Abstract: The invention is a method for producing a cast ceramic anode for metal oxide electrolytic reduction by feeding metallic iron and metallic nickel in solid form to an oxidizing reactor; melting and oxidizing the iron and nickel and forming molten nickel ferrite; mixing the molten nickel ferrite with dopant in a holding vessel such as ladle or tundish to increase electrical conductivity of the mixture, and casting the mixture into a mold to form a near net shape of the desired anode. Apparatus for carrying out the method, and the resulting product are also disclosed.

Abstract: An optical fiber coating device that recoats a coating removed portion of an optical fiber with light-curing resin has an observation window through which a mold inside of a shielding lid that covers the mold can be confirmed in a state where the shielding lid remains closed. There is provided an open/close lid that can open/close the observation window. An optical shielding guard plate is provided around the observation window. A filter that cuts off the external light having a specific wavelength is provided on the observation window. There is provided a photo sensor that can detect the amount of light of a light source that irradiates a light onto the light-curing resin, and the amount of light can be automatically adjusted on the basis of the detected result of the photo sensor. An alarm that urges to exchange the light source is raised on the basis of the detected result of the photo sensor. There is provided a TV camera that can capture the interior of the mold and other portions to be observed.

Abstract: The invention consists of a device and a method for sectioning of organs and irregular tissue blocks into tissue sections of a predefined thickness and orientation, in one uniform working process. The tissue is embedded into an alginate polymer, which is poured into an embedding container with two opposite arrays of parallel grooves. After hardening, the polymer can be sectioned in slices of a predetermined thickness. This is achieved by razor blade cuts through an array of parallel grooves in the embedding container. Finally, the tissue and alginate polymer can be removed by removing the side of the embedding container resulting in a series of parallel sections of predefined and often equal thickness.

Abstract: An air release molding system that injects high-pressure air into the die during the mold die release to eradicate mold resin sticking onto the mold die during the die release process.

Abstract: An apparatus for molding and a molding method utilizing a moveable mold platen which may hold, have affixed to, or carry a first portion of a mold or molds. A second or door platen may hold, have affixed to, or carry a second portion of a mold or molds. The door platen is placed in its closed position, and the moveable mold platen is brought up adjacent to it, so that the two portions of the mold are brought into engagement with one another. A desired molding material is injected into the mold cavity, after which the moveable platen is retracted, the door platen is opened, and the part is removed. A part to be encapsulated may be placed into the mold before the two portions of the mold are brought into engagement.

Abstract: A system and method is disclosed that uses an empirically-derived thermal transfer function for an ignition coil taken with respect to an ambient temperature and responsive internal temperatures. The system combines the transfer function with a minimum cure-induced stress profile, in order to obtain a time-temperature profile for minimizing cure-induced residual stress in an epoxy resin impregnated ignition coil. An accelerated minimal-stress profile is obtained by increasing an initial gel isotherm temperature of the above-mentioned time-temperature profile.

Abstract: The present invention provides in one embodiment, a system for encapsulating a substrate on a vehicle structure. The system includes the substrate, the vehicle structure and a package substrate. The substrate has a top portion and a bottom portion. The vehicle structure is operatively connected to the bottom portion of the substrate. The package substrate has a plurality of layers, where the package substrate is operatively connected to the top portion of the substrate. The package substrate conforms to a periphery area of the top portion of the substrate.

Abstract: A process for forming a molded plastic layer on a metal plate includes the steps of forming a plurality of posts that extend through and that are bonded to the metal plate in a first mold, placing the metal plate with the posts in a mold cavity of a second mold such that the posts abut against inner wall of the second mold and such that the metal plate partitions the second mold cavity into upper and lower mold sub-cavities, and introducing a resin into the upper and lower mold sub-cavities to form the molded plastic layer which encloses the metal plate.

Abstract: A device for and method of packaging electronic components (1) using injection-molding. For this purpose, a multiplicity of components (1) are arranged in predetermined positions on a first side (2) of a leadframe (3). The leadframe (3) has interconnects (5) with contact terminal areas (6) for connecting to contact areas (7) of the electronic components (1) and contact vias (8) to external contacts on a second side (10) of the leadframe (3). In this case, the leadframe (3) includes a ceramic substrate (11) with a first side (2) having edge regions (12) configured with a ductile, annular metal layer (13).

Abstract: A method and apparatus for molding a textile covered part in a plastic molding machine. A textile segment such as a piece of carpet is sprayed with a water mist prior to being loaded into the plastic molding machine. In a blow molding operation, a blow molding parison is loaded into the mold and expanded with compressed air to form the textile covered part. The machine includes a blow molding machine and a spray applicator that sprays water onto the textile segment prior to being loaded into the blow molding machine.

Abstract: A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

Abstract: A peripherally encapsulated product, such as an oven door outer shell, is molded in accordance with this invention by placing a piece of glass between mold clamping portions of relatively movable closed bodies when the latter are in an open position. Preferably both bodies are heated and thermosetting polymeric material (SMC or BMC) is placed upon selected areas of one of the mold bodies within and about an area corresponding to an annular mold cavity and outboard of a peripheral edge of a piece of glass. The glass is clamped between mold clamping portions of the mold bodies which are then progressively closed creating compression forces which extrude the thermosetting polymeric material into the annular cavity and into complete encapsulation of the continuous peripheral edge of the piece of glass. The thermosetting polymeric material is cured, the mold bodies are opened and the product is removed therefrom.

Abstract: A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.

Abstract: A jig structure for an integrated circuit package. The jig structure is used for integrated circuits to be covered by glue. The jig structure includes a base formed with a plurality of receiving regions for receiving the integrated circuits, a mold plate covering the base, a plurality of glue inlets formed on the mold plate at locations corresponding to each receiving region on the base, and a projection arranged between each glue inlet and its corresponding receiving region. The projection blocks and buffers the glue entering the receiving regions from the glue inlets. According to the jig structure, the mold flow of the glue can be effectively buffered when the glue is poured. Thus, it is not necessary to redesign the jig with the change of the relative position relationships between the glue inlets and the integrated circuits. The jig of this invention can be widely used for packaging various integrated circuits having different sizes and specifications.

Abstract: An apparatus for sealing a resin uses a liquid resin. A substrate has a frame for surrounding the substrate and is provided with a plurality of semiconductor devices. The substrate has a first opening portion. A squeegee guide plate is placed on the frame and has a second opening portion. The second opening portion is larger than first opening portion in size. A first squeegee moves along the squeegee guide plate in a first direction and rakes the liquid resin. The liquid resin is protuberated in order to bury the semiconductor devices. A second squeegee moves along the squeegee guide plate in a second direction opposite to the first direction and further rakes the liquid resin so as to smooth a surface of the liquid resin. A turning mechanism serves to turn the second squeegee in a circular arc form during the movement of the second squeegee.

Abstract: A process and apparatus for manufacturing fiberglass-reinforced panels are provided. The apparatus includes a guide mechanism and drive mechanism to drive individual elongate molds through a gel coating spraying section and thereafter through an oven to cure the gel coat. The elongate molds are thereafter driven through first and second resin/fiberglass application stations to apply a composite of resin and fiberglass strands. The apparatus also includes a station whereby wooden boards may be placed over the top of the resin and the fiberglass strands, and thereafter to a vacuum station whereby a vacuum can be placed over the wooden boards, such that when a vacuum is drawn on the composite, the resin is drawn into the wooden boards to form an integrated deposit panel.

Abstract: A gel coating method comprising making a mold (27), which has both a gelatinizer impermeability or a slight gelatinizer impermeability and a hardening agent permeability, retain a hardening agent (26) thereon beforehand by immersing the mold (27) in the hardening agent (26) and taking out the mold (27) therefrom, placing a gelatinizer (30) and an object to be sealed (9) in the resultant mold (27), allowing the hardening agent (26) to permeate through the mold (27) as a whole by immersing the mold in the hardening agent (26) again, and uniformly hardening the gelatinizer (30), which is around the object to be sealed (9), from the portion thereof which contacts the mold (27), whereby the object to be sealed (9) is rendered easily removable as gel-coated object (9a) from the mold (27).

Abstract: The composite molding apparatus includes a rigid base member and a complementary semi-rigid mold member or “black bag” caul plate having a sieve member formed therein. The sieve member layer of the semi-rigid mold member engages pins which extend from the sandwich core to limit penetration into the semi-rigid mold member to a predetermined depth. The semi-rigid mold member is supported relative to the rigid mold member by the pins to provide uniform pressure transfer to the composite article during a high pressure co-cure molding process without crushing the sandwich core.

Abstract: According to a molding method for a conductive plate of this invention, a substrate having through holes each corresponding to each protruded portion is employed and the substrate is sandwiched between both dies. Then raw powder is filled into each housing portion provided opposing each through hole in the substrate provided in each of both dies, through the through hole in order to form each protruded portion. Then the protruded portion is formed integrally with the substrate by heating the raw powder under pressure.

Abstract: An improvement to existing board manufacturing process which utilize lignocellulose particles is described wherein the adhesive to be applied as a binder is at least partly applied before the particles are dried. Using the invention improvement in resin application rates without increase in the water content of the particles fed to a press is achieved. Reduction in edge thickness swelling has been achieved.

Abstract: The present invention relates to a packaging substrate with electrostatic discharge protection. The packaging substrate is disposed in a recess of a mold and comprises an outer wall electrically connecting an inner wall of the recess. A first copper-mesh layer and a second copper-mesh layer extend to the outer wall to electrically connect the inner wall of the recess. Static electric charges generated during the molding process are conducted via the first copper-mesh layer or the second copper-mesh layer to the inner wall of the recess and then conducted away. Therefore, the static electric charges generated during the molding process can be safely conducted away from the packaging substrate, preventing the dies to be packaged from damage due to electrostatic discharge so as to raise the yield rate of semiconductor package products.

Abstract: A peripherally encapsulated product, such as an oven door outer shell, is molded in accordance with this invention by placing a piece of glass between mold clamping portions of relatively movable closed bodies when the latter are in an open position. Preferably both bodies are heated and thermosetting polymeric material (SMC or BMC) is placed upon selected areas of one of the mold bodies within and about an area corresponding to an annular mold cavity and outboard of a peripheral edge of a piece of glass. The glass is clamped between mold clamping portions of the mold bodies which are then progressively closed creating compression forces which extrude the thermosetting polymeric material into the annular cavity and into complete encapsulation of the continuous peripheral edge of the piece of glass. The thermosetting polymeric material is cured, the mold bodies are opened and the product is removed therefrom.

Abstract: A method of foam-embedding cables, in particular for foam-embedding a steering wheel skeleton which is equipped with cables, comprises the following steps: the cable is positioned in a foaming mold; a portion of the cable, which is not to be embedded in foam, is positioned in a resealable cavity provided in the foaming mold, the cavity being sealed against the ingress of foam; the cavity and the foaming mold are closed; the foaming mold is filled with foam; and the foaming mold and the cavity are opened to remove a product produced. There is also proposed a foaming tool for performing such method.

Abstract: Making a tire mold having a plurality of complete tire mold segments (20) of epoxy resin mold material formed in the chambers (18) of segmental shoes (10) and having reinforced stand alone ribs (56) formed in recesses in the tread models mounted in the shoes. The shoes (10) and models (50) are reusable and have standard shoe split diameters and chord lengths to reduce the time necessary to make the molds. The models (50) are of resilient material and are also reusable.

Abstract: An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surface roughness or a surface coating to cause the cleaning compound to more tightly adhere to the leadframe rail. As a result, cleaning compound flash is removed from the vents when the leadframe is removed from the mold.

Abstract: A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.

Abstract: A semiconductor chip molding apparatus includes an upper platen including an upper mold, a lower platen including a lower mold having a molding block configured to receive a lead frame, a controller, and an electrical detector for forming an electrical circuit between the controller and the lead frame when the lead frame is oriented improperly on the lower mold. A low-level test voltage is imparted to at least the lower mold. As a result, an electrical signal will flow from the detecting block when the lead frame rests on the detecting block. When such a signal is detected, therefore, the lead frame is determined as having been improperly set on the molding block. The signal generated is detected by a controller and used thereby to interrupt the operation of the molding apparatus.

Abstract: Mold cleaning apparatus (1) includes a manifold (5) adapted to be coupled to a suction device. A first conduit (6) extends from the manifold (5) and has a first opening (8) remote from the manifold. A second conduit (7) extends from the manifold (5) and has a second opening (11) remote from the manifold (5). The first and the second openings (8, 11) being directed in opposite directions, and the first conduit (6) having a section (10) with a cross-sectional area which is less than cross-sectional area at any point along the length of the second conduit (7).

Abstract: A mold has two mold halves (6, 7). One of the mold halves (6) includes a contact section (8) which is adapted to contact a surface (5) of a semiconductor chip (1) mounted in the mold, in use.

Abstract: A device for impregnating an insulation of a winding bar of an electric machine includes a container accommodating the winding rod and connected to a tank containing an impregnation agent. The container, which remains open during the impregnation process, is surrounded by an evacuation container to create a negative pressure within the container. To achieve a more rapid penetration of the impregnation agent and to simplify the overall process, a vacuum-tight sleeve acts as the container, the sleeve being encompassed by a pressure-resistant sleeve, and a conduit of an assembly that generates a vacuum leads into the interior of the sleeve. The impregnation agent is supplied with a pressure that is lower than the prevailing pressure in the pressure-resistant sleeve. The container can be a multi-part tool defining an interior for surrounding and accommodating the winding bar in a positive fit at least during an evacuation and impregnation process.

Abstract: A molding method for resin long body to make a thin long body of resin. Molten resin is supplied to a spaced portion of a mold through a thin film gate after a resin well of enlarged hollow ring is filled with the molten resin through plural pin runners in advance.

Abstract: A method and system for molding thermoplastic sandwich material to form a deep-drawn article utilizing a unique clamping technique and mechanism are described. The method includes the steps of positioning a blank of thermoplastic sandwich material having a cellular core over a female die having an article-defining cavity defined by inner surfaces of the female die. Then, an inner portion of the blank is forced into the female die along a substantially vertical axis and against the inner surfaces of the female die to obtain deep-drawn material. During the step of forcing at least one outer portion of the blank immediately adjacent the female die is clamped to guide the at least one outer portion of the blank to travel into the article-defining cavity at an acute angle with respect to the vertical axis. Thickness of at least one side wall of the deep-drawn material is substantially the same as thickness of the blank of thermoplastic sandwich material.

Abstract: A method and system for co-molding a thermoplastic material with a thermoplastic sandwich material to form a thermoplastic sandwich article having a thermoplastic inner portion are provided. In one embodiment, the thermoplastic material may be a composite material and the article is a deep-drawn article. In this embodiment, the method and system include a female die having an article-defining cavity defined by inner surfaces of the female die and an outer male die for forcing an inner portion of a blank of thermoplastic sandwich material having a cellular core and a predetermined amount of thermoplastic composite material placed on the blank into the female die along a substantially vertical axis and against the inner surfaces of the female die to obtain deep-drawn sandwich material. In a second embodiment in which the article formed is not deep-drawn, the outer male die is not required.

Abstract: A device for impregnating a conductor bar for a stator winding of an electrical machine, which includes an impregnating device with a hose-like flexible casing for receiving and encasing a conductor bar over an entire length thereof, and wherein the conductor bar is formed with a rectilinear region and angled regions adjoining the rectilinear region and is provided with an insulation. The device further includes a device which communicates with the casing for filling the casing with pressurized impregnating fluid, and a pressing device with a stationary pressing device having a plurality of clamping jaws surrounding on all sides at least the rectilinear region of the conductor bar, and movable sleeve-like pressing devices surrounding and pressing the angled regions of the conductor bar adjoining the rectilinear region.

Abstract: The present invention provides a method for creating a cryoarray of frozen tissue cores using a cryoarray system. Such system comprises a tissue mold, an embedding medium and a cryoarray device. The cryoarray device comprises a mold plate, an ejector plate, mold alignment pins, ejector pins, and cryoarray pins. Such method/system may be used for preparing frozen sections with multiple tissue specimens for assays such as in-situ hybridization and immunohistochemistry.

Abstract: The present invention provides an integrated, fully automated, high-throughput system for two-dimensional electrophoresis comprised of gel-making machines, gel processing machines, gel compositions and geometries, gel handling systems, sample preparation systems, software and methods. The system is capable of continuous operation at high-throughput to allow construction of large quantitative data sets.

Abstract: The invention is a seat bun mold (10) with a recess (12) suitable for containing a fastener strip (18) to be molded into the seat bun, the recess (12) having an end wall (14) shaped so as to provide a snap-fit seal against the end of the fastener strip (18), in order to prevent fouling of the fastener strip (18) during the seat bun molding process. End wall (14) extends from the bottom to the top of the recess (12), and substantially curves inward along its lower extent and outward along its upper extent. The end of fastener strip (18) is snapped into recess (12) by first aligning fastener strip (18) over recess (12) and then exerting downward pressure. The tension of the end of fastener strip (18) against end wall (14) forms a seal to prevent intrusion of liquid molding material through end wall (14) of recess (12).

Abstract: A method of producing a bead inductor includes the steps of forming an outer portion outside of a conductor coil, and forming a molded body with the conductor coil embedded therein. The outer portion is formed outside of the conductor coil by disposing the conductor coil in a cavity defined by first and second mold portions, with first and second gates formed in the first mold portion, inserting first and second spacer pin portions, which define a spacer pin which passes through the conductor coil and extends to and closes the second gate, and supplying material containing magnetic powder into the mold cavity from the first gate. The molded body is formed by closing the first gate after the formation of the outer portion, and supplying from the second gate material containing magnetic powder into a space formed by removing the spacer pin portions.

Abstract: A method and apparatus for making a composite article that includes a soft trim component employs a pair of mold halves, wherein a suitable skin material is sprayed onto a first mold cavity surface to obtain an in-mold coating, and a substrate is positioned between the mold halves such that a first area of one side of the substrate is located in opposition with the in-mold coating. A sprue defined in the second mold half, in opposition with the other side of the substrate, directs injected foam through an aperture in the substrate and into a gap defined between the one side of the substrate and the in-mold coating. A portion of the first mold half includes a layer of a sealing material that is harder than the substrate material to thereby eliminate the need to otherwise trim the overmolded soft trim component upon release from the mold.

Abstract: An injection molding apparatus for underlaying a flexible top material with plastic inside a cavity, which is formed between a female mold core plate and a mold core, with a dipping edge on the female mold side and another dipping edge on the mold core side, which bound a dipping edge gap that adjoins the cavity, into which gap the top material situated in the cavity extends. The dipping edge on the female mold side is formed on a dipping edge slider that is movably mounted on the female mold plate.

Abstract: A continuous process is used to make concrete building products with an expanded polystyrene core. The expanded polystyrene is fed into the inlet of an elongated guiding channel which has a longitudinally split mold. The expanded polystyrene is guided along the guiding channel without any means for pulling the expanded polystyrene. Concrete is then pumped into the split mold first through an first aperture in a first mold section of the split mold and then through another aperture, in a second mold section of the split mold, so that the concrete is coated on at least two opposing sides of the expanded polystyrene.

Abstract: An improved process for permanently attaching an overlay to a wheel disc, wherein the overlay is aligned and spaced apart from the wheel disc. A mold is created by a combination of the overlay, wheel disc and localized nests that engage at predetermined times during foam filling to close the mold. The mold is adequately sealed so that there is no foam leakage as the foam expands to fill the mold and, therefore, no final trimming of excess foam is required. The improved process is capable of accommodating a wheel having turbine openings therein.

Abstract: In the manufacture of semiconductor packages having molded plastic bodies, the plating of all of the surfaces of the molding tool that comes into contact with the molten resin during molding with a nodular thin dense chromium (“NTDC”) coating prevents the surfaces from adhering to the package body and ensures good package release, without formation of cracks or craters in the package body. This, in turn, permits the amount of both release agents and adhesion promoters used in the molding compound to be substantially reduced, or eliminated altogether, thereby resulting in a package body having improved strength and adhesion with the components of the package, and hence, an improved resistance of the package body to the propagation of cracks and its subsequent penetration by moisture.

Abstract: A modular building unit (1-6, 1A) including a building block (10, 10A) having lower and upper faces (9, 9A, 11, 11A), side faces (12, 12A, 13, 13A) and end faces (14, 14A). At least the lower and upper faces are provided with mounting strips (21-24, 53A, 54A) interfit with mating mounting strips (21-24, 53A, 54A) on similar adjacent modular building units (1-6, 1A) to join the adjoining building block units (1-6, 1A) in predetermined dimensionally accurate relationships. A method of securing the mounting strips (21-24, 53A, 54A) to the building block or brick (10, 10A) and the method of interlocking and securing adjacent modular building units (1-6, 1A) to each other are disclosed. A preferred embodiment of mounting strips (53A, 54A) is shown in FIGS. 8-10. A mold (203) is shown in FIG. 12 for the preferred method of forming a building block or brick (200).

Abstract: In an optical connector for positioning and fixing the distal end of a fiber optic ribbon cable with a connector ferrule, a guide-pin hole is formed in a mating end connected with another optical connector. A pair of positioning guide pins are inserted into the respective guide-pin holes. The guide-pin hole has an enlarged region whose diameter gradually increases toward the opening end portion of the mating end.

Abstract: An object of the invention is to eliminate a marking process and shorten the time and decrease the cost required for changing contents of marking. An uneven mask is mounted, using a mask set jig, on a mark surface die of the molding die for forming a resin mold package of a semiconductor device. The mark surface die is formed with jig-fixing grooves for mounting the mask set jig. The uneven mask is formed with protrusions and recesses corresponding to the contents of marking to be attached to the surface of the resin mold package. The contents of marking can thus be attached simultaneously with the molding process, and therefore the marking process after molding can be omitted. In accordance with the contents of marking, the uneven mask can be replaced. The time and cost required for changing the contents of marking can thus be reduced.

Abstract: A prefabricated insulated wall panel for building a wall. The wall panel includes one or more outer planar portions, a plurality of rib portions integral therewith and normal thereto and between which insulation is received, a strip of insulation attached to the inner edge of each rib portion for reducing thermal conductivity from the respective rib portion to wallboard attached to the wall panel, and a wallboard nailer strip which extends about the sides of the strip of insulation and has edge portions which are anchored in the respective rib portion. In accordance with one aspect of the invention, the nailer edge portions are insulated from the respective rib portion to limit thermal conductivity from the respective rib portion to the nailer. In accordance with another aspect of the invention, a pair of planar portions extend at an angle relative to each other so that the panel serves as a corner wall panel.

Abstract: A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.

Abstract: A double-walled thermoplastic article includes a double-walled body having inner and outer walls and an insert having visible portions and recessed runner sections. The body includes an insert portion in which its inner and outer walls are contiguous. The insert is attached to the body insert portion such that the visible portions of the insert are exposed and the runner sections are embedded within the insert portion. The article can be produced by a double-walled blow molding process.

Abstract: Improved methods for manufacturing a shaft for a golf club, devices useful in such methods, and golf club shafts manufactured in accordance with such methods. A plug is detachably affixed to a distal end of a mandrel. A plurality of plies pre-preg composite sheet are wrapped around the mandrel and plug and, thereafter, heated causing the resin comprising the various plies to be cured. The mandrel is then removed from the formed shaft, leaving the plug as an integral part of the distal tip of the shaft.