Abstract: A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, and a flow direction controlling structure. The first heat dissipation apparatus and the second heat dissipation apparatus are symmetrically disposed. The flow direction controlling structure has several rotatable elements disposed between the first heat dissipation apparatus and the second heat dissipation apparatus. Each of the rotatable elements has a fixed end and a correspondingly movable end for guiding airflow. The rotatable elements can be sheet-shaped, wing-shaped, arc-shaped or nonlinear in cross section. The thickness of the rotatable elements varies or decreases from the fixed end to the movable end. The rotatable elements overlap an adjacent rotatable element so as to selectively seal the heat dissipation apparatuses.

Abstract: A ventilation member (1) comprises a support body (2), a ventilation membrane (10), and a cover part (3). The support body (2) includes a bottom surface portion (4) connected to the casing (50) and a side surface portion (5) on which the ventilation membrane (10) is installed. A first opening (4h) is formed in the bottom surface portion (4), and a second opening (5h) is formed in the side surface portion (5). The ventilation membrane (10) is installed on the side surface portion (5) so as to close the second opening (5h). The cover part (3) has a cylindrical side wall part (3b) that circumferentially surrounds the support body (2) in such a state that the support body (2) is assembled therein. The position of the second opening (5h) to be formed in the side surface portion (5) of the support body (2) is adjusted so that the ventilation membrane (10) is protected when the membrane faces the cylindrical side wall part (3b).

Abstract: A fixing frame is used to fix at least one heat sink fan on a case of an electronic device. The fixing frame includes a cradle and at least one fastener. The cradle has two oppositely disposed plates, and the two plates respectively have a combining portion and a latching portion, such that at least one accommodation region is partitioned from the cradle for accommodating the fan, and the latching portion and the combining portion are combined with each other to form a clamping region. The fastener is disposed on the case and clamped in the clamping region, such that the cradle is fixed on the case.

Abstract: A mounting assembly includes a chassis having a plurality of opposite receiving tabs thereon, and a plurality of bracket subassemblies slidably mounted to the chassis along the receiving tabs of the chassis. Each bracket subassembly secures a fan therein and includes a bracket having a rear wall and two opposite sidewalls, a positioning member, and a lift-out apparatus attached to the bracket. The lift-out apparatus includes a clasping member fixed to the bracket, a sliding member slidably sandwiched between the sidewall of the bracket and the clasping member, and an elastic member. A locking structure is formed on the sliding member and the sidewall of the bracket. When the locking structure is unlocked, the sliding member is lifted out due to rebounding of the elastic member. The sliding member is then pulled to urge the bracket subassembly to disengage from the chassis.

Abstract: The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element.

Abstract: An apparatus is provided that provides a common opening for air flow and speaker outflow. The apparatus includes a compartment with an opening. The compartment has a top surface and a bottom surface and includes a fan and a speaker. The fan is positioned to rotate one or blades around an axis. The one or more blades spin in a direction substantially towards an opening during at least one point during the spinning. The fan directs the air flow towards the opening. The speaker is positioned such that its movement is along the axis.

Abstract: A cooling system for an embedded television is a structure disposed with a dissipating space for receiving a television; first and second air paths are circulated by air with the dissipating space; the first air path is used for guiding cold air to enter an inside of the dissipating space, the second air path is used for expelling hot air out of the inside of the dissipating space, and a general indoor air condition/exhaust system is utilized to cool the embedded television to allow the effective cooling to be proceeded on the embedded television so as to elongate the use of the television.

Abstract: Embodiments of the present invention provide a multi-fan cooling system in which redundancy in airflow across a plurality of electrical boards is maintained. This redundancy is provided by having an ability to at least partially divert airflow from a functioning fan to an electrical board for which its corresponding fan has failed. According to various embodiments of the present invention, the multi-fan cooling system comprises two fans located proximate to each other. An airflow plenum couples and distributes air from the two fans across a plurality of electrical boards. In certain embodiments, the plenum comprises stacked outlets that distribute airflow from the two fans across the plurality of electrical boards. During normal operation, this airflow is approximately evenly distributed across the electrical boards. However, if one of the fans fails, the plenum causes air from the single operating fan to still be distributed across the plurality of electrical boards.

Abstract: A cooling structure for a power supply is disclosed. The power supply has a housing. The cooling structure includes a cooling fan and a cooler. The cooling fan is located on the inner side of the top surface of the housing. The cooler is located below the cooling fan. The cooler includes a vertical board and a plurality of cooling fins. The cooling fins are disposed slantwise on the vertical board and at intervals. There is a plurality of air-guiding channels between the cooling fins. Thereby, the airflow of the cooling fan can be guided forward to a specified direction. The hot air circulating flow will not occur. The cooling fan blows onto the electronic elements on the circuit board to exhaust the heat generated by the electronic elements, and noise generated from the cooling fans is lowered.

Abstract: An apparatus with some embodiments is described having cooling capabilities for a computing device. In some embodiments, the apparatus may include a thermoelectric component (TEC) to transfer thermal energy with a first heat exchanger, through a heat attach and heat pipe, to or from the TEC, and then with a second heat exchanger. In some embodiments, the apparatus may include a second heat attach and a second heat pipe between the second heat exchanger and the TEC. Furthermore, in some embodiments, the apparatus may be at a docking station, where the docking station may connect with the computing device. Other embodiments are described.

Abstract: A docking station is provided for cooling an electronics rack of a data center. The docking station includes an enclosure having at least one wall, a cover coupled to the at least one wall, and a central opening sized to receive the electronics rack therein. The enclosure is separate and freestanding from the electronics rack and surrounds the electronics rack, and facilitates establishing a closed loop airflow path passing through air inlet and outlet sides of the rack and through an air return pathway of the enclosure. The docking station further includes an air-to-liquid heat exchange assembly, disposed within the air return pathway for cooling circulating air passing through the closed loop airflow path, and at least one modular cooling unit, disposed within the enclosure for providing system coolant to the air-to-liquid heat exchange assembly and to at least one electronics subsystem of the electronics rack.

Abstract: Cabinet for housing and cooling electronic components with internally circulating air that is cooled at each of a plurality of equipment shelves.

Abstract: An apparatus with some embodiments is described having a protrusion to provide air flow distribution to a computing device. In some embodiments, the apparatus may include a housing with one or more openings on each of the external surfaces of the housing, an air mover, and a protrusion to channel airflow to an inlet while restricting airflow from an outlet from being circulated back into the inlet. Furthermore, in some embodiments, the apparatus may be implemented on a computer system that includes one or more electronic components can generate thermal energy. Other embodiments are described.

Abstract: An assembly that facilitates the use of modules requiring orthogonal airflow in a chassis providing normal airflow. Partitions within the housing direct ambient airflow from the front air inlet, through the modules, and out the rear air exhaust. The housing and partitions define first and second vertically and horizontally offset slots for receiving first and second orthogonal airflow modules, and also define separate first and second airflow pathways. The first airflow pathway provides airflow through a front air inlet, under the second module, orthogonally through the first module and out the rear air exhaust. Similarly, the second airflow pathway provides airflow through a front air inlet, over the first module, orthogonally through the second module and out the rear air exhaust. Both airflow pathways both draw ambient air into the housing and exhaust warm air from the rear of the housing, while keeping the two airflow pathways separated.

Abstract: A thermal energy storage transfer system that is adapted to transfer heat from an electronics enclosure. The thermal energy storage system includes a thermal energy storage unit that is positioned within the electronics enclosure. The thermal energy storage unit contains a phase change material that stores heat created by electronics stored within the electronics enclosure and transfers the heat to outside of the electronics enclosure by use of a heat pipe and condenser.

Abstract: A cooling apparatus comprises cover 4 equipped with pump body 1, and a housing on which cover 4 is removably mounted. The housing includes a vent forming surface formed with a vent for introducing air into the housing, and a protrusion provided on the vent forming surface so as to surround the vent. Cover 4 includes a communication pipe whose one end fitted into a discharge port of a pressure pump, sheet-type packing 3a which is provided on an another end of said communication pipe and in which an opening at said another end of said communication pipe is positioned in a center portion, and pump fixture 2 for attaching the other end of the communication pipe.

Abstract: A gaming device has a housing with at least one air inlet vent and at least one air exhaust vent. In one aspect of the invention, the vents are configured with a duct or flange having at least one upwardly sloping portion configured to prevent the entry of contaminants such as liquids into the gaming device. In another aspect of the invention, a gaming machine cooling system includes at least one air flow device such as a centrifugal blower or squirrel-cage air handling device which provides high volumetric air flow at positive pressure. The air flow device is coupled to the exhaust vent, whereby the air flow device exhausts air from the interior to the exterior of the gaming device. A low pressure condition in the gaming machine causes cool air to be drawn into the interior of the housing.

Abstract: According to one embodiment, a housing of an electronic apparatus includes a first sidewall portion provided with an air vent, a ceiling wall portion extending from an upper end of the first sidewall portion toward the outside of the housing, and a pair of second sidewall portions which extend from respective side end portions of the first sidewall portion toward the outside of the housing and are opposed to each other.

Abstract: A heat dissipation device includes a heat sink (10) in thermal contact with a first heat-generating electronic component. A fan duct (30) receives the heat sink therein and has an inlet (350) and an outlet (302) at opposite sides thereof. A fan (20) is mounted in the fan duct at the inlet. A portion of airflow generated by the fan flows through the heat sink to cool the first heat-generating electronic component. A shutter (31) is mounted on the fan duct. Another portion of the airflow generated by the fan flows through the shutter to blow a second heat-generating electronic component located beside the first heat-generating electronic component and outside the fan duct.

Abstract: The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects.

Abstract: A heat dissipation apparatus (100) includes a centrifugal blower (20) and a heat dissipater (10). The centrifugal blower includes a casing (22), a stator accommodated in the casing, and a rotor (24) rotatable disposed around the stator. The casing includes a base wall (224), a sidewall (226) surrounding the base wall and a cover (222) attached to the sidewall. The sidewall defines an air outlet (221) therein. An air channel (223) is formed between blades (242) of the rotor and an inner surface of the sidewall of the casing. The heat dissipater is made of porous material and disposed at the air outlet of the centrifugal blower. The heat dissipater has a tongue portion (12) extending into a part of the air channel.

Abstract: Provided is a cooling apparatus for a flat display device. The cooling apparatus includes a flat display module, a cover for protecting the flat display module, an air inlet formed on a portion of the cover to allow external air to be introduced into the cover, an air outlet formed on one of four frame portions of the cover to allow the air introduced through the air inlet to be exhausted out of the cover, and a fan for directing the air in a direction extending from a screen surface of the flat display device.

Abstract: Reversible airflow in cooling systems of electronic devices is described. For example, an electronic device may include a reversible fan tray. The fan tray may include symmetric mounting features that allow the fan tray to be mounted in the electronic device in more than one orientation at the same location within the electronic device such that one or more fans in the fan tray either direct air into the electronic device or to pull air from electronic device. The fan tray may further include a symmetric arrangement of connectors that coincide with the symmetric arrangement of mounting features to allow the fan tray to be connected to a power source of the electronic device any of the more than one orientations. An arrangement of electronic devices including reversible fan trays may be configured so that inlet and outlet airflows are separated to increase cooling efficiency of the electronic devices.

Abstract: Briefly described, embodiments of this disclosure include heat management devices, heat management systems, methods of heat management, and the like.

Abstract: An information processing device includes a housing part; a heating part arranged in the housing part; a cooling unit configured to cool the heating part; an airflow supplying member configured to supply an airflow to the cooling unit; and an airflow limitation member configured to limit the airflow supplied by the airflow supplying member. A part of the cooling unit, the airflow limitation member, and the airflow supplying member are arranged in series. An air intake part is provided in one surface of the housing part so as to intake air into the airflow limitation member. An air discharge part is provided in another surface of the housing part so as to discharge air cooling the part of the cooling unit. An air discharge unit is provided at an air discharge opening provided at one side surface of the airflow limitation member.

Abstract: A server rack system comprises a server rack, a raised floor cooling system, and an exhaust system. The server rack includes a base, a front side, a rear side, and an interior portion including first, second, and third server rows. The raised floor cooling system includes a floor surface, ductwork disposed below the floor surface, a blower unit, and a vent. The exhaust system is coupled to the rear side of the server rack and includes a top portion, a bottom portion, and first, second, and third adjustable exhaust channels.

Abstract: An apparatus is provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

Abstract: A method of cooling at least one electronic device is described, wherein a movable pumping element (4) pumps a fluid to and/or from said device, and wherein the movement of said pumping element (4) is induced by heat. A system for cooling at least one electronic device is described, comprising at least one movable pumping element (4) for transporting a fluid to and/or from said device, wherein said pumping element (4) is movable by heat.

Abstract: A system for cooling interior and external housing surfaces of an electronic apparatus. The apparatus includes at least one electronic component, a heat transfer mechanism for transferring to an external surface of the apparatus heat generated by the electronic component, and a cooling mechanism for cooling the external surface of the apparatus. The cooling mechanism also includes an airflow generation device and an opening that enables airflow to simultaneously flow over at least one electronic component within the apparatus and over the external surface to dissipate the heat generated by the at least one electronic component.

Abstract: A configurable flow control air baffle comprises one or more removable flow impedance devices that affect the direction of airflow forced through a computer system, wherein the position of the one or more flow impedance devices are user-configurable. Various embodiments comprise various shapes, sizes and attachment configurations of the flow impedance devices. Hence, the airflow through computer systems is controllable by a user based on the different configurations of the components within respective computer systems. According to one embodiment, the removable flow impedance devices are user-configurable on the baffle by removably attaching the flow impedance devices to a baffle face, such as in one or more housing mechanisms. According to one embodiment, the removable flow impedance devices are user-configurable on the baffle by permanently decoupling, from the baffle, one or more preconfigured permanently removable flow impedance devices.

Abstract: A holding device for encased capacitors used for electric drive engineering. The inventive holding device comprises integrateable and separable lower and top holding parts. Axially protruded retaining clamps are arranged on the top holding part around each encased capacitor. The lower holding part comprises an opening for the respective capacitor and each opening is surrounded with a sealing lip. The retaining clamps are pressed against the capacitors by the internal surface of the lower holding part. Sections protruded from the respective openings of the lower holding part are embodied in the form of the capacitor sections freely extending directly to a cold air flow of a device. The sealing lip is sealingly placed on the external wall of each encased capacitor in such a way that the penetration of solid or liquid materials inside the lower holding part is prohibited, thereby preventing a high IP protection degree.

Abstract: An example embodiment includes three fans (F4, F5, F6) associated with three compression chambers (respectively CH2; CH3; CH4) that are separated from one another by walls (W5, W6) capable of maintaining a difference in pressure. One of the fans (F4) causes, in the chamber (CH3) associated with said fan, a pressure greater than that caused by the other fans (F4, F6) in the other chambers (CH2, CH4), in order to create air currents (C17, . . . , C20) with a higher flow, and which are intended to cool circuit boards (B16, B17, B18) having a lower dissipation than the other boards (C12, . . . , C15, C19, . . . , C22).

Abstract: There is provided a cooling apparatus for a flat display device. The cooling apparatus includes a flat display module, a cover for protecting an exterior of the flat display module, an air inlet formed on one side of the cover, for introducing external air, an air outlet formed in the other side of the cover, for discharging high temperature air contained inside the cover, and a shield for selectively closing the air outlet to prevent inflow of foreign substances.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: A heatsink apparatus for dissipating heat generated by electronic parts is provided. The heatsink apparatus includes a fan and a heatsink fin. One end of the heatsink fin is adhered to an electronic component, the other end forms a curl portion, and a curl inner surface receives an air flow generated by the fan, so as to quickly dissipate the heat energy of the electronic component.

Abstract: A new type of device, useful as a fan among other applications, in which fluid flow is induced by providing within the device a chamber of constantly increasing volume and a chamber of constantly decreasing volume. Fluid moves through these chambers impelled by the rotation of a pair of members linked together for rotation about skewed axes. The members move within a chamber having a spherical surface, into which open ports for inward and outward fluid flow. The device may be used to assist in cooling components of an electronic system such as a computer system.

Abstract: A heat extraction system is provided for a laptop computer that comprises a system unit that includes a set of heat sources and a video display unit that is movably attached to the system unit. The laptop computer has air inlets and air outlets that allow air to flow into the system unit, over the heat sources forming heated air, and exhaust the heated air. The laptop computer has a set of tubes, which have an inlet and an outlet, located behind a video display in the video display unit and an air connection from the air outlets to each inlet in the tubes. The set of tubes are formed such that heated air passing through a constriction in the set of tubes changes in velocity and pressure in order to satisfy the conservation of flow rate. Thus, heat produced by the heat sources is extracted from the laptop computer.

Abstract: Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.

Abstract: Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.

Abstract: Systems and methods for thermal management for electronic components in a sealed enclosure are provided. In one embodiment, a thermal management system for electronic components in a sealed enclosure comprises: an enclosure for housing electronic components, the enclosure sealed from an external environment; a card cage housed within the enclosure; at least one electronic device card installed in the card cage; and at least one baffle configured to form an airflow channel through at least part of the card cage, wherein the airflow channel directs air warmed by thermal energy from the at least one electronic device card to follow a circular path along an internal surface of the enclosure, wherein the internal surface is configured to conductively remove heat from the air to the environment external to the enclosure.

Abstract: An apparatus for enclosing electronic components comprises a chassis enclosure defining an internal chamber and having an upper portion and a lower portion. The upper portion comprises a first front wall having a length dimension greater than a width dimension, and a first pair of opposing side walls that are each contiguous with the first front wall. The lower portion comprises a second front wall having a length dimension less than the length dimension of the first front wall, and a second pair of opposing side walls that are each contiguous with the second front wall. A plurality of heat sink fins are on each of the first front and side walls, and on each of the second front and side walls. Each of the heat sink fins are configured to be substantially parallel to the length dimension of the first front wall and the second front wall, and extend continuously along each wall. The plurality of heat sink fins has an arcuate-like end view profile on each wall of the chassis enclosure.

Abstract: A heat dissipation device and fan module. The fan module is fixed to a fan tray, which has a track with a first engaging portion. A securing member is disposed on a shield, comprising a second engaging portion. The second engaging portion enters the first engaging portion, fixing the fan module to the fan tray. An actuator connects the securing member and the shield. When external force deforms the actuator, the securing member deforms therewith, withdrawing the second engaging portion from the first engaging portion.

Abstract: A computer system comprises a chassis and first and second electronic components disposed within the chassis. The computer system also comprises a multi-direction blower module having a blower housing connected to the chassis. The blower housing comprises an inlet, a first outlet, and a second outlet. A centrifugal blower is rotatably mounted within the blower housing. An internal wall is disposed within the blower housing and partially surrounds the blower. The airflow into the inlet is passed in thermal communication with the first electronic component. The airflow from the first outlet is passed in thermal communication with the second electronic device. The airflow from the second outlet is exhausted from the chassis.

Abstract: A computer comprising a chassis supporting an electronic component. A fan housing with an axial duct is mounted to the chassis. A blade assembly is rotatably disposed within the duct and comprises a plurality of fan blades that extend radially from a hub to a fan diameter. The axial duct has a chord length at least equal to the fan diameter.

Abstract: An apparatus in one example comprises at least one heat exchanger mounted within a rack-mount equipment bay and at least one duct coupled with the at least one heat exchanger that is configured to form a semi-closed cooling loop with at least one electronic device mounted within the rack-mount equipment bay. The at least one duct directs an airflow between the at least one heat exchanger and the at least one electronic device for cooling of the at least one electronic device.

Abstract: A display apparatus includes a display panel to display a picture, a main PCB to operate the display panel, a shield cover coupled to the main PCB, a front cover and a rear cover respectively coupled to the display panel and to the shield cover, and forming an external appearance of the display apparatus, and a fan assembly comprising a cooling fan, and a fan housing to accommodate the cooling fan and coupled between the main PCB and the shield cover to supply external air through the cooling fan to internal parts of the display apparatus. Accordingly, the display apparatus includes the cooling fan to directly cool the internal parts of the display apparatus.

Abstract: An air conducting cover for a server includes a recess portion, a guiding portion, and a connecting portion. The guiding portion upwardly and outwardly extends from an end of the recess portion. The connecting portion horizontally extends from an end of the guiding portion and is attached to the server. The server includes a server motherboard bracket and a server motherboard installed on the server motherboard bracket. The air conducting cover is disposed on the server motherboard bracket and combined with the server motherboard bracket as an airflow channel. The airflow channel is a diverging duct and gradually narrowed from two ends to a middle. Thus, a blowing speed of a cooling air insufflated into the server is accelerated. The air conducting cover can improve heat dissipation efficiency of the server without additional room and will not produce more noise.

Abstract: A power supply apparatus for use with a redundant power supply system includes a casing, a main circuit board and an airflow driving device. The casing includes a first airflow opening and a second airflow opening. The main circuit board is disposed within the casing and includes plural electronic components thereon. The airflow driving device is disposed in the middle region of the main circuit board. A cooling air is pumped by the airflow driving device to be introduced into the inner portion of the casing through one of the first airflow opening and the second airflow opening, then the heat generated from the electronic components is removed by the cooling air, and finally a heated air is exhausted through the other one of the first airflow opening and the second airflow opening.

Abstract: The cooling function power adapter inserts between the ionization gauge tube prongs and the power socket. Its unique cooling function dissipates the heat generated by the ionization gauge tube working under large power current. This adapter also lowers the working temperature of the power socket. This invention prevents or minimizes the condition where the materials of the power socket carbonize, discolor and/or deteriorate. Additionally, this adopter is designed with easy plug-in and non-directional feature, maintenance and replacement of the adapter take only seconds. This adapter ensures that the power socket is able to working under long periods of time under large power transmission. The fan cooling function further minimizes safety hazards.

Abstract: A rack panel, rack enclosure, and system for cooling electronic components which are vertically mounted in a rack enclosure wherein the system has a front panel with two hollow internal ducts separated by an inner screen-like wall for more evenly distributing and delivering virtually equal amounts of cold air to each component with the rack enclosure. An air inlet, with one or more air movers adjacent thereto, introduces cold air into the front panel, evenly circulates it through the two ducts, and delivers it to the electronic components. A temperature sensor on the exhaust vents of the rear panel of the rack enclosure sensing the temperature of the cold air as it is discharged from the rack enclosure to ensure a continued sustainable degree of cold air is maintained throughout the rack enclosure.