Abstract: Disclosed herein is a substrate embedding an electronic component and a method of manufacturing the substrate embedding an electronic component, the substrate embedding an electronic component including a first insulating part having the electronic component positioned therein, the electronic component being provided with terminals on a surface thereof; a first pattern layer provided at a lower portion of the first insulating part; a second pattern layer provided at an upper portion of the first insulating part; and a conductive film structure provided between at least one the first and second pattern layers and the terminal and electrically connecting the pattern layer to the terminal, and being advantageous for a decrease of the number of layers of a structure of the substrate embedding an electronic component and slimness.

Abstract: A wiring board has a surface formed with a chip mounting area to which a chip component is mounted and includes embedded therein first and second multilayer capacitors, each of which has inner electrode layers laminated in a lamination direction. The first multilayer capacitors are embedded in a peripheral region of the wiring board immediately below a peripheral edge of the chip mounting area and a vicinity of the peripheral edge of the chip mounting area such that the lamination direction of the inner electrode layers of the first multilayer capacitors is perpendicular to the surface of the wiring board. The second multilayer capacitors are embedded in any other regions of the wiring board inside and outside the peripheral region such that the lamination direction of the inner electrode layers of at least one of the second multilayer capacitors is parallel to the surface of the wiring board.

Abstract: The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.

Abstract: A substrate with built-in electronic component includes: a core layer that includes a core material and a cavity formed in the core material and containing an insulating material; an insulating layer that includes a ground wiring and a signal wiring and is formed on the core layer; and a plurality of electronic components that each include a first terminal and a second terminal and are stored in the cavity, the plurality of electronic components each having one end portion and the other end portion, the first terminal being formed at the one end portion and connected to the ground wiring, the second terminal being formed at the other end portion and connected to the signal wiring, the plurality of electronic components having at least one of arrangements in which the first terminals face each other and in which the second terminals face each other.

Abstract: The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device.

Abstract: A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure.

Abstract: Devices and methods for constructing low-profile, minimal-thickness electronic devices using existing production techniques are disclosed in this application. An electronic component and interposer form a sub-assembly. The sub-assembly is placed in an aperture in a circuit board with the interposer providing interconnections between the electronic component and the circuit board. Such placement conceals the thickness of the integrated circuit within the thickness of the circuit board, reducing overall thickness.

Abstract: A method of manufacturing a wiring board for use in mounting of an electronic component includes: forming an outermost wiring layer on a surface side where the electronic component is mounted; forming an insulating layer so as to cover the wiring layer; and forming a concave portion in the insulating layer. The concave portion is formed by removing, using a mask formed in a required shape by patterning, an exposed portion of the insulating layer in a step-like shape until a surface of a pad defined at a portion of the wiring layer is exposed. The concave portion is preferably formed by removing the portion of the insulating layer by sand blast.

Abstract: Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.

Abstract: A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer.

Abstract: A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.

Abstract: Embodiments of the present invention are directed to shifting the resonant frequency in a high-frequency chip package away from an operational frequency by connecting a capacitance between an open-ended plating stub and ground. One embodiment provides a multi-layer substrate for interfacing a chip with a printed circuit board. A first outer layer provides a chip mounting location. A signal interconnect is spaced from the chip mounting location, and a signal trace extends from near the chip mounting location to the signal interconnect. A chip mounted at the chip mounting location may be connected to the signal trace by wirebonding. A plating stub extends from the signal interconnect, such as to a periphery of the substrate. A capacitor is used to capacitively couple the plating stub to a ground layer.

Abstract: A printed circuit board according to one example embodiment includes a Z-directed component mounted in a mounting hole in the printed circuit board. The Z-directed component includes a body having a top surface, a bottom surface and a side surface. Four conductive channels extend through a portion of the body along the length of the body. The four conductive channels are spaced substantially equally around a perimeter of the body. An integrated circuit is mounted on a surface of the printed circuit board. The integrated circuit has a ball grid array that includes four conductive balls electrically connected to a corresponding one of the four conductive channels of the Z-directed component.

Abstract: A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element having a plurality of electrode pads disposed on upper and lower surfaces thereof, the passive element being embedded in the dielectric layer unit and corresponding to the positioning pad; a first circuit layer disposed on the top surface of the dielectric layer unit, the first circuit layer having first conductive vias electrically connected to the electrode pads disposed on the upper surface of the passive element; and a second circuit layer disposed on the bottom surface of the dielectric layer unit, the second circuit layer having second conductive vias electrically connected to the electrode pads disposed on the lower surface of the passive element. Through the embedding of the passive element, the overall structure may have a reduced height.

Abstract: A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole.

Abstract: Systems and methods for providing biologically compatible pockets or envelopes that can contain chips and other circuit elements and can make electrical connection between those elements and living organisms. The assembled biologically compatible pockets and circuit components can have biomedical applications, such as bioimplantable devices such as retinal, cochlear and cortical prosthesis implants, muscular stimulators, and other uses. In various embodiments, the described technology explains how to make and use pocket systems for dealing with chips having connectors on one or two surfaces, and with other circuit components such as resistors, capacitors, inductors and transistors. Operation of chips encapsulated according to the described technology is demonstrated. Accelerated life testing suggests that the pocket systems described will survive for years at 37 degrees C.

Abstract: Provided is a structure and disposing method of a radio frequency (RF) layered module using three dimensional (3D) vertical wiring. A first wafer in the RF layered module having the 3D vertical wiring may include a first RF device and at least one first via-hole. A second wafer may include a second RF device and at least one second via-hole disposed at a location corresponding to the at least one first via-hole. A vertical wiring may connect the at least one first via-hole and the at least one second via-hole. The vertical wiring may be configured to be connected to an external device through a bottom surface of the at least one first via-hole or a top surface of the at least one second via-hole.

Abstract: A single-layer component package comprising: a single conductive-pattern layer having a first surface; an insulating-material layer on the first surface of the single conductive-pattern layer; in an installation cavity inside the insulating-material layer, a semiconductor component having flat contact zones; and solid contact pillars containing copper and solderlessly, metallurgically and electrically connecting the flat contact zones to the single conductive-pattern layer.

Abstract: A component built-in board of multi-layer structure that has a plurality of unit boards stacked therein and is configured having a plurality of electronic components built in thereto in a stacking direction, wherein the plurality of unit boards include: a double-sided board that includes a first insulating layer, a first wiring layer formed on both surfaces of the first insulating layer, and a first interlayer conductive layer that penetrates the first insulating layer and is connected to the first wiring layer, and that comprises an opening in which the electronic component is housed; and an intermediate board that includes a second insulating layer, a first adhesive layer provided on both surfaces of the second insulating layer, and a second interlayer conductive layer that penetrates the second insulating layer along with the first adhesive layer, and the double-sided board is disposed above and below the intermediate board.

Abstract: An electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides and with at least one electronic component arranged in a cutout of the first layer, wherein the first layer is covered in each case with an electrically insulating, thermally conductive layer and a further layer composed of electrically conductive material is provided in each case on the thermally conductive layer, the further layer being coated in each case with a covering layer composed of electrically conductive material, and furthermore having plated-through boles composed of the material of the covering layer, which extend through the electrically insulating, thermally conductive layer covering the electronic component and the further layer composed of electrically and thermally conductive material for the purpose of making contact with the electronic component.

Abstract: A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and the set of electrical contacts of the second substrate is aligned with the set of electrical contacts of the first substrate. The sets of electrical contacts of the first and second substrate are compressed to displace the liquid curable adhesive from the inter-contact region, and provide electrical communication between the respective sets of electrical contacts. The liquid curable adhesive is then cured to form a solid matrix which maintains a relative compression between the respective sets of electrical contacts. One embodiment of the module comprises a high-speed superconducting circuit which operates at cryogenic temperatures.

Abstract: In a high-frequency module, a laminate including a plurality of dielectric layers each including an electrode pattern located thereon, and a switch element which includes a test terminal arranged to output a negative voltage applied to the switch element and which is mounted on the laminate, are integrally formed. A test external terminal for external connection which outputs a signal to the outside is provided on a back surface of the laminate. The laminate includes a voltage transmission path electrically connecting the test terminal to the test external terminal.

Abstract: A ceramic multilayer substrate incorporating a chip-type ceramic component, in which, even if the chip-type ceramic component is mounted on the surface of the ceramic multilayer substrate, bonding strength between the chip-type ceramic component and an internal conductor or a surface electrode of the ceramic multilayer substrate is greatly improved and increased. The ceramic multilayer substrate includes a ceramic laminate in which a plurality of ceramic layers are stacked, an internal conductor disposed in the ceramic laminate, a surface electrode disposed on the upper surface of the ceramic laminate, and a chip-type ceramic component bonded to the internal conductor or the surface electrode through an external electrode. The internal conductor or the surface electrode is bonded to the external electrode through a connecting electrode, and the connecting electrode forms a solid solution with any of the internal conductor, the surface electrode, and the external electrode.

Abstract: A wiring substrate includes an electronic component and a core substrate. A through hole extends through the core substrate and accommodates the electronic component, which includes a main body and connection terminals. The main body includes opposing first side surfaces, opposing second side surfaces, and opposing third side surfaces. The connection terminals cover the first side surfaces. First projections project from walls of the through hole toward the first side surfaces. Each first projection includes a distal end that contacts one of the connection terminals. Second projections project from walls of the through hole toward the second side surfaces. The opposing second projections include distal ends spaced apart by a distance longer than the distance between the second side surfaces and shorter than the distance between two farthest points on a periphery of each first side surface.

Abstract: Printed circuit boards are provided with embedded components. The embedded components may be mounted within recesses in the surface of a printed circuit board substrate. The printed circuit board substrate may have grooves and buried channels in which wires may be mounted. Recesses may be provided with solder pads to which the wires may be soldered or attached with conductive adhesive. An integrated switch may be provided in an opening within a printed circuit board substrate. The integrated switch may have a dome switch member that is mounted within the opening. A cover member for the switch may be formed from a flexible layer that covers the dome switch member. Terminals for the integrated switch may be formed from conductive structures in an interior printed circuit board layer. Interconnects may be used to electrically connect embedded components such as switches, integrated circuits, solder pads for wires, and other devices.

Abstract: An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts.

Abstract: There is provided a wiring board including a first stiffener, one face of which is bonded to a circuit board, a second stiffener having a disposition hole in which an electronic component is disposed, and a laminate that is formed by laminating a plurality of insulating layers and a plurality of wiring layers between the other face of the first stiffener and one face of the second stiffener, and includes a terminal connection part that is connected to the wiring layers, positioned in the disposition hole, and connected to a terminal part of the electronic component.

Abstract: A component built-in board mounting body has a component built-in board mounted on a mounting board, the component built-in board being configured having stacked therein a plurality of printed wiring bases that each have a wiring pattern and a via formed on/in a resin base thereof, and having an electronic component built in thereto, wherein the component built-in board has at least a portion of the plurality of printed wiring bases including thermal wiring in the wiring pattern and including a thermal via in the via, and is mounted on the mounting board via a bump formed on a surface layer of the component built-in board, and a surface on an opposite side to an electrode formation surface of the built in electronic component is connected to the bump via the thermal via and the thermal wiring, and is thermally connected to the mounting board via the bump.

Abstract: A circuit board for an optoelectronic semiconductor chip includes an electrically conductive first metal foil, a first electrically insulating foil, an electrically conductive second metal foil, wherein the first electrically insulating foil is applied to the first metal foil at a top side of the first metal foil and mechanically connects thereto, the first electrically insulating foil has a recess in which the first metal foil is exposed, the recess electrically conductively fixes the optoelectronic semiconductor chip to the first metal foil within the recess, the second metal foil is applied at a top side of the first electrically insulating foil, the top side facing away from the first metal foil, and mechanically connects to the electrically insulating foil, the first electrically insulating foil is free of the second metal foil at least in the region of the recess, and the second metal foil electrically contacts the optoelectronic semiconductor chip.

Abstract: The present invention provides a method for embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blind vias are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. With this methodology a resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.

Abstract: A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate.

Abstract: A circuit substrate includes: a laminate substrate in which a conductive layer and an insulating layer are laminated; a filter chip that has an acoustic wave filter and is provided inside of the laminate substrate; and a chip component that is provided on a surface of the laminate substrate and is connected to the filter chip, at least a part of the chip component overlapping with a projected region that is a region of the filter chip projected in a thickness direction of the laminate substrate.

Abstract: A substrate with built-in passive element includes passive elements and a substrate. The passive elements include at least one of a capacitor, an inductor, a resistor, a signal transmission element or an optical waveguide element. The capacitor, the inductor, the resistor, the signal transmission element or the optical waveguide element has a functional element filled in a groove-like or hole-like element forming region provided in the substrate along a thickness direction thereof. The functional element has a Si—O bond region obtained by reacting Si particles with an organic Si compound.

Abstract: A semiconductor device includes a first wiring board, a second semiconductor chip, and a second seal. The first wiring board includes a first substrate, a first semiconductor chip, and a first seal. The first semiconductor chip is disposed on the first substrate. The first seal is disposed on the first substrate. The first seal surrounds the first semiconductor chip. The first seal has the same thickness as the first semiconductor chip. The second semiconductor chip is stacked over the first semiconductor chip. The first semiconductor chip is between the second semiconductor chip and the first substrate. The second semiconductor chip is greater in size in plan view than the first semiconductor chip. The second seal seals at least a first gap between the first semiconductor chip and the second semiconductor chip.

Abstract: An electronic component or the like is mounted on a substrate, and on the electronic component, an insulating layer is provided. Afterward, via-holes V are made in the insulating layer on terminals of the electronic component. Each of the terminals of the electronic component has, for example, a laminate structure of a first metal layer, a second metal layer and a third metal layer. When the via-holes V are formed, part of the third metal layer having a comparatively high electric resistance is removed, and the corresponding portion is connected to a wiring layer including via-conductors. Moreover, the third metal layer excellent in close contact properties with the insulating layer is preferably used.

Abstract: An electrical assembly having controlled impedance signal traces and a portable electronic device comprising an electrical assembly having controlled impedance signal traces are provided. In accordance with one embodiment, there is provided a portable electronic device, comprising an electrical assembly, comprising: a chassis made from a conductive material and forming a first ground plane; a first dielectric substrate layer overlaying the chassis; a first signal trace overlaying the first dielectric substrate layer; and a second dielectric layer overlaying the first signal trace.

Abstract: A printed circuit board that include: an electronic component having a plating electrode pad having a predetermined thickness; an insulating resin layer that exposes a lower surface of the electrode pad, receives the electronic component, and embodies the electronic component so that the center of the base body forming the electronic component is positioned at the center of the insulating resin layer; and circuit layers that include a circuit pattern disposed on the electrode pad, form inter-layer connection, and are disposed on both surfaces of the insulating resin layer, respectively, the plating electrode pad having a thickness that conforms to a thickness from an upper surface of the electronic component to an upper surface of the insulating resin.

Abstract: A carrier with three-dimensional capacitor includes a substrate and a three-dimensional capacitor, wherein the substrate comprises a trace layer having a first terminal and a second terminal. The three-dimensional capacitor is integrally formed as one piece with the trace layer. The three-dimensional capacitor and the trace layer are made of same material. The three-dimensional capacitor comprises a first capacitance portion and a second capacitance portion, the first capacitance portion comprises a first section, a second section and a first passage, the second capacitance portion is formed at the first passage. The second capacitance portion comprises a third section, a fourth section and a second passage communicated with the first passage. The first capacitance portion is located at the second passage, a first end of the first capacitance portion connects to the first terminal, and a third end of the second capacitance portion connects to the second terminal.

Abstract: A substrate embedding a passive element includes a first conductor pattern layer disposed on a lower surface thereof and a second conductor pattern layer disposed on an upper surface thereof; a first via electrically connecting between the passive element and the first conductor pattern layer; and a second via electrically connecting between the passive element and the second conductor pattern layer, in which a volume of the first via is larger than that of the second via.

Abstract: A printed circuit board with embedded component includes a double-sided printed circuit board, an electronic component, a plurality of conductive paste blocks, an insulating layer and a wiring layer near the first wiring layer, an insulating layer and a wiring layer near the second wiring layer. The double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer. The first wiring layer and the second wiring layer are arranged on opposite sides of the base. The second wiring layer includes a plurality of electrical contact pads. The base defines a number of conductive vias. Each electrical contact pad is aligned with and electrically connected to one corresponding conductive via. The conductive paste blocks are electrically connecting to the conductive vias. The electronic component is electrically connected to the conductive paste blocks. The two insulating layers cover the electronic component and the second wiring layer.

Abstract: Stacked arrays of components are disclosed. In one embodiment, a first and a second layer of components are electrically and mechanically coupled to an interposer with an encapsulated third layer of components disposed between the first and second layers. The first layer can be configured to attach the stacked array to a host printed circuit board. The interposer can couple signals between the components on the first and second layers.

Abstract: A multi-layer printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a second electrically-insulating layer, and a first electrically-conductive layer disposed between the first and second electrically-insulating layers. The second layer includes a third electrically-insulating layer and a second electrically-conductive layer. The first layer stack and/or the second layer stack include a cut-out area defining a void that extends therethrough.

Abstract: Sensitive electronic components can be mounted on a printed circuit board within an electronic device. To isolate a sensitive component from stresses that may arise during an unintended impact event, the electronic component can be isolated using a groove in the printed circuit board. The electronic component may be mounted to a component mounting region using solder balls. The component mounting region may be surrounded on some or all sides by the groove. Flex circuit structures that bridge the groove or a portion of the rigid printed circuit board may be used to hold the component mounting region in place. The flex circuit structures may be provided in the form of separate structures or may be provided as an integral portion of the printed circuit board.

Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

Abstract: The present invention relates to a core substrate, a manufacturing method thereof, and a substrate with built-in electronic components and a method for manufacturing the same. In accordance with an embodiment of the present invention, a core substrate including: a first insulating layer; and a second insulating layer stacked on upper and lower surfaces of the first insulating layer and made of a material with a glass transition temperature lower than that of the first insulating layer.

Abstract: An electronic in-mold label includes a substrate having a first surface and a second surface. The substrate includes an electronics mounting area on the second surface and an electronic circuit positioned in the electronics mounting area. When the electronic in-mold label is molded on to, or into, a plastic product, the electronic circuit is molded into the plastic product and is operable to perform a function.

Abstract: A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.

Abstract: A manufacturing method for a component built-in module, including: forming, in a sheet member including resin, a via hole filled up with a conductive paste, a cavity in which an electronic component is to be built, and an adjustment space; and performing a heat press allowing the sheet member to abut against a substrate on which the electronic component has been mounted, wherein the adjustment space is formed so that a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the electronic component, is cancelled by a flow vector of the resin in a neighborhood of the via hole during the heat press, which is directed toward the adjustment space.

Abstract: The present invention relates to an electronic component embedded printed circuit board and a method for manufacturing the same. An electronic component embedded printed circuit board of the present invention includes a core having a cavity; an electronic component inserted in the cavity and having a bonding coating layer on an outer peripheral surface; insulating layers laminated on and under the core and in contact with the bonding coating layer; and circuit patterns provided on the insulating layers.

Abstract: Substrates having power planes, such as, for example, printed circuit boards, include at least one noise suppression structure configured to suppress electrical waves propagating through at least one of a first power plane and a second power plane. The at least one noise suppression structure may include a first power plane extension that extends from the first power plane generally toward the second power plane, and a second power plane extension that extends from the second power plane generally toward the first power plane. Methods for suppressing noise in at least one of the first power plane and second power plane include providing such noise suppression structures between the power planes.