Abstract: Apparatus and methods for an apparatus and method for a top wrap assembly is disclosed. The top wrap assembly includes a plurality of buns, wherein the plurality of buns comprises a plurality of assembled layers, wherein the plurality of buns defines a central bore, at least one shaft, wherein the at least one shaft is disposed in alignment with the central axis of the plurality of buns, wherein the at least a shaft is passes through the central bore, and a plurality of locking mechanisms, wherein each locking mechanism is configured to engage with the plurality of buns and the at least one shaft, wherein the locking mechanism is configured to secure the plurality of buns and the at least one shaft. The method comprises using the at least one shaft to execute the process described above.

Abstract: The tool includes a base including a rigid carrier and a flexible collar encircling the rigid carrier; an elastically compressible interface; and a flexible buffer including a central portion that is located in line with the rigid carrier and a peripheral portion that is located transversely therebeyond. This peripheral portion is connected to the carrier exclusively via the interface and via the collar, wherein the collar is configured so that the tool is elastically deformable between a rest position that it adopts in the absence of stress and a reference position in which the transverse end second surface of the flexible buffer is pressed against a reference surface that is spherical and of radius included between 40 mm and 1500 mm.

Abstract: A polishing pad or polishing tape with abrasive particles (e.g., diamond, aluminum-oxide, silicon-carbide, etc.) having an average particle size of between approximately 0.5 micrometers (?m) and 5.0 ?m, which are strongly adhered with water-insoluble binders to a flexible and lens-conformable substrate having a cushion so that there is little-to-no shedding or release of the particles from the substrate.

Abstract: The present invention discloses an automatic high-shear low-pressure force-controlled grinding device for a complicated curved surface and a machining method thereof, which belong to the field of complicated curved surface grinding technologies of difficult-to-machine materials. The device comprises a base, columns, an industrial robot, an electrical spindle, a force-controlled floating work holder, a workpiece chuck, a grinder plate, a six-dimensional force sensor, a rotary table, a triaxial precision displacement table, a safeguard hood, a safety door, and a pedestal. The grinder plate comprises a grinder plate substrate, a press plate, a lining plate, and an abrasive layer. Each module is effectively communicated, and a control system collects and processes signals as well as transmits commands to achieve automatic force-controlled grinding of the complicated curved surface.

Abstract: A polishing article has a polishing surface and an aperture, the aperture including a first section and a second section. The polishing article includes a projection extending inwardly into the aperture. The polishing article includes a lower portion on a side of the first surface farther from the polishing surface. A window has a first portion positioned in the first section of the aperture and a second portion extending into the second section of the aperture. The window has a second surface substantially parallel to the polishing surface. A first adhesive adheres the first surface of the projection to the second surface of the window to secure the window to the projection and a second adhesive of different material composition than the first adhesive. The second adhesive is positioned laterally between the second portion of the window and the lower portion of the polishing article.

Abstract: The embodied invention is an enhanced rotary brush tool that provides important cleaning on porcelain surfaces that are stained by hard water deposits. The brush tool incorporates an outer holder that includes a motor connecting end, a tapered shaft, an outer cup and shroud. A fill epoxy bonds the outer holder together with an internal strengthening rod and an abrasive pad. The overall assembly provides significant compressive strength to allow an individual to utilize pressure when scrubbing off the water hardness buildup.

Abstract: A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.

Abstract: A method of making conglomerate abrasive particles includes: providing agglomerate abrasive particles comprising mineral particles in a first vitreous binder; combining the agglomerate abrasive particles with a second vitreous binder material precursor to form precursor conglomerate abrasive particles; and heating the precursor conglomerate abrasive particles to convert the second vitreous binder material precursor into a second vitreous binder, different from the first vitreous binder, thereby forming the conglomerate abrasive particles. The first vitreous binder differs from the second vitreous binder by at least one of: i) elemental composition, or ii) an intrinsic physical property; and wherein the conglomerate abrasive particles can pass through a testing sieve having one-millimeter openings. Conglomerate abrasive particles preparable by the method, and abrasive articles containing them, are also disclosed.

Abstract: A rubbing roller is disclosed, which includes a cylindrical roller mandrel and a rubbing fabric in close contact with an outer surface of the roller mandrel; the rubbing fabric includes a first end face, an outer side face and a second end face in this order along an axial direction of the roller mandrel, and the first end face and the second end face are connected through the outer side; the outer side face of the rubbing fabric, at the first and second end faces, has a distance d1 from an axial line of the roller mandrel; the outer side face of the rubbing fabric, at a first cross section between the first and second end faces, has a distance d2 from the axial line of the roller mandrel, and d1>d2.

Abstract: Several devices and methods for preparing the vertebral endplates while minimizing damage to the vertebral endplates. Each design incorporates flexible means to reduce endplate damage while enabling removal of the cartilage adhered to the endplate cortical bone.

Abstract: A plate for machining surfaces is provided, comprising a body with bores and channels for aspirating dust, on the top of which a deflector is hooked. Said deflector includes at least one vertical curved wall adapted to define a double suction chamber consisting of a peripheral chamber and of a central chamber.

Abstract: A self-contained fibrous buffing article including at least one layer of a fibrous nonwoven fabric; the nonwoven fabric having a hardened adherent coating including a crosslinked binder, abrasive particles, and a lubricant blend; and the lubricant blend including at least a fatty acid, mineral oil and glycerin.

Abstract: A grinding disk is provided with a support plate with anchoring projections. A drive connector is connected to the support plate. An elastically deformable pad in the form of an injection molded part of un-foamed elastomeric thermoplastic synthetic material is provided and has a first face and an opposite second face. The pad has a chamber structure provided on the first face. The chamber structure has chambers laterally delimited by intermediate walls. The chambers have a top side that is open and is facing in a direction of the first side. The pad has a substantially closed support surface provided on the second face and facing away from the chamber structure. A working element is to be attached to the support surface. The support plate is connected to the first face of the pad to support the pad. The anchoring projections of the support plate are embedded within the pad.

Abstract: The work of replacing a polishing pad is easily performed, and thermal damage is prevented from occurring in a polishing table. A polishing apparatus 100 includes a polishing table 110 having an attachment surface 110a to which a polishing pad 108 used to polish a substrate 102 is attached. The polishing apparatus 100 also includes a silicone layer 111 provided on the attachment surface 110a of the polishing table 110 and interposed between the polishing table 110 and the polishing pad 108. By interposing the silicone layer 111, it is possible to easily detach and attach the polishing pad 108. In addition, since a heat treatment for coating the silicone layer 111 on the polishing table 110 is performed at a relatively low temperature, it is possible to prevent thermal damage from occurring in the polishing table 110 due to the heat treatment.

Abstract: A polishing pad, having a polishing layer comprising a thermoset polyurethane foam, wherein the polishing layer has an in-plane variation of 12 or less in microrubber A hardness, the variation being obtained by measuring the polishing layer from a polishing surface side of the layer, the thermoset polyurethane foam contains, as raw material components, an isocyanate component and active-hydrogen-containing compounds, and the active-hydrogen-containing compounds comprise a trifunctional polyol having at least one terminated hydroxyl group that is a secondary hydroxyl group, and having a hydroxyl group value of 150 to 1,000 mg KOH/g in an amount of 10 to 50 parts by weight for 100 parts by weight of the active-hydrogen-containing compounds.

Abstract: A flexible sanding apparatus includes a thin, relatively flat spring member and one or more coil spring members coupled to a first side of the flat spring member along a length of the flat spring member. A sanding surface may be coupled to a second side of the flat spring member. The flat spring member and the coil spring members may be elongated members coupled together lengthwise. The coil spring member may be a closed coil spring member that allows concave flexing of the sanding surface and inhibits convex flexing of the sanding surface.

Abstract: Apparatus and method for sharpening a tool. In accordance with some embodiments, a selected side surface of the tool is placed in contacting engagement against an upper reverse sharpening guide surface that faces an abrasive surface extending along a first plane. The upper reverse sharpening guide surface is aligned along a second plane that intersects the first plane at an acute angle. A tool cutting edge contactingly engages a non-abrasive support surface disposed between the upper reverse sharpening guide surface and the abrasive surface to establish a plunge depth of the tool prior to contact with the abrasive surface. The tool is thereafter moved away from the upper reverse sharpening guide in a lateral direction across the abrasive surface while nominally maintaining the tool at the acute angle to sharpen the cutting edge in a trailing cutting edge orientation.

Abstract: The present invention relates to a disc for abrading which is fitted to an electrically driven tool and is able to freely abrade flat surfaces and curved surfaces. And provided is a disc for abrading flat surfaces and curved surfaces, wherein the disc comprises: a holder of a plastic material, which rotates following the coupling of the electrically driven tool into a coupling hole formed in the centre thereof; a disc-shaped abrasive-fabric assembly formed by stacking layers of a plurality of abrasive-fabric pieces circumferentially along the edge of the holder; a resin layer for integrally linking the holder and the abrasive-fabric assembly; and a circular curving part which is formed between the edge of the holder and the edge of the abrasive-fabric assembly, and wherein the curving part can flex along the surface of a material to be abraded, so as to freely abrade a flat surface or curved surface of the material to be abraded.

Abstract: An abrasive article is provided. The article includes (a) a flexible backing having opposing first and second surfaces; (b) an abrasive layer comprising plurality of abrasive particles disposed on the first surface of the flexible backing; and (c) an adhesive layer comprising load bearing particles and an adhesive matrix, the adhesive layer disposed on the second surface of the polymer layer. At least a portion of the load bearing particles is substantially enveloped in the adhesive matrix and is in contact with the second surface of the polymer substrate.

Abstract: A sanding pad is disclosed having a socket for connection to a drive shaft of an oscillatory drive, wherein the socket is configured for positive connection to the drive shaft of the oscillatory drive, wherein the socket is connected to a support element, and a cushion element of flexible material, on which a sanding surface is formed, is mounted on the support element, wherein the sanding pad has a rim area, a socket area, which surrounds the socket, and an intermediate area between the rim area and the socket area, and wherein the rim area is materially reinforced relative to the intermediate area.

Abstract: A TSV (through silicon via) reveal process using CMP (chemical mechanical polishing) may be acoustically monitored and controlled to detect TSV breakage and automatically respond thereto. Acoustic emissions received by one or more acoustic sensors positioned proximate a substrate holder and/or a polishing pad of a CMP system may be analyzed to detect TSV breakage during a CMP process. In response to detecting TSV breakage, one or more remedial actions may automatically occur. In some embodiments, a polishing pad platen may have one or more acoustic sensors integrated therein that extend into a polishing pad mounted on the polishing pad platen. Methods of monitoring and controlling a TSV reveal process are also provided, as are other aspects.

Abstract: A machine tool clamping device for clamping a laminar machining tool to a tool holder that is eccentrically movably mounted includes at least one clamping unit with at least one movably mounted clamping element. The machine tool clamping device also includes at least one slotted link movement unit configured to move the clamping element in at least one operating state so as to generate tensile stress in the laminar machining tool.

Abstract: This disclosure is directed to a chemical mechanical polisher and a polishing pad component thereof. The chemical mechanical polisher comprises a polishing platen having a flat surface, and the polishing platen comprises: an electromagnet disposed under the flat surface and configured to fix a polishing pad base on the flat surface; and a switch configured to control the power-on and power-off of the electromagnet. The polishing pad component comprises a polishing pad base, and the polishing pad base is formed of a ferromagnetic material. The chemical mechanical polisher of this disclosure and the polishing pad component thereof can make polishing pad replacement easy, and can also save polishing pads and thus reduce the consumable cost of the chemical mechanical polishing.

Abstract: A reinforcement ring is for placement in a carrier head to abut an inner surface of a perimeter portion of a flexible membrane. The reinforcement ring includes a substantially vertical cylindrical portion, a first flange projecting inwardly from the bottom of the cylindrical portion, and a second flange projecting outwardly from a bottom of the cylindrical portion. The second flange projects downwardly at a non-zero angle from vertical.

Abstract: A flexible sanding apparatus includes a thin, relatively flat spring member and one or more coil spring members coupled to a first side of the flat spring member along a length of the flat spring member. A sanding surface may be coupled to a second side of the flat spring member. The flat spring member and the coil spring members may be elongated members coupled together lengthwise. The coil spring member may be a closed coil spring member that allows concave flexing of the sanding surface and inhibits convex flexing of the sanding surface.

Abstract: A sanding tool including a blade and a handle, the blade having first and second opposing faces. An attachment layer removably secures to the sanding tool at the opposing faces, thereby to provide opposing abrasive layers on opposing sides of the blade. The shape of the blade, with a wider yet thinner top end, and a reduced thickness from a bottom side thereof to a top edge thereof, reduces hand strain when sanding drywall, and also helps to assure uniform sanding and avoidance of hand injury when sanding corners, in a cost-effective manner.

Abstract: A rotatory sander pad includes a rigid inner portion for attaching to a rotary sander tool and a flexible outer portion for accepting an abrasive medium. The flexible outer portion includes a substantially flat bottom surface for accepting the abrasive medium, a through-hole substantially in its center, and a multi-dimensional upper surface that includes air flow channels disposed between the through-hole and a vertically oriented wall that direct air from below the substantially flat bottom surface through the through-hole and away from the abrasive medium.

Abstract: A system for dressing centrifugal clutches has a drum tool with an internal abrasive surface, and a flap tool with abrasive flaps. The drum tool can replace the clutch drum on the clutch driven shaft to dress the clutch shoes, or the flap tool can replace the clutch shoes and mechanism on the clutch drive shaft, which may be the engine crankshaft, to dress the clutch drum. In either case, the tool being used and the component being dressed can accurately simulate the engagement of the clutch shoes and clutch drum in operation, so that the clutch drum and shoes can be accurately dressed to the correct shape, matching each other, for use.

Abstract: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.

Abstract: A method for manufacturing a grinding disc comprising: injecting a first injection plastic material on a mandrel to form a preliminary carrier disc, the preliminary carrier disc including a first embedding portion for completely encircling the embedding section, and a carrier portion extended from a periphery of the first embedding portion; and injecting a second injection plastic material on the preliminary carrier disc to form a secondary carrier disc, the secondary carrier disc including an engaging portion adhered to and supported by the carrier portion, and a mounting surface opposite to the engaging portion. Thus, the grinding disc is adapted to quickly produce appropriate deformation according to contours of a grinding target for preferred grinding effects.

Abstract: The invention relates to a method of making a grinding disk, comprising the steps of: providing a cap; providing an abrasive part; placing the cap on the abrasive part to form an assembly; holding the assembly and injecting a molding material into a space between the cap and the abrasive part and into the abrasive part to bond the cap and the abrasive part. A grinding disk made by the method is also disclosed.

Abstract: An abrasive flap disc having improved properties with respect to production and grinding behavior combines an abrasive grit having a special grit mixture consisting of 25% to 75% (high-performance ceramic) zirconium dioxide and of 25% to 75% aluminum oxide with a number of abrasive lamellae per abrasive flap disc in the range between 30 and 46.

Abstract: Disclosed is a semiconductor wafer polishing method for polishing the surfaces to be polished of semiconductor wafers by use of polishing pads (16, 17) provided on fixing plates by relative movement of the polishing pads and the semiconductor wafers held by carriers. The shaping surfaces (25) of a polishing pad shaping jig (21) are shaped by inverting, with respect to ideal shapes, the shapes of the surfaces to be polished of each semiconductor wafer when the surfaces are polished by use of the polishing pads (16, 17) before shaping, and the shapes of the shaping surfaces of the polishing pad shaping jig are transferred to the pad surfaces (16A and 17A) of the respective polishing pads (16, 17). The surfaces to be polished of each semiconductor wafer are polished by use of the pad surfaces.

Abstract: A back-up apparatus for use with a surface treating apparatus can include a back-up plate having a pad attachment face and a back-up pad having a first pad face and a second pad face. The back-up apparatus can also include a porous interface layer. The interface layer can include an outer face. The back-up apparatus can also include a layer of a first adhesive on the outer face and extending into the interface layer, and a layer of a second adhesive provided on the layer of the first adhesive. The second adhesive can be selected to releasably adhesively bond to an abrasive sheet. The first and second adhesives can be selected such that the adhesive bond between the first adhesive and the second adhesive is stronger than the adhesive bond between the second adhesive and the abrasive sheet.

Abstract: A circular grinding wheel has a center point and defines a multiplicity of extraction holes, which, in particular, are circular extraction holes. The center point of each extraction hole is arranged at the point of intersection of a radial line extending from the center point of the grinding wheel with a circle of holes that is arranged concentrically with respect to the center point and that has a radius. At least one of the radial lines is a single-hole radial line, on which the center point of only a single extraction hole is arranged. The center points of all the extraction holes that are arranged on a single-hole radial line lie substantially on a common single-hole circle having a radius. Each radial line comprises the center point of an extraction hole on at least one radius on which the two radial lines that are adjacent to this radial line in the circumferential direction have no center point of an extraction hole.

Abstract: A structure for a backing plate of an abrasive disk is disclosed. The structure includes layers of abrasive resin interspersed with layers of reinforcing fiberglass. The layers are generally disk shaped and cover certain radial intervals of the entire backing plate between the inner diameter and the outer diameter. For example, a radial stress profile plotting the stress along a radial line from inner to outer diameter can be determined. The amount and radial positioning of reinforcing layers (e.g., reinforcing fiberglass) may then be determined. An appropriate amount of reinforcing layers may then be placed within the radial intervals that experience the highest stress.

Abstract: A lens pad for use in surfacing a lens work piece, one side of which pad provides a working surface and the other side of which pad provides micro formations spread out substantially uniformly over that other side of the pad. When the lens pad is in use, it is attached to a surface of a lens surfacing tool. The latter surface provides micro formations spread substantially uniformly over that surface of the lens surfacing tool. The micro formations of the pad interengage or interlock with those of such a surface of such a lens surfacing tool when the pad is in use. Also, such a lens surfacing tool, a combination of such a pad attached to such a tool, and a lens surfacing machine having such a tool, or such a combination.

Abstract: A polishing head for use in a polishing machine for optical surfaces, having an axis of rotation and a base body having a holding structure intended to be arranged at a polishing spindle and having a transport element intended to be held at a tool change arm, the transport element being positionable against a holding element of the tool change arm in order to perform a tool change, wherein at least one locking element is provided which can be positioned against the tool change arm such that a positive and/or non-positive joint results.

Abstract: A system for processing wafers that will reduce the amount of time required for polishing wafers, increase worker safety while performing the process and increase the percentage of acceptable wafers after processing.

Abstract: Disclosed herein are example devices and related methods for deburring and/or rounding of metal work pieces, including, for example, punched and laser-cut pieces, in, for example, a through-feed process. An example device disclosed herein includes a conveyor belt for continuously conveying the work pieces and at least one disc sander rotating around its vertical axis. The example includes a sanding surface that is attachable on its underside facing the work piece. Creating such a device, which also efficiently machines small work pieces, is achieved by holding the sanding surface in a resilient manner in a primarily orthogonal direction relative to the work piece.

Abstract: An apparatus for lapping a portion of an exterior surface of a housing is described. The apparatus includes at least a lapping tool arranged to execute a lapping operation. The lapping tool takes the form of a lapping pad which includes a conduit through which slurry can be transported for local deposition on the housing during a lapping operation. The apparatus also includes a stage on which a workpiece in the form of a housing is mounted. During the lapping operation, slurry is passed through the slurry conduit in the lapping tool, the lapping tool and the housing are moved in various motions. In this way, a gradual transition region is created between an accessory region and the remainder of the housing.

Abstract: An abrasive article is provided. The article includes (a) a flexible backing having opposing first and second surfaces; (b) an abrasive layer comprising plurality of abrasive particles disposed on the first surface of the flexible backing; and (c) an adhesive layer comprising load bearing particles and an adhesive matrix, the adhesive layer disposed on the second surface of the polymer layer. At least a portion of the load bearing particles is substantially enveloped in the adhesive matrix and is in contact with the second surface of the polymer substrate.

Abstract: A sanding drum assembly in one embodiment includes at least one elastic friction member defining an outer perimeter, a plurality of feet located inwardly of the at least one elastic friction member, each of the plurality of feet including a movable portion movable between a first position whereat the plurality of feet define a first outermost circumference and a second position whereat the plurality of feet define a second outermost circumference, wherein the second outermost circumference is larger than the first outermost circumference, and an actuator, wherein the plurality of feet and the actuator are configured such that as the actuator and the plurality of feet change from a first configuration to a second configuration, the plurality of feet are forced from the first position to the second position.

Abstract: A template for polishing Silicon Carbide, Sapphire, Germanium, Silicon and pattern wafers having a slurry inlet, channels, outlets and pockets for holding said wafers terminating in peripheral vacuum ports in order to facilitate an efficient flow of slurry over the semiconductor wafers during a polishing process.

Abstract: An abrasive article including a flexible backing having opposing first and second surfaces. The first surface of the flexible backing includes abrasive features. An adhesive layer including load bearing particles and an adhesive matrix is disposed on the second surface of the flexible backing. At least a portion of the load bearing particles is substantially enveloped in the adhesive matrix and is in contact with the second surface of the polymer substrate. A rigid support is preferably attached to the adhesive layer including the load bearing particles. At least a portion of the load bearing particles is preferably in contact with the rigid support.

Abstract: A grinding wheel comprises an outer base with a first attached grain pad; and an inner frame with a second attached grain pad; and a spindle axis shared by the outer base and the inner frame, wherein at least one of the outer base and the inner frame can move independently along the shared spindle axis; and wherein the outer base, the inner frame, and the shared spindle axis all have a same center. A grinding system comprises an above said grinding wheel, and a wheel head attached to the shared spindle axis, capable of moving vertically, in addition to a motor driving the grinding wheel to spin; and a chuck table for fixing a wafer on top of the chuck table; wherein the grinding wheel overlaps a portion of the chuck table, each capable of spinning to the opposite direction of another.

Abstract: A polishing pad used in conjunction with a carrier ring to polish a substrate and has a motion direction when polishing is provided. The carrier ring has at least one carrier groove, and the substrate has a substrate radius. The polishing pad has a polishing layer and a surface pattern. The surface pattern has traversing grooves, and an angle between the tangent line of each traversing groove and the tangent line of the motion direction is not equal to 0 degree. Each traversing groove respectively has a traversing groove trajectory corresponding to the motion direction, and the traversing groove trajectory of the traversing groove has a trajectory width smaller than the substrate radius. At leading region of the carrier ring corresponding to the motion direction, the traversing grooves have at least one carrier compatible groove which aligns with the at least one carrier groove of the carrier ring.

Abstract: A polishing head for use in a polishing machine for optical surfaces, having an axis of rotation and a base body having a holding structure intended to be arranged at a polishing spindle and having a transport element intended to be held at a tool change arm, the transport element being positionable against a holding element of the tool change arm in order to perform a tool change, wherein at least one locking element is provided which can be positioned against the tool change arm such that a positive and/or non-positive joint results.

Abstract: Methods of abrading surfaces by rotationally reciprocating abrasive surfaces in contact with the surfaces, abrasive articles for use in rotationally reciprocating tools, and methods of removing defects in a surface, where the methods include sanding using a rotationally reciprocating abrasive surface followed by one or more polishing operations are disclosed.

Abstract: This disclosure is directed to a chemical mechanical polisher and a polishing pad component thereof. The chemical mechanical polisher comprises a polishing platen having a flat surface, and the polishing platen comprises: an electromagnet disposed under the flat surface and configured to fix a polishing pad base on the flat surface; and a switch configured to control the power-on and power-off of the electromagnet. The polishing pad component comprises a polishing pad base, and the polishing pad base is formed of a ferromagnetic material. The chemical mechanical polisher of this disclosure and the polishing pad component thereof can make polishing pad replacement easy, and can also save polishing pads and thus reduce the consumable cost of the chemical mechanical polishing.