Abstract: A system for controlling the operation of a printing press used to apply an aqueous printable electrically conductive ink onto a substrate to create electrically conductive traces of such ink includes a probe for contacting the electrical traces and for obtaining a resistance measurement therefrom. A computer receives the resistance measurement, compares such measurement with pre-selected data correlating resistance with acceptable performance criteria for such traces, determines whether such resistance measurement signifies acceptable performance, and signals an appropriate mechanism for identifying those electrical traces which do not meet the acceptable performance criteria. Unacceptable traces are removed from the press prior to further processing. The computer can also signal an ink replenishment or conditioning system, contained in a replaceable cartridge, to correct any abnormalities in the ink properties.

Abstract: An apparatus and method for testing electromigration in semiconductor devices includes providing an electromigration test structure, where the electromigration test structure includes a first metal line; a metal bridge operatively coupled to the first metal line; a second metal line operatively coupled to the metal bridge; a barrier layer surrounding the electromigration test structure; current contact pads; and voltage contact pads. The current contact pads are connected to a current source and the voltage contact pads are connected to a voltage source. The barrier layer is exposed to the elevated current density as current travels from the first metal line across the barrier layer through the metal bridge to the second metal line.

Abstract: Described are methods, systems, and a computer-readable storage medium for controlling a discrete-type manufacturing process (e.g., an injection molding process) with a multivariate model. Data representing process parameters, operating parameters, or both of the manufacturing process are received. The received data is compared with a multivariate model that approximates the manufacturing process to provide a result. Upon the result of the comparing satisfying a condition, one or more values for a set of operating parameters for the manufacturing process are determined. When the one or more determined values for the set of operating parameters satisfies a criterion, at least one operating parameter of the manufacturing process is updated.

Abstract: A plasma processing apparatus includes a detector for detecting interference light of multiple wavelengths from a surface of a sample during processing, a pattern comparator for comparing actual deviation pattern data on the interference light obtained at a given time during processing and a plurality of standard deviation patterns corresponding to two or more thicknesses of the film, and calculating a deviation, the standard deviation patterns corresponding to interference light data of multiple wavelengths obtained, before the processing of the sample, for processing of another sample, a deviation comparator for comparing the deviation between the data and a predetermined deviation and outputting data on a thickness of the film of the sample at that time, a recorder for recording, as time series data, the data on the thickness of the film, and an endpoint decision unit.

Abstract: Furfurylated wood produced in a two-chamber system in which monomer/oligomer impregnation in an impregnation chamber is followed by successive stages of drying and curing. Physical properties of wood under treatment are measured, recorded and referenced into a database that accumulates wood species data relating to applied temperature and pressure profiles, physical properties and appearance of intermediate and finished samples of wood and also chemical treatment regimes, including soak time and monomer/oligomer concentrations. During drying and curing, monitoring of process parameters, including water removal and/or atmospheric conditions, are used by a controller both to control and determine a state of process completion by comparing recorded data with historically accumulated data or process set point conditions.

Abstract: A method and system are disclosed for assessing the capability of a pilot to operate an aircraft. The system senses the value of at least one operator information parameter for assessing the fitness of the pilot operating the aircraft and at least one aircraft information parameter relating to the position and motion of the aircraft. The operator information parameters include electroencephalogram information, electrocardiogram information, heart rate information, respiratory rate information, eye motion information, eyelid position information, eyelid motion information, expired gas mixture information, blood oxygen content information, blood oxygen saturation information and blood pressure information for the person operating the aircraft, and/or information about actions taken by the person operating the aircraft.

Abstract: Relating with board numbers of the boards mounted with the logic circuits and mounted places on the boards and in relation to log information to be collected from the logic circuits, analysis information describing information to be processed when the log information is generated, information of a condition for which the log information is to be valid, and information of a condition for which the log information is to be invalid are defined for analyzing failures using the analysis information based on the logic circuits. Upon the realization of the failure analysis based on the logic circuits, the analysis information further describes information of the priority of the log information to realize a thorough analysis of critical failures.

Abstract: A system is provided. The system comprises a computer system, an at least one memory; and a first application stored in the at least one memory. When executed by the computer system, the first application automatically executes a workflow that receives a first input from a human machine interface (HMI) in a first plant, in response to the first input generates a first event that assigns a first task associated to a first functional role performed at the first plant, receives a second input associated with the first task, in response to the second input generates a second event that assigns a second task associated to a second functional role, receives a third input associated with the second task, in response to the third input transmits information to the human machine interface that changes the process mediated by the human machine interface in the first plant.

Abstract: A system and method for automatic quality control is provided. A database is maintained storing quality control rules for producing a product, the quality control rules determined via a first computing device associated with a first entity controlling production of the product, the database maintained by a second computing device associated with a second entity for maintaining quality control of the product, the product produced by a plurality of production lines respectively associated with third entities. Quality control data is received at the second computing device from data collection devices at the plurality of production lines, each of the data collection devices enabled to collect the quality control data for the product. At the second computing device, the quality control data is compared with the quality control rules; at least one quality control event is triggered when the quality control data fails at least one of the quality control rules.

Abstract: Electronic supervision may be provided. First, a stock number may be sent to a database server. The stock number may correspond to a product comprising, for example, an electrical cable. In response to sending the database server the stock number, specification information corresponding to the product may be received from a database stored on the database server. The specification information may comprise, for an electrical cable, a number of wires, a weight per thousand feet, and a diameter. Next, product production may be monitored to determine faults occurring during production. Monitoring the production may comprise displaying a data monitoring screen to production personnel. The data monitoring screen may provide data regarding the product and product comparison against a standard maintained within the database for the product. Fault data corresponding to the determined faults occurring during the production may be saved to the database.

Abstract: A control systems and methods are presented for controlling a production system, in which a model-based planner includes a formulation, such as a SAT formulation representing possible actions in the production, with a solver being used to provide a solution to the formulation based at least partially on production and diagnostic goals and the current plant condition, and a translation component translates the solution into a plan for execution in the plant.

Abstract: A method to enable wafer result prediction from a batch processing tool, includes collecting manufacturing data from a batch of wafers processed in batch in the batch processing tool, to form a batch processing result; defining a degree of freedom of the batch processing result based on the manufacturing data; and performing an optimal curve fitting by trial and error for an optimal function model of the batch processing result based on the batch processing result.

Abstract: A tool control system for a scraper is disclosed. The tool control system may have a tool, a first tool actuator configured to move the tool, and a first sensor configured to detect a position parameter of at least one of the tool and the first tool actuator and to generate a corresponding first signal. The tool control system may also have a tool member operatively connected to the tool, a second tool actuator connectable to the tool member in a plurality of configurations to move the tool member, and a second sensor configured to detect a position parameter of at least one of the tool member and the second tool actuator and to generate a corresponding second signal. The tool control system may further have a controller configured to make a comparison of the first and second signals, and to determine a current connection configuration based on the comparison.

Abstract: Automatic illuminating and image recording system for an automobile service device, combined illuminating and image recording unit and method for automatic measured value-dependent setting of the image recording and exposure for an automobile service device having contactless measuring capability. Comprises at least one camera (32, 34) having an interface to a control unit, at least one illuminating unit (62, 64) having a control input, and a control unit. This control unit is equipped with an interface to the camera(s) (32, 34), with an interface to the illuminating unit(s) (62, 64), with an image processing-and, respectively, image pre-processing-unit and with an evaluating unit that generates control parameters for the illuminating unit(s) (62, 64) and/or the camera(s) (32, 34).

Abstract: A method of controlling a quantity of non-process of record (POR) process limiting yield (PLY) inspections in wafer processing includes setting aside planned capacity for non-POR work, upon receipt of a request for non-POR work, estimating a time required for completion of the request and comparing the estimated time against a remainder of the set aside planned capacity, approving the request in an event the comparison indicates that the estimated time is available in the set aside planned capacity and rejecting the request in an event the comparison indicates that the estimated time is not available in the set aside planned capacity.

Abstract: A process device with diagnostics for use in an industrial process includes a process variable sensor or controller element which is configured to sense or control a process variable of a process fluid of the industrial process. Circuitry is coupled to the process variable sensor or control element and configured to measure or control a process variable of the industrial process. A wireless communication adapter includes wireless communication circuitry configured to communicate in the industrial process. The wireless communication circuitry is further configured to receive a process signal from another process device. Diagnostic circuitry is configured to diagnose operation of the industrial process as a function of the sensed process variable and the received process signal.

Abstract: Resource exhaustion is anticipated, a cause of the resource exhaustion is identified and options are identified to address the resource exhaustion.

Abstract: A method and system for controlling machining processes are provided. The system includes a computer system communicatively coupled to a database. The computer system is configured to receive data relating to manufactured part processes, identify at least one machining process used to manufacture a part and a parameter of the at least one machining process, receive survey data relating to the manufacturing process parameters used during the at least one machining process, and receive identification data for the manufactured part. The computer is further configured to receive data relating to a design of experiment (DOE), determine an low cycle fatigue (LCF) life distribution, identify process parameters that affect the LCF, and determine an allowable range for each identified process parameters for safe operation. The computer system is further configured to output the process window embodied in a specification associated with at least one of the part and the process.

Abstract: According to one aspect of the invention a system and method for minimizing assembly line manufacturing including an override is provided. Each workstation is equipped with a docking station. A first database is in communication with the programmable controller and the docking station, and the docking station is also in communication with the workstation tools as well as the programmable controller. The override is disposed on a docking station. The system includes a checklist of tasks that each workstation tool is to perform. Accordingly the first database will receive the checklist for each part and will record whether or not each particular part had each of its tasks performed properly. The override may be actuated so as to allow a part to flow downstream the assembly line even though the all the tasks were not completed properly, thus minimizing manufacturing disruptions.

Abstract: According to various embodiments of the invention, systems and methods are provided for compressed design phase contour data created during the manufacturing of integrated circuits. In one embodiment of the invention, the method begins by generating a contour layout from a target layout during the design phase of a circuit. This contour layout is generated by way of a contour generator tool. Next, a set of differences between the contour layout and the target layout are calculated. A dataset containing these differences is generated. In some embodiments, the contour generator uses a post-optical proximity correction (OPC) layout of the target layout in order to generate the contour layout.

Abstract: A method and system for examining, auditing, and safely evaluating process systems, including fluid pressure systems, to aid overpressure design and/or sizing of overpressure equipment. The system includes a server subsystem, a storage subsystem, an assessment subsystem, and optionally a report generation subsystem, including computer hardware and application software for supporting these subsystems.

Abstract: A method for controlling mask fabrication is provided, wherein the method uses statistical process control analysis. A manufacturing model is defined. A process run of a mask is performed as defined by the manufacturing model. A fault detection analysis is performed to reduce a bias in the manufacturing model. A fine-tuning signal is generated in response to a result of the fault detection analysis. The process run operation is adjusted according to the fine-tuning signal.

Abstract: The present invention is a method of optimizing a process recipe of a substrate processing system including: a substrate processing apparatus that performs a film deposition process of a substrate to be processed according to a process recipe; a data processing unit that executes a calculation for optimizing the process recipe; and a host computer; the substrate processing apparatus, the data processing unit, and the host computer being connected to each other through a network.

Abstract: Electronic supervision may be provided. First, a stock number may be sent to a database server. The stock number may correspond to a product comprising, for example, an electrical cable. In response to sending the database server the stock number, specification information corresponding to the product may be received from a database stored on the database server. The specification information may comprise, for an electrical cable, a number of wires, a weight per thousand feet, and a diameter. Next, product production may be monitored to determine faults occurring during production. Monitoring the production may comprise displaying a data monitoring screen to production personnel. The data monitoring screen may provide data regarding the product and product comparison against a standard maintained within the database for the product. Fault data corresponding to the determined faults occurring during the production may be saved to the database.

Abstract: Methods and computer storage media provide for the installation of potted inserts and installation validation. According to embodiments described herein, an insert is placed within an insert aperture of a panel or other structure. Potting compound is injected into a potting cavity surrounding the insert through a fill hole in the insert until potting compound overflows from another fill hole. The installation is validated by applying a force to the installed insert at a determined frequency using a mechanical impedance instrument and measuring a response frequency. The response frequency is compared to an acceptable frequency range to determine whether the insert is properly installed.

Abstract: A method for batch control in a system. The system comprises at least two batch processing sets that share at least one shared equipment. A batch is initiated in each processing set. Process variables from each batch are monitored. At least one process variable from at least one batch are adjusted using bang-bang control to prevent conflicts.

Abstract: Disclosed are apparatus and methods for monitoring an operation parameter of a process tool, independently of a process system recipe, are provided. In general, an indirect effect that results from implementing an event from a process system recipe on the process system is monitored without using the specific values or setpoints that are entered for such event into the process system to thereby change a state of such process system. In one embodiment, the behavior of a process device as it transitions between different states is monitored for a single cycle of operation or over time to detect trends that indicate a potential failure of the process device. When a trend that indicates a potential failure is detected, an alarm is generated. In one implementation, the time for reaching a particular stage of operation may be repeatedly monitored over a plurality of device cycles. For example, the time to open a valve or door may be monitored.

Abstract: The present invention provides a processing system, a processing method and a program, which can readily control a gas flow rate. A vertical-type heating apparatus 1 includes a plurality of gas supply pipes 16 to 20 each adapted for supplying a processing gas into a reaction vessel 2 configured to contain therein semiconductor wafers W. For the gas supply pipes 16 to 20, flow rate control units 21 to 25 are provided, respectively, for controlling each flow rate. In a control unit 50, processing conditions including the flow rate of the processing gas and a film thickness-flow rate-relationship model indicative of a relationship between the flow rate of the processing gas and a film thickness, are stored.

Abstract: A processing system includes process modules, load lock modules, an equipment controller, and a machine controller. The equipment controller controls transfer and processing of wafers in the processing system. A transfer destination determining portion determines the transfer destination of each wafer such that each wafer is sequentially transferred to a normally operating process module. When an abnormality occurs in a process module, an evacuation portion temporarily evacuates to a cassette stage the wafer determined is to be transferred to the abnormal process module and that has not yet been transferred to the abnormal process module. When a new transfer destination of the evacuated wafer is determined, if a process that is performed immediately before processing the evacuated wafer in the processing module as the new transfer destination satisfies a predetermined condition, a transfer inhibition portion inhibits the transfer of the evacuated wafer to the new transfer destination.

Abstract: One aspect related to design of systems and methods for manufacturing products that include technology in skilled areas is configuring a production station for use by an operator without specialized skills. The present invention contemplates an approach to designing a station configurable to perform one or more of incoming inspection, assembly, testing, and branding. A preferred approach includes verifying data associated with units prior to accepting them for incorporation, preventing incorporation of an incorrect unit, and guiding an operator in possible remedial action. This approach includes storing data in a server and making such data substantially instantly accessible to production stations once written in the server. Such data preferably includes software to configure the production station such that the operator need not have specialized skills. A production station designed using this approach is particularly useful in the manufacture of an outdoor unit of a split-mount microwave radio system.

Abstract: A production management system has processing devices A, B, C, D, E, and P. A kind of product ? is processed in the order of the processing devices A, P, B, P, and C, and a kind of product ? is processed in the order of the processing devices D, P, E, and P. To determine whether the processing device P is to be used to produce the product ? or the product ?, an input ratio of each kind of product is multiplied by the number of times of passing the processing device P for each kind of product, thereby calculating a core of each kind of product. Based on the calculated score, whether the processing device P is to be used to produce the product ? or the product ? is determined. Accordingly, the work-in-process balance of key processes between different kinds of products can be equalized.

Abstract: A surface defect data display and management system comprises a risk score calculation unit for calculating the magnitude of an influence a surface defect on a wafer detected by a wafer inspection system or review system has upon a reduction in the yield of a final product as a risk score of the surface defect based on a defect size of the surface defect on the wafer and a pattern concentration obtained from design data of a pattern figure nearby a location corresponding to the position of the surface defect, and a correlation graph and defect image display unit for preparing a correlation graph showing the correlation between the defect size and the risk score of each defect, displaying the prepared correlation graph on the display apparatus and displaying additionally a defect image list of one or more defects selected by using the correlation graph.

Abstract: A method and system for controlling and monitoring the quality of concrete based on the concrete's maturity (which is a function of its time-temperature profile, or temperature history). Five different applications or embodiments of the present invention are discussed, namely, Enhanced Maturity, Moisture-Loss Maturity, Improved Maturity, SPC Maturity, Loggers, Readers, and Software. Enhanced Maturity involves a maturity calibration method to account for the water-to-cementitious-materials ratio, air content, and gross unit weight of the concrete. Moisture-Loss Maturity is a method for determining the appropriate time to terminate moisture-loss protection of concrete and concrete structures. Improved Maturity is a method and system for determining the strength of curing concrete using improved maturity calculations.

Abstract: A measurement method for thread parameters for a threaded object (3), by means of a measurement device (1) defining a spatial reference system (X, Y, Z) incorporating an optical sensor (5) to retrieve the shape of the threaded object, and defining a spatial reference system (X?, Y?, Z?), the measurement device (1) having a computer to assemble a first matrix that describes the quadratic form representing the threaded object in the spatial reference system (X, Y, Z), thus providing the relationship between the two spatial reference systems.

Abstract: A global predictive monitoring system for a manufacturing facility. The system may be employed in an integrated circuit (IC) device fabrication facility to monitor processing of semiconductor wafers. The system may include deployment of a swarm of individually separate agents running in computers in the facility. Each agent may comprise a genetic algorithm and use several neural networks for computation. Each agent may be configured to receive a limited set of inputs, such as defectivity data and WIP information, and calculate a risk from the inputs. A risk may be a value indicative of a production yield. Each agent may also generate a quality value indicative of a reliability of the risk value. New agents may be generated from the initial population of agents. Outputs from the agents may be collected and used to calculate projections indicative of a trend of the production yield.

Abstract: A plant monitoring control device (200) provides an operation console (201), a control device (207) and a data processing device (203) that acquires process data, alarm log data, auxiliary device operation log data and an operation command from an operation staff to store in storage devices (221A, 221B, 221C, 221D) on a time series basis. An event analysis console unit (201b) has an event analysis support program to select an event specified by an operator, acquire key time information, search data related with the selected and specified event as event associated data on the basis of event data related information, and combine the data in a predetermined time range among the pieces of the searched time series event associated data with that in the operation console on the basis of the key time information to then be displayed on the operation console.

Abstract: A metrology device for inspecting a substrate is provided. In an embodiment, the metrology device includes a remote radiation source device, an optical system for creating a radiation beam, and an optical fibre for transferring radiation from the optical system to the location where the metrology operations are performed. The optical system includes a control system that includes a deformable mirror, a detector that detects the position of a radiation beam, and a controller that produces a control signal for input into the deformable mirror, the control signal being based on the detected position of the radiation. In this way, the shape of the deformable mirror can be used to control the position of the radiation beam output by the optical system into the optical fibre.

Abstract: A method of optimizing production cycle queue time includes selecting a plurality of process steps for a production cycle, calculating queue times for each of the plurality of process steps, statistically analyzing the queue times, and generating at least one visual output that illustrates the statistically analyzed queue times.

Abstract: A plasma-processing tool for processing a substrate using at least a first process recipe and a second process recipe is provided. The plasma-processing tool includes transducers configured to collect process data streams, each process data stream pertaining to a process parameter being monitored during recipe execution. The tool also includes a logic circuitry configured for receiving a set of meta-data wherein each meta-data includes identification data about the substrate and the process recipe being executed. The logic circuitry is also configured for receiving a set of process data streams, each of which being associated with a specific process recipe. The logic circuitry further includes storing the meta-data and the process data streams associated with the first process recipe as a first file and the meta-data and the process data streams associated with the second process recipe as a second file.

Abstract: Method and system for defect detection in manufacturing integrated circuits. In an embodiment, the invention provides a method for identifying one or more sources for possible causing manufacturing detects in integrated circuits. The method includes a step for providing a plurality of semiconductor substrates. The method includes a step for processing the plurality of semiconductor substrates in a plurality of processing steps using a plurality of processing tools. The method additionally includes a step for providing a database, which includes data associated with the processing of the plurality of semiconductor substrates. The method further includes a step for testing the plurality of semiconductor wafers after the processing of the plurality of semiconductor substrates. Additionally, the method includes a step for detecting at least one defect characteristic associated with the plurality of the semiconductor substrates that have been processed.

Abstract: A method for determining the extent of cure of binder in a product comprising heating a sample of the product to vaporize free moisture in the sample and expel vaporized free moisture from the sample, measuring cure moisture content of the product, measuring binder content of the product, calculating a product ratio of cure moisture content to binder content, and comparing the product ratio of cure moisture content to binder content to a predetermined desirable ratio of cure moisture content to binder content.

Abstract: A menu-driven manufacturing technique includes determining a product and product configuration, along with process steps to be carried out in manufacturing workstations. Display screens corresponding to the particular manufacturing process steps are accessed and displayed on monitors at the workstations to lead operators through the processes. Control circuitry may verify that the correct components and tools are utilized as called for by the various process steps. Powered tools and test setups may be integrated with the system to enable improved quality control.

Abstract: A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.

Abstract: By performing a two-step approach for predicting a quality distribution during the fabrication of semiconductor devices, enhanced flexibility and efficiency may be accomplished. The two-step approach first models electrical characteristics on the basis of measurement data, such as inline measurement data, and, in a second step, an appropriate distribution for the electrical characteristics may be established, thereby obtaining modeled wafer sort data which may then be used for predicting a quality distribution of the semiconductor devices under consideration.

Abstract: A server device is provided with a measurement information storage unit 1201 which can store plural measurement information, i.e., information having a measurement value and time information indicating time; an instruction receiving unit for receiving an output instruction of the measurement information; a measurement information acquisition unit for acquiring, from the measurement information storage unit, the measurement information designated by the output instruction; an output information composing unit for composing output information by using the acquired measurement information; and an output unit for outputting the output information composed by the output information composing unit.

Abstract: A method optimizes photomask inspection. After masks are manufactured, the method predicts the likelihood that the masks will be defect free based on defect criteria, etch area, etch mode, and etch tool type associated with the masks. The method skips an initial mask inspection for masks that have a predictability value above a predetermined value and performs the initial mask inspection for masks that have a predictability value below the predetermined value. After initial inspection is preformed (or skipped), a pellicle is mounted on the mask and then all masks are inspected or reinspected for defects and foreign matter.

Abstract: A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment engineering system parameter group containing equipment engineering system parameters corresponding to the wafers; creating a prediction formula of quality control value data, acquiring a first equipment engineering system parameters; inputting the first equipment engineering system parameters to the prediction formula, and performing calculation to predict first quality control value data of the wafers in the first lot; determining processing of the wafers corresponding to the first quality control value data; acquiring measured first quality control value data of the wafers in the first lot; replacing the quality control value data corresponding to the wafers in the first processed lot; updating the prediction formula.

Abstract: An operation instruction method includes: an operation detecting step of detecting a manual operation; an operation detail displaying step of displaying the details of a manual operation detected at the operation detecting step; and an operation occurrence notifying step of, in response to detection of a manual operation at the operation detecting step, notifying the occurrence of the manual operation to another operation instruction device over the communication line. The operation instruction method further includes: a notification receiving step of receiving a notification of occurrence of a manual operation sent from another operation instruction device; and an operation occurrence display step of, when a notification of occurrence of a manual operation is received at the notification receiving step, displaying the occurrence of the manual operation.

Abstract: A constraint analysis and reliability agent executes a method for analyzing operation of a manufacturing asset, and includes the steps of collecting operation data for a machine over a plurality of predetermined time periods. The operation data includes a plurality of mutually exclusive events that describe operation of the machine. For each of the predetermined time periods, it is determined whether the machine is in an “ON” or an “OFF” state. Data for the “OFF” states is removed from the collected data to generate a filtered data set. Reliability information is then generated based, at least in part, on the filtered data set. This facilitates predictions of future machine operation.

Abstract: Techniques for estimating a quality of one or more wafers are presented. One or more first wafers comprising one or more first dies are tested. A probability of wafer failure is determined in accordance with one or more first test measurements of the one or more first dies. A pass status and/or a fail status of one or more second wafers is inferred by testing a select one or more second dies of the one or more second wafers and evaluating one or more second test measurements of the select one or more second dies in accordance with the determined probability of wafer failure.