Abstract: The present invention provides methods for packaging small size memory cards wherein the methods comprise molding over a populated printed circuit board, thereby an encapsulated memory card is obtained with desirable external dimensions and features. In one aspect of the invention, methods are provided for preventing mold bleed underneath of the contact pads of memory cards. In one embodiment, the mold bleeding is prevented by using slidable holding pins that exert pressure directly upon the contact pins during the molding process. In another embodiments, the mold bleeding is prevented by covering the contact pads with temporary substrate coverage during the molding process. In yet another embodiment, the mold bleeding is prevented by using pressing edges that exert pressure directly upon the area of contact pads during the molding process. In still another embodiment, the mold bleeding is prevented by using vacuum pressure to secure the populated PCB onto the bottom of a molding apparatus.

Abstract: A bead of liquid encapsulant or underfilled material (16) is dispensed along one or more edges of the flip chip (12). A plenum is located along the sides of the chip (12) in which encapsulant or underfilled material has not been deposited, such as opposite the dispensed material. Thereafter, the plenum is subject to a negative pressure source for drawing a vacuum to the area beneath the chip (12) and the substrate (10). The negative pressure aids in the natural capillary underfilling action and for quicker and more effective underfilling of the chip. Simultaneous underfilling of a plurality of chips (12) can be achieved by mounting a like plurality of vacuum tools to a plate which is moved into registration with a like plurality of chip/substrate workstations. By operatively connecting the vacuum tools to a controller, and to appropriate valves which can be set to adjust the vacuum level.

Abstract: A process for the production of gussetless multi-wall sheets is disclosed. Also disclosed is an extrusion die for the production of such sheets. The inventive coextrusion process entails feeding part of the base material directly into and via the male insert of the extrusion die to produce a gussetless sheet.

Abstract: A mold for producing a finished countertop on top of a countertop substrate is provided. The mold is comprised of a shaped inner surface to receive a countertop material pour and form a countertop edge and a tab extending from the shaped inner surface, the tab dimensioned to cover at least part of the substrate edge and extend over at least a part of the substrate top and hold the shaped inner surface adjacent the countertop substrate edge. Also included in the invention is a method of making a countertop using the mold.

Abstract: A semiconductor device is retained on a retaining section. A mask is set on the semiconductor device and has an opening at which part of the semiconductor device is exposed. An extruding section is moved by a first drive section over an opening in the mask and, during this movement, extrudes a fluidizing resin into the opening in the mask. A squeegee is moved by a second drive section over the opening in the mask to allow a movement of the fluidizing resin present over the opening which is extruded into the opening from an extruding section and a removal of any excessive resin from the plane of the opening.

Abstract: A problem in the manufacture of filters using tubular membrane bundles is keeping potting material from flowing into the openings at the ends of the tubes. A preferred embodiment of a method for manufacturing a tubular membrane filter employs a non-contact heat source such as radiant heating to melt the tips of the tubular membranes. This prevents the migration of potting material into the tubes when the potting material is flowed into the ends of tube bundles during the manufacturing process for a filter.

Abstract: The invention provides methods, systems, and devices for installing barriers in openings or gaps in or between structures such as walls, ceilings, and floors. At least one barrier molding bag is positioned in the hole or gap, and a flowable firestop material that is preferably operative to cure or harden, such as a hydratable cementitious slurry, is introduced into the bag to create a barrier in the hole or gap.

Abstract: A process for the recycling of PET flakes from comminuted PET bottles, wherein the flakes are subjected to a washing treatment, are treated for at least 20 minutes in at least one washer at an elevated temperature higher than 70° C. with a cleaning solution which contains caustic soda, and at the same time are also mechanically and hydraulically treated.

Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. Methods of vacuum encapsulating semiconductor chip packages are also disclosed.

Abstract: The flow of resin during the molding of composite articles is controlled by forming areas of immobilized resin during the infusion of resin into the fibrous body. The immobilized resin is formed using an immobilization agent that interacts with the infused resin to form a high viscosity resin barrier that is effective in blocking the flow of non-immobilized resin. The barriers of immobilized resin are located within the fibrous body so as to control the flow of non-immobilized resin during the molding process to prevent or least reduce resin depletion and to selectively block resin flow from the mold.

Abstract: The present invention relates to a control method for improving the productivity of a screen printer for an electronics-mounting machine. Thus, a screen printer according to this invention uses a recognition camera to inspect the results of printing of a circuit board concurrently with a cleaning operation of the rear surface of a screen, thereby enabling the effective use of time. This screen printer also enables cream solder to be automatically supplied to reduce the operation time by determining whether the next screen to be used is unused. During automatic screen replacement, this screen printer enables a desired screen stored in the corresponding stocker to be automatically specified in order to replace the current screen in response to a selected NC program.

Abstract: A plurality of lead frames is supplied in a lead frame-by-frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a semiconductor device to each lead frame with the adhesive by holding the semiconductor device in place to cure for a preselected period of time of about one second. Later, the lead frames have their edges trimmed and then are separated into separate lead frames.

Abstract: To manufacture a connector having a metal insert by insert molding, the metal insert is fixed to first and second fixing portions of dies defining a resin injection chamber therein. Resin is supplied from a resin supply passage to the resin injection chamber. A crank passage, intervening between the resin supply passage and the resin injection chamber, decelerates a flow velocity of the resin supplied into the resin injection chamber.

Abstract: A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.

Abstract: One aspect of the present invention pertains to an apparatus for forming a rigid foamed cementitious core within a plurality of article shells. In general, the apparatus can be comprised of a shell bank for retaining a plurality of article shells and comprising a sled and a plurality of reinforcement shells, a filing station for delivering a gas-entrained cementitious material, and a pump. The gas-entrained cementitious material cures to form a rigid foamed cementitious core within each article shell in the plurality of article shells.

Abstract: A process for the production of an over moulded substrate is provided together with an apparatus suitable for use in the process.

Abstract: The present invention provides a method and apparatus for dispensing onto a substrate. In one embodiment, the apparatus includes an injector having an injecting outlet and an air inlet, a fixture for receiving a substrate in communication with the injecting outlet and the air inlet and having a gasket forming a seal around the injecting outlet and air inlet, and a sheet of substantially taut film disposed between the injector and a substrate placed in the receptacle of the fixture such that, when the injector is in a position for dispensing encapsulant to a process area on the substrate, at least the injectng tip and the inlet tip of the injector project through the substantially taut film to the process area.

Abstract: The present invention relates to an electrospinning apparatus including a spinning dope drop device (3) formed between a metering pump (2) and a nozzle block (4), the spinning dope drop device (3) including (i) a sealed cylindrical shape, (ii) a spinning dope inducing tube 3c and a gas inletting tube 3b receiving gas through its lower end and having its gas inletting part connected to a filter 3a being aligned side by side at the upper portion of the spinning dope drop device, (iii) a spinning dope discharge tube 3d being protruded from the lower portion of which, and (iv) a hollow unit for dropping the spinning dope from the spinning dope inducing tube 3c being formed at the middle portion of which. In addition, a method for preparing a non-woven fabric drops flowing of a spinning dope at least once by passing the spinning dope through a spinning dope drop device (3) before supplying the spinning dope to a nozzle block (4) supplied with a voltage in electrospinning.

Abstract: Disclosed herein is a variable lamination manufacturing process and apparatus. The method comprises the step of coating strip-shaped material with an adhesive while the strip-shaped material is fed. Thereafter, the strip-shaped material being fed is cut into material pieces of a variable width, variable inclinations and a variable length in accordance with the three-dimensional computer aided design data of a three-dimensional product using a linear heat source. The cut material pieces are stacked on a moving table to be positioned in the corresponding positions of the three-dimensional product. Finally, the stacked cut material pieces are pushed to bond one piece to anther.

Abstract: An apparatus for manufacturing a multi-layered preform moulding material includes a reinforcement material and a resin material. The apparatus includes a mechanism for joining the reinforcement layers together by impregnation of the resin material into the reinforcement material to form the moulding material, thereby obviating the need for any additional bonding to join the individual reinforcement layers before impregnation.

Abstract: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.

Abstract: Methods of randomly dispersing chopped carbon fiber and consolidating the materials together to make a fiber reinforcement mat are disclosed. The term “Z-mat” is used to describe the claimed random fiber mat in which the chopped fibers are not preferentially oriented in either the x or y direction in the in-plane directions of the mat. The stiffness in the Z-mat is substantially independent of the test direction in the plane of the mat. The Z-mat offers the distinct advantages of higher stiffness and lighter weight.

Abstract: An apparatus for sealing a resin uses a liquid resin. A substrate has a frame for surrounding the substrate and is provided with a plurality of semiconductor devices. The substrate has a first opening portion. A squeegee guide plate is placed on the frame and has a second opening portion. The second opening portion is larger than first opening portion in size. A first squeegee moves along the squeegee guide plate in a first direction and rakes the liquid resin. The liquid resin is protuberated in order to bury the semiconductor devices. A second squeegee moves along the squeegee guide plate in a second direction opposite to the first direction and further rakes the liquid resin so as to smooth a surface of the liquid resin. A turning mechanism serves to turn the second squeegee in a circular arc form during the movement of the second squeegee.

Abstract: A molding machine 1 which molds two sheets of disc substrates on which the information is recorded simultaneously, a cooling mechanism 3 for cooling each of the disc substrates, first movably mounting means 2 for movably mounting the disc substrate from the molding machine onto the cooling mechanism, and a second movably mounting means 4 for mounting each of the disc substrates onto a receiving portion of the turn table 5 are provided.

Abstract: The present invention involves a carbon fiber-filled sheet molding compound and method of manufacturing the same. The invention comprises providing chopped automotive carbon fibers, a predetermined resin paste, a first carrier film, and a second carrier film. The method further involves coating substantially completely one side of one of the first and second carrier films with the predetermined resin paste to define a coated side, depositing the chopped automotive carbon fibers onto the coated side, and covering the deposited carbon fibers with the second carrier film to define a compactible carbon-filled laminate. The method further includes compacting the carbon-filled laminate to admix the resin paste with the carbon fibers between the films, whereby to form the automotive carbon fiber-filled sheet molding compound.

Abstract: A fixture for disposing laser blocking material on the interior of an airfoil is disclosed. Various construction details are developed which allow for the repetitive disposition of the laser blocking material in one airfoil after another. In one embodiment, the fixture includes a tool member and a nozzle adaptor for providing a sealing surface to a nozzle which extends into the tool member.

Abstract: A void filling device which facilitates insertion of a void filling material into a tubular component and hold of the void filling material therewithin. The device comprises a holder for void filling material which is designed to retain the void filling material to fill a void space by expanding with heat and is of a different material from the void filling material so as to be elastically deformed and inserted into the void space When the cross-sectional configuration of the void space of the tubular component is a rectangle, the holder is formed into a plate-like configuration which is longer than the diagonal line of the rectangle and is adapted to be insertable into the void space by bending the same arcuately.

Abstract: An apparatus and method for controlling the surface level of a liquid residing within a relatively vertically stationary workpiece support platform disposed within a reservoir for use in stereolithographic processes wherein a layered object or structure is formed by selectively curing portions of the liquid to at least a semisolid state in multiple, at least partially superimposed layers. Providing precise control of liquid depth over the vertically stationary platform as well as focusing of a laser beam for curing the liquid at the varying surface levels thereof relative to the vertically stationary platform is effected using a laser range finder system controlled by a computer used to control the stereolithographic process in a closed loop fashion.

Abstract: A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.

Abstract: A process and apparatus for producing fiber reinforced resin structures using vacuum assisted resin transfer molding technology, wherein the apparatus and process employ a first fluid impervious flexible sheet containing therein a resin port; a fiber containing preform; a primary vacuum line; a resin channeling means; and a secondary vacuum line. The fluid impervious flexible sheet is placed over or around the fiber containing preform to form a chamber to which the primary vacuum line is connected. The resin channeling means is positioned on top of the fluid impervious flexible sheet, exterior to the chamber containing the preform in a fashion so as to form a pocket between or around the resin channeling means and said fluid impervious flexible sheet to which the secondary vacuum is applied. Activation of the secondary vacuum causes formation of channels in the fluid impervious flexible sheet. These channels increase the speed and efficiency of resin impregnation of the fiber containing preform.

Abstract: An apparatus and a method for filling high aspect ratio holes in electronic substrates that can be advantageously used for filling holes having aspect ratios larger than 5:1 are disclosed. In the apparatus, a filler plate and a vacuum plate are used in conjunction with a connection means such that a gap is formed between the two plates to accommodate an electronic substrate equipped with high aspect ratio via holes. The filler plate is equipped with an injection slot while the vacuum plate is equipped with a vacuum slot such that when a substrate is sandwiched therein, via holes can be evacuated of air and injected with a liquid simultaneously from a bottom side and a top side of the substrate. The present invention novel apparatus and method allows the filling of via holes that have small diameters, i.e., as small as 10 &mgr;m, and high aspect ratios, i.e.

Abstract: A device for making decorative candles which have varied shapes and colors of wax throughout in an heated water bath and an apparatus utilizing said device comprised of multiple heated sources of melted wax suspended above an open topped waterproof box, having one side lined with a water proof gasket through which a waterproof sleeve communicates to a base plate upon which the candle is formed by moving the plate in three dimensions within the water bath and collecting thereon the colored wax, supplied to the top of the water by a heated tube means from selected sources of melted colored wax, as it sinks and cools in the water. The rate of cooling of the wax is controlled by the temperature of the water bath. The water borne wax is built up around a core candle or around a wick, stretched from the center of the plate to an arm, extending to the center of the plate from a rod extending from one edge of the plate to a selected height above the plate.

Abstract: A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.

Abstract: The present invention provides a method and apparatus for dispensing materials onto a substrate. In one embodiment, a dispensing system includes a controller, a vacuum source in electrical communication with the controller, the vacuum source applying a vacuum to at least a portion of the substrate in response to an instruction from the controller, an injector in electrical communication with the controller, the injector comprising a valve in communication with a pressure source and a material port in communication with a material source, the valve permitting material from the material source to be dispensed onto a substrate in accordance with an instruction from the controller. In one embodiment, the dispensing system also includes a trap in communication with the vacuum source, where the trap substantially prevents excessive material dispensed by the injector from contacting the vacuum source.

Abstract: A machine for preparing food products, for example lasagne, comprising a feeder which is suitable to take a plurality of lines of product and to feed each line to a respective product conveyor; each line comprises product distribution units suitable to distribute the product in respective containers fed by a conveyance device. The product conveyors extend parallel to each other and one above the other and have different lengths, each product conveyor having a delivery end at a distribution station which is suitable to deposit the product, which arrives from the respective product conveyor, in a container which is supplied to the distribution station by the conveyance device.

Abstract: The present invention provides an apparatus for forming an aluminium chassis having heat insulating foam filled in a hollow portion, and more particularly to an improvement wherein the heat insulating foam is filled in the hollow portion of the aluminium chassis for windows and doors principally in order to improve an efficiency of heat insulation and sound absorption.

Abstract: An apparatus for monitoring the cure of a resin-impregnated material includes a pultrusion die; a plurality of first electrodes mounted in the pultrusion die; a plurality of insulators surrounding the plurality of first electrodes, respectively, in the pultrusion die; a resin-impregnated preform that includes a second electrode therein, the resin-impregnated preform being inserted into the pultrusion die; a constant contact electrode that contacts the second electrode; and a power supply connected to the constant contact electrode wherein electric current flows from the power supply to the constant contact electrode then to the second electrode then through the resin-impregnated preform to the plurality of first electrodes.

Abstract: An adjustable reinforcement insertion guide is installed within the slip form mold of a mobile concrete slip form machine, for guiding steel reinforcement screens into the mold interior during the casting of continuously poured concrete barrier walls (i.e. “Jersey Walls”). The guide is vertically adjustable, in order to clear curbs, open cut joints, etc, as required. Additional adjustment is provided for a series of laterally adjustable outlet panels on the back of the guide, which provide additional accuracy and adjustment in guiding the steel mesh or screen which passes through the guide. The guide is fixed to the mobile slip form machine (with the exception of the vertical adjustment of the guide relative to the slip form machine), and travels with the machine as fresh concrete is introduced into the slip form mold of the machine.

Abstract: This invention is related to a method for encapsulating bond regions in electronic components comprising, for example, metallic bond regions, the method comprising the steps of exposing an electronic component having at least one bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5×105 Pa to about 3.0×105 Pa, thereby forming a treated, non-encapulated electronic component, then encapsulating the electronic component.

Abstract: A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.

Abstract: A plurality of lead frames is supplied in frame by frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a device and holds it during in place to cure for a preselected period of time of about one second to each device site with adhesive. Later, the lead frames have their edges trimmed and then are separated into separate lead frames.

Abstract: A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.

Abstract: A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.

Abstract: A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. During the encapsulation process, the dispense chamber remains evacuated at all times while the smaller inlet and outlet chambers are evacuated and vented in a controlled manner to allow transfer of chip packages to and from the dispense chamber without venting of the dispense chamber to atmosphere.

Abstract: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless A space around the apparatus can be effectively utilized.

Abstract: The invention relates to the production of foamed sandwich elements including skins joined by a frame. In applying the foam in a cassette formed by the frame and one of the skins the invention provides for use of an applicator having a two-dimensional movable discharge orifice.

Abstract: There is disclosed a method of connecting a plurality of mandrels to one another to constitute an integral mandrel 10, forming a fabric 1 on the surface of the integral mandrel, and infiltrating the formed fabric with matrix. A plurality of products can simultaneously be manufactured, and this can remarkably reduce fiber loss and enhance productivity.

Abstract: The method for the manufacture of sections of fiber-plastic compound materials is carried out by means of at least one draw nozzle (10). In this nozzle, fibers (41) which are impregnated with flowable plastic (42) are formed under pressure to a product (41) with a predetermined cross-section and consolidated with the withdrawal of heat. The cross-sectional surface of the draw nozzle is periodically increased and decreased in time in its entire shape imparting region, with a value for the frequency of the oscillating cross-sectional surface being chosen less that 1 kHz, preferably less than 100 Hz.

Abstract: A method of making a polymer coated rail in which a rail to be coated (10) is positioned on a mould base (11) in an inverted manner, so that the head (12) of the rail is immediately adjacent the base plate (11). Then, mould side pieces (13, 14) are secured to the base plate (11) to run parallel to the side of the rail (10). Antislip material such as bauxite or granite chippings (21) are positioned in the mould so that they lie on the base plate (11), and then the liquid polymer is poured into the mould to fill the spaces (19, 20) and so encapsulate the rail (10). The polymer is poured into the mould, until its surface (22) covers the foot (23) of the rail. In this state, the polymer is allowed to cure, so that it solidifies, and once the side plates (13, 14) have been removed, the rail together with its polymer coating can be lifted from the base plate (11).

Abstract: A fixture for disposing laser blocking material on the interior of an airfoil is disclosed. Various construction details are developed which allow for the repetitive disposition of the laser blocking material in one airfoil after another. In one embodiment, the fixture includes a tool member and a nozzle adaptor for providing a sealing surface to a nozzle which extends into the tool member.