Metal Base Patents (Class 427/405)
  • Patent number: 6071570
    Abstract: A method of preparing electrodes is now described, which electrodes have enhanced adhesion of subsequently applied coatings combined with excellent coating service life. In the method, a substrate metal, such as a valve metal as represented by titanium, is provided with a highly desirable rough surface characteristic for subsequent coating application. This can be achieved by various operations including etching to ensure a roughened surface morphology. In subsequent operations, a barrier layer is provided on the surface of enhanced morphology. This may be achieved by operations including heating, as well as including thermal decomposition of a layer precursor. Subsequent coatings provide enhanced lifetime even in the most rugged commercial environments.
    Type: Grant
    Filed: August 27, 1997
    Date of Patent: June 6, 2000
    Assignee: Eltech Systems Corporation
    Inventors: Kenneth L. Hardee, Lynne M. Ernes, Richard C. Carlson
  • Patent number: 6054174
    Abstract: A method for producing an electronic apparatus casing including: a step of forming a copper layer by way of non-electrolytic plating onto a casing body made from a magnesium or magnesium alloy material shaped into a predetermined configuration; a step of forming a nickel layer on the copper layer by way of non-electrolytic plating; a step of carrying out a surface grinding and a honing to the nickel layer; a step of forming a hard transparent glass layer by using a colloid solution containing SiO.sub.2 and Na.sub.2 O; and a step of forming a silica layer on the hard glass layer by using a partially hydrolyzed solution of an organic silicate ester.
    Type: Grant
    Filed: November 20, 1997
    Date of Patent: April 25, 2000
    Assignee: Sony Corporation
    Inventors: Masahiko Kakizaki, Takahiro Shimouchi
  • Patent number: 6051273
    Abstract: A material deposition process is disclosed in which apertures of a contact mask used therein have a constricted opening terminating in a `knife edge` in a sidewall thereof near the top mask side, especially within the top 25% of the mask thickness above the substrate. A process is disclosed in which the mask, in addition, has apertures which have larger dimension lower openings on a bottom side of the mask contacting the substrate than constricted openings near the top side of the mask. Single solder bump and "bump on bump" over BLM (ball limiting metallurgy) processes are disclosed which utilize such contact mask to reduce the damage and detaching of such features during processing and subsequent handling.
    Type: Grant
    Filed: November 18, 1997
    Date of Patent: April 18, 2000
    Assignee: International Business Machines Corporation
    Inventors: Hormazdyar Minocher Dalal, Gene Joseph Gaudenzi, Frederic Robert Pierre, Georges Henri Robert
  • Patent number: 6045866
    Abstract: Disclosed is a method of forming electroless metal plating layers on one single surface of a plastic substrate and the product thereof. The method includes steps of degreasing or pre-etching the material for forming the substrate, etching the material, adding catalysis, activating, drying, spraying non-conducting paint on a first surface of the material, accelerating, forming an electroless copper plating layer on a second surface of the material, activating, forming an electroless nickel plating layer on the second surface of the material, sealing, dehydrating, drying, inspecting, and packing. Wherein, the steps of spraying non-conducting paint and drying give the material a beautiful painted appearance on the first surface thereof. The non-conducting paint on the first surface of the material facilitates easy formation of smooth electroless copper and nickel plating layers on the second surface of the material. Therefore, a product of the method can be used in electronic products requiring high sensitivity.
    Type: Grant
    Filed: August 18, 1998
    Date of Patent: April 4, 2000
    Assignee: Jin Yee Enterprise Co., Ltd.
    Inventor: Ho-chih Chuang
  • Patent number: 6027762
    Abstract: A method of producing a flexible board includes printing a circuit pattern on a base film, and providing a plating onto a surface of the circuit pattern.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: February 22, 2000
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Tsutomu Tomita, Hironobu Kanesawa, Takaaki Murata, Shingo Naito, Toshiki Hayasaka
  • Patent number: 6015775
    Abstract: A self-lubricating sintered sliding member and its producing method, the member having excellent seizing resistance and wear resistance even in offset load and high load applications.The self-lubricating sintered sliding member is composed of an iron-family metal substrate and a sintered contact layer that is formed on a sliding side of the iron-family metal substrate and made from a sintered contact material containing an iron-family material. The sintered contact layer has, on a surface thereof, protrusions formed from solid lubricant particles including graphite. A solid lubricant layer is laid over the surface of the sintered contact layer where the protrusions are formed.
    Type: Grant
    Filed: February 4, 1998
    Date of Patent: January 18, 2000
    Assignee: Komatsu Ltd.
    Inventors: Takemori Takayama, Yoshikiyo Tanaka
  • Patent number: 6004619
    Abstract: Process for manufacturing circuit boards in which a masking layer (2) is applied to a carrier substrate (1) of insulating material and after producing openings for soldering pads, conductor traces, and through or blind holes, in accordance with a preferred embodiment by laser ablation, a thin electrically conductive layer (5) is applied to the surface of the carrier substrate including the masking layer. Subsequently, the masking layer (2) and the conductive layer deposited thereon, for example copper, are removed and the remaining metal surfaces (6) are chemically reinforced to produce the desired thickness. The process permits the production of dense structures using few process steps and without additional abrasion steps.
    Type: Grant
    Filed: November 7, 1997
    Date of Patent: December 21, 1999
    Assignee: Hewlett-Packard Company
    Inventors: Siegfrid Dippon, Walter Olbrich
  • Patent number: 5989637
    Abstract: A method and apparatus for preventing overspray onto bonding pads of a laser bar during facet coating includes manufacturing inserts with gaskets that are aligned with the laser bar such that the gaskets mask off the bonding pads during the facet coating process so that no overspray onto the bonding pads occurs. The gaskets are preferably made of gold with a thin titanium coating to prevent thermal compression bonding with the bonding pads. The inserts with gaskets are preferably manufactured using standard wafer processing techniques. The gaskets are preferably formed using the compliant layer metalization process described in U.S. Pat. No. 5,559,817.
    Type: Grant
    Filed: April 16, 1998
    Date of Patent: November 23, 1999
    Assignee: Lucent Technologies, Inc.
    Inventors: John S. Rizzo, Gustav Edward Derkits, Jr., Raymond Frank Gruszka, John E. Boyd
  • Patent number: 5985466
    Abstract: A powder having metal oxide films on its surface is obtained in which the films have a heightened refractive index and which hence shows a high reflectance and has a bright color. A powder is obtained which has a reduced number of metal oxide films on the surf ace and hence has a small particle diameter. A powder having a multilayered film on the surface which comprises a base particle having on the surface thereof a multilayered film comprising at least a metal oxide film formed by the hydrolysis of a metal alkoxide, and in which the multilayered film has undergone a heat treatment.
    Type: Grant
    Filed: September 10, 1997
    Date of Patent: November 16, 1999
    Assignees: Nittetsu Mining Co., Ltd., Katsuto Nakatsuka
    Inventors: Takafumi Atarashi, Katsuto Nakatsuka
  • Patent number: 5980973
    Abstract: A method of providing biocompatible surface texturing on a metal component of an implantable device and the device so produced. The coating is provided by applying particles of metal falling substantially entirely in the range of 1 to 5 microns to a surface of said component to provide a layer of generally uniform thickness and sintering said particles to one another and to said component to provide a generally continuous external surface having surface texturing in the form of projections formed from said sintered particles. The particles are preferably applied to a depth of 1 to 25 microns. In a preferred embodiment particles of titanium are applied to a surface of a titanium component.
    Type: Grant
    Filed: March 13, 1998
    Date of Patent: November 9, 1999
    Assignee: Medtronic, Inc.
    Inventors: Chike O. Onyekaba, George C. Johnstone, David D. Verness
  • Patent number: 5968603
    Abstract: A process for manufacturing wear and corrosion-protected surfaces on plasticized screws for injection molding machines forms the wear-resistent layers over the entire screw surface in two steps. A laser technique is used to melt additives into the surfaces of the screw rib, flank and top as well as the screw base by high-speed flame spring with hard metallic and/or ceramic substances.
    Type: Grant
    Filed: May 30, 1997
    Date of Patent: October 19, 1999
    Assignee: Engel Maschinenbau Gesellschaft m.b.H.
    Inventors: Otto Urbanek, Peter Baldinger
  • Patent number: 5958204
    Abstract: A method of controlling the final coating thickness of a diffused aluminide coating on a metal substrate. The method includes: (a) depositing an alumina-doped platinum-silicon powder onto a metal substrate, (b) heating the coated substrate to diffuse the platinum-silicon powder into the substrate and removing the undiffused scale, (c) depositing an aluminum-bearing powder onto the platinum-silicon-enriched substrate, and (d) heating the coated substrate to diffuse the aluminum-bearing powder into the substrate and removing the undiffused scale. The depositions are preferably done electrophoretically, in which case the Pt--Si deposition bath is doped with alumina or some other inert particulate. Alternatively, slurry deposition may be used. The method may also be used to deposit Pd--Si coatings onto metal substrates.
    Type: Grant
    Filed: September 26, 1997
    Date of Patent: September 28, 1999
    Assignee: Allison Enaine Company, Inc.
    Inventors: George Edward Creech, Paul Stephen Korinko, Michael Joe Barber, Subhash K. Naik
  • Patent number: 5960251
    Abstract: Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.
    Type: Grant
    Filed: December 18, 1996
    Date of Patent: September 28, 1999
    Assignee: International Business Machines Corporation
    Inventors: Vista A. Brusic, Vijay S. Darekar, Michael A. Gaynes, Ravi F. Saraf
  • Patent number: 5955151
    Abstract: A cobalt based coating is provided which is functional to reduce the coefficient of friction between two operatively, frictionally engaging titanium alloy surfaces.
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: September 21, 1999
    Assignee: The Westaim Corporation
    Inventors: Karel Hajmrle, Anthony P. Chilkowich
  • Patent number: 5955141
    Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.
    Type: Grant
    Filed: September 17, 1997
    Date of Patent: September 21, 1999
    Assignee: Alpha Metals, Inc.
    Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
  • Patent number: 5952049
    Abstract: Processes for producing improved environmental protection, corrosion resistance and improved paint adhesion for metals; e.g., ferrous, aluminum, or magnesium alloys; and other surfaces upon contact is disclosed. The processes comprise use of one or more Group IV-A metals such as zirconium in an acidic solution with one or more oxyanions or other non-fluoanions to stabilize and solubilize the metal while fluorides are specifically excluded from the processes and compositions. The processes optionally contain pretreatment stages that serve to activate a surface and/or promote formation of a Group IV-A metal oxide matrices through use of an oxygen donor. The compositions are at a pH below about 5.0 and is preferably in a range between about 1.0 and about 4.0. The coatings may contain surfactants, sequestering agents, or organic additives for improved corrosion protection and paint adhesion. The substrate may be treated by immersion, spray, fogging or rollcoat.
    Type: Grant
    Filed: January 26, 1998
    Date of Patent: September 14, 1999
    Assignee: Natural Coating Systems, LLC
    Inventor: Charles E. Tomlinson
  • Patent number: 5952042
    Abstract: A method of forming a superalloy part comprises: forming a preform from tape, said tape comprising a base metal layer and a braze alloy layer, said base metal layer comprising fibrillated polytetrafluoroethylene and an oxygen-sensitive superalloy base metal powder selected from the group consisting of titanium, aluminum, hafnium, and chromium, and said braze alloy layer comprising fibrilated polytetrafluoroethylene and braze alloy; heating the preform in an hydrogen or vacuum environment. Another method of forming a superalloy part comprises using a tape comprising fibrilated polytetrafluoroethylene, said oxygen-sensitive superalloy base metal powder, and powdered braze alloy.
    Type: Grant
    Filed: August 18, 1997
    Date of Patent: September 14, 1999
    Assignee: Coating Applications, Inc.
    Inventors: Kevin Rafferty, Bruce Rowe
  • Patent number: 5945158
    Abstract: A process for the preparation of silver coated particles useful as polymer fillers is provided. Copper coated, or copper particles are dispersed in an alkaline ammoniacal solution to remove impurities and activate the surfaces thereof. A combined completing and reducing agent is added. Finally, a solution containing silver ions is used to coat the particles with a uniform layer of silver.
    Type: Grant
    Filed: July 14, 1997
    Date of Patent: August 31, 1999
    Assignee: N.V. Union Miniere S.A.
    Inventors: Stojan Djokic, Maurice Dubois, Ross H Lepard
  • Patent number: 5939215
    Abstract: A metallic backing layer such as steel covered by a functional layer of AlSn, AlPb, CuPb, CuSn or CuZn, applied by spraying in air, and a softer covering layer applied to the functional layer by chemical or electrolytic deposition exhibits improved corrosion resistance, running-in behavior and conformability.
    Type: Grant
    Filed: August 4, 1997
    Date of Patent: August 17, 1999
    Assignee: Federal-Mogul Wiesbaden Gmbh
    Inventor: Gerd Andler
  • Patent number: 5935640
    Abstract: A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.
    Type: Grant
    Filed: December 2, 1997
    Date of Patent: August 10, 1999
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Eric Yakobson
  • Patent number: 5922409
    Abstract: The oxidation and corrosion resistance of a nickel-base alloy are enhanced by a process which includes first enriching the surface of an alloy substrate with platinum, as by electrolytic deposition, and then simultaneously diffusing aluminum and silicon from a molten state into the platinum-enriched substrate. The invention further provides coatings and coated substrates with enhanced oxidation and corrosion resistance.
    Type: Grant
    Filed: February 19, 1997
    Date of Patent: July 13, 1999
    Assignee: Sermatech International, Inc.
    Inventors: Bruce G. McMordie, Thomas A. Kircher
  • Patent number: 5914439
    Abstract: A durable, corrosion-resistant glass fiber spinner is prepared by applying as a barrier layer a uniform layer of an alloy, compatible with the material of the spinner, on the walls of the spinner bores. A layer of platinum group metal is applied over the barrier layer.
    Type: Grant
    Filed: May 8, 1997
    Date of Patent: June 22, 1999
    Assignee: Owens Corning Fiberglas Technology, Inc.
    Inventor: Dennis McGarry
  • Patent number: 5912045
    Abstract: This invention relates to a process for producing a selective absorber which contains one or more layers of a non-homogeneous material (cermet), the non-homogeneous material having been produced by means of a sol-gel process.
    Type: Grant
    Filed: November 21, 1997
    Date of Patent: June 15, 1999
    Inventors: Thomas Eisenhammer, Helmut Schellinger, Miladin Lazarov
  • Patent number: 5912055
    Abstract: An apparatus for continuous hot-dip coating of metal strip is provided. The apparatus includes a first coating pot to hold a molten bath of a first coating metal and a first metal heating means to heat the bath of molten metal in the first pot. The apparatus also includes a second coating pot to hold a molten bath of a second coating metal, which second pot is shallow in relation to the first pot and is positionable within an upper part of the first but removable therefrom, and a second metal heating means operable to heat the molten bath of metal in the second pot.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: June 15, 1999
    Inventors: Leslie George Gore, Robert John Henson, Palanisami Karunakaran
  • Patent number: 5900283
    Abstract: An improved method for providing a protective coating on a metal-based substrate is disclosed. It involves the following steps:(a) applying a rough, oxidizable metallic bond layer over the substrate;(b) applying an intermediate layer of alumina over the metallic bond layer by chemical vapor deposition; and then(c) applying a zirconia-based thermal barrier coating over the intermediate layer by a plasma spray technique.The intermediate layer conforms to the bond layer and chemically isolates the bond layer from the thermal barrier coating. The metal-based substrate is often made from a superalloy.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: May 4, 1999
    Assignee: General Electric Company
    Inventors: Himanshu Bachubbai Vakil, Melvin Robert Jackson
  • Patent number: 5882723
    Abstract: Durable electrolytic cell electrodes having low hydrogen overpotential and performance stability. A highly porous electrocatalytic primary phase and an outer, secondary phase reinforcement coating are provided on an electrically conducting transition metal substrate to make the electrodes. Durability is achieved by the application of the outer secondary phase to protect the primary phase electrocatalytically active coating. A process is also disclosed for catalizing a substrate surface to promote electroless deposition of a metal.
    Type: Grant
    Filed: January 13, 1997
    Date of Patent: March 16, 1999
    Assignee: The Dow Chemical Company
    Inventor: Yu-Min Tsou
  • Patent number: 5882733
    Abstract: Process for continuously galvanizing steel sheet by passing the sheet through a bath consisting of zinc, aluminium and silicon, the aluminium content ranging from 0.05% to 0.5% by weight and the silicon content from 0.005% by weight up to saturation.There is neither formation of aluminiferous floating dross nor formation of bottom dross in such a bath.
    Type: Grant
    Filed: September 22, 1997
    Date of Patent: March 16, 1999
    Assignee: Union Miniere France S.A.
    Inventor: Richard Bruno Sokolowski
  • Patent number: 5879760
    Abstract: A method for protecting a titanium aluminide substrate against environmental degradation at higher temperatures, which comprises applying a layer of a ductile titanium alloy to at least one exterior surface of the substrate and applying an oxidation resistant coating to the exterior surface of the ductile layer. The titanium aluminide substrate may be monolithic or a fiber-reinforced composite structure. The oxidation resistant coating is an ion-plated coating of (a) a noble metal, such as gold or platinum, or (b) a coating of tungsten followed by an ion-plated coating of a noble metal.
    Type: Grant
    Filed: November 5, 1992
    Date of Patent: March 9, 1999
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Daniel Eylon, Paul R. Smith
  • Patent number: 5876795
    Abstract: A process for producing a low-stress electrolessly deposited layer of nickel yielding a clean nickel film and having a wettable surface is described. Diffusion is performed in a non-oxidizing environment, using a gas mixture containing nitrogen. The diffusion temperature is optimally set at a temperature of at least 500.degree. C., i.e., at least 150.degree. C. below typical prior art diffusion temperatures. The presence of nitrogen during diffusion changes the direction of the outgoing born away from the surface of the film, and eliminates the requirement that the nickel film be plated on refractory metal that contains glass, which was previously required to provide a media for the boron to diffuse into it for its subsequent removal.
    Type: Grant
    Filed: May 21, 1997
    Date of Patent: March 2, 1999
    Assignee: International Business Machines Corporation
    Inventors: Charles Curtis Goldsmith, Thomas Lester Nunes
  • Patent number: 5863617
    Abstract: A method for applying a rough slip resistant non-skid surface to a substrate in the field at the cite of use, comprising applying at least one base coat of metal to a surface of the substrate; wetting the surface of the substrate with a surfactant; spreading grit onto the wetted surface of the substrate; applying at least one bond coat of metal over the grit and the substrate, locking the grit in place; and, applying at least one finish coat of metal over the grit and the substrate.
    Type: Grant
    Filed: August 21, 1997
    Date of Patent: January 26, 1999
    Assignee: Harsco Technologies Corporation
    Inventor: Eugene A. Piontek
  • Patent number: 5858557
    Abstract: A copper-tungsten or copper-molybdenum substrate is plated with a nickel/gold plating by first activating a surface of the substrate. In activating, the surface is contacted to a concentrated alkaline solution at elevated temperature, and then to a concentrated acidic solution. The surface is thereafter plated with a nickel strike layer, plated with a nickel primary layer overlying the nickel strike layer, sintered, re-activated in a concentrated acidic solution, plated with a nickel secondary layer overlying the nickel primary layer, and plated with a gold layer overlying the nickel secondary layer.
    Type: Grant
    Filed: October 14, 1997
    Date of Patent: January 12, 1999
    Inventors: Sunghee Yoon, William A. Reed
  • Patent number: 5851599
    Abstract: A battery electrode substrate which is constituted of a porous metallic body structure having communicating pores at a porosity of at least 90% and an Fe/Ni multilayer structure wherein the skeletal portion of the porous metallic body is composed mainly of Fe and has an Ni covering layer on the surface thereof while pores communicating with the inside and outside of Fe skeletal portion exist in the Fe skeletal portion and the inside of the pores is covered with Ni. The electrode substrate is produced by applying an iron oxide powder of at most 20 .mu.m in an average particle size on a porous resin core body; heat treating the core to remove an organic resin component while simultaneously sintering Fe to obtain a porous Fe body; and then covering the Fe skeletal portion with Ni by electroplating. In this process, the iron oxide can be used in combination with carbon powder. Further, a nickel porous sintered body can also be produced using nickel oxide in place of iron oxide.
    Type: Grant
    Filed: September 20, 1996
    Date of Patent: December 22, 1998
    Assignees: Sumitomo Electric Industries Co., Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Keizo Harada, Kenichi Watanabe, Shosaku Yamanaka, Kiyoshi Hayashi, Nobuyasu Morishita, Hiroki Takeshima, Hideo Kaiya, Munehisa Ikoma
  • Patent number: 5846606
    Abstract: A process is described for metallizing materials such as plastics, glasses, ceramics and metals, in which (a) the material to be metallized is provided with a coating which contains intrinsically conductive polymer, (b) the intrinsically conductive polymer is activated by reduction and (c) the metal is applied to the material in a non-electrochemical manner by bringing the coated material into contact with a solution containing ions of the metal.
    Type: Grant
    Filed: July 29, 1997
    Date of Patent: December 8, 1998
    Assignee: Zipperling Kessler & Co. (GmbH&Co.)
    Inventor: Bernhard Wessling
  • Patent number: 5843586
    Abstract: A single-crystal article having a thermal barrier coating on a surface thereof, and a method for processing the article so as to promote the life of the coating. As a result of its single-crystal microstructure, the article is characterized by having been unidirectionally solidified along a primary crystallographic direction, and secondary crystallographic directions that are normal to the primary crystallographic direction. Improved spallation resistance of the coating is achieved by selectively orienting the secondary crystallographic direction with respect to a direction normal to a life-limiting surface region of the thermal barrier coating.
    Type: Grant
    Filed: January 17, 1997
    Date of Patent: December 1, 1998
    Assignee: General Electric Company
    Inventors: Jon C. Schaeffer, Mark A. Rosenzweig, Kevin G. McAllister, P. Kennard Wright
  • Patent number: 5834065
    Abstract: This invention discloses processes and articles for the manufacturing of composite plated articles comprising finely divided particulate matter dispersed within metallic matrices and having light emitting properties, such articles being useful in the metallization of articles and their reuse through subsequent rejuvenation, without damaging the base metal of said articles.
    Type: Grant
    Filed: May 22, 1995
    Date of Patent: November 10, 1998
    Assignee: Surface Technology, Inc.
    Inventor: Nathan Feldstein
  • Patent number: 5827567
    Abstract: Disclosed herein is a method of preparing a game ball mold cavity for application of a coating system. A dual region coating system for a game ball mold and a coating application method also are disclosed. The mold preparation method provides for a longer use of a game ball mold than results when conventional mold preparation techniques are used. The dual region coating system comprises a fluorocarbon polymer in the hemispherical opening of the mold cavity, and a metal, such as nickel, impregnated with a fluorocarbon polymer on the land area. The dual region coating system of the invention is particularly useful for making golf ball cores containing zinc-diacrylate and/or zinc dimethacrylate, as these materials tend to adhere to the walls of a mold cavity.
    Type: Grant
    Filed: November 27, 1996
    Date of Patent: October 27, 1998
    Inventor: John Peter Molitor
  • Patent number: 5827618
    Abstract: This invention provides a rust-proofed steel sheet for a fuel tank including an alloy layer containing at least one of Ni, Fe, Zn and Sn and deposited on the surface of a steel sheet to a thickness of 2 .mu.m per surface, and a Sn--Zn alloy plating layer consisting of 40 to 99 wt % of Sn and the balance of iron, containing not greater than 20 crystals/0.25 mm.sup.2 of zinc crystals having a major diameter of not greater than 250 .mu.m and deposited on the alloy layer to a thickness of 2 to 50 .mu.m per surface. The to-be-plated steel sheet to which the plating layer is applied has a composition consisting of C.ltoreq.0.1%, Si.ltoreq.0.1%, Mn: 0.05 to 1.2%, P.ltoreq.0.040%, Al<0.1% and if necessary, at least one of B, Ti, Nb and Cr, and the balance of Fe and unavoidable impurities. This invention provides also a production method of a rust-proofing steel sheet for a fuel tank comprising the steps of applying Ni--Fe type pre-plating to an annealed steel sheet in a quantity of 0.1 to 3.0 g/m.sup.
    Type: Grant
    Filed: November 27, 1996
    Date of Patent: October 27, 1998
    Assignee: Nippon Steel Corporation
    Inventors: Yashichi Oyagi, Takayuki Omori, Masahiro Fuda, Ken Sawada, Nobuyoshi Okada
  • Patent number: 5824367
    Abstract: A method for the deposition of a diamond film, which includes the steps of immersing metallic or nonmetallic substrate in and electroless nickel plating bath containing a reducing agent to form a nickel layer; and depositing the diamond film on the electroless nickel plated substrate. As a result, employing electroless plating to form an inter layer is improved. In addition, the diamond film can be formed regardless of the type of materials used.
    Type: Grant
    Filed: February 21, 1997
    Date of Patent: October 20, 1998
    Assignee: National Institute of Technology and Quality
    Inventors: Jung-Il Park, Kwang-Ja Park
  • Patent number: 5824205
    Abstract: A method producing a coating on a substrate by aluminizing, chromizing or siliconizing the substrate, and depositing on the coated substrate by electrolytic or electroless deposition a metal matrix M.sub.1 from a bath containing particles of CrAlM.sub.2 to co-deposit the particles with the matrix as M.sub.1 CrAlM.sub.2, where M.sub.1 is Ni, Co or Fe or two or all of these elements and M.sub.2 is Y, Si, Ti, Hf, Ga, Nb, Mn, Pt, a rare earth element or two or more of these elements. Preferably, the method includes platinum aluminizing of the substrate. Heat treatments may be incorporated before and after deposition of the M.sub.1 CrAlM.sub.2. The deposition of the M.sub.1 CrAlM.sub.2 is carried out at a current density of less than 5 mA per square centimeter. Preferably, the deposition forms a M.sub.1 CrAlM.sub.2 layer less than 50 microns thick, and occurs at a bath loading of less than 40 grams per liter of the particles.
    Type: Grant
    Filed: May 16, 1996
    Date of Patent: October 20, 1998
    Assignee: Praxair S.T. Technology, Inc.
    Inventor: John Foster
  • Patent number: 5789089
    Abstract: A hot-dipped aluminum coated steel sheet including, on the surface thereof, a coating layer consisting of 2 to 15 wt % of Si, not greater than 1.2 wt % of Fe, 0.005 to 0.6 wt % of Mn, 0.002 to 0.05 wt % of Cr and the balance of Al and unavoidable impurities, and an alloy layer disposed between the coating layer and the steel sheet, having a thickness of not greater than 7 .mu.m and having a mean composition consisting of 20 to 50 wt % of Fe, 3 to 20 wt % of Si, 0.1 to 10 wt % of Mn, 0.05 to 1.0 wt % of Cr and the balance substantially consisting of Al. This steel sheet can be produced by conducting coating in a coating bath consisting of 3 to 15 wt % of Si, 0.5 to 3.5 wt % of Fe, 0.05 to 1.5 wt % of Mn, 0.01 to 0.2 wt % of Cr and the balance substantially consisting of Al, or by adjusting the sum of the concentrations of Zn and Sn in the impurities in the coating layer to not greater than 1 wt %.
    Type: Grant
    Filed: May 17, 1996
    Date of Patent: August 4, 1998
    Assignee: Nippon Steel Corporation
    Inventors: Jun Maki, Takayuki Ohmori, Masaaki Enjuji, Haruhiko Eguchi, Masaaki Yamamoto, Yu Ando, Yusho Oyama, Nobuyoshi Okada
  • Patent number: 5788823
    Abstract: A method of improving oxidation resistance of a platinum modified aluminide diffusion coating on a substrate involves electroplating the substrate with a platinum layer from an aqueous hydroxide based electroplating solution and aluminizing the substrate to grow the platinum modified aluminide diffusion coating on said layer. The electroplating solution preferably includes an alkali element and/or alkaline earth element that is incorporated in the platinum layer and in the aluminide diffusion coating formed thereon to significantly improve oxidation resistance of the coating.
    Type: Grant
    Filed: July 23, 1996
    Date of Patent: August 4, 1998
    Assignee: Howmet Research Corporation
    Inventors: Bruce M. Warnes, Thomas A. Legard, Nick S. DuShane, Jack E. Cockerill, Robert W. Beck
  • Patent number: 5783315
    Abstract: An article having a protective coating thereon includes a substrate having a substrate composition and a substrate surface, and a protective coating contacting and overlying at least a portion of the substrate surface. The substrate is preferably a Ti--Nb aluminide, an .alpha.2-titanium aluiminide, or a .gamma.-titanium aluminide. The protective coating includes a metallic layer contacting the substrate surface and having a composition, in atomic percent, of from about 5 to about 40 percent chromium, from about 44 to about 59 percent aluminum, balance titanium plus incidental impurities. The protective coating may further include a ceramic layer contacting and overlying the metallic layer, with the metallic layer lying between the ceramic layer and the substrate.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: July 21, 1998
    Assignee: General Electric Company
    Inventors: Jon C. Schaeffer, Russell L. McCarron, Gerald H. Meier, Roger A. Perkins, Joseph F. Cullinan
  • Patent number: 5780113
    Abstract: The present invention provides a method for forming a multi-layer coating film by applying a clear coating (B) on the film of a leafing type aluminum flake-containing metallic coating (A), which method comprises forming a film of the metallic coating (A), curing the film, applying thereon a composition (C) containing a polymer formed from an unsaturated monomer having a phosphoric acid group represented by --O--PO(OH)(R.sub.1) (wherein R.sub.1 is a hydroxyl group, a phenyl group or a C.sub.1-20 alkyl group) and a hydroxyl group-containing unsaturated monomer, and then applying the clear coating (B) on the film of the composition (C).The method can form a multi-layer coating film improved in interlayer adhesivity between the metallic coating film and the clear coating film, without reducing the excellent effects and metallic feeling provided by a metallic coating film containing leafing type aluminum flake.
    Type: Grant
    Filed: April 4, 1997
    Date of Patent: July 14, 1998
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Yutaka Masuda, Akimasa Nakahata, Yoshiyuki Yukawa, Motoshi Yabuta
  • Patent number: 5780110
    Abstract: A method for manufacturing an article for use in a gas tubine engine is disclosed, which comprises applying a metallic bond coating on a superalloy substrate; surface doping a surface of the bond coating with at least one element selected from the group consisting of Fe, Cr and Y by plating, ion implantation, MOCVD and sputttering; and then applying an insulative ceramic coating on the bond coating.
    Type: Grant
    Filed: March 18, 1997
    Date of Patent: July 14, 1998
    Assignee: General Electric Company
    Inventors: Jon C. Schaeffer, William B. Connor, Robert D. Field
  • Patent number: 5776617
    Abstract: A diffusion barrier to help protect titanium aluminide alloys, including the coated alloys of the TiAl.gamma.+Ti.sub.3 Al (.alpha..sub.2) class, from oxidative attack and interstitial embrittlement at temperatures up to at least 1000.degree. C. is disclosed. The coating may comprise FeCrAlX alloys. The diffusion barrier comprises titanium, aluminum, and iron in the following approximate atomic percent:Ti-(50-55)Al-(9-20)Fe.This alloy is also suitable as an oxidative or structural coating for such substrates.
    Type: Grant
    Filed: October 21, 1996
    Date of Patent: July 7, 1998
    Assignee: The United States of America Government as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Michael P. Brady, James L. Smialek, William J. Brindley
  • Patent number: 5773078
    Abstract: An improved method for depositing zirconium oxide from a zirconium oxide source onto a substrate by means of physical vapor deposition is described. The method includes the step of adding zirconium metal to the zirconium oxide source, which is usually in the form of a cylindrical ingot. The zirconium metal is present in an amount sufficient to chemically bond with a substantial portion of oxygen which would otherwise be freed from the oxide source, as both the zirconium metal and the zirconium oxide source are evaporated during physical vapor deposition. The invention is especially suited for EB-PVD techniques, in which an electron beam is used to evaporate the zirconium metal and the zirconium oxide source during physical vapor deposition. In one embodiment, the zirconium metal comprises a tube which surrounds and contacts at least a portion of the outer surface of the ingot. In another embodiment, the zirconium metal is in the form of a rod inserted in a cavity within the ingot.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: June 30, 1998
    Assignee: General Electric Company
    Inventor: David William Skelly
  • Patent number: 5759641
    Abstract: A method of applying strengthening coatings to metallic or metal-containing surfaces is provided in which the surface (2) to which a strengthening coating is to be applied is first subjected to activation, then at least one strengthening coating layer (1) is applied to the surface thus prepared. Said layer is treated with a laser beam (3) having a diameter (d) ranging from 0.2 mm to half the diameter (d) of the laser beam (3) entering into focusing element (5), with a power of at least 0.5 kW, with a rate of relative travel (A) of the surface being treated (2) and the laser beam (3) of at least 50 mm/min, the distance (L) between the focal plane (f) of the focusing element (5) to the surface being treated (2) being less than or equal to half the focal distance (F).
    Type: Grant
    Filed: May 15, 1996
    Date of Patent: June 2, 1998
    Inventors: Ludmila Nikolaevna Dimitrienko, Maria Alexandrovna Zelenskaia, Evgeny Dmitrievich Izotov
  • Patent number: 5738708
    Abstract: A composite metal membrane including a first metal layer of Group IVB met or Group VB metals, the first metal layer sandwiched between two layers of an oriented metal of palladium, platinum or alloys thereof is provided together with a process for the recovery of hydrogen from a gaseous mixture including contacting a hydrogen-containing gaseous mixture with a first side of a nonporous composite metal membrane including a first metal of Group IVB metals or Group VB metals, the first metal layer sandwiched between two layers of an oriented metal of palladium, platinum or alloys thereof, and, separating hydrogen from a second side of the nonporous composite metal membrane.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: April 14, 1998
    Assignee: The Regents of the University of California Office of Technology Transfer
    Inventors: Nathaniel M. Peachey, Robert C. Dye, Ronny C. Snow, Stephan A. Birdsell
  • Patent number: 5733598
    Abstract: A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on the printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.
    Type: Grant
    Filed: March 10, 1997
    Date of Patent: March 31, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoki Sera, Toshiharu Fukui, Kouji Tanabe, Futoshi Matsui
  • Patent number: 5733599
    Abstract: A process for enhancing the solderability of a surface through the use of immersion silver deposits is disclosed. In the preferred embodiment two immersion deposits are utilized in sequence. A composition for immersion silver plating is also disclosed.
    Type: Grant
    Filed: March 22, 1996
    Date of Patent: March 31, 1998
    Assignee: MACDermid, Incorporated
    Inventors: Donald Ferrier, Eric Yakobson