Abstract: A thermal management system (201) is provided herein which comprises a plurality of heat sources (203), a heat exchanger (205), a plurality of heat pipes (207) in thermal communication with said heat exchanger, and a synthetic jet actuator (211) adapted to direct a synthetic jet upon or across a surface of said heat exchanger.

Abstract: An electronic apparatus includes a circuit board, circuit elements mounted on the circuit board, and a cooling structure for cooling the circuit elements. The circuit elements include a heat generating element. The cooling structure includes a heat spreader, cooling fins integrally formed with the heat spreader, an air inlet, an air outlet, and a fan device for generating cooling air flowing from the air inlet to the air outlet. The heat spreader is placed above the circuit board and thermally joined to the heat generating element mounted on the circuit board. The cooling fins extend toward the circuit board to provide a plurality of air passages between the circuit board and the heat spreader. The air inlet and outlet communicate with each other through the air passages.

Abstract: An assembly for extracting heat from a housing for electronic equipment, the housing having a front, a back, two sides and a top. The assembly is defined by a back for the housing that defines an open area proximate the top, and an air passageway in fluid communication with the open area in the back, to conduct heated air exiting the housing through the open area away from the housing.

Abstract: A fan mounting assembly for securing a fan having a bottom wall, includes a computer chassis and a securing member. The computer chassis forms a first limiting member and a pair of second limiting members. The first limiting member is for restricting a horizontal and vertical movement of the fan. The second limiting members are respectively formed at opposite sides of the computer chassis, different to the first limiting member, for restricting lateral movement of the fan. The first limiting member and second limiting members together forms a housing for accommodating the fan. The securing member is resiliently attached to the computer chassis, for securing the fan in the housing.

Abstract: An exemplary heat dissipation device is provided for removing heat from a first electronic element and a second electronic element attached to a circuit board. The first electronic element is arranged at a side of the second electronic element. The heat dissipation device includes a heat sink attached to the CPU, a fan attached to the heat sink, and an air guide member attached to the second electronic element. The air guide member includes a guiding portion to guide air from the fan to the second electronic element.

Abstract: The present invention provides an illuminating device and heat-dissipating structure thereof. The heat-dissipating structure includes a plurality of heat-dissipating units stacked together. Each heat-dissipating unit includes a cone-like portion with an opening and a plurality of protrusions connected to the cone-like portion, wherein at least one of the protrusions of one heat-dissipating unit is coupled to that of the adjacent heat-dissipating unit to form one or more zonal planes for allowing a light source to be disposed thereon to constitute the illuminating device, and the openings of the heat-dissipating units are liked together to form an airflow passage.

Abstract: Preferred embodiments provide a cooling system for an electronic display. A constricted convection channel is used to force cooling air against a posterior surface of the electronic display. Fans may be used to propel or pull air through the constricted convection channel in a substantially uniform manner. A refrigeration unit or thermoelectric module may be employed to cool or heat the air traveling through the constricted convection channel. Some embodiments include a closed loop which extracts heat (or adds heat) to the front display surface.

Abstract: Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.

Abstract: In the disk array system, in the basic chassis, HDD modules are installed from a front surface in a front part of a backboard, and duplex CTL modules are installed up and down from a rear surface in a rear part, and duplex power source modules containing fans are installed in the left and right sides thereof. By the operation of the fans, in the rear part, the cooling air flows separately into each CTL module and into each power source module, and the cooling air having passed through the area of the duct by a block in the CTL module is drawn by the fans in the power source module through a ventilation hole and is then exhausted outside. The cooling air flow path to the plurality of ICs is divided by the block. The rotation speed of the fans is controlled by using a temperature sensor.

Abstract: A cooling fan mounting structure for a flat display displaying an image on a screen based on a video signal is disclosed. The structure includes a chassis bracket attached to a rear of the display, and a type of fan holder to which the cooling is attached. The fan holder has an end with an insertion hole located in alignment with a screw hole and through which a screw is inserted to be fixed when the chassis bracket is attached, a positioning convex portion fitted into a positioning hole positioning the chassis bracket, and a locking claw bent into such a crank shape that the locking claw has a step located lower by a thickness of the chassis bracket and extends from the step, the positioning convex portion being inserted into the rectangle hole to be locked.

Abstract: A device adapted to optimize air duct flow in an electronic system including a printed circuit board configured to support one or more electronic components having various heights. The device includes an air duct including a rigid cross-sectional member, the air duct being adapted to facilitate air flow from an inlet port to an outlet port. Further, the rigid cross-sectional member includes an opening having an interior perimeter, the interior perimeter of the opening being attached to a flexible sheet by a pressure sensitive adhesive. The rigid cross-sectional member attached to the flexible sheet is adapted to compress one or more electronic components to the printed circuit board when the rigid cross-sectional member is mounted on the printed circuit board, and is configured to form an airtight enclosure to optimize air duct flow.

Abstract: An electronic assembly includes a casing (10) of an electronic product, and a thermal module disposed in the casing. The casing has a sidewall (102) defining a plurality of slots (1011) therein. The thermal module includes a centrifugal blower (50), a fin assembly (40) and a plurality of sub-fins (701). The centrifugal blower defines an air outlet (502) therein. The fin assembly is disposed at the air outlet of the centrifugal blower and includes a plurality of fins (401) and has a plurality of air passages (402) formed between adjacent fins. The sub-fins are located between the fin assembly and the sidewall of the casing, and forming a plurality of air channels (702) therebetween. The air channels of the sub-fins communicate the air passages of the fin assembly with the slots of the sidewall of the casing.

Abstract: A power supply apparatus for use with a redundant power supply system includes a casing, a main circuit board and an airflow driving device. The casing includes a first airflow opening and a second airflow opening. The main circuit board is disposed within the casing and includes plural electronic components thereon. The airflow driving device is disposed in the middle region of the main circuit board. A cooling air is pumped by the airflow driving device to be introduced into the inner portion of the casing through one of the first airflow opening and the second airflow opening, then the heat generated from the electronic components is removed by the cooling air, and finally a heated air is exhausted through the other one of the first airflow opening and the second airflow opening.

Abstract: A pyramidal case for computer, with a square base includes a support on a box, with a rectangular rear section and a trapezoidal front section, which dissipates the heat with greater efficiency and effectiveness, through obliged paths of the air flows which amplify the natural thermodynamics of the warm air masses. The study and the coercion of the air flows, applied to this invention, allow a greater dissipation of the heat with respect to any other existing case, which bases the cooling on directional air flows towards each component, but that inside the case itself, become chaotic and poorly efficient in the management of the whole generated heat.

Abstract: A chassis assembly for an electronic device such as a storage device. The assembly includes a chassis for housing various functional components included in the electronic device. A sub-housing for containing a waste heat generating device, a device which requires temperature moderation, is included. The sub-housing defines a first airflow exhaust path for exhausting air in a first direction and a second airflow exhaust path for exhausting air in a second direction. The directing of airflow from the sub-housing is based on a chassis enclosure configuration such as to allow for the implementation of a common component including a component enclosure in a variety of chassis form factors.

Abstract: A computer casing includes a casing body and a housing covered onto the exterior of the casing body. The casing body constitutes a support framework of the computer casing and includes a sidewall disposed on an internal side of the casing body of the computer casing for erecting a computer panel. The sidewall includes a fan aligning portion having a plurality of ventilation holes. The fan aligning portion is disposed on the computer panel and at a position corresponding to the backside of a central processing unit (CPU) for installing a fan to assist the heat dissipation of the CPU.

Abstract: The invention relates to an electronic device operating in difficult environments. The electronic device comprises at least one printed circuit board supporting heat-dissipating electronic components, a heat sink, a first side of which is in contact with electronic components on a first side of the printed circuit board, and a second side of which is designed to evacuate heat by convection, characterized in that it also comprises a cover delimiting a channel in which a coolant circulates to ensure convection, the cover being joined to the heat sink and the printed circuit board, and in that the channel prevents the coolant from coming into contact with the electronic components.

Abstract: A heat sink that radiates n exoergic circuit elements mounted on a circuit board includes a housing that has a heat-receiving surface that receives heat from the n exoergic circuit elements, and n+2 fixture parts to each of which a fixture member is attachable, each fixture member compressively fixing the housing onto the circuit board, wherein n is equal to or greater than 2, the heat sink is used to commonly radiate the n exoergic circuit elements, and a line that connects two fixture members to each other among n+2 fixture members passes between two centers of gravity of two adjacent exoergic circuit elements.

Abstract: The present invention provides an airflow conducting structure for an electronic device having a base and a control box. The control box is inserted in and mounted on the base, and a first connection section is disposed in a grooved top of the base. The control box has a box body, a heat generating source disposed in the box body, and a second connection section disposed on the bottom of the box body for being connected to the first connection section. The airflow conducting structure includes airflow inlets and airflow outlets that are respectively disposed on the base and the control box, so as to form a chimney-like airway. Therefore, a better heat dissipating efficiency is achieved without increasing the volume of the electronic device.

Abstract: A heat dissipation device is disposed in an electronic device and performs thermal exchange with an electronic component of the electronic device. The heat dissipation device includes a heat sink and a plurality of fluttering slices. The heat sink is attached on the electronic component to conduct the thermal energy of the electronic component. The fluttering slices are disposed on the heat sink, and the fluttering slices are actuated to generate an airflow when the electronic device is moved, so as to disturb the air inside the electronic device, thereby achieving the purpose of improving the thermal dissipation performance.

Abstract: A noise-reducing attachment apparatus for a heat exchanger door is provided for facilitating attenuation of noise emanating from an electronics rack. The apparatus includes a frame structure configured to coupled to the heat exchanger door. The door includes in air opening and air-to-liquid heat exchanger, and air passing through the air opening also passes across the heat exchanger. The air opening facilitates passage of external air through the electronics rack. The frame structure defines in part an airflow channel through the apparatus, wherein air passing through the air opening also passes through the airflow channel when the apparatus is operatively coupled to the door. An acoustically absorptive material, which is coupled to the frame structure and at least partially defines the airflow opening through the apparatus, is selected and positioned to attenuate noise emanating from the electronics rack when the apparatus is coupled to the heat exchanger door.

Abstract: An electronic device with an airflow guiding duct includes a chassis, an airflow guiding duct, and a top cover. The chassis includes a bottom wall and a sidewall perpendicular to the bottom wall. A circuit board is mounted on the bottom wall. A pair of securing members protrudes from a top of the sidewall. The airflow guiding duct includes a top wall and a plurality of securing slots defined in the top wall corresponding to the securing members, for the securing members being lockingly engaging in the securing slots, thereby limiting movement of the airflow guiding duct in directions parallel to the circuit board. The cover is mounted on the chassis and abuts against the top wall of the airflow guiding duct, for limiting movement of the airflow guiding duct in a direction perpendicular to the circuit board.

Abstract: A portable computer having a decorative cover is disclosed. The portable computer includes a main housing and a display side housing. The display side housing is openably and closably attached to the main housing. Several apertures for forced air cooling are formed in a bottom and a side of the main housing. The decorative cover is configured to cover surfaces of the display side housing and the main housing. A tray having a flat plate member and a spacer are attached to the bottom of the main housing. The spacer is configured to secure a predetermined space between the flat plate member and the bottom of the main housing to form an air flow passage for allowing outside air to pass through the apertures. The spacer is arranged between the decorative cover and the bottom of the main housing.

Abstract: An automotive alternator rectifier including a terminal connection portion configured by connecting a terminal leading out of first unidirectional conducting element bodies disposed on a surface of a first heat sink so as to be spaced apart or a terminal leading out of second unidirectional conducting element bodies disposed on a surface of a second heat sink so as to be spaced apart with a circuit board terminal is disposed between a rotor and a circuit board. For this reason, temperature increases in the first unidirectional conducting element bodies and the second unidirectional conducting element bodies can be suppressed and workability when connecting the terminal connection portion is improved.

Abstract: Some embodiments of a method, apparatus and computer system are described for inverted vortex generator enhanced cooling. In various embodiments an apparatus may comprise a first surface comprising at least one heated component, a second surface in proximity to the first surface, the second surface comprising a non-heated surface, and one or more inverted vortex generators attached to the non-heated surface, a portion of the one or more inverted vortex generators in proximity to and configured to dissipate heat from the at least one heated component. Other embodiments are described.

Abstract: An attenuation mechanism for an electronic device is presented. The attenuation mechanism includes an outer member that has an inner member oriented axially within the outer member. The inner member has an axial twist that causes a line of sight blockage between an exterior and an interior of a housing of an electronic device when the attenuation mechanism is mounted through the housing, such that sound and electromagnetic radiation is attenuated without obstructing cooling air that is flowing through the housing.

Abstract: A display apparatus includes a casing, a display module, a cooling device, and a dust-proof device. The casing has first and second openings. The display module disposed in the casing has a display area exposed by the first opening and a non-display area corresponding to the second opening. The cooling device disposed at the non-display area in the casing has an air inlet corresponding to the second opening. The dust-proof device includes a body disposed at the non-display area in the casing, a cover disposed at the body, and a dust-proof element disposed therebetween. The body has first holes corresponding to the air inlet. The second opening exposes second holes of the cover. Each second hole overlaps at least one of the first holes. An airflow produced by the cooling device flows through the second opening, the second holes, the dust-proof element, the first holes, and the air inlet.

Abstract: A cooling fan module comprising a module housing and a fan assembly. The fan assembly comprises a blade assembly coupled to a motor disposed within a fan housing that is disposed within the module housing. The fan housing has an inlet and an outlet that is disposed within the module housing. A fan control circuit board is disposed within the module housing and outside of the fan housing. The fan control circuit board is coupled to the motor. An electrical connector is coupled to the fan control circuit board and projects outside of the module housing.

Abstract: A heat-dissipating module suitable for dissipating heat generated by a heat-generating element is provided. The heat-dissipating module includes a first heat-conducting plate, a first heat-dissipating tube, and a fan. The first heat-conducting plate is thermally coupled to the heat-generating element. The first heat-dissipating tube has a first opening and a second opening opposite to the first opening. The first heat-conducting plate is connected to the first heat-dissipating tube and located at an outside of the first heat-dissipating tube. The fan is disposed adjacent to the first opening and corresponding to first opening. The fan is adapted for generating an air current flowing in the first heat-dissipating tube. The heat-dissipating module can transfer the heat generated by the heat-generating element during operation to an external environment.

Abstract: In a cooling device of an image forming apparatus, a space is formed between a flat surface of a sheet metal attached on a circuit board attached part and a power source circuit board. A duct is formed by a shielding member formed in a U shape surrounding the space, and on the lower part of the flat surface of the sheet metal, a tubular part as an air outlet is formed so as to be elongated to the side of a main body. On the upper part of the sheet metal arranged in a vertical direction, a fan motor is mounted, which sends cooled air into the power source circuit board and the duct. The cooled air cools the power source circuit board and also cools a power source unit in the main body via the tubular member.

Abstract: Embodiments disclosed herein include an apparatus that includes an component capable of generating heat, an external wall with an interior surface, an air mover to be positioned to generate airflow between the interior surface of the external wall and the component. A vent may then be formed within the external wall to provide for a volume of air for the air mover to create airflow between the interior surface and the component. In some embodiments, the vent may be positioned in relation to the air mover to deflect at least a portion of the heat from the component from reaching the external wall. In some embodiments, a louvered portion may be included; and may be formed on the air mover or at the vent in the external wall. Other embodiments are described.

Abstract: A system and method of reducing consumption of electricity used to cool electronic computer data center, networking, and telecommunications equipment, and to reduce the incidence of thermal failure of electronic components, includes provision of one or more partitions to reduce the volume of the cooled environment supplying coldest possible cooled air from air conditioning systems to a chamber adjacent to racks containing the electronic components, preventing dilution of the supplied cooling airflow by warmer air from outside of the reduced volume environment, and controlling the delivery of cooling air flow through the reduced volume of the cooled environment.

Abstract: A diaphragm air pump comprises a pump chamber, a diaphragm and one or more piezoelectric beams or bimorphs. Fluid flows into the pump chamber and then flows out of it, the diaphragm is provided within the pump chamber, and one or more central openings are formed in the diaphragm. One or more central check valves are provided in the central openings. The diaphragm is just bonded with piezoelectric beams, not fixed to the lower housing of the pump chamber in order to get large displacement. With the provided diaphragm air pump, it is possible to actively adjust the air quantity according to the requirement for fuel cell or a part-to-be-cooled, and it is also possible to reduce noise and power consumption compared with a conventional fan type cooler or air pumps.

Abstract: The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.

Abstract: An electronic module. The electronic module includes a chassis, a plurality of capacitors, a plurality of bus bars, and a heat sink. The chassis includes a first end and a second end. The first end is opposite the second end. The capacitors are positioned within the chassis, and at least one of the capacitors is proximate the first end. The bus bars are positioned within the chassis proximate the second end. The heat sink is positioned between the capacitors and the bus bars. The capacitors, the heat sink and the bus bars are positioned such that when an airflow enters the chassis at the first end, a portion of the airflow sequentially comes in contact with the capacitors, the heat sink, and the bus bars before exiting at the second end.

Abstract: The flexible circuit board according to the present invention includes a plurality of mounting portions which are mounted with electronic circuits respectively, a connector portion that performs signal transmission between the electronic circuit mounted on each of the mounting portions and the electronic circuit device, and coupling portions that couple the respective mounting portions to the connector portion in different directions. The flexible circuit board is mounted on the electronic circuit device in a state of being folded at a predetermined part of one of the coupling portions.

Abstract: A heat-dissipating device having an air-guiding cover includes a heat-dissipating body, an air-guiding cover, a plurality of heat pipes, a fixing base and a fan. The heat-dissipating body is constituted of a plurality of heat-dissipating pieces that are stacked up at intervals. On the heat-dissipating body, venting channels and a plurality of through holes are provided. The air-guiding cover includes a hollow cylinder and an air-guiding blade. The hollow cylinder covers the heat-dissipating body. The air-guiding blade is accommodated in the venting channel. Each of the plurality of heat pipes includes a section to be heated and a heat-releasing section extending from the section to be heated. The heat-releasing section penetrates into the through hole. The bottom of the fixing base is provided with a plurality of grooves for accommodating the sections to be heated of the heat pipes. The fan is provided above the air-guiding cover.

Abstract: Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.

Abstract: A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. The convection bridge is clamped between the VME electronics module and the modified chassis, requiring no modifications to the VME electronics module. For enhanced performance, additional features may include having any individual or combination of fin orientation on the convection bridge, interstitial material such as grease or indium foil can be inserted between the convection bridge and the VME electronics module, and compatible air-moving appliances such as a fan as part of the modified VME chassis.

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Abstract: A method, apparatus, and system are described for an ionic wind generator. The ionic wind generator may have a first electrode that is elevated off a surface of a device that the ionic wind generator is intended to cool. A first surface of the first electrode is in contact with a first surface of a first post that elevates the first electrode off the surface of the device that the ionic wind generator is intended to cool. The ionic wind generator causes a generation of ions that are then drawn through an interstitial atmosphere from the first electrode to a second electrode to affect a velocity of local flow over the surface of the device between the first electrode and the second electrode. The flow from a forced flow device also affects the velocity of local flow over the surface of the device between the first electrode and the second electrode.

Abstract: A cooling device includes a cooling fan placed in a power storage device, an exhaust port placed in a battery, and a cooling wind flow path for allowing cooling wind taken in from the cooling fan to flow therethrough. In the power storage device and the battery, communication between a gap inside a casing a gap inside a casing can be established via an opening. The cooling wind supplied from the wind blowing fan (F10) flows through the gap formed inside the casing for the power storage device to cool capacitor cells. Subsequently, the cooling wind that has passed through the power storage device is introduced into the inside of the casing for the battery via the opening, and flows through a gap between the upper surface of battery cells and the casing and a gap between the battery cells to cool the battery cells. Thereafter, the cooling wind is emitted to the outside of the casing via the exhaust port.

Abstract: An airflow-guiding device for guiding airflow to heat generating components includes an airflow-guiding shield and at least one airflow-guiding piece rotatable in the airflow-guiding shield. The airflow-guiding piece includes a guiding surface guiding airflow, and a blocking surface blocking airflow. An airflow-guiding position where the guiding surface faces the heat generating components guides airflow thereto, and an airflow-blocking position where the blocking surface faces the airflow blocks the airflow. The airflow-guiding piece rotates between the airflow-guiding position and the airflow-blocking position.

Abstract: A chassis (300) for housing at least one cardcage (302) is disclosed. The chassis includes a first portion (420) of a chassis housing (300) through a sixth portion (460) thereof. The first through sixth portions forming a boundary around a storage region of the chassis housing (300). The chassis (300) also includes at least one air moving device (316). At least first (413) and second openings (425) are situated within the chassis housing (300). The first and (413) second openings (425) located at substantially different elevations relative to each other. A cardcage (302) is located in the storage region and situated in a skewed orientation relative to at least two of the portions of the chassis housing (300). The at least first (413) and second (425) openings and the at least one air moving device (316) are located relative to the skewed oriented cardcage (302) to facilitate airflow thereacross.

Abstract: A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing.

Abstract: An airflow arresting apparatus is provided configured to reside above an electronics rack within a data center. The apparatus includes an airflow arrester and a track mechanism. The airflow arrester includes a collapsible panel sized and configured to reside above the electronics rack, and when operatively positioned above the electronics rack, to extend vertically above the electronics rack and at least partially block airflow from passing over the electronics rack between the air outlet and air inlet sides of the rack. The track mechanism is sized and configured to reside above the electronics rack, and the airflow arrester is slidably engaged with the track mechanism. Positioning of the airflow arrester at a desired location above the electronics rack is facilitated by the airflow arrester slidably engaging the track mechanism.

Abstract: According to one embodiment, there is provided an electronic apparatus including: a substrate on which an electronic component is mounted; a casing that accommodates the substrate and has a recess portion; an air vent through which the recess portion is communicated with an inside of the casing; a hood that covers the recess portion and includes an exhaust port; a fan that is configured to suction air from the inside of the casing through the air vent to the recess portion and discharge the air to outside through the exhaust port, the fan being housed between the recess portion and the hood; and a motor that is supplied with power from the substrate to rotate the fan, the motor being housed between the recess portion and the hood.

Abstract: A fan fastening structure for a computer housing includes a computer housing, an air-guiding mask, and a cooling fan. The computer housing has a front board and a backboard. An opening is located outside of the backboard that links into the interior of the computer housing. One front end of the air-guiding mask is located at the opening of the backboard, and the rear end is installed with the cooling fan. One front end of the air-guiding mask forms an air inlet, and the rear end forms an air outlet. There is a channel that links the air inlet with the air outlet. The cooling fan has an air-entering surface and an air-exhausting surface. The air-entering surface corresponds to the air outlet. By cooperating with the air-guiding mask and the cooling fan, heat is exhausted to the outside of the computer housing quietly, rapidly, and efficiently. Costs are thereby reduced.

Abstract: Computer chassis configured for controlled airflow including at least one component board; a segmented curtain suspended across a region of airflow in the computer chassis above the component board; and at least one component mounted on the component board displacing at least one segment of the segmented curtain creating an airflow channel under the displaced segment. Segmented curtains for controlling airflow in a computer chassis including one or more segments capable of being displaced by components mounted on a component board in the computer chassis; and one or more fasteners for suspending the segmented curtain across a region of airflow in the computer chassis. Controlling airflow in a computer chassis including inserting a component board into the computer chassis; displacing, a segment of a segmented curtain thereby creating an airflow channel; and providing airflow through the airflow channel created by the displacement of the segment of the segmented curtain.

Abstract: A heat dissipation device includes a heat sink and two conductor bases. The heat sink includes two base plates attached to a graphics card and thermally connecting with two graphics processing units (GPUs) mounted on the graphics card, and a plurality of fins soldered on tops of the base plates. The conductor bases connect with the base plates of the heat sink and thermally connect with other electronic components mounted around the GPUs thereby to dissipate heat generated by the other electronic components. The GPUs and the other electronic components have different heights.