Quality Control Patents (Class 700/109)
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Patent number: 7546178Abstract: An aligner evaluation system includes (a) an error calculation module configured to calculate error information on mutual optical system errors among a plurality of aligners; (b) a simulation module configured to simulate device patterns to be delineated by each of the aligners based on the error information; and (c) a evaluation module configured to evaluate whether each of the aligners has appropriate performances for implementing an organization of a product development machine group based on the simulated device pattern.Type: GrantFiled: August 3, 2007Date of Patent: June 9, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Takuya Kouno, Shigeki Nojima, Tatsuhiko Higashiki
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Patent number: 7542821Abstract: A conversion control system is described that includes a database to store data defining a set of rules and an interface to receive local anomaly information from a plurality of different analysis machines associated with a plurality of manufacturing process lines that perform a plurality of operations on a web of material, and each of the manufacturing process lines includes position data for a set of regions on the web containing anomalies. The system also includes a computer that registers the position data of the local anomaly information for the plurality of manufacturing process lines to produce aggregate anomaly information. The system further includes a conversion control engine that applies the rules to the aggregate anomaly information to determine which anomalies represent actual defects in the web for a plurality of different products.Type: GrantFiled: July 26, 2007Date of Patent: June 2, 2009Assignee: 3M Innovative Properties CompanyInventors: Steven P. Floeder, Kenneth G. Brittain, James A. Masterman, Carl J. Skeps
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Patent number: 7542880Abstract: A method for estimating a state associated with a process includes receiving a state observation associated with the process. The state observation has an associated process time. A weighting factor to discount the state observation is generated based on the process time. A state estimate is generated based on the discounted state observation. A system includes a process tool, a metrology tool, and a process controller. The process tool is operable to perform a process in accordance with an operating recipe. The metrology tool is operable to generate a state observation associated with the process. The process controller is operable to receive the state observation, the state observation having an associated process time, generate a weighting factor to discount the state observation based on the process time, generate a state estimate based on the discounted state observation, and determine at least one parameter of the operating recipe based on the state estimate.Type: GrantFiled: April 6, 2006Date of Patent: June 2, 2009Assignee: Advanced Micro Devices, Inc.Inventors: Richard P. Good, Kevin A. Chamness, Uwe Schulze
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Patent number: 7535688Abstract: The present invention provides a substrate processing apparatus that executes electrical discharge processing before detaching a substrate held onto an electrostatic chuck of a lower electrode constituting a stage and undergoing a specific type of processing from the electrostatic chuck. Before electrically discharging the substrate, a decision is made as to whether or not the specific type of processing on the substrate has ended normally, and electrical discharge conditions are set based upon regular electrical discharge condition information stored at a regular electrical discharge condition information storage means if the substrate processing is judged to have ended normally, whereas electrical discharge conditions are set based upon non-regular electrical discharge condition information stored at a non-regular electrical discharge condition information storage means if the substrate processing is judged not to have ended normally.Type: GrantFiled: March 13, 2006Date of Patent: May 19, 2009Assignee: Tokyo Electron LimitedInventors: Takeshi Yokouchi, Fumiko Yagi
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Patent number: 7536233Abstract: The present invention provides a method and apparatus for adjusting tool processing speeds based on work-in-process levels. The method includes determining at least one work-in-process level associated with a first processing tool and modifying a processing speed associated with the first processing tool based on said at least one work-in-process level.Type: GrantFiled: January 30, 2006Date of Patent: May 19, 2009Assignee: Advanced Micro Devices, Inc.Inventor: Chandra Shekar Krishnaswamy
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Patent number: 7531368Abstract: The invention can provide a method of processing a wafer using Site-Dependent (S-D) processing sequences that can include S-D creation procedures, S-D evaluation procedures, and S-D transfer sequences. The S-D creation procedures can be performed using S-D processing elements, the S-D evaluation procedures can be performed using S-D evaluation elements, and S-D transfer sequences can be performed using site-dependent transfer subsystems. Site-dependent data can be stored in site-dependent libraries and/or databases.Type: GrantFiled: March 30, 2007Date of Patent: May 12, 2009Assignee: Tokyo Electron LimitedInventors: Mark G. Winkler, Thomas E. Winter
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Publication number: 20090118851Abstract: Integration of factory level advanced process control (FL-APC) system and tool level advanced process control (TL-APC) system using selectable APC operation modes indicating different operational settings for the FL-APC system and at least one TL-APC system is disclosed. During operation, the FL-APC system controls operation of the TL-APC system. The invention allows a manufacturing execution system (MES) to have additional capability to run the process control functions at FL-APC system and/or TL-APC system, and allows integration of a variety of different tools with a TL-APC system. An implementation method, system and program product are also disclosed.Type: ApplicationFiled: January 2, 2009Publication date: May 7, 2009Inventors: Gary W. Behm, Emily M. Hwang, Yue Li, Teresita Q. Magtoto
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Patent number: 7526699Abstract: A method of monitoring a processing system in real-time using low-pressure based modeling techniques that include processing one or more of wafers in a processing chamber, calculating dynamic estimation errors for the precursor and/or purging process, and determining if the dynamic estimation errors can be associated with pre-existing BIST rules for the process. When the dynamic estimation error cannot be associated with a pre-existing BIST rule, the method includes either modifying the BIST table by creating a new BIST rule for the process, or stopping the process when a new BIST rule cannot be created.Type: GrantFiled: March 31, 2006Date of Patent: April 28, 2009Assignee: Tokyo Electron LimitedInventors: Sanjeev Kaushal, Pradeep Pandey, Kenji Sugishima
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Publication number: 20090105864Abstract: A method of manufacturing an article, the method comprising: storing a set of manufacturing instructions for a machine; inputting at least some of the manufacturing instructions into the machine; manufacturing an article with the machine in accordance with the input manufacturing instructions; generating a realization log which is indicative of the operations that the machine has actually performed in manufacturing the article; and generating a report by comparing the realization log with the stored set of manufacturing instructions.Type: ApplicationFiled: September 23, 2008Publication date: April 23, 2009Applicant: AIRBUS UK LIMITEDInventors: Robert LLOYD, Peter LUNT, Jeremy CUSHEN, Ashutosh TIWARI, Kostas VERGIDIS
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Patent number: 7519885Abstract: A method of monitoring a processing system in real-time using low-pressure based modeling techniques that include processing one or more of wafers in a processing chamber; determining a measured dynamic process response for a rate of change for a process parameter; executing a real-time dynamic model to generate a predicted dynamic process response; determining a dynamic estimation error using a difference between the predicted dynamic process response and the expected process response; and comparing the dynamic estimation error to operational limits.Type: GrantFiled: March 31, 2006Date of Patent: April 14, 2009Assignee: Tokyo Electron LimitedInventors: Sanjeev Kaushal, Pradeep Pandey, Kenji Sugishima
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Patent number: 7519447Abstract: The present invention provides a method and apparatus for integrating multiple sample plans. The method includes receiving a first wafer state data set from an in situ wafer measurement device, the first wafer state data set being indicative of at least one characteristic of at least one wafer processed by a processing tool and receiving a second wafer state data set from an ex situ wafer measurement device, the second wafer state data set being indicative of the at least one characteristic of the at least one wafer processed by the processing tool. The method also includes forming a third wafer state data set using the first and second wafer state data sets and determining the at least one characteristic of the at least one wafer based upon the third wafer state data set.Type: GrantFiled: October 5, 2004Date of Patent: April 14, 2009Assignee: Advanced Micro Devices, Inc.Inventors: Christopher A. Bode, Kevin R. Lensing
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Publication number: 20090093903Abstract: Methods, systems, and computer program products for automating process and equipment qualifications in a manufacturing environment are provided. A method includes defining a triggering event for initiating a qualification of an equipment, process module, or process. The qualification is configured to identify whether the equipment, process module, or process is operating according to specified criteria. The method also includes qualifying a monitor for use in the qualification. Upon the occurrence of the triggering event, the method includes running qualified monitors through the qualification. Based upon the results of qualifying the monitor for use in the qualification or the results of the execution of the qualification, the method includes determining and implementing a disposition for the monitor.Type: ApplicationFiled: October 4, 2007Publication date: April 9, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bruce Clemens, Marco A. D'Antonio, John Federico, Glade S. Keaney, Gregory L. MacDonald, Christopher P. Pluchino, Paloma Zapata
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Patent number: 7516047Abstract: A method for use in a system for diagnosing the causes of manufacturing defects involves process characterization. A set of forms is identified for a workpiece and for a piece of manufacturing equipment that acts upon the workpiece. The forms for the workpiece are preferably a hierarchic set of geometric forms. Each such geometric form corresponds to an aspect of the action of the manufacturing equipment upon the workpiece. A plurality of measurements is made on a defective workpiece following the hierarchical order of forms. The measurements are compared to a reference datum, and a deviation from the datum is computed. If the deviation exceeds a preselected threshold, an alert condition results, attributable to the action of the manufacturing equipment. Targeted adjustment corresponding to the action that caused the defect can then be made to the equipment.Type: GrantFiled: October 23, 2006Date of Patent: April 7, 2009Assignee: Red X Holdings, LLCInventor: John R. Allen
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Patent number: 7509185Abstract: Methods of integrating a computer product with a pharmaceutical manufacturing software system for manufacturing of pharmaceuticals and validation of pharmaceutical manufacturing processes and quality assurance processes are described and disclosed herein. Consequently, the methods provide a means to manufacture pharmaceuticals on an integrated level whereby the manufacturer can ensure data and product integrity and minimize cost.Type: GrantFiled: August 14, 2006Date of Patent: March 24, 2009Assignee: SMP Logic Systems L.L.C.Inventor: Shane M. Popp
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Patent number: 7509177Abstract: The invention relates to the control of an orienting/positioning system comprising comprising at least a sensor and an actuator for controlling an orienting and/or positioning action adapted to change an input space of the sensor. A first step evaluates pre-action output information of the sensor in order to detect a pre-action position of a manipulating device in the input space of the sensor. A second step decides on a targeted post-action position of the manipulating device in the input space of the sensor. A third step defines a command for the actuator by mapping any deviation of the pre-action position and the targeted post-action position in the input space of the sensor to actuator control coordinates using a predefined mapping function. A fourth step orients/positions the manipulating device according to the defined command in order to carry out the orienting/positioning action. A fifth step detects a real post-action position of the manipulating device in the input space of the sensor.Type: GrantFiled: April 8, 2005Date of Patent: March 24, 2009Assignee: Honda Research Institute Europe GmbHInventors: Frank Joublin, Tobias Rodemann
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Patent number: 7505879Abstract: According to the present invention, multivariate analysis model expressions are generated for a plasma processing apparatus 100A and a plasma processing apparatus 100B by executing a multivariate analysis of detection data provided by a plurality of sensors included in each plasma processing apparatus when the plasma processing apparatuses 100A and 100B operate based upon first setting data. Then, when the plasma processing apparatus 100A operates based upon new second setting data, detection data provided by the plurality of sensors in the plasma processing apparatus 100A are used to generate a corresponding multivariate analysis model expression, and by using the new multivariate analysis model expression corresponding to the plasma processing apparatus 100A generated based upon the second setting data and to the plasma processing apparatus 100B, a multivariate analysis model expression corresponding to the new second setting data is generated four the plasma processing apparatus 100B.Type: GrantFiled: December 6, 2004Date of Patent: March 17, 2009Assignee: Tokyo Electron LimitedInventors: Masayuki Tomoyasu, Hin Oh, Hideki Tanaka
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Patent number: 7502659Abstract: A method for sorting integrated circuit (IC) devices of the type having a fuse identification (ID) into those devices requiring enhanced reliability testing and those requiring standard testing includes storing fabrication deviation data, probe data, and test data in association with the fuse ID of each of the devices indicating each of the devices requires either enhanced reliability testing or standard testing. The fuse ID of each of the devices is then automatically read before, during, or after standard testing of the devices. The testing process requirement data stored in association with the fuse ID of each of the devices is then accessed, and the devices are sorted in accordance with the accessed data into those devices requiring enhanced reliability testing and those requiring standard testing.Type: GrantFiled: October 3, 2006Date of Patent: March 10, 2009Assignee: Micron Technology, Inc.Inventor: Raymond J. Beffa
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Patent number: 7502658Abstract: An exemplary method for performing fabrication sequence analysis, the method comprising, defining a process group, wherein a process group includes fabrication processes in a fabrication sequence, determining fabrication process paths in the process group to define independent variables, wherein a process path is a plurality of fabrication equipment used to fabricate a particular semiconductor device in the fabrication sequence, receiving a dependent variable for the fabrication sequence, performing analysis of variance to calculate a p-value for the process group, determining whether the p-value is lower than a threshold value, identifying a poor process path responsive to determining that the p-value is lower than a threshold value, and outputting the identified poor process path.Type: GrantFiled: February 19, 2008Date of Patent: March 10, 2009Assignee: International Business Machines CorporationInventors: Steven G. Barbee, Jeong W. Nam, Viorel Ontalus, Yuusheng Song
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Publication number: 20090062952Abstract: A method is provided for managing and validating product development. The method may include obtaining a product specification for a product and identifying prior products that have capabilities within a defined range of the product specifications. The method may also include developing a performance specification based on the product specification and the identified prior products. Further, the method may include obtaining approval for the performance specification, developing the product according to the performance specification, and validating that the product meets the performance specification.Type: ApplicationFiled: August 31, 2007Publication date: March 5, 2009Inventors: Andrew Donald Sullivan, Thomas Gerard Muir, Brian John Hoehne, Franklin Harrison Henninger
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Patent number: 7496421Abstract: The invention relates to a method and an apparatus for order control in a production process for a fiber product. In this case, at least one primary product is provided and processed further to form the fiber product, the processing steps of the further processing being performed by machines, the production process being monitored and controlled. According to the invention, in order to control and monitor a production order constituting the basis of the production process, an actual/target evaluation is performed between a target standard predefined by the production order and an actual status of the production process. The deviation from the target standard determined thereby is displayed.Type: GrantFiled: June 5, 2006Date of Patent: February 24, 2009Assignee: Saurer GmbH & Co. KGInventors: Reinhard Mühlenmeister, Jörg Gross, Dirk Seulen
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Publication number: 20090049377Abstract: A method and system of comparing a part to a computer model of the part obtains coordinate data for a plurality of points on a part, compares the coordinate data to a computer model of the part to obtain comparison data, reports the comparison data corresponding to a selected surface of the part, and excludes comparison data for all surfaces other than the selected surface.Type: ApplicationFiled: August 16, 2007Publication date: February 19, 2009Inventor: Jeffrey L. Moore
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Publication number: 20090046921Abstract: Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include inspecting the pick operation in pick and place machines by collecting images of the pick event inside the machine and identifying errors as they happen. By detecting and displaying this information as it generated on the machine, the operator or machine can take prompt and effective corrective actions.Type: ApplicationFiled: October 29, 2008Publication date: February 19, 2009Applicant: CyberOptics CorporationInventors: Steven K. Case, Paul R. Haugen, David W. Duquette, David D. Madsen, David Fishbaine, Lance K. Fisher, Timothy G. Badar, Swaminathan Manickam
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Patent number: 7477262Abstract: Determining a minimum condition and a maximum condition of an assembly of parts includes determining a subset of the assembly of parts, constructing a tolerance chain comprised of tolerance features associated with the parts and that have tolerances that can assume maximum and minimum values, setting at least one tolerance to a minimum value or a maximum value, and calculating the minimum condition and the maximum condition of the assembly based on the setting of the tolerance.Type: GrantFiled: October 4, 2005Date of Patent: January 13, 2009Assignee: Dassault Systemes SolidWorks CorporationInventors: Clay Tornquist, Todd Jarvinen
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Patent number: 7471991Abstract: Methods for performing boundary value analysis on a pharmaceutical manufacturing process are described and disclosed herein. The algorithm performing the boundary value analysis is integrated into a pharmaceutical manufacturing process and control of the pharmaceutical manufacturing process is attained. Consequently, the methods provide a means to manufacture pharmaceuticals on an integrated level whereby data and product integrity are achieved and over time costs are minimized.Type: GrantFiled: August 8, 2006Date of Patent: December 30, 2008Assignee: SMP Logic Systems LLCInventor: Shane M. Popp
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Patent number: 7472024Abstract: There is provided with a data analysis method, including: providing a database storing for each of devices an example that includes inspection time, the degradation level, operation characteristics, and replacement information; providing a evaluation maintenance strategy including an evaluative inspection time, an evaluation time and evaluative replacement condition; providing a prediction model for predicting the degradation level of a device from operation characteristics thereof; estimating by using the database an estimated number of devices that have already been replaced before the evaluation time, evaluating the degradation level at the evaluative inspection time of each of as many devices as estimated number and devices subjected to inspection of same periodic inspection time as the evaluation time; and evaluating the degradation level at the evaluation time of devices whose degradation level at the evaluation inspection time does not satisfy the replacement condition.Type: GrantFiled: September 20, 2007Date of Patent: December 30, 2008Assignee: Kabushiki Kaisha ToshibaInventor: Makoto Sato
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Patent number: 7465417Abstract: The present invention provides a method and system for controlling the quality of a product produced by an injection molding production process. The invention includes performing a multivariate analysis on injection molding process data collected real-time and determining whether the real-time data is within a predetermined production control limit. When the real-time production data exceeds the control limit, the process is considered out of control and product produced during the out of control condition is removed real-time from the injection molding production process.Type: GrantFiled: July 19, 2004Date of Patent: December 16, 2008Assignees: Baxter International Inc., Umetrics ABInventors: Lee Merrill Hutson, Svante Wold
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Publication number: 20080306620Abstract: The invention relates to a method for machining a workpiece (20) on a numerically controlled machining device (9), whereby two or more machining steps (11, 12, 13) are provided for machining the workpiece (20). A machining data record (28) for controlling and/or adjusting the numerically controlled machining device (9) can be run in a control and/or adjustment device (26) of the numerically controlled machining device (9) together with a program (30) for operating the control and/or adjustment device (26). The machining data record (28) is used together with the program (30) for operating the control and/or adjustment device (26) to generate simulation data (47) in a simulation step. Subsequently, simulated material removal data (49) are generated from the simulation data (47) by means of a material removal simulation. The invention provides a simple method of controlling the machining steps of workpieces that are produced in a plurality of machining steps.Type: ApplicationFiled: May 26, 2006Publication date: December 11, 2008Applicant: Siemens AktiengesellschaftInventor: Wolfgang Mutscheller
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Patent number: 7463941Abstract: A quality control system has: a QC value storage unit, a data acquisition device, a device internal information storage unit, a recipe storage unit, a QC value prediction unit, a wafer determination unit, a recipe selection unit, and a measurement device.Type: GrantFiled: April 3, 2006Date of Patent: December 9, 2008Assignee: Kabushiki Kaisha ToshibaInventors: Akira Ogawa, Yukihiro Ushiku, Tomomi Ino
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Publication number: 20080300711Abstract: Systems and methods are disclosed for consistently translating or converting between geometric dimensioning and tolerancing information and variation parameters for a three dimensional variation analysis tool. The methods and systems may receive geometric dimensioning and tolerancing information; translate, with a computer, the received geometric dimensioning and tolerancing information into variation parameters for a three dimensional variation analysis tool; and output the variation parameters.Type: ApplicationFiled: June 1, 2007Publication date: December 4, 2008Inventors: James A. Day, Zuozhi Zhao, Yanyan Wu, Dean M. Robinson
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Patent number: 7460968Abstract: The present invention provides a method and apparatus for selecting wafers for sampling. The method includes determining a plurality of sampling rules associated with at least one of a plurality of wafers and selecting at least one wafer for sampling based on the plurality of sampling rules.Type: GrantFiled: September 30, 2005Date of Patent: December 2, 2008Assignee: Advanced Micro Devices, Inc.Inventors: Richard P. Good, Matthew A. Purdy
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Patent number: 7457679Abstract: A computer based proactive process control technique used to predict the capability of a manufacturing process. A solid model of statistical process control is created by a computer program to simulate the Bell Curve of the data or the data with in +/?3 standard deviation. With product knowledge and process knowledge, it is possible to setup and control the manufacturing process to yield a desired level. The computer program operates within a communication media network. Suppliers and manufactures through their main servers are connected to floor computers, which are data input and output computers. All the servers are connected to the main server of a prime contractor. Manufacturing data from the supplier's field computers goes to their respective servers, and that data in turn goes to the main server of the prime contractor. From the prime contractor server, the data can be retrieved through computers that are data reviewing stations.Type: GrantFiled: May 19, 2005Date of Patent: November 25, 2008Inventor: Bob Matthew
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Publication number: 20080275585Abstract: A system, method, and computer readable medium for extracting a key process parameter correlative to a selected device parameter are provided. In an embodiment, the key process parameter is determined using a gene map analysis. The gene map analysis includes grouping highly correlative process parameter and determining the correlation of a group to the selected device parameter. In an embodiment, the groups having greatest correlation to the selected device parameter are displayed in a correlation matrix and/or a gene map.Type: ApplicationFiled: February 5, 2008Publication date: November 6, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chun-Hsien Lin, Francis Ko, Kewei Zuo, Henry Lo, Jean Wang
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Publication number: 20080275586Abstract: A method to enable wafer result prediction includes collecting manufacturing data from various semiconductor manufacturing tools and metrology tools; choosing key parameters using an autokey method based on the manufacturing data; building a virtual metrology based on the key parameters; and predicting wafer results using the virtual metrology.Type: ApplicationFiled: February 5, 2008Publication date: November 6, 2008Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Francis Ko, Chih-Wei Lai, Kewei Zuo, Henry Lo, Jean Wang, Ping-Hsu Chen, Chun-Hsien Lin, Chen-Hua Yu
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Patent number: 7447610Abstract: A method and system for reliability similarity of semiconductor devices. The method includes providing a first plurality of semiconductor devices, providing a second plurality of semiconductor devices, and determining a first reliability associated with the first plurality of semiconductor devices. The first reliability is represented by at least a first probability density function. Additionally, the method includes determining a second reliability associated with the second plurality of semiconductor devices. The second reliability is represented by at least a second probability density function. Moreover, the method includes processing information associated with the first probability density function and the second probability density function, and determining a numerical number based on at least information associated with the first probability density function and the second probability density function.Type: GrantFiled: October 17, 2005Date of Patent: November 4, 2008Assignee: Semiconductor Manufacturing International (Shanghai) CorporationInventor: Eugene Wang
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Patent number: 7447559Abstract: In an apparatus and a method of forming a photoresist pattern, a photoresist-coating section coats a substrate with a photoresist composition to form a photoresist film. A light is irradiated onto the photoresist film by using an exposure section, and a developing section develops the photoresist film. A residue-sensing section senses a residue of the developed photoresist film to generate information of the residue corresponding to the sensed residue. A residue-removing section sprays a solvent in a region of the residue corresponding to the information of the residue to dissolve the residue, and the residue-removing section absorbs the residue dissolved by the solvent. Therefore, the residue is effectively removed by spraying the solvent in the region of the residue and absorbing the residue dissolved by the solvent.Type: GrantFiled: October 6, 2004Date of Patent: November 4, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Gi-Cheon Yoon, Geun-Soo An
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Publication number: 20080269936Abstract: An inspection-required product selection method and program for minimizing the number of investigation steps at the time of occurrence of a defect of a product placed on the market are disclosed. A combination of product lots to be inspected is assumed based on the information on the material lots used for a product lot scheduled for production for a predetermined future period and the number of the product lots inspected during the same period. The number of the material lots not included in the product lots to be inspected is totalized for each product lot, and the statistical values are calculated for all the conceivable combinations of the product lots. The combination of the product lots optimizing the statistical values is selected for inspection.Type: ApplicationFiled: April 25, 2008Publication date: October 30, 2008Inventors: Masataka TANAKA, Takaaki KUMAZAWA, Masayuki ICHINOHE
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Publication number: 20080269935Abstract: Method for quality control of mechanical pieces, such as screws, pins, pivots and similar, intended for mass-production mechanical industries such as automobile and household appliances industries and similar, by means of an apparatus comprising in casings a plurality of operation stations and a piece-holder table which is pitched revolving to convey the pieces to the operation stations.Type: ApplicationFiled: April 10, 2008Publication date: October 30, 2008Inventor: Carlo Agrati
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Patent number: 7444197Abstract: Methods, systems, and software program for validation of pharmaceutical manufacturing processes and quality assurance process are described and disclosed herein. Consequently, the methods provide a means to perform validation on an integrated level whereby the quality control unit can ensure data and product integrity and minimize cost.Type: GrantFiled: May 6, 2004Date of Patent: October 28, 2008Assignee: SMP Logic Systems LLCInventor: Shane M. Popp
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Patent number: 7444196Abstract: A patterned structure in a wafer is created using one or more fabrication treatment processes. The patterned structure has a treated and an untreated portion. One or more diffraction sensitivity enhancement techniques are applied to the structure, the one or more diffraction sensitivity enhancement techniques adjusting one or more properties of the patterned structure to enhance diffraction contrast between the treated portion and untreated portions. A first diffraction signal is measured off an unpatterned structure on the wafer using an optical metrology device. A second diffraction signal is measured off the patterned structure on the wafer using the optical metrology device. One or more diffraction sensitivity enhancement techniques are selected based on comparisons of the first and second diffraction signals.Type: GrantFiled: April 21, 2006Date of Patent: October 28, 2008Assignee: Timbre Technologies, Inc.Inventors: Steven Scheer, Alan Nolet, Manuel Madriaga
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Publication number: 20080249647Abstract: Data harvesting can be carried out relative to performance or reliability information associated with one or more groups of electrical units. Ambient condition detectors associated with a variety of industrial or commercial installations and subject to a variety of different conditions can be returned for performance and reliability testing after predetermined usage intervals. Analysis of test results can be maintained in a database. Customers can be provided multilevel access to the information in the database. Reliability and test results for a class of detectors can be provided to a number of customers that have provided samples for evaluation. Application specific information can be limited to a particular customer or customers.Type: ApplicationFiled: April 3, 2007Publication date: October 9, 2008Inventor: Neils R. Hansen
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Publication number: 20080243288Abstract: A method which improves the correspondence between the produced fancy yarn and the predetermined configuration of said fancy yarn. The fancy yarn is guided through a sensor device in a spinning device after it is formed and the diameter of the fancy yarn is continuously measured by the sensor device. The fancy configuration of the produced yarn is determined on the basis of the measured values of the diameter and is compared with the predetermined fancy configuration. The comparison is carried out until sufficient correspondence between the predetermined fancy configuration and the fancy configuration of the optimized, produced yarn is achieved.Type: ApplicationFiled: December 29, 2004Publication date: October 2, 2008Applicant: Saurer GmH & Co. KGInventors: Hans Grecksch, Gerhard Rienas, Christoph Haase, Olav Birlem, Iris Biermann
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Publication number: 20080243289Abstract: A system and method modifies a dynamic model of a process in a plant for an advanced process control controller wherein the model includes sub models. Performance of the controller is monitored and performance degradation is quantified as the process changes. It is then determined whether a selected number of sub models need updating or the entire model dynamics need updating as a function of the quantified controller performance degradation If a selected number of sub models need updating, an excitation signal is initiated for such sub models to identify new sub models. If the entire model dynamics need updating, a complete perturbation signal is initiated and triggers exhaustive closed-loop identification of entire model. The newly identified model or sub models is incorporated in the controller.Type: ApplicationFiled: March 28, 2007Publication date: October 2, 2008Inventors: Ramprasad Yelchuru, Harigopal Raghavan, Ravindra D. Gudi, Jagadeesh Brahmajosyula, Srinivasa Prabhu Edamadaka
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Publication number: 20080228306Abstract: A sensor network collects time-series data from a process tool and supplies the data to an analysis system where pattern analysis techniques are used to identify structures and to monitor subsequent data based on analysis instructions or a composite model. Time-series data from multiple process runs are used to form a composite model of a data structure including variation. Comparison with the composite model gives an indication of tool health. A sensor network may have distributed memory for easy configuration.Type: ApplicationFiled: April 21, 2008Publication date: September 18, 2008Applicant: SENSARRAY CORPORATIONInventors: Forrest Gilbert Yetter, Jeffrey M. Parker, Wayne G. Renken, John B. Pieper
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Publication number: 20080228305Abstract: A computer-based method for controlling product quality is disclosed. The method includes the steps of: detecting whether a quality of raw materials bought from at least one supplier are acceptable; detecting whether a quality of using materials used at a processing procedure are acceptable; detecting whether a quality of products being manufactured at the processing procedure are acceptable; receiving and storing a post-procedure report obtained by sampling the products after the processing procedure; repeating steps of detecting materials used at a processing procedure, detecting products being manufactured at the processing procedure, detecting the sampling products after the processing procedure, and completing the manufacturing if all the products are finished. A related system is also disclosed.Type: ApplicationFiled: November 27, 2007Publication date: September 18, 2008Applicants: HONG FU JIN PRECISION INDUSTRY (Shenzhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHI-CHIH WANG, BING-YU HE, YONG-HUA SONG
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Publication number: 20080221720Abstract: A method for identifying a predetermined state of a manufacturing process by monitoring the process which involves, monitoring a plurality of variables that vary in value during the manufacturing process. The method also involves mapping as points in a hyperspace the values of each variable at a plurality of times, where the hyperspace has a number of dimensions equal to the number of variables and the number of points is equal to the plurality of times. The method also involves identifying that a manufacturing process has reached the predetermined state when one of the points reaches a closed volume in the hyperspace that is located within a predefined distance from a predefined location in the hyperspace.Type: ApplicationFiled: March 7, 2007Publication date: September 11, 2008Applicant: MKS Instruments, Inc.Inventors: Lawrence Hendler, Matthew Richter
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Publication number: 20080221721Abstract: A system and method are provided for manufacturing workpieces, such as metal articles like sputtering target, the system comprising: comparing one or more physical or chemical values of a respective one of a plurality of metal target blanks to one or more comparable values of at least one desired criterion; selecting one of the metal target blanks from a plurality of metal target blanks as a work-in-progress; assigning a serial route for the work-in-progress; processing the work-in-progress by translating the work-in-progress from note to node with an automated transport, after completion of the events at each node; rejecting or accepting the work-in-progress as a metal target by evaluating a result of at least one event of the one or more respective events to be completed at, at least one of the plurality of nodes.Type: ApplicationFiled: January 18, 2006Publication date: September 11, 2008Applicant: Tosoh SMD ETNA, LLCInventors: Wiley Zane Reed, Bobby R. Cosper, Kenneth G. Schmidt, Neil D. Bultz, Charles E. Wickersham, John P. Matera
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Patent number: 7424336Abstract: Disclosed is a test data analyzing method and system for use in estimation of a defect cause of a product, such as, an integrated circuit, a liquid crystal display, an optical transceiver, a thin film magnetic head, etc., which is fabricated through plural processes. The estimation of a defect cause is achieved by selecting a wafer number to be analyzed, reading test data, reading fabrication line data, counting frequency of machine codes by wafers, grouping test data by machine codes or frequencies, comparing test data distributions between groups by machine codes, and comparing results between machine codes.Type: GrantFiled: July 11, 2006Date of Patent: September 9, 2008Assignee: Hitachi High Technologies CorporationInventors: Makoto Ono, Junko Konishi
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Patent number: 7419271Abstract: Aspects of the invention can provide a manufacturing method for fine structure elements having a first flat portion forming step of forming an upper flat surface serving as a first flat portion on a substrate with a flat cutting tool serving as a cutting section a second flat portion forming step of cutting the upper flat surface serving as the first flat portion by a predetermined depth and forming a lower flat portion serving as a second flat portion with the flat cutting tool serving as the cutting section, a refractive surface forming step of forming a slope serving as a refractive surface having a predetermined angle with respect to the lower flat surface serving as the second flat portion by the flat cutting tool serving as the cutting section.Type: GrantFiled: March 1, 2005Date of Patent: September 2, 2008Assignee: Seiko Epson CorporationInventor: Shunji Kamijima
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Publication number: 20080201005Abstract: A machine tool having a function of setting a workpiece reference position to a central position of a workpiece. The workpiece has a machining surface symmetrical with respect to two orthogonal lines and is mounted on the machine tool having movable axes supported by fluid bearings so that the two lines extend parallel to axes of a machine coordinate system. A distal end of a stylus of a probe of an on-machine measuring device is brought into contact with the workpiece along first and second lines respectively parallel to the two lines from opposite sides of the workpiece. The contact is detected based on an increase of a position deviation and coordinate values at the time of the contact are stored. Coordinate values of a central position of the workpiece are obtained based on stored coordinate values and the central position is set as a reference position of the workpiece.Type: ApplicationFiled: February 11, 2008Publication date: August 21, 2008Applicant: FANUC LTDInventors: Yonpyo HON, Kenzo EBIHARA, Tomohiko KAWAI
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Patent number: 7412297Abstract: A method for designing and manufacturing lens modules includes selecting design parameters from a design database stored with the design parameters suitable for a lens module desired to be manufactured to design the lens module according to characteristics of the lens module and storing the design parameters of the lens module in an analysis database, analyzing the lens module based on a predetermined analysis process to generate analysis parameters corresponding to the lens module and storing the generated analysis parameters in the analysis database, and re-designing the lens module based on the analysis parameters stored in the analysis database.Type: GrantFiled: August 28, 2006Date of Patent: August 12, 2008Assignee: Industrial Technology Research InstituteInventors: Chir-Weei Chang, Chy-Lin Wang, Wei-Chung Chao