Abstract: A jet generating device includes a vibrating member which vibrates gas, a driving unit which drives the vibrating member, and a housing which has a first opening and a first chamber connected to the first opening and containing the gas. The housing supports the vibrating member, and is such that, of sounds generated as a result of vibrating the vibrating member, the sound having a maximum noise level has a predetermined frequency. In addition, the housing discharges the gas as pulsating gas through the first opening as a result of driving the vibrating member.

Abstract: An electronic apparatus comprises a case configured to house an electronic circuit unit and includes an air intake, through which external air is taken into the case, and an exhausting opening, from which the air is ejected, an circulator provided in the case and configured to take the external air into the case through the air intake and supply the air to the electronic circuit unit, an evaporation unit provided in the case and configured to cool the air by thermal exchange between the air and a working medium and guide the air to the exhausting opening, the working medium being vaporized as a result of the thermal exchange, and a condenser provided out of the case and configured to liquidize the working medium and supply the working medium to the evaporation unit.

Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.

Abstract: A heat dissipating mechanism includes a housing. A hollow space is formed inside the housing. The heat dissipating mechanism further includes an airflow guiding structure installed inside the hollow space for separating the hollow space into a first channel and a second channel. An inlet and an outlet are formed on the airflow guiding structure. Airflow enters the first channel via the inlet and jets out of the outlet for mixing with thermal current generated by a heat source in the second channel.

Abstract: A heat dissipation device for dissipating heat generated from an add-on card. The heat dissipating device includes two heat sinks and two heat pipes connecting with the two heat sinks. Each of the heat sinks includes a base and a fin group mounted on a top surface of the base. Each of the heat pipes includes a connecting section and two heat-conductive sections extending from opposite ends of the connecting section. One of the two heat-conductive sections of each of the heat pipes is sandwiched between the base and the fin group of one heat sink, and another of the two heat-conductive sections is sandwiched between the base and the fin group of another heat sink.

Abstract: A system and method are disclosed for enclosing electronic equipment in a noiseproofed and ventilated enclosure. This includes supplying air to an enclosure and removing air from the enclosure through acoustic chambers attached to the enclosure. The acoustic chambers can be constructed of materials or be treated with materials that have noise-absorbing or noise-abating properties. In addition, the acoustic chamber for exhausting air from the enclosure can contain baffles that help to prevent noise that has entered the acoustic chamber from leaving the chamber. And, the system and method can use a cable egress port that allows cables and wiring to pass through the egress port while blocking the transmission of noise through the egress port.

Abstract: A portable folding heat-sink assembly for notebook computers implements two or more housings connected at adjacent sides thereof with one or more pivot shafts. Furthermore, heat-sink fans, a circuit board, a switch, and an indication lamp may be optionally settled in some of the housings. Anti-slip pads and supports may be provided at the bottoms of the housings while adjustable pedestals may be provided on the housings. Thus, by the pivot shafts, the heat sink assembly can be expanded for use and can be folded into a reduced volume for portage. Besides, the heat sink assembly can be uprighted on a table to function as an electric cooling fan.

Abstract: A system (50) includes a material layer (52) having an opening (62) extending through it and a pumping device (54) positioned behind the layer (52). A target element (56) is positioned in front of the material layer (52). In a partial cooling mode (124), the pumping device (54) drives a jet (134) of coolant through the opening (62) toward the target (56). Transducers (58, 60), positioned at opposing ends of the opening (62), produce output signals (130, 132) that perturb the jet (134) to partially control its oscillation. The jet (134) spreads from a location (96) on the target element (56) in one direction (142) to provide uniform cooling over a portion (126) of the target element (56) in the direction (142), and the jet (134) non-uniformly spreads in another direction (144) to provide non-uniform cooling over a portion (128) of the target element (56) in the other direction (144).

Abstract: A thermal module includes a heat sink disposed on a contact surface of the heat source, a mounting bracket having first and second ends, a fastening member, a pressing member, and at least one clip. The mounting bracket surrounds the heat source. The first end has at least one latch portion. The second end has at least one mounting slot and at least one first opening in communication with the mounting slot. The fastening member is slidably mounted in the mounting slot. The clip spans the heat sink and has two ends respectively engaged with the latch portion and a portion of the fastening member respectively. The pressing member includes a pressing tightly engaged with the clip and urges the heat sink when an operation portion of the pressing member is rotated from the first predetermined position to the second predetermined position.

Abstract: A cooling arrangement is disclosed for electrical components which are arranged in a housing of a soft starter which in particular may be designed for operation of an electric motor. In at least one embodiment, the cooling arrangement includes at least one fan arranged inclined in an opening in a housing wall such that the rotation axis of the fan is at an angle to the normal to the housing wall.

Abstract: Systems and method for cooling computer systems are provided. A rack system for housing a plurality of computers is provided, the rack system including: a rack assembly configured to support a first stack of computers and a second stack of computers; and at least one fan assembly configured to create an airflow through the first stack of computers and into the second stack of computers. A method of cooling a plurality of computers in a rack system is provided, including: supporting a first stack of computers and a second stack of computers in a rack assembly; and effectuating an airflow through the first stack of computers and into the second stack of computers.

Abstract: A personal computer has a central air plenum straddled by opposed drive bays, and memory modules in the plenum are covered by a shroud that increases the air flow over the memory modules. The plenum establishes a first pathway for air flow and parallel to the plenum is a second pathway for air flow past cards such as graphics and network cards.

Abstract: A device (103) is provided which comprises (a) a housing (115) equipped with a viewing window (253); (b) a diaphragm (301), visible through said viewing window; (c) an actuator (126) adapted to vibrate said diaphragm at an operating frequency; and (d) a strobe light (121).

Abstract: A fan noise control apparatus is provided to facilitate the reduction of noise. According to the preferred embodiments, an acoustically transparent portion is provided to permit noise from one source to pass through to interact and cancel with another noise.

Abstract: An electronic device can be provided with a heat-generating component and a cooling module for dissipating heat. In some embodiments, the cooling component may include a fan configured to produce an outflow of air, and a divider configured not only to direct a first portion of the outflow between a first surface of the divider and the heat-generating component, but also to direct a second portion of the outflow along a second surface of the divider. In other embodiments, the cooling component may include a divider and a pressure clip. A first portion of the pressure clip may be configured to exert a pressure on a first surface of the divider such that the pressure may hold a portion of a second surface of the divider in contact with the heat-generating component.

Abstract: A telecommunications cabinet in which active equipment can be mounted. The cabinet including an airflow ducting arrangement located in the interior region of the cabinet. The airflow ducting arrangement accommodating thermal cooling of active equipment having internal side-to-side air cooling arrangements.

Abstract: An information processing apparatus including: a main unit; a cooling fan that suctions open air into the main unit to cool inside the main unit with an air flow; and a nonvolatile semiconductor storage device that is provided within the main unit to be used as an external storage device, the device including: a printed circuit board; a nonvolatile semiconductor memory that is mounted on the printed circuit board; a memory controller that is mounted on the printed circuit board and controls the nonvolatile semiconductor memory; and a temperature sensor that is mounted on the printed circuit board and detects temperature within the nonvolatile semiconductor storage device, wherein the memory controller is disposed at an upstream side of the air flow and the temperature sensor is disposed at a downstream side of the air flow.

Abstract: A system is provided herein which comprises (a) a plurality of circuit boards (207); (b) a plurality of slots (205), wherein each of said slots is adapted to provide power to a circuit board coupled thereto, and wherein each of said circuit boards is coupled to one of said slots; and (c) a thermal management card (209) disposed in one of said slots, said thermal management card containing at least one synthetic jet ejector.

Abstract: A flat-panel display apparatus comprises a display panel, a circuit board, and a cover. The circuit board includes a first and second circuit boards. The first circuit board is arranged above the second circuit board so that, on the back side of the display panel, a mounting surfaces of the first and second circuit boards are approximately in parallel with a display surface of the display panel and do not overlap each other. Each of the first and second circuit boards have a primary mounting surface on which a large number of electrical components are mounted, and a secondary mounting surface that is opposite the primary mounting surface. The primary mounting surface of the first circuit board is arranged in an inverted orientation to the primary mounting surface of the second circuit board. A radiator with fins is provided on the secondary mounting surface side of the first circuit board.

Abstract: The present invention provides a display apparatus that can achieve high durability by making the most of the function of the exhaust fans to effectively suppress the rise of the temperature. The display apparatus comprises a display panel for displaying images, a rear case covering a rear side of the display panel, and an exhaust fan disposed within the rear case, wherein the rear case includes a first air-hole area and a second air-hole area each provided with a plurality of air holes, the first air-hole area is located at a higher level than the second air-hole area with respect to a vertical direction with a spacing therebetween, and at least partially faces the exhaust fan, and an area surrounded by the first air-hole area, the second air-hole area and external common tangents thereof is a shielded area in which no air hole is provided.

Abstract: A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.

Abstract: An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment having a front, a rear, a top, a bottom and two sides is disposed between the side wall and the manifold. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment.

Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

Abstract: A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.

Abstract: An airflow conducting apparatus is used for dissipating heat from at least one memory module received in a corresponding socket on a motherboard. The airflow conducting apparatus includes an airduct and a valve piece. The airduct is positioned over the socket and configured to guide air to flow therethrough. The valve piece is attached to an inside of the airduct. The valve piece includes a plurality of parallel elastic flaps. Each flap has at least one configuration that deflects air flowing through the airduct.

Abstract: A mobile, modular communications device, featuring a multiple-slot base chassis designed to support a plurality of individual user-configurable and interchangeable personality modules, capable of providing the ability to accept secure/classified user communications, including voice, data and video, the means to encrypt or secure such user communications through either internal or external encryption capabilities, the means to optimize the secure voice, data and video communications for transmission across a remote reachback communications link and the ability to provide multiple network/uplink reachback transmission alternatives, such as local area networks, satellites, cellular, ISDN or other forms of fixed or wireless communications. The invention is intended to provide a standardized, structured and modular approach to the provisioning of different technologies within the overall system and to be capable of being deployed as a man-carry or rack-embedded unit.

Abstract: According to one embodiment, a housing for a pedestal canister includes a first side plate and a fan. The first side plate includes a plurality of fins disposed on an exterior portion of the first side plate. The fan is coupled to the exterior portion of the first side plate. The pedestal canister is configured to be disposed within a pedestal aperture of a pedestal mounting block.

Abstract: An electronic device with a heat dissipation mechanism includes a main body, at least one supporting member, at least one driving device, a temperature sensor, and a controller. The main body defines a plurality of heat dissipation holes and at least one through hole. The heat dissipation holes are configured for dissipating heat of the electronic device. The supporting member passes through the through hole, and one end of the supporting member protrudes from the bottom of the main body. The driving device is configured for driving the supporting member to move along its axis, causing the electronic device to be kept in a flat state or in an inclined state. The temperature sensor is for sensing the temperature of the electronic device. The controller is for driving the driving device, causing the supporting member to move a predetermined distance along its axis, according to the sensed temperature.

Abstract: In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

Abstract: A cooling system including one or more piezo fans for an electronic assembly is disclosed. The electronic assembly may include heat-generating components coupled with a front side of a printed circuit board (PCB) and one or more piezo fans coupled with a back side of the PCB. One or more piezo fans may be capable of cooling the heat-generating components from the back side. The cooling system may further include a heat sink coupled with the back side of the PCB.

Abstract: In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.

Abstract: A high-velocity low-pressure cooling system (100), especially suited for data center applications, includes an air coolant loop (102), a non-air coolant loop (104) and a cooler unit (126) for heat transfer between the loops (102 and 104). The air loop (102) is used to chill ambient air that is blown across heat transfer surfaces of equipment mounted in data center racks (110). In this manner, effective cooling is provided using a coolant that is benign in data center environments.

Abstract: A notebook computer with a tilting keyboard, which opens a vent when tilted, solves multiple problems and may further materially contribute to countering terrorism. A tilted position of the keyboard allows the vent to open when the notebook lid is open, thereby providing extra cooling capacity during periods of computer use when there is a lessened need for compactness. The vent is it least partially closed when the keyboard is in the stowed position and the lid is closed, thereby reducing the possibility of debris ingestion when air flow needs are reduced and the need for compactness is increased. A security inspection position of the keyboard enables inspection of the inside of the computer, for example as part of a security checkpoint procedure. A negative tilt can reduce wrist strain and repetitive motion injuries for some users. Some embodiments tilt the keyboard automatically in response to the lid opening, and stow the keyboard automatically in response to the lid being closed.

Abstract: A waterproof casing for a power supply has a lower casing, an upper casing, an inlet cover and an outlet cover. The lower cover contains electronic components. The upper casing is mounted on the opening of the lower casing and has an inlet cavity, at least one inlet, an outlet cavity and at least one outlet. The at least one inlet and outlet are formed through the upper casing and respectively communicate with the inlet cavity and outlet cavity. The inlet cover and outlet cover respectively seal the inlet cavity and the outlet cavity, communicate the inlet cavity and the outlet cavity with the lower casing to allow the air to flow inside the casing and to keep the water from flowing in the inlet cavity and the outlet cavity. Structure of the waterproof casing is simplified, so benefits manufacturing.

Abstract: In an electric connection box, a heat insulation wall is vertically extended in a case. This forms, between the heat insulation wall and the inner wall of the case, an ascending flow path where air can ascend and a descending flow path where air can descend. An upper communication opening and a lower communication opening that connect between the ascending flow path and the descending flow path are arranged at the upper end and the lower end, respectively, of the heat insulation wall. A relay is placed in the ascending flow path. Among the regions of the case, a region forming the descending flow path is provided with a heat radiation wall section for releasing heat of air in the descending flow path to the outside of the case.

Abstract: Reversible airflow in cooling systems of electronic devices is described. For example, an electronic device may include a reversible fan tray. The fan tray may include symmetric mounting features that allow the fan tray to be mounted in the electronic device in more than one orientation at the same location within the electronic device such that one or more fans in the fan tray either direct air into the electronic device or to pull air from electronic device. The fan tray may further include a symmetric arrangement of connectors that coincide with the symmetric arrangement of mounting features to allow the fan tray to be connected to a power source of the electronic device any of the more than one orientations. An arrangement of electronic devices including reversible fan trays may be configured so that inlet and outlet airflows are separated to increase cooling efficiency of the electronic devices.

Abstract: An electrical apparatus having a cooling system includes a first cover to cover a first part of the electrical apparatus to be cooled and a second cover substantially enclosing the first cover to define a surrounding space. A base plate on which the first cover is mounted defines an environmentally-sealed enclosure that houses the first part of electrical apparatus. A first circulation device causes air to circulate in the environmentally-sealed enclosure and a second circulation device causes a cooling fluid to circulate around the surrounding space. A heat transfer structure is positioned on each side of the first cover. A third cover is mounted to an opposite side of the base plate from the first cover to define a second enclosure that houses a second part of the electrical apparatus to be cooled. A heat exchange structure is positioned within the second enclosure. The second circulation device is arranged to drive cooling fluid both through the heat exchange structure and through the surrounding space.

Abstract: An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.

Abstract: Systems and methods for Venturi fan-assisted cooling of electrical equipment are provided. In one embodiment, a cooling unit for an enclosure housing electronics is provided. The cooling unit comprises: a fan shroud having at least one electrical fan; and a Venturi chamber having a first inlet for receiving a heated airflow from a heatsink, a second inlet for receiving an airflow from a surrounding environment, and an outlet coupled to the fan shroud, the fan drawing air from the Venturi chamber via the outlet when the fan is on. The Venturi chamber comprises a wall for directing the airflow air from the surrounding environment in from the second inlet and across the heated airflow from the heatsink in a manner to as to draw the heated airflow through the heatsink using a Venturi effect, when the fan is on.

Abstract: In a disk array apparatus, by taking note of a first sound of a specific frequency which is a noise element of original sounds generated from a fan, a second sound whose phase is inverted to that of the first sound is generated by a structure of a cooling air flow path passing through the fan, and the second sound is synthesized with the first sound on the cooling air flow path, thereby reducing the noise. For example, an exhaust duct is located on a fan unit in an upper part of the apparatus, two flow paths extending to an exhaust port are formed in an internal structure of the exhaust duct, and the two flow paths are designed so that the difference in the flow path length therebetween becomes equivalent to half wavelength of the specific frequency.

Abstract: An electronic device including a base and a pluggable unit is provided. The base includes a first heat sink having a first heat-transfer contacting surface. The pluggable unit includes a second heat sink and a heat source. The second heat sink has a second heat-transfer contacting surface. When the pluggable unit is plugged in the base, the first heat-transfer contacting surface gets in contact with the second heat-transfer contacting surface.

Abstract: A cooling fan module is disclosed. The cooling fan module includes a module housing, a fan assembly, a fan control circuit board, and an electrical connector. The fan assembly is disposed within the module housing and includes a fan housing, a motor disposed within the fan housing, and a blade assembly coupled to the motor. The fan control circuit board is disposed between the module housing and the fan housing, and is coupled to the motor. The electrical connector is coupled to the fan control circuit board and projects outside of the module housing.

Abstract: A tray-type structure device includes a side plate, a front plate attached to a forward end of the side plate, having the functions of opening and closing, and positioned on the front side of a housing, a top plate attached to an upper end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, a bottom plate attached to a lower end of the side plate, with a plurality of openings formed therein, and having the function of variably setting a ventilation resistance, and a back plate attached to a rearward end of the side plate, having the functions of opening and closing, and positioned on a side of the housing toward a backboard. The device has a tray structure having a tray-like shape formed by the front plate, top plate, bottom plate, side plate and back plate.

Abstract: A portable high-voltage test instrument comprises an electronic unit having means for producing a test voltage located in the kV range, a control area cooperating with the electronic unit, at least one terminal for the component or cable to be tested and for an external voltage supply, a housing for permanently accommodating the electronic unit and a cooling system, disposed inside the housing, for cooling the electronic unit, the cooling system comprising an air-cooled assembly having an air inlet and an air outlet. This housing is provided with a lid part that can be moved between an open and a closed position, such that all terminals, the control area and the air inlet and air outlet are covered in closed position thereof, whereas all terminals, the control area and the air inlet and air outlet are unobstructed in open position thereof.

Abstract: A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

Abstract: An electronic device includes a chassis enclosing a fan and a sliding member. The chassis defines an air intake aligned with an inlet of the fan, and an opening. The sliding member is slidably mounted to the chassis and includes an operation part exposing through the opening. The sliding member is capable of either fully or partially covering and uncovering the air intake of the chassis via manipulating the operation part to slide in the opening.

Abstract: An integrated active cooled cabinet/rack for electronic equipments. An aspect of the present invention is to provide a control unit for the cabinet, that enables individual equipment monitoring and control and thereby ensure that the equipment housed in the cabinet and generating the highest level of heat is cooled down to an acceptable preset temperature.

Abstract: Device with integrated electronic components, that comprises a board forming a support for the said components, a cover mounted on the said board to cover the said components, and a separating partition which extends from the cover to the board substantially perpendicularly to the latter, the said partition separating two distinct zones of the board, wherein it comprises an overcover covering the cover and defining an internal space between the cover and the overcover in which are provided cooling gas division means delimiting two distinct secondary spaces in the internal space, an upstream secondary space into which cooling gas is able to be injected and a downstream secondary space into which cooling gas is able to be discharged so that cooling gas injected into the upstream zone of the board is directed toward the downstream secondary space of the internal space and that cooling gas injected into the upstream secondary space of the internal space is directed toward the downstream zone of the board.

Abstract: An electrical component may include a vent located in a mounting portion of a case to vent a blast from within the case. A chassis may have a mounting site for an electrical component, wherein the mounting site includes a passage to receive a blast from the electrical component. A system may include a chassis having a mounting site to engage a mounting portion of a case for an electrical component, wherein the mounting portion of the case includes a vent, and the chassis forms at least a portion of a blast chamber to receive a blast from the vent.

Abstract: A baffle manages airflow through optionally mounted electronic components by using flexible members formed to extend to empty connectors and flex away from the connectors to accommodate electronic components mounted to the connectors.