Abstract: A electronic medical thermometer (1) comprises a maincase (2) which is made substantially of transparent material. The main-case thermometer (1) has a display element (6) for displaying the temperature and the maincase (2) has a display area (7) through which the display element can be observed. The maincase (2) further has an additional transparent or translucent area (8), through which an interior member such as a subcase (17) or the decorative sheet (27) are provided with a colored or patterned surface.

Abstract: A heat loss gauge for measuring gas pressure in an environment includes a resistive sensing element and a resistive compensating element. The resistive compensating element is in circuit with the sensing element and is exposed to a substantially matching environment. An electrical source is connected to the sensing element and the compensating element for applying current through the elements. The current through the sensing element is substantially greater than the current through the compensating element. Measuring circuitry is connected to the sensing element and the compensating element for determining gas pressure in the environment to which the sensing element and compensating element are exposed based on electrical response of the sensing element and the compensating element.

Abstract: A temperature sensor comprises (a) a first voltage generating circuit that generates and outputs a first voltage having a positive or negative temperature coefficient in proportion to the absolute temperature; (b) a second voltage generating circuit that generates a second voltage having an opposite sign of temperature coefficient compared to the first voltage and outputs a reference voltage that does not have a temperature coefficient based on the second voltage; and (c) a comparator that compares the first voltage output from the first voltage generating circuit with the reference voltage output from the second voltage generating circuit.

Abstract: According to one exemplary embodiment, a test structure for determining electromigration and interlayer dielectric failure comprises a first metal line situated in a metal layer of the test structure. The test structure further comprises a second metal line situated adjacent and substantially parallel to the first metal line, where the second metal line is separated from the first metal line by a first distance, and where the first distance is substantially equal to minimum design rule separation distance. The test structure further comprises an interlayer dielectric layer situated between the first metal line and the second metal line. According to this exemplary embodiment, electromigration failure is determined when a first resistance of the first metal line or a second resistance of the second metal line is greater than a predetermined resistance, and interlayer dielectric failure is determined when a first current is detected between the first and second metal lines.

Abstract: An electronic clinical thermometer has a probe including a temperature sensor and a heat flux sensor which are controlled to make measurements at specified time intervals. The measured values are used in solving the equation of heat conduction to estimate the temperature of an internal body position. A heater may be included to preheat a body part in order to reduce the time required for measurement. The probe may use two temperature sensors to measure temperatures at two body surface positions through insulating members which are different in thermal conductivity.

Abstract: A temperature measuring sensor is incorporated in a substrate of a semiconductor device and has a diode, and resistor formed in the substrate and connected in series. When a first forward constant current is supplied to the diode through the resistor, a potential difference VA1 is produced between terminal ends of both the diode and the resistor, and a potential difference VF1 is produced between terminal ends of the diode. When a second forward constant current is supplied to the diode through the resistor, a potential difference VA2 is produced between the terminal ends of both the diode and the resistor, and a potential difference VF2 is produced between the terminal ends of the diode. A real temperature T of the substrate is calculated by the following formula: T=(q/k)(VF1?VF2)[1/[ln((VA1?VF1)/(VA2?VF2))]] herein: T is an absolute temperature, k is Boltzmann's constant, and q is an electron charge.

Abstract: A fire sensor comprising a heat detection element for detecting heat from a hot airflow generated by a fire, a sensor main body, and an outer cover, which has a plurality of plate fins protruding from the sensor main body, for protecting the heat detecting element. The plate fins have a predetermined offset angle to a center line passing through the center of the outer cover and are erected approximately perpendicular to the sensor main body.

Abstract: A heat loss gauge for measuring gas pressure in an environment includes a resistive sensing element and a resistive compensating element. The resistive compensating element is in circuit with the sensing element and is exposed to a substantially matching environment. An electrical source is connected to the sensing element and the compensating element for applying current through the elements. The current through the sensing element is substantially greater than the current through the compensating element. Measuring circuitry is connected to the sensing element and the compensating element for determining gas pressure in the environment to which the sensing element and compensating element are exposed based on electrical response of the sensing element and the compensating element.

Abstract: A sensor, especially a temperature sensor, has a measuring resistor (7) including a substrate with an electrically insulating surface and a resistor layer situated thereon, which is enclosed by a housing (6) having current lead-ins to a plug system (1) for connection leads or contact pins (10) in a region of the housing facing away from the measurement. The measuring resistor (7) is arranged in the region of an end (14) of the housing facing the measurement, and between the measuring resistor (7) and the contact pins (10) at least one spacing element (9) of electrically insulating material is provided with lateral recesses for guiding the electrical connection leads (12) which extend from the measuring resistor (7). The temperature sensor can be simply adapted by variable configuration of the plug system and spacing element to various types of customer-specific requirements.

Abstract: A rapid response electronic clinical thermometer is disclosed. The clinical thermometer comprises a measuring end portion adhered to a metal head portion having a temperature sensing element and a conductive wire joining the temperature sensing element, characterized in that the conductive wire is adhered to the inner wall of the metal head portion such that the conductive wire is not a heat dissipation portion for heat energy surrounding the sensing element, and further acts as a source of heat energy compensation so as to indicate the accurate temperature, reducing the temperature measuring time.

Abstract: An electronic thermometer is constructed to include a casing, an electronic thermometer module mounted in the casing, a metal probe electrically connected to the electronic thermometer module for sensing the body temperature, an integrally formed flexible covering covered on the casing, and a hard stem connecting the metal probe to the distal end of the tapered front portion of the flexible covering, whereby the stress produced at the time when the measuring end is bent for measuring body temperature will be concentrated at a root portion with a larger inner diameter thereby preventing the measuring end from breaking and ensuring safety in operation. Furthermore, the flexible covering appropriately encloses the casing and has a tapered front portion protruded over the front side of the casing to a distance and has an integrally formed push button, locating flange, and embossed portions for waterproof, decoration and holding convenience thereby reducing manufacturing process and lowering the cost.

Abstract: An apparatus compensates for voltage and temperature variations on an integrated circuit with: a voltage sensor having a digital voltage output; a temperature sensor having a digital temperature output; a register coupled to the voltage sensor and the temperature sensor, the register adapted to concatenate the digital voltage output and the temperature output into an address output; and a memory device having an address input coupled to the address output of the register, the memory device being adapted to store one or more corrective vectors.

Abstract: At least one forward-biased semiconductor diode having a potential barrier is used as a temperature sensor whose sensitivity can be finely adjusted. An operational amplifier circuit (A1) is used to apply a bias voltage of DC or rectangular waveform to a semiconductor diode (D) having a potential barrier used as a temperature sensor. In view of the fact that the temperature sensitivity of the semiconductor diode (D) depends on the height of its potential barrier, the forward bias voltage applied from a bias circuit (2) directly to the semiconductor diode (D) is finely adjusted to obtain desired temperature sensitivity. The output voltage of the sensor is associated with a current, having an exponential temperature dependence, which flows in the semiconductor diode (D) with the forward bias being fixed.

Abstract: An electronic fever thermometer includes a housing made of a transparent material, for example, transparent plastic. The housing includes a temperature sensor to measure the temperature, and a display element to display the measured temperature. The housing has a treated outer and/or inner surface so that the housing is essentially nontransparent to visible light. The housing also has an untreated viewing area. The display element is arranged within the housing adjacent to the viewing area.

Abstract: A furnace temperature detector includes a spike thermocouple attached to a heating chamber; an overheat thermocouple attached to the heating chamber; an inner thermocouple installed inside a reaction tube; a temperature controller connected to the spike thermocouple and the inner thermocouple; an overheat controller connected the overheat thermocouple; and a control switch for directing the output line of the overheat thermocouple. When the furnace overheats, the overheat thermocouple detects the overheating and generates and outputs an electric signal corresponding to the overheating to the overheat controller; the overheat controller generates and outputs an overheat control signal.

Abstract: An electronic thermometer includes a display device for displaying a temperature of an associated object under temperature measurement in a predetermined display digit number. A temperature measurement device generates a temperature measurement signal based on the temperature of the associated object. A computation device is provided for computing a temperature value of a digit number larger than the predetermined display digit number to be displayed on the display device on the basis of the temperature measurement signal. A control device controls the display device to display a first temperature value portion and a second temperature value portion. The first portion is displayed with a first set of predetermined digits and the second portion is displayed with a second set of predetermined digits, including any digit or digits other than the first predetermined digits.

Abstract: The present invention relates to a temperature measurement device, particularly to a temperature measurement device for the cold junction of a non-contact temperature measurement element, characterized in that a plurality of electrical-conductive pins is provided on the bottom surface of a base.

Abstract: A device for measuring the temperature within a body from a body surface at a different temperature, comprising: a heat shield for application to the body surface, comprising an outer heat-conducting portion (52), and an inner heat-insulating portion (50); a heater or cooler (41) to heat or cool the outer portion (52) of said heat shield to the temperature of the body surface; a first temperature sensor (37) positioned on a surface of the inner heat-insulating portion (50) of the heat shield which is applied to the body surface; a second temperature sensor (38) positioned to measure the temperature of the outer portion (52) of the heat shield; a heater or cooler control circuit to heat or cool the outer portion (52) of the heat shield towards the temperature measured by the first the first temperature sensor (37); and a second control circuit to forecast the first temperature sensor (37) equilibrium temperature.

Abstract: Methods, Systems, and Devices for Evaluation of Thermal Treatment. A magnetically detectable particle and related methods, systems, and devices are provided for generating a temperature measurement for a batch or a continuous stream of material. The particle can include a first and second magnet each comprising a positive and negative pole. The particle can also include an adhesive having a release temperature and operable to attach one or both of the positive and negative poles of the first magnet proximate to the same polarity pole of the second magnet or to attach one of the positive and negative poles of the first magnet between the poles of the second magnet below the release temperature such that a first magnetic field is generated by the first and second magnet. The adhesive can also be operable to release the first and second magnets from one another above the release temperature.

Abstract: A circuit is arranged to provide a thermal shutdown signal in response to an overtemperature condition. The thermal shutdown circuit is typically implemented in the same die as the circuitry that is to be protected. The thermal shutdown circuit provides a first current in response to a change in temperature when a VBE associated with a transistor decreases below a predetermined level. The first current is mirrored to provide a scaled current. A thermal shutdown signal is activated when the scaled current becomes greater than a reference current. The first current is increased in response to the activated thermal shutdown signal such that the thermal shutdown circuit is deactivated at a temperature that is lower than the temperature at which the circuit is activated. The thermal shutdown circuit is deactivated when the temperature of the die decreases.

Abstract: A method of generating a temperature measurement for a batch or a continuous stream of material. The method includes providing a particle having a signal that changes at a pre-determined temperature; inserting the particle into the batch or continuous stream; and detecting a signal change from the particle to thereby generate a temperature measurement for the batch or continuous stream. A suitable system for use in carrying out the method is also described.

Abstract: A temperature measuring device includes a temperature-responsive element that mechanically moves a first inductive assembly component relative to a second inductive assembly component in response to temperature changes. The movement of the first inductive assembly component relative to the second inductive assembly component generates a change in a local eddy current pattern that corresponds to the sensed temperature.

Abstract: A contact measurement probe for measuring a temperature of a substrate in a process environment includes a probe head having a contact surface made of a ceramic material or a polymeric material for contacting the substrate. The contact measurement probe eliminates electrical biasing effects in process environments that include an ion source, thereby providing greater accuracy and reproducibility in temperature measurement.

Abstract: An integrated sensor comprising a thermopile transducer and signal processing circuitry that are combined on a single semiconductor substrate, such that the transducer output signal is sampled in close vicinity by the processing circuitry. The sensor comprises a frame formed of a semiconductor material that is not heavily doped, and with which a diaphragm is supported. The diaphragm has a first surface for receiving thermal (e.g., infrared) radiation, and comprises multiple layers that include a sensing layer containing at least a pair of interlaced thermopiles. Each thermopile comprises a sequence of thermocouples, each thermocouple comprising dissimilar electrically-resistive materials that define hot junctions located on the diaphragm and cold junctions located on the frame. The signal processing circuitry is located on the frame and electrically interconnected with the thermopiles.

Abstract: An electronic patch thermometer consists of a measuring apparatus attaching to or disposing on a targeted object (such as human body skin or a tongue surface, indoor or outdoor, surfaces of a container, water tanks, and the likes) and a receiving apparatus for receiving signals measured by the measuring apparatus. When the receiving apparatus is moved nearby the measuring apparatus and a measuring switch located on the receiving apparatus is pressed, the receiving apparatus generates a magnetic field transmitting to the measuring apparatus to generate electric power required. The measuring apparatus measures and induces temperature signals of the targeted object and transmits the signals by radio waves to the receiving apparatus which reads and displays the temperature value of the targeted object.

Abstract: Techniques for preventing an integrated circuit (IC) from overheating are described herein. According to one embodiment, an exemplary process includes detecting whether a temperature of an integrated circuit (IC) exceeds a threshold independent of an operating state of the IC, and removing at least a portion of a power from the IC if the temperature of the IC exceeds the threshold. Other methods and apparatuses are also described.

Abstract: An imager temperature sensor and a current correction apparatus are provided which use dark pixel measurements from an imager chip during operation together with a fabrication process constant as well as a chip dependent constant to calculate chip temperature. The chip temperature may be used to generate a current correction signal. The correction signal is used to tune a current on the imager chip to correct for temperature variations.

Abstract: A control structure and method for controlling a sensor heater including a power supply connected to a switching device for pulse width modulating a voltage from the power supply. The switching device is further connected to a resistance heater. A microcontroller having a single output is connected to the switching device and a single input from the microcontroller is connected to a high side of the resistance heater. The microcontroller determines a pulse width modulation duty cycle to maintain a constant power dissipation of the resistance heater.

Abstract: A temperature probe for use in a medical thermometer. The temperature probe includes a probe body and a hollow tip member secured to the probe body. The hollow tip member further has an outer wall as a thermal contact surface, an inner wall inside the outer wall, a thermal isolation space formed between the outer wall and the inner wall, and a hollow cavity surrounded by the inner wall. A thermal sensor is disposed within the hollow tip member so as to sense the temperature of the thermal contact surface and produce a temperature signal. A set of transmission wires is connected to the thermal sensor to pass the temperature signal.

Abstract: A method of generating a temperature measurement for a batch or a continuous stream of material. The method includes providing a particle having a signal that changes at a pre-determined temperature; inserting the particle into the batch or continuous stream; and detecting a signal change from the particle to thereby generate a temperature measurement for the batch or continuous stream. A suitable system for use in carrying out the method is also described.

Abstract: The invention concerns a sensor for direct measurement of electromagnetic power, comprising a guiding structure (2) for bringing the power, a dissipative charge (3) and a thermometer. The invention is characterized in that the charge (3) and the thermometer are formed by a single element.

Abstract: A thermal characterization chip comprising a substrate having overlying electronics, the electronics including semiconductor circuitry and thin film circuitry overlying the semiconductor circuitry; wherein the electronics define a plurality of thermal domains, each of the domains defining a portion of a receiving surface for receiving an external influence that alters a thermal parameter within the thermal domains; and wherein the electronics further comprises monitoring circuitry for monitoring the thermal parameter in each of the thermal domains over a test time period.

Abstract: An electronic thermometer with a directionally adjustable LCD display is disclosed. The thermometer includes a control circuit and a display wherein the display is provided with identifiable signals capable of identifying characters and/or symbols in multiple directions, characterized in that the thermometer is provided with a direction sensing element such that the thermometer, under normal operating direction, is in an upright position facing the user, and if the thermometer is reversed, the direction sensing element due to the gravity will produce a directional signal and the control circuit of the thermometer receives the signal which immediately outputs to the display device to produce an upright display signal to the user whereby the display shows upright characters and/or symbols in multiple directions. As a consequence, the electronic thermometer can adjust to provide an upright display regardless of whether the user uses the left hand or right hand to hold the thermometer.

Abstract: A temperature sensor (10) for use in a cooking appliance of the kind in which an electric heater (1) incorporating at least one heating element (5) is located behind a cooking plate (2). The temperature sensor is adapted to be located between the at least one heating element and the cooking plate. The sensor (10) comprises a sensing element (13) having an electrical parameter which changes as a function of temperature and a housing (12) for the sensing element. The housing has a first surface region (15) with high thermal radiation absorption relative to a second surface region (16). The sensor is adapted to be located with the first surface region (15) of the housing facing substantially towards the cooking plate (2) and the second surface region (16) facing substantially towards the at least one heating element (5).

Abstract: Methods and systems for effecting a parameter and detecting a parameter using two electric signal in a conductive path are described.

Abstract: An electronic thermometer is constructed to include a casing, an electronic thermometer module mounted in the casing, a metal probe electrically connected to the electronic thermometer module for sensing the body temperature, a flexible covering is covered on the casing, the flexible covering having a tapered front portion protruded over the front side of the casing to a distance, and a hard stem connecting the metal probe to the distal end of the tapered front portion of the flexible covering.

Abstract: An assembly method and structure of an electronic clinical thermometer is disclosed. The thermometer can be disassembled or assembled as required, wherein one of the detachable modules such as the measuring body has an incomplete electronic clinical thermometer circuit lacking at least two elements, and these electronic elements are mounted within the other module such as the measuring probe, so that the two modules when attached together form a complete clinical thermometer.

Abstract: A cylindrical metal tube (3) accommodating therein a thermistor device (2), the electric characteristics of which change with temperature, is pushed into, or clamped and fixed to, a sheath portion (42) positioned on a flange (4) to the rear of a projection portion (41) of the flange (4), and is laser welded in a circumferential direction. A weld portion (L1) formed to bridge the metal tube (3) and the sheath portion (42) of the flange (4) firmly fixes the metal tube (3) to the flange (4). In the temperature sensor (1) having this construction, the weld portion (L1) between the metal tube (3) and the flange (4) is not exposed to a high temperature environment. Therefore, oxidation hardly occurs at the weld portion and reliability of air tightness to an exhaust gas can be improved.

Abstract: A electronic medical thermometer (1) comprises a maincase (2) which is made substantially of transparent material. The main-case thermometer (1) has a display element (6) for displaying the temperature and the maincase (2) has a display area (7) through which the display element can be observed. The maincase (2) further has an additional transparent or translucent area (8), through which an interior member such as a subcase (17) or the decorative sheet (27) are provided with a coloured or patterned surface.

Abstract: A temperature sensor circuit which includes: an adjustment circuit which generates a first divided voltage obtained by dividing a reference voltage; a current generation circuit which has a transistor element and generates a current corresponding to a gate voltage of the transistor element, the first divided voltage being supplied to a gate terminal of the transistor element; a voltage generation circuit which includes a diode element to which the current is supplied, an analog voltage being generated between both ends of the diode element; and an analog/digital (A/D) conversion circuit which compares a second divided voltage obtained by dividing the reference voltage with the analog voltage and converts the analog voltage into a digital value.

Abstract: A method for measuring a temperature of an integrated circuit is disclosed. The integrated circuit includes a temperature sensing element being excited by a first switched current and a second switched current. The method includes coupling a first capacitor to the temperature sensing element through a first switch and coupling a second capacitor to the temperature sensing element through a second switch. The first and second capacitors are external to the integrated circuit. The method further includes charging the first capacitor through the first switch to a first voltage when the temperature sensing element is being excited by the first switched current, charging the second capacitor through the second switch to a second voltage when the temperature sensing element is being excited by the second switched current, and measuring a difference between the first voltage and the second voltage to determine the temperature of the integrated circuit.

Abstract: A temperature sensing and control method and apparatus. In one aspect of the present invention, an apparatus according to the teachings of the present invention includes an optical path disposed in semiconductor material. A four-terminal resistor is defined in the semiconductor material. At least a portion of the optical path is directed through the four-terminal resistor. The four-terminal resistor includes a first pair of terminals between which a probe current is to be injected. The four-terminal resistor also includes a second pair of terminals between which a voltage drop is to be measured so as to determine a resistance along the portion of the optical path directed through the four-terminal resistor. Temperature may be derived from the determined resistance of the four-terminal resistor. In one embodiment, the temperature of the semiconductor material may then be controlled with a heater in response to the derived temperature.

Abstract: A method for identifying the classification of temperature detection components of the electronic thermometer that has a disposable temperature detection component and a main device for measuring and displaying temperature. To achieve measuring accuracy, the temperature detection component has a classification identification zone formed on a desired location. When the temperature detection component is coupled to the main device, the main device determines the classification attribute of a temperature detection element of the temperature detection component based on the indication of the classification identification zone, and through process software resided in the main device automatically calculates and displays the accurate temperature value.

Abstract: A temperature measuring apparatus includes a releasable probe chamber for housing a thermometry probe in which the chamber is isolated from the remainder of the thermometry apparatus. Preferably, the probe chamber is releasably attached to the apparatus and causes engagement or disengagement of at least one control switch of the apparatus depending on whether a probe is being removed or inserted into the probe chamber.

Abstract: A rapid respond electronic clinical thermometer is disclosed. The clinical thermometer comprises a measuring and end portion adhered a metal head portion having a temperature sensing element and a conductive wire joining the temperature sensing element, characterized in that the conductive wire is adhered to the inner wall of the metal head portion such that the conductive wire is not a heat dissipation portion for heat energy surrounded the sensing element, and further acts as a source of heat energy compensation so as to rapid indicate the mercury temperature, reducing the temperature measuring time.

Abstract: A method and system for automated temperature measurement is described. The system includes a programmable logic controller, a temperature measurement diode, an analog-to-digital converter coupled to the diode and the programmable logic controller, a current source coupled to the diode and configured to generate a first current and a second current different from said first current, and a processor coupled to the current source and to the analog-to-digital converter. The processor controls the current source such that the current source sequentially applies the first current to the diode at a first point in time and applies the second current to the diode at a second point in time. The processor also receives a first voltage across the diode measured when the first current is applied to the diode and a second voltage across the diode measured when the second current is applied to the diode. Based on the first and second voltages, the processor determines the temperature proximate the diode.

Abstract: Techniques for measuring a contact potential difference of a sample at an elevated temperature using a probe designed for room temperature measurement are disclosed. In such measurements, probe damage by excessive heating can be prevented without any probe modifications to include probe cooling. This can be achieved by minimizing the time the probe spends in close proximity to the heated sample. Furthermore, the effect of probe heating by the sample on the probe reading can be corrected by including an additional contact potential difference measurement of a reference plate kept at room temperature in the measurement cycle.

Abstract: A method for measuring the temperature of a cooking vessel or saucepan by means of a radiant heater is described. The radiant heater has a heating coil with a corresponding control and an induction coil as an inductive sensor and which is located in a metal tray. With the inductive sensor, measurement takes place of the frequency of the inductive resonant circuit comprising saucepan, heating coil, induction coil and metal tray, which is dependent on the temperature of the components. In the control is stored known slopes or paths of the temperature and therefore the frequency of the metal tray over the time. From this the control means gathers correction values in order to produce from the measured curve a compensated curve. At characteristic points, such as the start of a cooking or boiling process or an empty cooking or boiling of the saucepan, it is possible to detect said temperatures.

Abstract: A temperature sensor according to the present invention includes a sensor body for sensing a temperature; a sheath pin core wire electrically connected to the sensor body; a connector electrically connecting between the sheath pin core wire and the lead wire; and a protection tube for containing the connector and the sheath pin core wire, and for protecting the connector and the sheath pin core wire. A connection portion between the sheath pin core wire and the lead wire is hardened by a ceramic material so that a molded portion is provided. A displacement limiting means is provided for limiting displacement of the molded portion exceeding a predetermined value in the protection tube. The present invention can sufficiently reduce the tension acting on a sheath pin core wire. Further, the present invention can provide an exhaust temperature sensor having a sufficiently low tension acting on the sheath pin core wire which can be effectively used in an internal combustion engine.

Abstract: A thermocouple holder assembly for a furnace tube including a heat sink block for welding to the furnace tube, the heat sink block having a first bore therein for slidably receiving the distal end of an elongated sheathed thermocouple, the heat sink block having a hollow heat sink tube extending from the first bore for receiving a portion of the thermocouple, and a heat shield for welding to the furnace tube having walls for shielding and completely enclosing the heat sink block to shield the heat sink block from ambient heat on the exterior of the heat shield, the heat shield having a cavity therein for receipt of the heat sink block and the heat sink tube and flexible insulation material placed over the heat sink block and the heat sink tube, one of the walls having a second bore extending therethrough to the cavity for slidably receiving the thermocouple, the second bore being positioned in-the heat shield wall for alignment with the heat sink tube for conveying the thermocouple through the second bore to