Abstract: An article includes a substrate and an adhesion layer overlying the substrate. The adhesion layer includes a first phase including particles, and a second phase including braze alloy that bonds the particles to the substrate. The article further includes a ceramic layer overlying the adhesion layer. In one embodiment, the ceramic layer is a thermal barrier coating (TBC), formed of stabilized zirconia (ZrO2).

Abstract: This invention consists of a coating applied to the metal surface which reduces the field emission levels of the surface. This coating could also decrease the secondary electron coefficient of the surface. The preferred embodiment described below is a hybrid coating consisting of two layers. However, a single-layer coating may also be used so long as it decreases field emission. Likewise, any number of coating layers may be used, so long as the resultant coating reduces field emission. The coating may also alter the properties of the interface between the metal surface and any macroparticle debris, in order to reduce field emission levels, but this is not essential, so long as the field emission from the surface is reduced. The invention is a coating which is not harmful to dc and rf vacuum system components, as for example, coatings which contain halogen atoms, such as CaF [J. N. Smith, Jr., J. Appl. Phys. 59, 283 (1986)].

Abstract: A member covered with a self-fluxing alloy sprayed coating is produced by previously forming a porous ceramic sprayed coating on a surface of a self-fluxing alloy sprayed coating prior to a refusing treatment of the coating formed on a substrate, heating the sprayed coating in an inert gas atmosphere controlled to 1˜300 hPa or by a high frequency induction heating system and thereafter removing the ceramic sprayed coating to expose the self-fluxing alloy sprayed coating. This member is uniform in the thickness, less in the retention of pores or oxide impurities and has a strong coating property.

Abstract: A method for coating conductive metal onto a electrode comprises a step of adhering a tape onto a first side of a tooling plate, a step of shaking electrodes to be fell into respective guiding holes of the tooling plate and to be held at first ends of the electrodes, a step of pre-pressing second ends of the electrodes in the guiding holes of the tooling plate, a step of holding the tooling plate with a vacuum holder to dip the second ends of the electrodes down into a liquid conductive metal trough, a step of re-dipping the tooling plate into the liquid conductive metal trough for modifying shapes of the first ends of the electrodes, a step of baking the second ends of the electrodes, a step of adhering another tape onto a second side of the tooling plate and removing the tape at the first ends of the electrodes, a step of pre-pressing the first ends of the electrodes, a step of holding the tooling plate with the vacuum holder to dip the first ends of the electrodes into the liquid conductive metal trough, a

Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.

Abstract: A method of manufacturing thin foil alloys through a series of steps. A carrier having a polished carrier surface is placed within a deposition chamber. The carrier surface is generally polished to a mirrored surface finish. A sacrificial layer is applied atop the carrier surface. The sacrificial layer is made of a material that may be easily dissolved or separated from the carrier surface to remove the metal foil. The carrier surface and sacrificial layer are placed within the deposition chamber. The sacrificial layer is exposed to an evaporated first metal which becomes deposited upon the sacrificial layer. An evaporated second metal is then applied concurrently or sequentially with the first metal. The first and second evaporated metals solidify on the sacrificial layer to form a multilayer foil. At this point, the multilayer foil includes discrete layers or areas of the evaporated metals.

Abstract: A method in accordance with our invention for providing texture bumps on a substrate comprises the step of forming elliptical ridge-shaped bumps on the substrate. In one embodiment, substrate is used in the manufacture of a magnetic disk used in a disk drive. The elliptical bumps cause less vibration of the read-write head than circular bumps. The elliptical bumps also provide reduced friction between the disk and a read-write head during use.

Abstract: The present invention, therefore, provides a method of forming a metallic coating film comprising forming a metallic base coating film and a clear top coating film on a substrate provided with an undercoating film and optionally an intermediate coating film in advance,

Abstract: Various articles of manufacture, such as electrosurgical scalpels, razor blades, and electronic components, comprise a quasicrystalline AlCuFe alloy film less than about 3000 Å thick, formed by depositing in sequence on a substrate through radio frequency sputtering a stoichiometric amount of each respective alloy material and then annealing those layers to form the film through solid state diffusion.

Abstract: A laminated steel sheet of the present invention has a surface-treated steel sheet with an outermost chromium oxide having specific surface area of 1.08 to 1.35 as a base sheet, and a plastic film is laminated on at least one side of the base sheet, and has excellent in tenacious adhesion to the plastic film after forming.

Abstract: A form of packaging or packaging aid having integral guarantee of original pack and/or first-time opening containing a substrate with a surface that reflects visible light. The reflective surface is made of metal or is a metallic reflective surface. One or more single ceramic layers are provided on the reflecting surface. The ceramic layers are made of a compound having the formula SiOx, where x represents a number from 1.5 to 2.0, each ceramic layer has a thickness of 50 to 2000 nm. The ceramic layer is directly, nonreleasably affixed to the substrate or to the reflective surface of the substrate. On the ceramic layers, a reflecting layer which is semipermeable to visible light is provided. The reflective layer is made of metal and has a thickness of 0.2 to 60 nm, and is such that light striking the coated substrate is reflected and seen as different colors depending on the direction or angle at which it is viewed by an observer.

Abstract: A method is taught for protecting copper and copper-based composites from high temperature oxidation, by the application thereto of a cobalt-based alloy diffusion barrier and a copper-aluminum alloy protective outer layer.

Abstract: A method for restoring a protective coating including a metallic environmental resistant coating of a coating total thickness within a coating design thickness range on a metal substrate of an article includes the application of a replacement material to at least one discrete local surface area on which an undesirable amount of degradation has occurred. Such degradation can extend through the protective coating into the metal substrate. The degradation product can include at least one of oxidation, coating rumpling, and coating voiding, for example, rumpling or voiding of a bond coat under a ceramic thermal barrier coating (TBC). The degradation product first is conditioned at the discrete local area to expose an underlying portion while retaining at least a portion of the metallic environmental coating on surface areas adjacent the discrete surface area. Then a replacement metallic environmental resistant material is applied, retaining the coating total thickness within the coating design thickness range.

Abstract: A thermal barrier coating system for a superalloy substrate is disclosed. The superalloy is preferably of the type that is capable of forming an adherent alumina layer. A bond coat is applied to a local area of the substrate, so that a portion of the substrate remains exposed. The localized area is defined to be the area(s) at which a TBC typically fails first, e.g., the leading and trailing edges of an airfoil, or other area. An alumina layer is formed on the remaining portion of the substrate, and also on the bond coat. A ceramic layer is then applied on the alumina layer. Even if the ceramic material is removed, the localized bond coat remains, and reduces the rate at which the underlying substrate oxidizes. A coated article is also disclosed, as is a system that utilizes a conventional superalloy and aluminide coating with the localized bond coat.

Abstract: A method for providing a partial plating to a lead pin, comprising the steps of plating an entire surface of the lead pin; covering a first part of a plated surface of the lead pin by a gel member; and subjecting a second part of the plated surface of the lead pin, which extends out of the gel member, to a metal-coating removing agent, to remove a metal coating of the second part of the plated surface. The plating step may include providing a composite plating on the entire surface of the lead pin, and the subjecting step may include removing an uppermost metal layer of the composite plating by the metal-coating removing agent. The composite plating may include a nickel base layer and a gold uppermost layer deposited on the nickel base layer. The gel member may be formed from a non-oily clay or paper-mache for handcraft use.

Abstract: A method of forming a tungsten plug in a semiconductor device includes forming a contact hole in an insulating layer, forming a contiguous titanium layer in the contact hole and on the insulating layer, forming a titanium nitride layer on the titanium layer. forming a thin tungsten layer of about 50 angstroms or less on the titanium nitride layer by CVD (chemical vapor deposition), annealing the structure once the thin tungsten layer has been formed, and depositing additional tungsten by CVD to completely fill the contact hole. The titanium nitride layer can be formed by a discrete CVD process or as a result of the annealing process. Forming a thin tungsten layer by CVD before the contact hole is completely filled in with tungsten is used to stabilize the titanium layer. For instance, a small amount of fluorine from the source gas of the thin tungsten layer diffuses into the titanium layer.

Abstract: A process for plating aluminum alloy substrates (10), such as 390 aluminum alloy pistons (12), with iron comprises (a) plating on the aluminum substrate a layer of zincate from a zincate bath; (b) plating on the zincate layer a layer (14) of nickel from an electroless nickel bath; (c) plating on the nickel layer a layer (16) of iron from an iron ammonium sulfate bath; and (d) plating on the iron layer a layer (18) of tin from an alkaline tin bath. During the electroless plating, the zincate layer, which protects the underlying aluminum against oxidation, is sacrificed. All of these baths are environmentally much safer than cyanide and chloride. They are also cost effective and can be utilized in a totally closed loop plating system.

Abstract: An industrial material such as metal, ceramics or plastics whose surface has a film passivated by fluoridation and a process of manufacturing the above industrial material. The industrial material comprises a substrate, a nickel alloy film formed on the substrate and containing nickel, semimetal and/or other metal whose fluoride becomes a volatile compound, and a fluorine passivated film formed at least on a surface of the nickel alloy film in such a manner that the fluorine passivated film contains nickel and does not contain said other metal or the semimetal, and satisfies stoichiometric ratio. The process of manufacturing an industrial material comprises the steps of performing grounding treatment of a surface of a substrate, forming a nickel alloy film, on the surface of the substrate, containing nickel, semimetal and/or other metal, and forming a fluorine passivated film on the nickel alloy film.

Abstract: A machine tool or die that is fabricated from thermally spray-formed steel is easily repaired by cleaning, roughing and covering the surface to be repaired by a cold-spray layer of metal and then forming a weldment by conventional electric welding processes. The repaired surface is then finished by conventional machining, grinding and polishing and then the tool is put back into service.

Abstract: A method of applying thermal barrier coating systems to a metal piece having a cooling hole extending along a central axis through the piece from a first surface of the piece to a second surface opposite the first surface. The method includes spraying a bond coat and a thermal barrier coating on the first surface at an angle and to a thickness to prevent the bond coat and thermal barrier coating from entirely filling the hole. The method also includes spraying a high pressure fluid jet from an elongate nozzle assembly having an orifice configured to direct the jet laterally away from the nozzle assembly toward the hole and in a direction generally parallel to the central axis of the hole.

Abstract: A low friction, low contact resistance coating for electrical terminal members, especially members made of copper base alloys and low carbon steel alloys and plastics, is formed of a coarse electroplate of tin or silver characterized by grains having an average dimension in the range of about 0.5 to 10 micrometers where such grains carry very small particles of polytetrafluoroethylene or the like having average diameters in the range up to about 0.30 micrometers.

Abstract: A thermal barrier coating system and a method for forming the coating system on an article. The coating system employs a bond coat of a nickel aluminide alloy over which a thermal-insulating ceramic layer is deposited. The nickel aluminide bond coat contains zirconium, but is otherwise predominantly of the beta (&bgr;) NiAl phase. The bond coat is preferably deposited by a physical vapor deposition process to have a fine-grain microstructure and a limited diffusion zone in the article surface.

Abstract: There is disclosed herein a multilayer circuit board having air bridge crossover structures and a subtractive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers which provide mechanical and/or electrical fortification to the circuit.

Abstract: An iron aluminide coating consists essentially of: 1 5-35% by weight aluminum 15-25% by weight chromium 0.5-10% by weight molybdenum, tungsten, tantalum and niobium 0-0.

Abstract: An electrolyzing electrode which is for electrolyzing a metal electrolytic solution, shows a long lifetime in use as an ordinary anode and has sufficient durability even when in a poor potential region, and a process for the production thereof. The electrolyzing electrode of the present invention has an undercoating layer which is formed of platinum metal and tantalum oxide and contains, as metals, 1 to 20 at % of platinum and 80 to 99 at % of tantalum, on an electrically conductive electrode substrate, has an intermediate layer which is formed of iridium oxide and tantalum oxide and contains, as metals, 70 to 99.9 at % of iridium and 0.1 to 30 at % of tantalum, on the undercoating layer, and further has an overcoating layer which is formed of platinum metal and iridium oxide and contains, as metals, 60 to 99.9 at % of platinum and 0.1 to 40 at % of iridium, on the intermediate layer.

Abstract: A heat curable bonding composition of the present invention comprises an aqueous solution containing phosphate ion (PO4−3) and chromium(III) ion (Cr+3, or trivalent chromium) and is substantially free of hexavalent chromium ions. The bonding composition may further contain at least one secondary cationic species. The bonding composition has a pH in the range of about 1 to about 3.5.

Abstract: The invention includes methods of forming aluminum containing lines having titanium nitride containing layers thereon, and preferably by physical vapor deposition. In one aspect, a first layer including at least one of elemental aluminum or an aluminum alloy is formed over a substrate. A second layer including an alloy of titanium and the aluminum from the first layer is formed. The alloy has a higher melting point than that of the first layer. A third layer including titanium nitride is formed over the second layer. The first, second and third layers are formed into a conductive line. In one aspect, a method of forming an aluminum containing line having a titanium nitride containing layer thereon includes physical vapor depositing a first layer having at least one of elemental aluminum or an aluminum alloy over a substrate.

Abstract: A method for restoring or enhancing an environmental resistant coating of a coating total thickness within a coating design thickness range on a metal substrate of an article includes the application of a restoring or enhancing metal to at least one discrete local surface area. Then at least the discrete local surface area is coated with an environmental resistant coating. For use of the method to restore a coating on an article which has experienced service operation and the discrete surface area includes an undesirable amount of oxidation/corrosion products, the oxidation/corrosion products first are removed from an outer portion of the coating while retaining a coating present at the discrete surface areas and retaining the entire coating on surface areas adjacent the discrete surface areas. Then the restoration metal is applied.

Abstract: An improved fluxing method for the galvanization of steel, particularly batch galvanization, is disclosed. In this process, a metallic element is deposited (for example, by electroless plating) on the surface of the steel sheet or other article prior to its being dipped in the galvanization bath. Preferred metals for use in this fluxing process are tin, copper, nickel, with tin being more preferred, and mixtures of copper and tin being most preferred. This metallic film layer has a thickness between about 5 and about 50 nm. The process of the present invention provides a number of benefits when compared to conventional fluxing processes: for example, it is compatible with the inclusion of aluminum in the galvanization bath; it permits a greater time delay between the fluxing and galvanization operations; and it eliminates the formation of hydrogen chloride or other toxic fumes when the fluxed article is dipped in the molten zinc galvanization bath.

Abstract: The present invention relates to a container for holding high purity isopropyl alcohol (IPA) used in the electronic industry, which extremely dislike the inclusion of metal impurities. The container made of metal for holding high purity IPA, wherein at least the inside surface layer of the container is composed of nickel.

Abstract: Process using the following stages in the following order: a) scouring, b) initial surface treatment in a single operation meeting three criteria relating to resistance to corrosion, lubrication and cleanability, c) shaping, d) second so-called nickeling surface treatment, e) enameling. With the aid of this order of operations and the criteria defining the initial surface treatment, scouring may be carried out on line on the installations for production of sheet-steel strips.

Abstract: A wire for a wire saw apparatus for slicing a material includes an element wire, a binder coated on an outside circumferential surface of the element wire, and abrasive grains dispersed in the binder. The element wire is a high tensile strength metal wire, the binder is a material such as an organic or inorganic material other than a metal, and the abrasive grains are held on a surface of the element wire by the binder. The element wire is also made by either a natural quartz glass or a high purity synthesis quartz glass.

Abstract: A composite plated metal material having a composite coating layer with excellent adhesion and mechanical properties is produced by (1) displace deposition-plating a metal I base material with a metal II having a nobler oxidation-eduction potential than that of metal I and (2) dope-modifying the resultant metal II coating layer with a metal III-containing deposit in which metal III is different from metal II and exhibits a nobler oxidation-reduction potential than that of metal I, by using a displace deposition-plating aqueous solution containing metal III-containing compound ions.

Abstract: The invention provides a process for producing a coated Cu alloy having a surface which has a low coefficient of friction and a high resistance to abrasion and is suitable for fabricating connectors, charging-sockets of electric automobiles etc. The coated Cu alloy is produced by coating the surface of a copper alloy with Sn and heat treating the coated Cu alloy at a temperature in the range of 100-450° C. for 0.5-24 hours. The Cu alloy which is coated with Sn consists of 1-41 wt % Zn with the balance being Cu and incidental impurities. By using the coated Cu alloy, the force of insertion, resistance to abrasion and resistance to corrosion of connectors can be significantly improved.

Abstract: By applying a reaction solution containing an aqueous solution of copper salts and salts of inorganic acids, to a pre-oxidized or partially already patinated copper surface, it is possible to produce a patina layer on copper objects, either directly at the construction site or also at the factory. The reaction solution is particularly well-suited for pre-oxidized or partially already patinated copper surfaces. Copper surfaces, which have not been completely green-patinated, or have been damaged, also obtain a uniform patina layer when the reaction solution is used. The reaction solution can be changed in its consistency and adapted to the conditions of use in each case by adding wetting agents or thickeners. The reaction solution can be applied using a brush, roller or spraying device, and can be stored and processed at ambient temperature.

Abstract: This invention relates to an improved adhesiveless flexible laminate, comprising: a polymer film having a plasma treated surface; a nickel tie coat layer comprising nickel or a nickel alloy adhered to said plasma treated surface; and a copper seed coat layer adhered to the nickel layer. In one embodiment, another layer of copper is adhered to the copper seed coat layer. This invention also relates to a process for making the foregoing adhesiveless flexible laminate, the process comprising the steps of: (A) contacting at least one side of a polymeric film with a plasma comprising ionized oxygen produced from a non-metallizing cathode to provide a plasma treated surface; (B) depositing a tie coat of nickel or nickel alloy on said plasma treated surface; and (C) depositing a seed coat layer of copper on said nickel tie coat layer. The process also includes the optional step of (D) depositing another layer of copper over the copper seed coat layer from step (C).

Abstract: A new method for making patterned magnetic storage media with magnetic and substantially non-magnetic zones utilizes a selective oxidation processes. Selective oxidation is achieved by subjecting a magnetic layer to an oxygen plasma through voids in a patterned mask. A high resolution patterned mask is made by embossing and reactive ion etch processes. The method is used to fabricate patterned magnetic disks media with alternating magnetic and non-magnetic zones ranging from 10 to 1000 Nanometers in width. Magnetic storage disks produced by this method have high-bit densities, minimal topography and reduced signal noise.

Abstract: Provided is a low-priced metal coating treatment which causes less pollution, wherein the dispersion of ceramics and the forming of a metal coat are performed by blasting treatment; and a ceramic dispersion plating process making it possible to improve wear resistance, heat resistance and the like of a workpiece and the adhesion of the metal coat. When ceramic particles are ejected on the surface of a workpiece comprising a metal or a metal component by blasting, the workpiece is heated and softened so that the ceramic particles are dispersed inside the workpiece to form a dispersed layer. When a coating metal powder is further ejected thereon by blasting, the temperature of the dispersed layer rises in the same way so that elements in the composition of the coating metal powder diffuse and penetrate inside/on the surface of the dispersed layer to form a plating layer.

Abstract: A method for preventing formation of a "bridge" is provided for electrolessly plated nickel or gold between copper patterns. A circuit board having a copper pattern is immersed in a pretreatment solution containing thiosulfate for electroless nickel plating, or the pretreatment solution is sprayed over the board. The pretreatment solution may be incorporated with an additive, such as a pH adjustor, complexing agent, surfactant or corrosion inhibitor.

Abstract: A method and a device are described for the repair and/or touch-up of small surface flaws in large press plates or endless bands of sheet metal, especially steel sheet, having a structured metal coating and a hard-chrome plating for surface-embossing plastic-coated wooden or laminated panels. Each flaw is repaired by surrounding it with a mask, pickling, and galvanically metallizing it. For a simplified and cost-favorable repair or touch-up, a galvanic solution is applied to the masked and pickled flaw for microgalvanizing damaged areas smaller than 14 mm.sup.2 by dipping the tip of an electrode into the solution. The pickled flaw can first be provided with a thin, microgalvanically applied nickel layer, and it is then copper-plated. The copper build-up is restructured by hand, if necessary, and covered with a hardened cobalt layer.

Abstract: As an electroless plating technique capable of surely promoting the plating reaction without Pd substitution reaction and fastening the plating deposition, there are proposed an electroless plating method of subjecting a primary plated film (or metal film) formed on a substrate to a secondary plating (or electroless plating), characterized in that the secondary plating is carried out after a surface potential of the primary plated film is adjusted so as to be more base than such a most base surface potential that a surface current density of the primary plated film is zero in an electroless plating solution for the secondary plating; and a pretreating solution for electroless plating comprising an alkali solution, reducing agent and complexing agent; and an electroless plating bath suitable for use in this method.

Abstract: A process for producing a metallic protective layer whereby a metal-containing plating, cladding, paint or other coating is applied to at least a portion of a reactor system and then contacted with a gaseous stream containing hydrocarbons, such as impure hydrogen, thereby producing a continuous and adherent metallic protective layer. The gaseous stream preferably comprises hydrogen, which may be recycled. A preferred embodiment of the invention is directed to touch-up procedures where a portion of an already protected reactor system is replaced or rewelded and the protective layer is formed as the replaced portion is brought on-stream.

Abstract: The superparamagnetic monodispersed particles comprise a core of a first polymer, an internal layer of a second polymer coating the core and in which a magnetic material is distributed, and an external layer of a third polymer coating the magnetic layer and capable of interacting with at least one biological molecule. At least the second polymer is heat sensitive and has a predetermined lower critical solubility temperature (LCST) of 15-65.degree. C. These particles may be used to isolate at least one biological molecule from a liquid specimen.

Abstract: A thermal barrier coating system and a method for forming the coating system which yields a thermal barrier coating having good adhesion to a bond coat overlying a metal superalloy substrate. The adhesion of the bond coat and the thermal barrier coating is enhanced by forming a mature .alpha.-alumina (Al.sub.2 O.sub.3) scale at the bond coat-TBC interface. The desired mature .alpha.-alumina scale can be obtained by utilizing one or more of the following steps: preoxidation of the bond coat at certain minimum temperatures and durations; inoculation of the surface of the bond coat; surface doping or alloying of the bond coat surface; and the addition of noble metals to the bond coat. Each of these steps promotes the formation of .alpha.-alumina and avoids the formation of the .gamma., .delta. and .theta.-alumina phases which undergo phase transformations at elevated temperatures, with the result that a more spallation-resistant thermal barrier coating system is obtained.

Abstract: A steel bearing member having an erosion resistant surface and a method of making the same is disclosed. The steel bearing member comprising a bearing substrate, a first overlay of hardbanding material having sintered cemented metal carbide pellets in steel and containing hard submicron sized particles, and a second overlay of steel containing hard particles that migrated from the first overlay of hardbanding material during application of the second overlay over the first overlay. A radial bearing member and a method of making the same is disclosed. A composition applied to the bearing substrate to improve the erosion resistance of this surface comprising a steel carrier and carbide pellets composed of submicron hard particles cemented with a metal binder is disclosed.

Abstract: A battery electrode substrate which is constituted of a porous metallic body structure having communicating pores at a porosity of at least 90% and an Fe/Ni multilayer structure wherein the skeletal portion of the porous metallic body is composed mainly of Fe and has an Ni covering layer on the surface thereof while pores communicating with the inside and outside of Fe skeletal portion exist in the Fe skeletal portion and the inside of the pores is covered with Ni. The electrode substrate is produced by applying an iron oxide powder of at most 20 .mu.m in an average particle size on a porous resin core body; heat treating the core to remove an organic resin component while simultaneously sintering Fe to obtain a porous Fe body; and then covering the Fe skeletal portion with Ni by electroplating. In this process, the iron oxide can be used in combination with carbon powder. Further, a nickel porous sintered body can also be produced using nickel oxide in place of iron oxide.

Abstract: In a method of coating easily oxidisable materials by plasma powder build-up welding of additive materials in powder form using alternating current or direct current with superimposed alternating current to produce a plasma transferred arc for powder build-up welding in accordance with patent application No 196 26 941.5 a CuNi-alloy is used as an additive welding material with additions (in % by weight) of:______________________________________ Fe below about 10; Cr below about 5; B below about 4; Si below about 4; C with about 1.5; ______________________________________with a degree of mixing of more than 40% by volume.

Abstract: There is provided a surface alloyed component which comprises a base alloy with a diffusion barrier layer enriched in silicon and chromium being provided adjacent thereto. An enrichment pool layer is created adjacent said diffusion barrier and contains silicon and chromium and optionally titanium or aluminum. A reactive gas treatment may be used to generate a replenishable protective scale on the outermost surface of said component.

Abstract: Gold is deposited on a copper base defining electrical circuit features disposed on a substrate containing a palladium seeder, by initially treating the substrate with an alkaline cleaner, followed by treating the substrate with sodium persulfate, and subsequently treating the substrate with a diluted sulfuric acid solution. The substrate is rinsed between each one of the treatments, and after the final rinse following treatment with diluted sulfuric acid, the substrate is immersed in a gold deposition solution whereby gold is deposited on the exposed surfaces of the copper circuit features on a substrate. The process embodying the present invention provides a method for depositing gold on high density copper conductor lines or pads, even in areas of the surface in which the conductors are spaced apart 2.0 mil or less, without cleaning or removing the palladium seed from the surface.

Abstract: A permanent magnet useful in an ultra-high vacuum atmosphere, such as an undulator requiring the ultra-high vacuum atmosphere of less than 1.times.10.sup.-9 Pa and which, has excellent magnetic characteristics, includes an R-Fe-B system permanent magnet having a Ti undercoat layer on a surface thereof, an external layer selected from TiN, AlN and Ti.sub.1-x Al.sub.x N (x is 0.03 to 0.70), and an Al intermediate layer therebetween.