Abstract: A semiconductor chip has shapes on a particular level that are small enough to require a first mask and a second mask, the first mask and the second mask used in separate exposures during processing. A circuit on the semiconductor chip requires close tracking between a first and a second FET (field effect transistor). For example, the particular level may be a gate shape level. Separate exposures of gate shapes using the first mask and the second mask will result in poorer FET tracking (e.g., gate length, threshold voltage) than for FETs having gate shapes defined by only the first mask. FET tracking is selectively improved by laying out a circuit such that selective FETs are defined by the first mask. In particular, static random access memory (SRAM) design benefits from close tracking of six or more FETs in an SRAM cell.

Abstract: A method for routing-based pin placement is provided and includes receiving a logical description of a macro of a partitioned circuit with connectivity information and a physical outline, generating an abstracted shape as an abstraction of a generic shape of a pin for providing a connection to the macro in accordance with the connectivity information as a shape conforming to dimensions of the macro, providing a routing tool with freedom to route a net for connection to the pin toward any part of the abstracted shape of the pin to create a routed net and identifying a location where the routed net crosses the physical outline as a chosen location for the pin.

Abstract: A method for designing a system on a target device is disclosed. Extraction is performed on a first version of the system during synthesis in a first compilation resulting in a first netlist. Optimizations are performed on the first version of the system during synthesis in the first compilation resulting in a second netlist. Placement and routing are performed on the first version of the system in the first compilation. Extraction is performed on a second version of the system having a changed portion during synthesis in a second compilation resulting in a third netlist. The first version of the system in the first netlist and the second version of the system in the third netlist are differentiated to identify identical regions, wherein at least one of the performing and differentiating is performed by a processor.

Abstract: A method of generating a bias-adjusted layout design of a conductive feature includes receiving a layout design of the conductive feature. If a geometry configuration of the layout design is within a first set of predetermined criteria, the bias-adjusted layout design of the conductive feature is generated according to a first layout bias rule. If the geometry configuration of the layout design is within a second set of predetermined criteria, the bias-adjusted layout design of the conductive feature is generated according to a second layout bias rule.

Abstract: The disclosed invention gives an estimation of the placement location of the units comprising a NoC within the floorplan of a chip. From that, and with knowledge of the number of wires of links within the NoC topology, an estimation of the wire density at each point is calculated. Furthermore, an estimate is made of the locations of the critical timing paths within the chip. The timing path calculation is also used to generate IO constraints for the synthesis of modules comprising different parts of the NoC. Further still, a scenario of traffic through the NoC is combined with the wire map and information about the width of links within the topology to generate an estimation of power consumption.

Abstract: In an embodiment, a buffer bay is represented with a moveable object that has a location within a unit in a netlist. The location of the moveable object that represents the buffer bay is changed to a new location in the netlist if changing the location improves placement within the unit. In an embodiment, a net weight of a net that connects the moveable object to an artificial pin is considered in determining whether to change the location to the new location. In an embodiment a bounding area that encompasses the location is considered in determining whether to change the location to the new location.

Abstract: Methods and apparatuses to design and analyze digital circuits with time division multiplexing. At least one embodiment of the present invention efficiently models subsystems connected by a TDM channel by introducing equivalent delays in the connections for the subsystems, where the delays are determined according to the upper bounds of the delays caused by the TDM channel. The TDM channel is modeled with its equivalent delays. Thus, a transformation tool is allowed to take into account the original constraints and time budgeting of the sending subsystem and the receiving subsystem. The problem of asynchronous clock domains is eliminated; and, simulation time of the multiplexed circuit is also improved. In some embodiments of the present invention, multiple TDM slots are assigned to a particular signal to reduce the equivalent connection delay caused by the TDM channel for the particular signal.

Abstract: Decoupling capacitors (dcaps) are placed in an IC design by assigning different dcap utilization rates to logic cones, applying the rates to corresponding dcap regions surrounding cells in the cones, identifying any overlap of regions from different logic cones, and inserting a dcap at the overlapping region having the highest dcap utilization rate. The best location for the dcap is computed using a hypergraph wherein the cells are edges and the regions are nodes. Any node that is dominated by another node is removed and its edge is extended to the dominating node. The dcap is inserted in the region having the most edges (the edges can be weighted). The process is repeated iteratively, updating the hypergraph by removing nodes connected to dcap location, and inserting the next dcap at a region corresponding to the node which then has the greatest number of connected edges.

Abstract: A congestive placement preventing apparatus for modifying a circuit layout includes an analyzing module, a defining module and an extension module. The analyzing module performs a congestion analysis on the circuit layout to generate an analysis result. The defining module defines a congestion region and a share region adjacent to the congestion region on the circuit layout according to the analysis result. A density of electronic cells of the congestion region is higher than that of electronic cells of the share region. The extension module arranges a plurality of electronic cells in the congestion region to the congestion region and the share region, thereby reducing the density of electronic cells in the congestion region.

Abstract: A system automatically routes interconnect of an integrated circuit design using variable width interconnect lines. For example, a first automatically routed interconnect may have a different width from a second automatically routed interconnect. The system will vary the width of the interconnect lines based on certain factors or criteria. These factors include current or power handling, reliability, electromigration, voltage drops, self-heating, optical proximity effects, or other factors, or combinations of these factors. The system may use a gridded or a gridless (or shape-based) approach.

Abstract: A method of partitioning a circuit design can include identifying a circuit design in which components of the circuit design are assigned to each of a plurality of regions, wherein each region corresponds to a physical portion of an integrated circuit. A maximum oversubscription region can be determined for a selected component type from the plurality of regions. A target region from the plurality of regions can be selected that is adjacent to the region of maximum oversubscription. The method also can include re-assigning, by a processor, a selected number of components of the maximum oversubscription region to the target region.

Abstract: A method for automatically generating and prioritizing several design solutions that resolve a double patterning (DP) loop violation in an IC design layout. The method of some embodiments receives a DP loop violation marker and identifies pairs of edges of shapes that form a double patterning loop based on the DP loop violation marker. For each pair of edges that violates the design rule, the method generates one or more design solutions. Each design solution moves a single edge or both edges to resolve the violation. The method of some embodiments computes the cost of applying each design solution to the IC design layout and prioritizes the generated solutions for all the identified pairs of edges based on the computed cost for each solution. The method in some embodiments then selects a solution from the prioritized solutions and applies the selected solution to the design layout.

Abstract: A method for designing a stressor pattern is described, wherein the stressor pattern is used to form S/D regions of a second-type MOS transistor. A first distance between a boundary of the stressor pattern and a first active area of a first-type MOS transistor is derived. If the first distance is less than a safe distance, the stressor pattern is shrunk to make the first distance at least equal to the safe distance.

Abstract: A design system for designing complex integrated circuits (ICs), a method of IC design and program product therefor. A layout unit receives a circuit description representing portions in a grid and glyph format. A checking unit checks grid and glyph portions of the design. An elaboration unit generates a target layout from the checked design. A data prep unit prepares the target layout for mask making. A pattern caching unit selectively replaces portions of the design with previously cached results for improved design efficiency.

Abstract: An integrated circuit and method of generating a layout for an integrated circuit in which circuitry peripheral to an array of repetitive features, such as memory or logic cells, is realized according to devices constructed similarly as the cells themselves, in one or more structural levels. The distance over which proximity effects are caused in various levels is determined. Those proximity effect distances determine the number of those features to be repeated outside of and adjacent to the array for each level, within which the peripheral circuitry is constructed to match the construction of the repetitive features in the array.

Abstract: An integrated circuit and method of generating a layout for an integrated circuit in which circuitry peripheral to an array of repetitive features, such as memory or logic cells, is realized according to devices constructed similarly as the cells themselves, in one or more structural levels. The distance over which proximity effects are caused in various levels is determined. Those proximity effect distances determine the number of those features to be repeated outside of and adjacent to the array for each level, within which the peripheral circuitry is constructed to match the construction of the repetitive features in the array.

Abstract: A method includes defining and storing one or more attributes of a source resonator and a device resonator forming a system, defining and storing the interaction between the source resonator and the device resonator, modeling the electromagnetic performance of the system to derive one or more modeled values and utilizing the derived one or more modeled values to design an impedance matching network.

Abstract: This invention comprises a layout method to effectively protect logic circuits against soft errors (non-destructive errors) and circuit cells, with layout, which are protected against soft errors. In particular, the method protects against cases where multiple nodes in circuit are affected by a single event. These events lead to multiple errors in the circuit, and while several methods exist to deal with single node errors, multiple node errors are very hard to deal with using any currently existing protection methods. The method is particularly useful for CMOS based logic circuits in modem technologies (.ltoreq.90 nm), where the occurrence of multiple node pulses becomes high (due to the high integration level). It uses a unique layout configuration, which makes the circuits protected against single event generated soft-errors.

Abstract: A superconducting nanowire avalanche photodetector (SNAP) with improved high-speed performance. An inductive element may be coupled in series with at least two parallel-coupled nanowires. The nanowires may number 5 or fewer, and may be superconducting and responsive to even a single photon. The series inductor may ensure current diverted from a photon-absorbing nanowire propagates to other nanowires and become amplified. The series inductance may be less than 10 times the nominal inductance per nanowire, and may also be larger than a minimum inductance to avoid spurious outputs in response to a photon absorption. The series inductance may be configured to achieve a desired tradeoff between SNAP reset time and spurious outputs. For example, the series inductance may be configured achieve minimum reset time or maximum bias margin, subject to user-defined constraints. By appropriately configuring the series inductance, a systematic method of designing improved SNAPs may be provided.

Abstract: A cell library intended to be used to form an integrated circuit, this library defining a first cell including a first MOS transistor of minimum dimensions, and a second cell including a second MOS transistor of lower leakage current, wherein the second cell takes up the same surface area as the first cell, and the second MOS transistor has a gate of same length as the gate of the first MOS transistor across at least a first width in its central portion, and of greater length across at least a second width on either side of the central portion.

Abstract: Methods and apparatuses for designing at least one integrated circuit (IC). In one embodiment, the method comprises partitioning a circuit into portions that represent a partitioning solution and assigning traces to interconnect the portions to generate a trace assignment solution. The method further comprises optimizing the circuit through a modification of at least one of the partitioning solution and the trace assignment solution, the optimizing based on evaluating a design parameter which is based at least in part on the trace assignment solution.

Abstract: A global placement grating (GPG) is defined for a chip level to include a set of parallel and evenly spaced virtual lines. At least one virtual line of the GPG is positioned to intersect each contact that interfaces with the chip level. A number of subgratings are defined. Each subgrating is a set of equally spaced virtual lines of the GPG that supports a common layout shape run length thereon. The layout for the chip level is partitioned into subgrating regions. Each subgrating region has any one of the defined subgratings allocated thereto. Layout shapes placed within a given subgrating region in the chip level are placed in accordance with the subgrating allocated to the given subgrating region. Non-standard layout shape spacings at subgrating region boundaries can be mitigated by layout shape stretching, layout shape insertion, and/or subresolution shape insertion, or can be allowed to exist in the final layout.

Abstract: Estimating the latency time of the clock tree of an ASIC including: providing a netlist and a placement related to the clock tree of the ASIC; extracting a number of the load timing devices connected by the clock tree according to the netlist related to the clock tree; extracting a physical distribution area of the load timing devices connected by the clock tree according to the placement related to the clock tree; estimating a latency time of the clock tree according to the relationship between the number of the load timing devices, the physical distribution area of the load timing devices and latency time of the clock tree in design data related to the ASIC design.

Abstract: An embodiment of a circuit is described that includes a first inductor comprising a first end and a second end, where the first end of the first inductor forms an input node of the circuit. The embodiment of the circuit further includes a second inductor comprising a first end and a second end, where the second end of the first inductor is coupled to the first end of the second inductor forming an output node of the circuit; a resistor coupled to the second end of the second inductor; and an electrostatic discharge structure coupled to the output node and configured to provide an amount of electrostatic discharge protection, where the amount of electrostatic discharge protection is based on a parasitic bridge capacitance and a load capacitance metric.

Abstract: An automated method for aligning a critical datapath in an integrated circuit design inserts an artificial alignment net in the netlist which interconnects all cells in the bit stack of the datapath. The cells are placed using a wirelength optimization which assigns weights to wire sections based on the alignment direction. The rate of change of the alignment weighting value can vary during different stages of global placement. The invention is particularly suited for a force-directed placer which uses a linear system solver to obtain a globally optimum solution for placement of the cells having some overlap among the cells, and thereafter spreads the cells to reduce the overlap. Pseudo nets are also inserted which interconnect a cell and an expected location of the cell after spreading for that iteration.

Abstract: A method includes creating a technology file including data for an integrated circuit including at least one die coupled to an interposer and a routing between the at least one die and the interposer, b) creating a netlist including data approximating at least one of capacitive or inductive couplings between conductors in the at least one die and in the interposer based on the technology file, c) simulating a performance of the integrated circuit based on the netlist, d) adjusting the routing between the at least one die and the interposer based on the simulation to reduce the at least one of the capacitive or the inductive couplings, and e) repeating steps c) and d) to optimize the at least one of the capacitive or inductive couplings.

Abstract: A system and method for design and modeling of vertical interconnects for 3DI applications. A design and modeling methodology of vertical interconnects for 3DI applications includes models that represent the frequency dependent behavior of vertical interconnects by means of multi-segment RLC scalable filter networks. The networks allow for accuracy versus computation efficiency tradeoffs, while maintaining correct asymptotic behavior at both high and low frequency limits. In the framework of the model it is shown that a major effect is pronounced frequency dependent silicon substrate induced dispersion and loss effects, which is considered in through silicon via (TSV) parallel Y-element parameters, including capacitance and conductance.

Abstract: A method receives an initial circuit design. The circuit design includes at least one path having at least one beginning point comprising a source, at least one ending point comprising a sink, and one or more circuit elements between the source and the sink. The method evaluates timing performance parameter sensitivities to manufacturing variations of each of the elements to identify how much each element will increase or decrease the timing performance parameter of the path for each change in each manufacturing variable associated with manufacturing the elements. Further, the method alters the elements within the path until elements that produce positive changes to the timing performance parameter for a given manufacturing variable change approximately equals (in magnitude) elements that produce negative changes to the timing performance parameter for the given manufacturing variable change, to produce an altered circuit design.

Abstract: Solutions for determining intra-die wirebond pad placement locations in an integrated circuit (IC) die are disclosed. In one embodiment, a method includes generating a dividing band in the IC die, the dividing band dividing the IC die into a first region and a second region; determining a voltage (IR) drop across the first region and the second region; comparing the IR drops across the regions; and in response to the IR drops being substantially unequal, moving the dividing band, determining new IR drops across the regions, and comparing the new IR drops until the IR drops are substantially equal. The dividing band may provide desired locations for intra-die wirebond pads.

Abstract: Disclosed are improved methods, systems, and computer program products for implementing an I/O ring structure to generate an I/O ring arrangement for an electronic design, and for performing chip planning and estimation based upon the I/O ring arrangement. Nodes in the I/O ring structure are used to track objects in the I/O ring.

Abstract: A method for designing a system to be implemented on a target device includes computing slack potential of paths between components on the target device after timing analysis. A graphical representation of the slack potential and slack for the paths is generated. The graphical representation identifies that a design change is required for a first portion of the system associated with a first path and that a change in placement is required for a second portion of the system associated with the second path.

Abstract: A method for recursive hierarchical static timing analysis. The method includes accessing a lower-level netlist representing a lower-level block of a circuit design to be realized in physical form, and accessing constraints for the lower-level block. Static timing analysis is performed on the lower-level block. The method includes accessing an upper-level netlist representing an upper-level block of the circuit design to be realized in physical form, and accessing constraints for the upper-level block. Static timing analysis is performed on the upper-level block while incorporating results from the static timing analysis on the lower-level block.

Abstract: According to one embodiment, an original plate evaluation method is disclosed. The original plate includes a substrate and N patterns differing from one another in shape. The method includes selecting N1 patterns from the N patterns based on first criterion, obtaining measured values for the N1 patterns, performing a decision whether the obtained measured values satisfy first specification value, selecting N2 patterns from the N patterns based on second criterion, predicting shapes of transfer patterns corresponding to N2 patterns, performing a decision whether the predicted shapes satisfy second specification value, and evaluating the plate based on the decision.

Abstract: Methods and apparatuses are disclosed for generating a placed, routed, and optimized circuit design. Other embodiments are a circuit design and circuit created with the technology. The placed, routed, and optimized circuit design obeys relative positioning rules of a set of the circuit elements. Such relative positioning rules were created specifically for these circuit elements.

Abstract: A basic cell circuit architecture having plurality of cells with fixed transistors configurable for the formation of logic devices and single and dual port memory devices within a structured ASIC is provided. Different configurations of ensuing integrated circuits are achieved by forming variable interconnect layers above the fixed structures. The circuit architecture can achieve interconnection of transistors within a single cell or across multiple cells. The interconnection can be configured to form basic logic gates as well as more complex digital and analog subsystems. In addition, each cell contains a layout of transistors that can be variably coupled to achieve a memory device, such as a SRAM device. By having the capability of forming a logic circuit element, a memory device, or both, the circuit architecture is both memory-centric and logic-centric, and more fully adaptable to modern-day SoCs.

Abstract: Disclosed is an improved mechanism and method for implementing electronic designs. According to some approaches, a method, mechanism, and compute program product is disclosed for implementing electronic designs that allows visual editing of complex objects with advanced editing features, which also provides for automated correspondence of the editing results to parametric values for a programmable object in the design.

Abstract: A method of inserting dummy metal and dummy via in an integrated circuit design. The method includes inserting, by a computer, dummy metals using a place and route tool, wherein the place and route tool has timing-awareness to improve a timing performance of the integrated circuit design. The method further includes inserting, by the computer, dummy vias using a design-rule-checking utility separately from the inserting of the dummy metals, wherein at least one of the dummy vias has a different size than at least another of the dummy vias.

Abstract: A layout data creation device includes a transistor adjustment unit. The transistor adjustment unit divides a pillar-type transistor including a plurality of unit pillar-type transistors into the unit pillar-type transistors groups. The unit pillar-type transistors can be placed in a placement area. The number of the unit pillar-type transistors in each group is an integer. The transistor adjustment unit generates sub-pillar-type transistors that are placed in the placement area.

Abstract: A method of gridded glyph geometric objects (L3GO) integrated circuit (IC) design, wherein at least one inter-level connect in a L3GO circuit design is represented as a point matrix glyph (PMG) on a L3GO grid. Each PMG connects a pair of conductors on the next adjacent (above and below) layer and includes an array (one or two dimensional) of point glyphs contained within a cage. The point glyphs may have uniform size and may be on minimum pitch. Each PMG may also include a flange on the above and below layer. A default flange insures adequate coverage of cut shapes represented by the point glyphs.

Abstract: A method of filling dcaps in an integrated circuit includes identifying a set of dcap-eligible areas of the integrated circuit for areas large enough to accommodate at least one dcap cell having a selected size smaller than a default size. The dcap cell includes at least one built-in power track. A set of dcap cells are filled in the identified set of dcap-eligible areas. Each of the built-in power tracks included in the set of dcap cells is connected to a corresponding power grid. An integrated circuit including a power grid channel formed between at least two power grids and a plurality of dcaps including a first dcap included in a dcap cell, the dcap cell including built-in power tracks, each one of the built-in power tracks being connected to a corresponding one of the at least two power grids is also described.

Abstract: Techniques, systems, and methods are provided for optimizing pattern density fill patterns for integrated circuits. The method includes adjusting an area of a scribe line and a density of dummy fill shapes in the adjusted scribe line, while maintaining an area of the die, to achieve a pattern density associated with technology ground rules for a particular design of the die.

Abstract: A computer-implemented method is disclosed for layout pattern or layout constraint reuse by identifying sub-circuits with identical or similar schematic structure based on a topology comparison strategy. The selected sub-circuit is transformed into a topology representing the relative positions among the instances of the selected sub-circuit. Based on the topology, one or more sub-circuits with identical or similar topologies in a predefined scope of a schematic are recognized and identified. Accordingly, the layout or the layout constraint of the selected sub-circuit is copied and associated to each of the identified sub-circuits. Furthermore, once the sub-circuits are identified, they can be listed on a user interface with notations to allow users to confirm each of the identified sub-circuits respectively.

Abstract: In a method of forming an integrated circuit, a layout of a chip representation including a first intellectual property (IP) is provided. Cut lines that overlap, and extend out from, edges of the first IP, are generated. The cut lines divide the chip representation into a plurality of circuit regions. The plurality of circuit regions are shifted outward with relative to a position of the first IP to generate a space. The first IP is blown out into the space to generate a blown IP. A direct shrink is then performed.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: A semiconductor integrated circuit includes a first wiring, a second wiring, a third wiring, a fourth wiring, a first overlap area, a second overlap area, a multi-cut via, the multi-cut via including a first via and a second via formed in the first direction, and a single-cut via formed to connect the third wiring to the fourth wiring in the second overlap area. A width of the second portion of the second wiring corresponding to a first direction is longer than a width of the first portion of the second wiring corresponding to the first direction. A distance between the center of the first via and the center of the second via is longer than the width of the first portion of second wiring.

Abstract: A method of increasing an initial threshold voltage (Vt) of selected devices. The method includes designing devices with desired antenna effects and adjusting an increase in Vt of some devices to specific values. The desired antenna effects produce a desired threshold voltage of the devices.

Abstract: A method including receiving layout data representing the plurality of patterns, the layout data including a plurality of layers and identifying spaces between adjacent patterns in at least one layer of the plurality of layers which violate a G0-rule, by a processor of a computer system. The method further includes determining whether each identified space is a critical G0-space, by the processor, wherein the identified space is determined to be the critical G0-space if removal of a portion of at least one of pattern merges two adjacent odd-loops of G0-spaces into a single even-loop of G0-spaces or converts one odd-loop of G0-spaces to a non-loop of G0-spaces. The method further includes receiving a modification of the at least one pattern and updating a spacing of a layer adjacent to the at least one layer based on the received modification, by the processor.

Abstract: A computer system identifies active nets in a netlist of a circuit design by performing simulation of the netlist. Active nets are interconnections between circuit components showing a level of activity during the simulation. The computer system extracts, from a layout of the circuit design, a parasitic netlist of a part of the circuit design, where the part determined by the active nets. The parasitic netlist is a list of parasitic nets, or unwanted circuit interconnections that are unavoidable adjuncts of the active nets. The computer system performs simulation of the circuit design including the netlist of a circuit design and the parasitic netlist of the part of the circuit design.

Abstract: A method of generating an integrated circuit with a DPT compatible interconnect pattern using a reduced DPT compatible design rule set and color covers. A method of operating a computer to generate an integrated circuit with a DPT compatible interconnect pattern using a reduced DPT compatible design rule set and using color covers. A reduced DPT compatible design rule set.

Abstract: An integrated circuit includes a first plurality of transistors and a second plurality of transistors coupled together to form a standard cell that performs a logic function. Each of the first plurality of transistors is more critical to a speed of operation of the standard cell than any of the transistors of the second plurality of transistors. Each of the first plurality of transistors has a gate length longer than a gate length of any of the transistors of the second plurality of transistors.