Abstract: An abrasive article made from a plurality of abrasive composites bonded to form a three dimensional abrasive article. Each abrasive composite includes a plurality of primary abrasive particles bonded together by a first binder matrix to form a shaped or irregular abrasive composite. Present within the abrasive composite is an intra-composite porosity between and among the primary abrasive particles. Inter-composite porosity is present within the abrasive article between and among the abrasive composites. The abrasive article is used to grind glass and other workpiece surfaces to a mirror finish.

Abstract: A method of manufacturing a polishing substrate is disclosed. The method includes disposing into a mold a reaction mixture of dibasic acid and a hydroxylated polymer, and applying a pressure and a temperature to the reaction mixture that are sufficient to cause polymerization and substrate formation in the mold. The dibasic acid is preferably adipic acid. Before pressure and temperature are applied to the reaction mixture, the reaction mixture is capable of being fortified with a polishing agent and/or a filler for controlling modulus and/or the coefficient of expansion.

Abstract: This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrofoil polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.

Abstract: The present invention provides a superabrasive tools and methods for making the same. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy that contains Cr, Mn, Si, or Al or mixtures thereof.

Abstract: A laminated pad and method of manufacturing such pad wherein the laminated pad includes a grip portion and a work surface. The work surface may be comprised of any of a variety of substances including absorbent material, abrasive material, or polishing material. The grip portion may be upstanding for facile gripping with one's fingers.

Abstract: Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished.

Abstract: The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The deformable pad of the present invention includes a plurality of solid supports which substantially eliminate the nonuniform polishing rates in known CMP processes and may be tailored to optimize a wide array of CMP processes. The CMP apparatus of the present invention incorporates a deformable pad of the present invention and may include several other known features, such as a polishing pad, a substrate carrier, mechanical assemblies for agitating the polishing pad or substrate carrier, etc.

Abstract: A wafer retainer includes: a foam layer capable of adsorbing a wafer on a surface thereof in a detachable manner; a first pressure-sensitive adhesive layer formed on a back face of the foam layer; a support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support for adhering to a base plate of a polishing machine; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-chain crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition.

Abstract: A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.

Abstract: The present invention relates to a polishing pad for the chemical mechanical polishing (CMP). According to the present invention, there is provided a chemical mechanical polishing pad for polishing a semiconductor wafer with chemicals containing predetermined components supplied between the semiconductor wafer and the polishing pad, comprising a base layer; and an abrasive layer which contains polishing abrasives capsulated with a material soluble in the chemicals and is formed to have a constant thickness on the top surface of the base layer. The capsulated polishing abrasives become free abrasives in the chemicals supplied upon polishing, and take part in the polishing. Capsulating the polishing abrasives can be performed by granulization or spraying. According to the polishing pad of the present invention, planarization polishing can be performed as whole. In addition, since a small amount of chemicals are used, it is advantageous in the economic and environmental aspects.

Abstract: Provided are encapsulated belts and encapsulated pads for use in a variety of polishing application, including the chemical-mechanical polishing and planarization of semiconductor wafers and other workpieces. The encapsulated belts and pads are characterized by a robust seal between a polishing layer of the pad or belt and the edges of the subpad layer of the pad or belt. The robust seal is accomplished by casting a polymer directly over the subpad layer. The edges of the subpad layer may include one or more functional features that promote the formation of a watertight and slurry-resistant seal when the subpad layer is covered with a cast polymer. Also provided is a method of producing a robust seal between the polishing layer and the edge region of the subpad by encapsulating a subpad layer with a polymeric material.

Abstract: A polishing pad with a polishing layer having a macro-texture and a micro-texture wherein the polishing layer is formed by solidifying a flowable material, the polishing layer further comprising hard domains and soft domains, each domain having an average size less than 100 microns.

Abstract: A support belt to be used with a polishing belt. The support belt includes an interior layer made of a polymer, wherein said interior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a first seam and an adhesive placed on an exterior surface of the interior layer. An exterior layer made of a polymer and attached to the adhesive, wherein the exterior layer has a first free end and a second free end that abut one another but are not attached to one another so as to form a second seam.

Abstract: As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad where the polishing pad is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt where the base belt includes a reinforcement layer where the reinforcement layer is a fibrous-type material. In addition, the polishing pad is located over the base belt.

Abstract: An abrasive article that includes a fixed abrasive element having a plurality of abrasive particles, a resilient element, and a plurality of rigid segments disposed between the fixed abrasive element and the resilient element.

Abstract: The invention provides a polishing disk comprising (a) a body comprising a front surface, a back surface, and a peripheral surface, (b) a polishing surface, (c) an end-point detection port extending through the body from the front surface to the back surface, and (d) a drainage channel in fluid communication with the end-point detection port. The invention further provides a method of preparing such a polishing disk and a method of polishing a substrate with such a polishing disk.

Abstract: The invention is directed to a base-pad for placement under a polishing pad for use with a polishing fluid during a polishing operation, the base-pad having a layer with vertical elongated pores that absorb polishing fluid and that confine absorbed polishing fluid from transport laterally in the base-pad. Micropores in the layer are impermeable to the polishing fluid and permeable to gasses.

Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.

Abstract: An abrasive article comprising a backing material having first and second opposed major surfaces and an abrasive layer comprising abrasive particles and binder secured to the said first major surface, the article also bearing a hydrophilic/lipophilic urethane material to enhance dimensional and conformational stability of the abrasive article.

Abstract: An abrasive article includes a fixed abrasive element, a resilient element, a rigid element disposed between the resilient element and the fixed abrasive element, and a plurality of microstructures disposed between the rigid element and the fixed abrasive element.

Abstract: A method of producing a chemical mechanical planarization (CMP) polishing belt structure is disclosed that includes forming a strip of substantially rigid material into a support belt having an interior surface and an exterior surface. At least a portion of the exterior surface of the support belt is altered to form a plurality of gripping members integral with the exterior surface of the support belt. An interior surface of a seamless CMP belt is applied to the exterior surface of the support belt such that the plurality of gripping members engage the interior surface of the seamless CMP belt in a non-slip grip.

Abstract: A polishing pad for polishing glass and the like has a working layer with a plurality of polishing grains, an attaching layer with which the polishing pad is attachable to a polishing head of a power tool, and a connection layer which connects the working layer, with the attaching layer, and the connection layer is composed of vulcanizable material, which is vulcanized at certain temperature and under certain pressure and thereby connects the working layer with the attaching layer.

Abstract: The invention provides a backing for an abrasive article comprising a sheet-like polymeric substrate having a first major surface including a pattern of non-abrasive raised areas and depressed areas and an opposite second major surface including a plurality of shaped engaging elements that are one part of a two-part mechanical engagement system. An abrasive product is provided by coating at least the raised areas of the backing with an abrasive coating.

Abstract: An abrasive pad removably attachable to a driven rotatable shaft and including a plurality of angularly offset abrasive members. Each abrasive member includes an outwardly facing surface having an abrasive disposed thereon. A first abrasive member is partially received within a loop formed by a second abrasive member. Likewise the second abrasive member is partially received within a loop formed by a third abrasive member. Finally, the third abrasive member is partially received within a loop formed by a fourth abrasive member. Each abrasive member is angularly offset from a radially adjacent abrasive member by approximately 45° with each abrasive member lying substantially in a single plane. Also disclosed is a method for forming such an abrasive pad.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a fixed abrasive polishing pad having metal abrasive elements selected to be a compound of metal in the substrate. Alternatively, the metal abrasive elements can include a refractory metal where the substrate includes a refractory metal. Where the substrate includes two metals, the abrasive elements can be selected to planarize the first metal at a rate that is less than approximately twice the rate at which it planarizes the second metal. A single fixed abrasive polishing pad and a single planarizing liquid can be used to planarize both metals.

Abstract: A buff is made from a non-woven fabric where the fibers are first carded and formed into a fairly thick fleece. The fleece is passed over a topographical surface on, for example, a moving belt or a drum. The fleece is subject to a bow-tie hydroentanglement process where many fine jets of water entangle the fibers on the topographical surface. Excess water is vacuumed from the system. The fabric is dried and chemically treated. With the fabric a variety of buffing tools are made, in wheel, belt or roll form. Tests against standard and mill treatment buffs show a remarkably lower fabric weight loss percentage and lower or normal operating temperatures. The fabric has exceptional mechanical strength having a tensile strength in excess of 650 N/50 mm according to DIN 29073/3. Preferably the fabric has a tensile strength of at least 1,000 N/50 mm in the machine direction and in excess of 900 N/50 mm in the cross direction according to such DIN.

Abstract: A polishing pad for use in chemical mechanical polishing (CMP) is disclosed. The polishing pad has a pad surface for polishing wafer surfaces. The pad surface is composed of a polymeric matrix material. The polishing pad also contains a polymeric additive which is defined in the polymeric matrix of the pad surface and in cells of the pad surface. The polymeric additive may include one of a polyurethane, a polyamide, a polyester, a polyacrylonitrile, a polyacrylate, a polymethacrylate, a polyvinylchloride, and a polyvinylidene chloride. The polymeric additive is configured to be hydrophilic so that the pad surface is wettable to enable improved slurry distribution over the pad surface.

Abstract: An improved pad and process for polishing metal damascene structures on a semiconductor wafer. The process includes the steps of pressing the wafer against the surface of a polymer sheet in combination with an aqueous-based liquid that optionally contains sub-micron particles and providing a means for relative motion of wafer and polishing pad under pressure so that the moving pressurized contact results in planar removal of the surface of said wafer, wherein the polishing pad has a low elastic recovery when said load is removed, so that the mechanical response of the sheet is largely anelastic. The improved pad is characterized by a high energy dissipation coupled with a high pad stiffness. The pad exhibits a stable morphology that can be reproduced easily and consistently. The pad surface resists glazing, thereby requiring less frequent and less aggressive conditioning.

Abstract: A flap disc consists of a backing plate to whose peripheral zone laminae overlapping like a fan or roof tiles are attached. In order to improve the abrasive effect of such a flap disc using less material and simpler production, the lamellae 10 consist of first lamellae 12, comprising a backing 14, a base bonding coat 15 applied to the backing, a layer of abrasive grain 16 deposited over the base bonding coat 15, and a size coat 18 over the layer of deposited abrasive grain 16, and second lamellae 20, consisting of a backing 22 and a layer 24 with grinding active fillers applied to the backing.

Abstract: An abrasive sheet member is disclosed, including a substrate having first and second major surfaces, an abrasive on the first major surface, and a plurality of hooking stems on the second major surface. The hooking stems are adapted to hook engaging structures on an opposed surface to releasably affix the abrasive sheet member to the surface.

Abstract: A seamless polishing apparatus for utilization in chemical mechanical polishing is disclosed. The seamless polishing apparatus includes a base belt that has a reinforcement layer and a cushioning layer. The seamless polishing apparatus also includes a polishing pad that is attached to the base belt as a result of a direct casting of a polymeric precursor on a top surface of the cushioning layer. In addition, the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.

Abstract: A support structure includes a first sheet with perforations having a front surface and a back surface and a second sheet with perforation having a front surface and a back surface. Each-perforation in the first sheet and the second sheet has a portion adjacent to the front surface of the sheet that is wider than a portion of the perforation that is adjacent to the back surface of the sheet. A core made of a first material is formed between the back surface of the first sheet and the back surface of the second sheet and within the perforations to anchor the first sheet and the second sheet to the core. Molded features may be disposed on the front surfaces of the sheets and integrally formed with the core through perforations in the sheets. The support structure may be used in a horizontal base or an end-of-arm tool.

Abstract: As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad where the polishing pad is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt where the base belt includes a reinforcement layer and a cushioning layer. In addition, the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.

Abstract: A polishing pad assembly is provided that is useful for the chemical mechanical polishing of glass and electrical devices such as semiconductor wafers that comprises a polish pad and a semi-rigid base material firmly adhered to the polishing pad for positioning on a polishing platen of a polishing machine; wherein the semi-rigid base material has a modulus of rigidity of 0.01-50 GPa (GigaPascals) determined according to ASTM D 790, a thickness of 0.25-15.0 mm, and a grooved surface having a pitch of 5-100 mm and the grooves have a width of 0.025-2.5 mm and a depth of 0.1-2.5 mm.

Abstract: Dishing in chemical mechanical polishing (CMP) is reduced by introducing a material that balances electrochemical forces. In a first embodiment of the invention, a polishing pad having copper material in grooves on the polishing pad surface is used in the polishing process to reduce dishing. In a second embodiment of the invention, the polishing pad has perforations with copper fillings. In a third embodiment of the invention, a copper retaining ring on the polishing head introduces copper material to the CMP process to reduce dishing. In a fourth embodiment of the invention, a conditioning plate of copper is used in the polishing apparatus. In a fifth embodiment of the invention, additional copper features are placed on the substrate to be polished. The polishing of the additional features introduces copper steadily through the polishing process. In a sixth embodiment of the invention, copper compounds are added to the polish slurry.

Abstract: Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

Abstract: A cleaning sheet has a foamed sheet and a polishing layer with abrading particles on its surface. Mutually disconnected indentations are formed through the polishing layer reaching the foamed sheet in a uniform point pattern including a plurality of mutually adjacent ginko-leaf shaped figures for collecting cullet and dust particles therethrough into air bubbles opening on the upper surface of the foamed sheet.

Abstract: The present invention gives a method of fabricating a composite polishing pad. A first polishing pad has a glue layer on a surface of the first polishing pad and a number of hard polishing materials positioned on the glue layer. Then portions of the first polishing pad are punched off to remove portions of the hard polishing material positioned on the surface of the first polishing pad so as to form holes penetrating the first polishing pad. A second polishing pad has a glue layer on a surface of the second polishing pad, and soft polishing materials adhere to the glue layer. Then portions of the soft polishing material positioned on the surface of the second polishing pad are removed while retaining the glue layer, and the portions of the soft polishing material retained on the surface of the second polishing pad completely match the holes formed in the first polishing pad.

Abstract: Dishing in chemical mechanical polishing (CMP) is reduced by introducing a material that balances electrochemical forces. In a first embodiment of the invention, a polishing pad having copper material in grooves on the polishing pad surface is used in the polishing process to reduce dishing. In a second embodiment of the invention, the polishing pad has perforations with copper fillings. In a third embodiment of the invention, a copper retaining ring on the polishing head introduces copper material to the CMP process to reduce dishing. In a fourth embodiment of the invention, a conditioning plate of copper is used in the polishing apparatus. In a fifth embodiment of the invention, additional copper features are placed on the substrate to be polished. The polishing of the additional features introduces copper steadily through the polishing process. In a sixth embodiment of the invention, copper compounds are added to the polish slurry.

Abstract: A polishing pad for polishing glass and the like has a working layer with a plurality of polishing grains, an attaching layer with which the polishing pad is attachable to a polishing head of a power tool, and a connection layer which connects the working layer, with the attaching layer, and the connection layer is composed of vulcanizable material, which is vulcanized at certain temperature and under certain pressure and thereby connects the working layer with the attaching layer.

Abstract: A composite polishing pad for use in a linear chemical-mechanical polishing apparatus is provided. The pad comprises a hard polishing pad having a polishing surface and an attachment surface opposite the polishing surface, the attachment surface comprising a border comprising an adhesive, the border surrounding a cavity, the cavity being sized and shaped to receive a soft polishing pad. The soft polishing pad is disposed completely in the cavity and completely fills the cavity, and the soft polishing pad has a first side adhered in the cavity of the hard polishing pad, and a second side comprising an adhesive, whereby the attachment surface of the hard polishing pad and the second side of the soft polishing pad are substantially in a common plane. Other composite polishing pads are also provided, as are methods for making composite pads and methods for preventing composite pads from splitting apart into their component pads.

Abstract: A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with abrasive particles. Adhesive is applied in layers with abrasive particles in-between each layer of adhesive. Abrasive particles may vary in size and material from layer to layer to achieve cleaning, shaping and polishing objectives.

Abstract: A method for making high density foam semiconductor polishing pads and belts with controlled, reproducible microcellular structure by mechanical frothing. The method involves agitating a liquid polymer resin at a controlled temperature and pressure in order to produce a stable froth. Next, the resin froth is metered under pressure to a mix head where it is typically combined with a desired amount of curative before being injected or poured into a mold.

Abstract: A hardened skin care instrument having a file tooth portion formed by an electroplating process is disclosed. The instrument including a handle part with a recessed portion formed thereon, and a head part comprises an abrasive piece attached to the head part. The abrasive piece includes a plurality of release grooves that are produced by corroding a selected portion of a copper film laid on one surface of a base made of synthetic resin, and a plurality of file tooth portions that are formed by adhering abrasive powder to the remaining portion of the copper film by an electroplating. The release grooves and file tooth portions are arranged to cross over each other.

Abstract: A cleaner and polish article comprises a substrate capable of absorbing and retaining a fluid and having two opposed surfaces wherein at least one surface is abrasive, and a nonabrasive aqueous cleaner and polish formulation absorbed, in the substrate. The cleaner and polish formulation comprises an aqueous cleaning emulsion containing water, a surfactant and an organic solvent, a polishing agent, and a carrier, whereby cleansing and polishing action is achieved by the formulation, and abrasive cleansing action and polishing action is achieved by the cleaner and polish formulation as well as by the abrasive surface of the substrate. The substrate is further capable of absorbing the dissolved or softened soil residue to assist in the cleansing action. The substrate can comprise a cloth-like towel. A plurality of such towels is provided in a continuous roll placed in a selectively sealable, essentially airtight container.

Abstract: A stacked polishing pad includes an upper polishing layer and a lower sub-layer having major faces which are in contact with each other. The polishing layer is substantially impermeable to liquid while the sub-layer is liquid absorbent. The sub-layer has an outer peripheral edge which is sealed to prevent absorption of liquid into the sub-layer through the outer peripheral edge. When the stacked polishing pad is mounted on a platen of a polishing machine, the sub-layer has no exposed surface which can absorb liquid.

Abstract: A disposable polish applying and buffing mitt comprising a multilayered mitt with a polish impervious layer removably attached to an impervious buffing mitt. A disposable polish applying and buffing mitt comprising a multilayered mitt with a sponge-like layer having an impervious backing removably attached to a buffing mitt. A disposable polish applying and buffing kit comprising a multilayered mitt with a first layer of polish impervious material removably secured to a second layer of polish impervious material forming a compartment therebetween which can hold a polish. The first layer of polish impervious material is removed from the second layer of polish impervious material to expose the polish for application. After the polish is applied to the object, the second layer of polish impervious material is removed to expose the buffing mitt.

Abstract: A supporting disk for a surface grinding wheel comprises a glass-fiber reinforced phenolic resin body which has an upper covering layer of a textile glass fabric or a glass-yarn layer, an intermediate layer of a fiber mat, and a lower covering layer of a textile glass fabric or a glass-yarn layer.

Abstract: A slightly bendable nail file which has indicia in the form of a pictorial image. The file comprises a flexible foamed synthetic resin core sandwiched by paperboard panels. Each paperboard panel has a layer of transparent grit bonded thereto. One paperboard panel has a photograph formed thereon, the photograph being outwardly visible through the transparent grit. The other paperboard panel has a mirror coating.

Abstract: An optical endpoint system for a CMP system with a viewport located off-center on the platen, said view port being adjustable in height so that the window of the viewport can be made flush with the top of the polishing pad.