moving device, respectively; and a controller unit configured for receiving signals generated by the first sensor and the second sensor go as to the transmit control signals to the first fan and the second fan.

Abstract: The present invention relates to an electric radiating pipe capable of enhancing a heating efficiency in such a manner that a mixture of a porous operation medium and a volatile operation fluid is filled in a radiation pipe, and a porous operation medium is fast heated based on a viscosity difference, and a densely filled operation fluid is phase-changed to a high temperature vapor or a high temperature liquid based on a heated operation medium. In a radiating pipe that includes a certain shaped pipe body, and a heat wire passing through to the interior of the pipe body wherein both ends of the pipe body are sealed by a plugging cap, there is provided an electric radiating pipe that includes a porous non-flammable operation medium and volatile operation fluid being mixed and being filled into the interior of the pipe body.

Abstract: An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.

Abstract: An electronics cooling fan comprises a centrifugal clutch adapted to disengage and freewheel upon fan failure.

Abstract: A rack structure which is capable of improving heat-dissipating efficiency thereof within a limited space, and a communication apparatus which is capable of enhancing cooling efficiency by applying the rack structure thereto. In the rack structure of the communication apparatus, the air used for cooling printed circuit boards within a lower shelf and thereby increased in temperature is cooled by causing the same to flow through the heat-dissipating duct on a lateral side and is then used again for cooling printed circuit boards within an upper shelf. This makes it possible to increase the heat-dissipating efficiency of the communication apparatus to thereby improve the cooling performance thereof. As a consequence, the necessity of increasing the number of cooling fans or increasing the size of fans becomes small, and the cooling performance of the communication apparatus can be maintained within a limited installation space.

Abstract: A air shroud installed on a circuit board is composed of a circuit board which is installed with an outer housing, an inner surface of which is connected with at least more than one fan, and a side of which is provided with an air exit. The fan is provided with an air entrance and an air exit, wherein the air exit is corresponding to the air exit of outer housing. Air sucked in by the air entrance of fan is expelled out of the air exit of outer housing to be exported, through the air exit of fan, such that the air can be led to another space area or be used to dissipate heat from a specific electronic component.

Abstract: In one embodiment, an air guiding plate is attached to an enclosure with a plurality of vents defined therein. The air guiding plate includes a plurality of guiding holes defined therein. Each of the guiding holes is surrounded by a plurality of walls and includes an inlet with a large size, and an outlet with a small size. The outlets are in alignment with the vents of the enclosure. A size in cross section of each of the walls gradually decreases along a direction from the inlet to the outlet.

Abstract: A heat dissipation module is disclosed. A first heat dissipation apparatus and a second heat dissipation apparatus are symmetrically disposed. A flow direction controlling structure has a rotatable element disposed between the first and second heat dissipation apparatuses and formed an isolation wall thereof, so that the first and second heat dissipation apparatuses respectively have a tunnel. Each of the rotatable elements has a fixed end and a correspondingly movable end for guiding air flow. When outlet pressures of the first and second heat dissipation apparatuses are different, the movable end deflects to the first heat dissipation apparatus or the second heat dissipation apparatus to change outlet areas thereof. The heat dissipation module and the flow direction controlling structure control air flow and prevent backflow, so as to maintain overall outlet area and improve heat dissipation effect of the module.

Abstract: A dissipator for discharging heat from electronic components, the electronic components being intended for the functioning of a rotary electrical machine, the rotary electrical machine comprising a rear bearing, the dissipator comprising a top face and a bottom face integrating fins, wherein the dissipator is disposed between the rear bearing of the rotary electric machine and the electronic components, the bottom face integrating the fins coming opposite the rear bearing when the dissipator is disposed between the rear bearing of the rotary electrical machine and the electronic components.

Abstract: The invention involves systems to channel the air available for cooling inside the chassis of the computing device to force the air into selected channels in the memory bank (i.e., between the modules rather than around the modules or some other path of least resistance). This tunneled cooling (or collimated cooling) is made possible by using a set of baffles (or apertures) placed upstream of and between the cooling air supply and the memory bank area to force air to go only through the rectangular space available between adjacent modules in the memory bank of the high speed computing machines (super computers or blade servers in these cases). In some instances, it may be desirable to include both a blower fan, for forcing cool air through the baffles and through the heat exchanger(s) aligned with openings in the baffles, and a suction fan to draw or pull air as it exits the rear of the blade server chassis.

Abstract: A cooling fan device for a computer including a fan device having a primary housing and a side housing. A computer casing a side walls having an area with air permeable holes, right positioning slots, and a left positioning slot. Projection parts of the primary housing are latched into the right positioning slots, and a flange part on a press plate is latched into the left positioning slot, such that the fan device can be quickly assembled on or disassembled from the computer casing without using screws.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: An air shroud apparatus includes a base wall. A plurality of support walls extend from the base wall in a spaced apart orientation from each other. A component housing is defined between the support walls and the base wall. A reinforced section is located on the base wall and includes a reinforcing beam extending between the plurality of support walls and a plurality of reinforcing members extending between the base wall and the reinforcing beam and located in a spaced apart orientation between the plurality of support walls such that a plurality of air passageways are defined between the reinforcing beam and the reinforcing members. The air shroud may be coupled to an information handling system chassis in order to direct airflow from a fan in the chassis to components in the chassis.

Abstract: A mount module for an inverter includes a housing element with a recess being open to the front face, for holding a single inverter. The upper face and the lower face of the housing element are complementary to one another, and/or the right side and the left side of the housing element are complementary to one another, and/or the rear face of the housing element is complementary to itself. The respective side or sides and face or faces of the housing element each have at least one connection device. A relatively large number of the mount modules can be disposed one above the other, alongside one another, and/or with their rear faces against one another and can be connected to one another in order, for example, to form a central inverter unit for large photovoltaic installations.

Abstract: An electronic device cooling system, comprising an electronic device comprising a plurality of housing walls and at least one duct wall extending between at least one of the housing walls and a circuit board disposed within the electronic device to form a duct to enable cooling air to flow within the duct to dissipate heat from within the electronic device.

Abstract: A cooling system in accordance with a preferred embodiment of the invention includes a chassis, a fan mounted in the chassis, a memory, and an air conducting cover, wherein the air conducting cover comprises two sidewalls mounted in the chassis, and a top wall connecting tops of the two sidewalls, the two sidewalls and the top wall cooperatively form an airflow channel, and the memory is in the airflow channel. Because the airflow channel is narrow, a more efficient airflow speed is achieved in the airflow channel. Thus, the cooling system effectively dissipates heat without encroaching on much needed space.

Abstract: A server including a cooling fan assembly and an input/output assembly at opposite ends of the server, and a processor assembly located between the cooling fan assembly and input/output assembly. The server also includes a cover plate that covers the processor assembly and cooling fan assembly and that has a power supply on the face of the cover plate facing the processor assembly and is electrically connected to the processor assembly.

Abstract: An electrostatic chuck includes; a base made of ceramics, in which an electrode generating electrostatic attractive force is embedded; a cooling member which contains metal; a bonding material which bonds the base and the cooling member to each other; a gas providing passage which penetrates the base, the bonding material, and the cooling member; and an engagement member and a bolt member, which are fixing members mechanically fixing the base and the cooling member to each other.

Abstract: An air directing apparatus includes a first air directing member defining a component access passageway. A second air directing member is moveably coupled to the first air directing member, whereby the second air directing member is moveable relative to the first air directing member into a first position and a second position, wherein with the second air directing member in the first position the component access passageway is substantially obstructed and with the second air directing member in the second position the component access passageway is substantially unobstructed.

Abstract: A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

Abstract: An improved air flow management has an air control device for blocking air from low impedance airflow pathways without high thermal components and directing the air flow initially at specific components with high thermal loading. Other components are cooled by the air as it passes from the high thermal loading component to exit from the unit. The air control device directs the air flow by locating and sizing apertures in the air control device based on the location and thermal load of the components on the printed circuit board. Accordingly, the unit can require less air flow through the unit and smaller or no heat sinks than conventional methods.

Abstract: An information handling system (‘IHS’) cooling apparatus includes a blank base comprising a pair of opposing ends. A connector engagement member extends from each opposing end of the blank base. A notch is defined by the blank base and located on each opposing end of the blank base. A contacts channel is defined by the blank base and the connector engagement members and extends between the opposing ends of the blank base. The IHS cooling apparatus may be secured in an IHS connector in order to direct airflow over memory devices secured in adjacent IHS connectors.

Abstract: A heat dissipation device adapted for cooling a heat-generating electronic component includes a heat sink (30), a fan (40) mounted on the heat sink (30), a fan duct (70) mounted on the fan (40) and a clip (50) securing the fan duct (70) on the fan (40). The fan (40) is sandwiched between a top of the heat sink (30) and a bottom of the fan duct (70). The clip (70) includes an axis (51) pivotably mounted on to a bottom of the fan duct (70), a locking portion (52) extending from an end of the axis (51) and buckled with the fan duct (70), and a pressing portion (53) bent from the axis (51) and engaging with a bottom surface of the top plate (42) of the fan (40).

Abstract: A hybrid cooling system and method of fabrication are provided for a multi-component electronics system. The cooling system includes an air moving device for establishing air flow across at least one primary and at least one secondary heat generating component to be cooled; and a liquid-based cooling subsystem including at least one cold plate, physically coupled to the at least one primary heat generating component, and a thermally conductive coolant-carrying tube in fluid communication with the at least one cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and includes a plurality of thermally conductive fins extending from a surface thereof. The plurality of thermally conductive fins are disposed at least partially over the at least one secondary heat generating component to be cooled, and provide supplemental cooling of at least a portion of the air flow established across the multiple components of the electronics system.

Abstract: An apparatus for concealing a light emitting video display mounted to a vertical surface by reflecting incident ambient light in mirror-like fashion. The apparatus includes a perimeter structure, which is positioned adjacent to the vertical surface about the video display. The perimeter structure has a front opening for enabling visual access to the video display. A beam-split film is disposed within the front opening, and has the characteristics of partial transmission of the light emitted by the video display and partial reflection of the incident ambient light. A fan is disposed to circulate air adjacent to the video display, and a light baffle is disposed about the perimeter structure for enabling circulation of ambient air through the perimeter structure while preventing the transmission of ambient light into the perimeter structure.

Abstract: A system of at least one integrated electronic board device with integral cooling system. The device comprises an integrated electronic board, with a plurality of heat-dissipating electronic components distributed over it, with heat-exchanging devices coupled to the heat-dissipating electronic components, and a plurality of slots provided adjacent each of the plurality of heat-dissipating electronic components. Each slot fluidically communicates with a heat-exchanging device. An adjoining cover defining, with the integrated electronic board, a cavity for providing an integral reservoir between the slots and at least one port that may be connected to a flow generator for generating a flow of a fluidic coolant through said at least one of a plurality of heat-exchanging devices.

Abstract: An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.

Abstract: An airflow-guiding device (40) is secured at one side of a row of fans (20) in a computer chassis (10) and is capable of allowing air to flow therethrough in one direction only. The airflow-guiding device includes a bracket (42) and a plurality of shielding plates (44). The bracket is secured in the chassis and defines a plurality of guideways (428) therein. The shielding plates are pivotably secured in the guideways with shafts (442) thereof, respectively. The shaft of each of the shielding plates separates the corresponding plate into two portions. One of the two portions is larger and weightier than the other of the two portions.

Abstract: A cabinet includes a front panel, a rear panel defining a plurality of vent ports, and a top wall defining a plurality of apertures therein adjacent to the front panel. A rack having a plurality of shelves is mounted in the cabinet for holding electronic devices. At least one intake fan is installed on a top portion of the cabinet below the apertures of the top wall, and at least one exhaust fan installed on a bottom portion of the cabinet adjacent to the rear panel. The intake fan directs airflow downward into the cabinet for cooling the electronic devices. The exhaust fan directs airflow heated-exchanged with the electronic devices out of the cabinet via the vent ports of the rear panel.

Abstract: A heat-dissipating device and a housing thereof. The housing includes a passage for guiding an air stream flowing from an opening to another opening, wherein an sidewall of the passage at least one of the opening sides extends radially outwards with a rotational axis of the heat-dissipating device or the passage so as to enlarge intake or discharge area for the air streams. Accordingly, the intake airflow rate may be greatly increased and the heat-dissipating efficiency of the heat-dissipating device may be greatly enhanced without changing assembling conditions with other elements.

Abstract: A system and method are disclosed for enclosing electronic equipment in a noiseproofed and ventilated enclosure. This includes supplying air to an enclosure and removing air from the enclosure through acoustic chambers attached to the enclosure. The acoustic chambers can be constructed of materials or be treated with materials that have noise-absorbing or noise-abating properties. In addition, the acoustic chamber for exhausting air from the enclosure can contain baffles that help to prevent noise that has entered the acoustic chamber from leaving the chamber. And, the system and method can use a cable egress port that allows cables and wiring to pass through the egress port while blocking the transmission of noise through the egress port.

Abstract: A heat sink is provided that makes air velocity between cooling fins uniform in order to improve heat dissipation performance, thereby realizing a reduction in weight and achieving high cost performance. Distal ends of fins disposed substantially in front of a cooling fan are located on the uppermost stream side in the flowing direction of cooling air, and distal ends of fins on both sides in the width direction of the heat sink are located on the lowermost stream side. Each of the fins is preferably provided with a slope so that the height of the fin gradually increases from the distal end thereof in a direction from the upstream side to the downstream side in the flowing direction of cooling air.

Abstract: In one embodiment, an airflow regulation device comprises a at least one base member configured to couple to a connector on a circuit board, a first segment connected to the at least one base member and extending a first height from the at least one base member, and a second segment removably connected to the first segment and extending a second height from the at least one base member, wherein the second height is different than the first height.

Abstract: A system and method are disclosed for enclosing electronic equipment in a noiseproofed and ventilated enclosure. This includes supplying air to an enclosure and removing air from the enclosure through acoustic chambers attached to the enclosure. The acoustic chambers can be constructed of materials or be treated with materials that have noise-absorbing or noise-abating properties. In addition, the acoustic chamber for exhausting air from the enclosure can contain baffles that help to prevent noise that has entered the acoustic chamber from leaving the chamber. And, the system and method can use a cable egress port that allows cables and wiring to pass through the egress port while blocking the transmission of noise through the egress port.

Abstract: EMI from an operating information handling system is managed by disposing a stirring device in the chassis of the information handling system to mechanically modulate the resonance of predetermined RF signals emitted from processing components within the chassis. For example, a cooling fan disposed in the chassis has a reflective surface formed on its blades so that rotation of the blades mechanically modulates the RF signals. The blades have a depth of at least one-quarter of the wavelength of the RF signal and are coated with a low resistance material, such as steel, aluminum, copper, carbon loaded plastic or a high dielectric ceramic. The fan rotates at the faster of the speed required to provide desired cooling or the speed desired to produce a desired average RF signal amplitude.

Abstract: An electric connection box according to the present invention can include a circuit board having a first surface capable of mounting an electronic component, and a second surface defining a non-mounting surface, a case vertically housing the circuit board, an air ventilation path extending between the non-mounting surface of the circuit board and an inner wall surface of the case by opposing the non-mounting surface of the circuit board to the inner wall surface in the case, a suction port positioned in the case and in communication with the ventilation path, an exhaust port positioned in the case above said suction port and in communication with the ventilation path, and a heat generating component in communication with the ventilation path.

Abstract: A switch chassis includes a plane having pass-through vias. An array of connector pairs is provided. A connector pair includes a first multi-path connector on first side of the plane and a second multi-path connector on the second side of the plane interconnected through the pass-through vias in the plane. Fabric cards can be connected to respective columns of first connectors and line cards can be connected respective rows of second connectors of the connector pairs to orient the fabric and lines cards orthogonally with respect to each other.

Abstract: A flat display device includes a flat display module, a front cover supporting a front portion of the flat display module, a back cover supporting a rear portion of the flat display module, a peripheral portion formed on the back cover and having an inclined surface inclined toward a center of the flat display module as it goes rearward, and a cross-flow fan disposed in the back cover and aligned with the inclined surface of the peripheral portion of the back cover. The cross-flow fan has an air exhaust channel having an air outlet inclined toward the center of the flat display module as it goes rearward.

Abstract: A system for cooling a data center includes a plurality of cooling racks, with each cooling rack including a housing and cooling system components supported by the housing. The system further includes a fluid communication system coupled to the cooling system components of the plurality of racks. The fluid communication system is configured to provide chilled coolant to and exhaust heated coolant from coolant system components of each cooling rack. The system also includes at least one controller coupled to each cooling rack of the plurality of cooling racks to control the operation of each cooling rack. The plurality of cooling racks and the fluid communication system are configured to be modular to allow placement of cooling racks in different locations in a row of equipment racks within the data center. Methods of cooling a data center are further disclosed.

Abstract: A heat spreader with a filtering function is set in a case of an electrical apparatus. The heat spreader includes a heat sink set and a filter unit. The heat sink set is set in the case. The filter unit is set in the case and is adjacent to the heat sink set. In addition, an electrical apparatus includes a case and a filter unit, and a heat spreader is set in the electrical apparatus. The filter unit is set in the case and is adjacent to the heat spreader.

Abstract: Flow conditioners for use with air inlets on computer cabinets are disclosed herein. In one embodiment, a large computer system includes a plurality of computer cabinets arranged in close proximity to each other. Each of the computer cabinets can include a fan, impellor, or other air mover positioned proximate to an inlet that receives cooling air from a plenum, such as a floor plenum. In this embodiment, a flow conditioner configured in accordance with the present invention can be positioned proximate to the air inlet. The flow conditioner can include a vortex diffuser and a flow-speed normalizer. The flow-speed normalizer can include a perforated screen that forms a cylinder around the inlet, and the vortex diffuser can include one or more vanes that extend across the cylinder adjacent to the inlet.

Abstract: Electronic equipment includes a chassis that compose a case, a first printed circuit board, an MPU and a memory both of which are mounted in the case and consume high power, and a cooling fan for taking in air from the outside into the inside of the case. The cooling fan supplies an air current to the MPU and the memory to cool them. The electronic equipment also includes a wind direction control board between the cooling fan and the MPU and the memory to partition the inside of the case into at least two subspaces. The wind direction control board has an opening at a position opposed to the MPU and the memory.

Abstract: A device for cooling an electronics unit, in particular a control electronics unit of a hand-held power tool, has an air-conducting device that directs at least a portion of an air stream exiting an electric motor to the electronic unit, while a method for cooling includes directing an air stream exiting the electric motor to the electronics unit.

Abstract: Embodiments of the present invention recite an electronic device comprising a chassis, a backplane, at least one heat generating component coupled with the backplane, and a fan. In embodiments of the present invention, the chassis comprises at least one air inlet disposed on a side of the chassis and at least one exhaust outlet disposed on the bottom surface of the chassis. The heat generating component is suspended from said backplane when coupled therewith and is disposed above the at least one exhaust outlet. The fan draws cooling air through the at least one air inlet and expels the cooling air through the at least one exhaust outlet.

Abstract: A multi-processor system has a tubelike computer module including plural mother boards configured onto plural side walls of a rack body to form a unitary, continuous and non-segment airflow channel. The airflow channel of the tubelike computer module has larger space and fewer barriers to allow the airflow passing through smoothly, and to reduce wind noises or turbulences. Therefore, the system achieves optimum heat-dissipation efficiency and noise reduction by means of specific space arrangement and less cooling system requirement.

Abstract: A power supply unit (PSU) has walls which define an internal volume of the PSU. A metal sheet forming left and right side walls and an upper wall is provided with plural perforations on each of those walls. The perforations are circular in shape, and formed in a regular grid pattern. The perforations are formed by punching the metal sheet before it is bent into shape. The perforations in the housing of the PSU allow hotspots to be carried through the walls of the housing of the PSU, following which the hotspots are unable to damage internal components of the PSU. This allows the use of reduced flow rate fans.

Abstract: The fire block module includes a number of rectangular plate strips, arranged vertically and parallel to each other to form a grid layer. The grid layer is arranged horizontally in respect of the vertical direction of flame propagation occurring in the event of a fire, thus achieving good heat energy dissipation and preventing flame propagation.

Abstract: Disclosed is a dynamic air moving system comprising a rail system disposed in an electronic enclosure, at least one fan housing moveably disposed on the rail system, the fan being actuatable along the rail system, a pivotable fan disposed in each of the at least one fan housings, at least one blade included with the fan, the at least one blade being rotatable about at least one blade axes, a fan controller chip controlling actuation of at least one fan housing, individual rotation of at least one blade, and rotation of the fan, a chip thermal sensor disposed on at least one chip located in the electronic enclosure, the thermal sensor being linked to the fan controller chip, and a drive thermal sensor disposed on at least one disk drive associated with the electronic enclosure, the drive thermal sensor being linked to the fan controller chip.

Abstract: An assembly and a heat-dissipating device having the same assembly are provided, in that tapped holes in fans of the heat-dissipating device are used with at least two columnar first fixing parts for mounting or detaching the heat-dissipating device with the need for extra tools. Accordingly, problems in the prior art may be solved.