Diaphragm Patents (Class 73/715)
  • Patent number: 8965725
    Abstract: In order to mitigate the negative effects of a change in atmospheric pressure, an improved capacitance diaphragm gauge (CDG) sensor incorporates an independent ambient atmospheric pressure sensor near the CDG sensor body. The ambient atmospheric sensor is located outside the CDG sensor body to sense the ambient atmospheric pressure surrounding the CDG sensor body. The ambient atmospheric sensor provides an output that represents the ambient atmospheric pressure. A sensor output processing circuit receives the output of the ambient atmospheric sensor as well as the output of the CDG sensor. The processing circuit utilizes the output from the ambient atmospheric pressure sensor to fine tune the CDG measurement of pressure by executing an in situ, real time, automatic calibration adjustment of the CDG.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: February 24, 2015
    Assignee: Reno Technologies, Inc.
    Inventors: David J. Ferran, Robert J. Ferran
  • Patent number: 8943896
    Abstract: A pressure transducer using a ceramic diaphragm which is not easily damaged so that there is no risk of leakage of a target medium to be measured, having a superior mass-production capability and a reduced volume and enabling low-price by simplifying a flexible cable and a printed circuit board (PCB) to connect the transducer and a signal processing chip. The pressure transducer includes the ceramic diaphragm formed as a rectangular planar ceramic diaphragm and having a surface having formed thereon a pattern made of an electrically conductive material and strain gages; a base plate configured to face the surface of the ceramic diaphragm having formed thereon the pattern; and an adhesive layer configured to be formed along edges of a contacting surface of the ceramic diaphragm and the base plate so as to bond the ceramic diaphragm and the base plate and form a space for the strain gages.
    Type: Grant
    Filed: October 10, 2012
    Date of Patent: February 3, 2015
    Assignee: Auto Industrial Co., Ltd.
    Inventors: Kyong M. Park, Si-Dong Kim
  • Patent number: 8935962
    Abstract: A sensor assembly including a flexible member having a first end and a second end, a rotating member connected to the second end of the flexible member, a positional element disposed on the rotating member, and a sensor capable of sensing a movement of the positional element. A movement of the second end of the flexible member allows the rotating member and the positional element to rotate.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: January 20, 2015
    Assignee: Gammon Technical Products, Inc.
    Inventor: James H. Gammon
  • Publication number: 20150013467
    Abstract: A pressure sensor is provided, which includes a pressure detector that has a pressure receiving surface in contact with a liquid, and detects a pressure of the liquid to a pressure receiving section, and a housing having a housing inner wall that demarcates a liquid chamber, wherein the housing inner wall is provided with an inflow hole, and an outflow hole, at least a part of a connecting portion, which is connected to the pressure receiving surface, of the housing inner wall is formed as an inner wall of the outflow hole, and the housing inner wall at the portion formed as the inner wall of the outflow hole protrudes more outward of the liquid chamber than the other connecting portion adjacent to the portion formed as the inner wall of the outflow hole.
    Type: Application
    Filed: January 31, 2013
    Publication date: January 15, 2015
    Inventors: Hiroshi Imai, Toshiyuki Takanohashi
  • Patent number: 8931348
    Abstract: A pressure sensor is provided which is suitable as an airbag sensor of a vehicle. The pressure sensor includes a pressure chamber having a small opening and a large opening, a pressure sensor element having a pressure receiving surface, and a diaphragm. The diaphragm is designed to seal the large opening. The pressure sensor element is designed to seal the small opening at least using the pressure receiving surface.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: January 13, 2015
    Assignee: Robert Bosch GmbH
    Inventor: Peter Kunert
  • Patent number: 8919203
    Abstract: The invention relates to a thermal protection element (1), which is arranged on the front side for protecting a diaphragm (11) of a pressure sensor (10) to which pressure is applied. According to the invention, the thermal protection element (1) has, in the region of the sensor diaphragm (11), lamellae (2) which run parallel or are configured as circular arc segments (8) and cover 40% to 60% of the diaphragm surface, with the ratio between the cross-sectional height (h) of the lamellae (2) and the cross-sectional width (b) thereof being 8:1 to 12:1.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: December 30, 2014
    Assignee: PIEZOCRYST ADVANCED SENSORICS GmbH
    Inventors: Alexander Friedl, Wolfgang Michelitsch
  • Patent number: 8915141
    Abstract: Pressure sensor unit for sealed attachment to a fluidic system comprising a mounting member, a membrane cavity extending through the mounting member with an opening in contact with the fluidic system when the sensor unit is attached thereto, a membrane formed at the distal end of the membrane cavity, and a membrane deflection sensor, wherein the membrane is separated from the mounting member by a stress insulating member arranged to isolate the membrane from stress and strain in the mounting member.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: December 23, 2014
    Assignee: GE Healthcare Bio-Sciences AB
    Inventors: Tomas Agren, Klas Marteleur
  • Patent number: 8910524
    Abstract: A gage/differential pressure transducer assembly having enhanced output capabilities, comprising a first pressure port adapted to communicate a first pressure to a first sensor, the first sensor comprising a first Wheatstone bridge adapted to output a first signal indicative of the first pressure, wherein the first pressure is a main pressure; and a second pressure port adapted to communicate a second pressure to a second sensor, the second sensor comprising a second Wheatstone bridge adapted to output a second signal indicative of the second pressure, wherein the second pressure is a reference pressure; and an output port connected to the first Wheatstone bridge and the second Wheatstone bridge for outputting a third signal representative of the difference between the first and second pressures.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: December 16, 2014
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Andrew Bemis, Timothy Nunn
  • Publication number: 20140360277
    Abstract: A sensor includes: a housing with a terminal; a joint including a projecting portion; a sensor module provided to the projecting portion and including a strain gauge; a conductive member connecting the terminal and the strain gauge; a cap-shaped synthetic resin base provided to the projecting portion, including a top with an opening in which the strain gauge is exposed and lateral portions intersecting the top, and having an inner circumferential surface slidable along an outer circumferential surface of the projecting portion; and an electronic component mounted on the lateral portions. The conductive member includes: a flexible circuit board having a first end connected to the terminal and a second end connected to the base; and a three-dimensional circuit connected to the electronic component, three-dimensionally arranged continuously along the top and the lateral portions of the base, and having one end connected to the flexible circuit board.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 11, 2014
    Inventors: Yukinobu Iimori, Hironori Kobayashi, Shuji Tohyama
  • Publication number: 20140360501
    Abstract: The invention relates to a gas pressure measurement system comprising at least one gas circuit and at least one pressure sensor (6) arranged so as to be able to measure the pressure of the gas in at least part of the gas circuit, said at least one pressure sensor being protected by a protective membrane permeable to gas, arranged between said at least one pressure sensor and the gas circuit. It further comprises a flexible intermediate piece formed by an elastically deformable material arranged between said at least one pressure sensor and the protective membrane, said flexible intermediate piece comprising an internal passage putting the protective membrane and said at least one pressure sensor in fluid communication. Patient ventilation apparatus comprising a gas circuit able to convey gas between a gas source and a patient, as well as such a gas pressure measurement system.
    Type: Application
    Filed: June 6, 2014
    Publication date: December 11, 2014
    Inventors: Hadrien GUIDUCCI, Damien Germani
  • Publication number: 20140352446
    Abstract: A microelectromechanical pressure sensor structure that comprises a planar base and side walls and a diaphragm plate. The side walls extend circumferentially away from the planar base to a top surface of the side walls. The planar base, the side walls and the diaphragm plate are attached to each other to form a hermetically closed gap in a reference pressure, and a top edge of the inner surfaces of the side walls forms a periphery of a diaphragm. The diaphragm plate comprises one or more planar material layers of which a first planar material layer spans over the periphery of the diaphragm. The top surface of the side walls comprises at least one isolation area that is not covered by the first planar material layer.
    Type: Application
    Filed: June 2, 2014
    Publication date: December 4, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Heikki KUISMA
  • Patent number: 8901684
    Abstract: A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: December 2, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Hubert Benzel, Frank Henning, Armin Scharping, Christoph Schelling
  • Patent number: 8887574
    Abstract: A measurement system for measuring a pressure of a fluid is provided. The measurement system includes a sensing module and a liquid electrical circuit. The sensing module includes a flexible film and a liquid electronic device. The flexible film has a first side and a second side opposite to the first side. The fluid is disposed on the first side of the flexible film, and the liquid electronic device is disposed on the second side of the flexible film. The flexible film converts the pressure of the fluid into a parameter of the liquid electronic device. The liquid electrical circuit is electrically coupled to the liquid electronic device. The liquid electronic device and the liquid electrical circuit output a measurement signal corresponding to the parameter in response to an applied electrical energy. A manufacture method of a measurement system is also provided.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: November 18, 2014
    Assignee: Academia Sinica
    Inventors: Yi-Chung Tung, Chueh-Yu Wu, Wei-Hao Liao
  • Patent number: 8887575
    Abstract: One or more reactive gases are introduced to a capacitance manometer at a particular area or areas of the diaphragm between the inner and outer capacitive electrodes so the error-inducing measurement effects of positive and negative bending are neutralized or minimized. Additionally, a guard structure may be used with the electrode structure of the capacitance manometer. The guard structure presents an area that is relatively insensitive to the diffusion of the gas into the diaphragm and the resulting changing surface tension, thus providing increased or optimal stability of the zero reading of the manometer. The guard may also provide electrostatic isolation of the electrodes.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: November 18, 2014
    Assignee: MKS Instruments, Inc.
    Inventors: Steven D. Blankenship, Paul D. Lucas
  • Publication number: 20140331775
    Abstract: A semiconductor filter is provided to operate in conjunction with a differential pressure transducer. In one embodiment, a method comprises receiving, at a filter having a plurality of apertures, a pressure, wherein the pressure includes a static pressure component and a dynamic pressure component; filtering, by the plurality of apertures, at least a portion of the dynamic pressure component of the pressure, wherein a diameter of each of the plurality of apertures is such that the plurality of apertures filters at least the portion of the dynamic pressure component of the pressure; outputting, from the filter, a filtered pressure; and wherein the filtered pressure is used to determine the dynamic pressure component of the pressure.
    Type: Application
    Filed: January 17, 2014
    Publication date: November 13, 2014
    Inventor: Nora Kurtz
  • Patent number: 8881594
    Abstract: A pressure measuring device includes a resilient expandable pressure sensor element having an open end and an opposite closed end. The pressure sensor element includes spiral flutes extending between the open and closed ends defining spiral bellows. The pressure sensor element is tapered over at least a portion of its length from the open end to the closed end. The pressure measuring device also includes a supporting structure having a pressure indicating scale. The supporting structure holds the pressure sensor element such that the open end of the pressure sensor element is in communication with a fluid whose pressure is to be measured and pressure applied by the fluid causes the pressure sensor element to expand axially and be visibly displaced relative to the pressure indicating scale by a distance related to the pressure applied by the fluid.
    Type: Grant
    Filed: January 17, 2012
    Date of Patent: November 11, 2014
    Inventors: Alexander Henry Slocum, Alexander H. Slocum, Jr.
  • Patent number: 8881596
    Abstract: An MEMS pressure sensor is designed to reduce or eliminate thermal noise, such as temperature offset voltage output. The pressure sensor includes a pressure sensing element having a diaphragm, and a cavity formed as part of the pressure sensing element, where the cavity receives a fluid such that the diaphragm at least partially deflects. The pressure sensing element also includes a plurality of piezoresistors, which are operable to generate a signal based on the amount of deflection in the diaphragm. At least one trench is integrally formed as part of the pressure sensing element, and an adhesive connects the pressure sensing element to the at least one substrate such that at least a portion of the adhesive is attached to the trench and redistributes thermally induced stresses on the pressure sensing element such that the thermally induced noise is substantially eliminated.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: November 11, 2014
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
  • Publication number: 20140318656
    Abstract: A pressure sensor system may sense the pressure of a gas or liquid. The system may include a housing that has an entry port for the gas or liquid; a pressure sensor within the housing; and a baffle positioned between the entry port and the pressure sensor. The baffle may have one or more inlets oriented to receive gas or liquid that enters the entry port; one or more outlets oriented to deliver the received gas or liquid to the pressure sensor; and one or more sealed flow channels that prevent the gas or liquid from escaping from the baffle, other than through the one or more outlets. At least one of the outlets may be located within no more than one millimeter of a location on the pressure sensor. The pressure sensor and baffle may be made at the same time during a process of depositing, pattering, etching, wafer bonding, and/or wafer thinning a series of layers using microelectromechanical systems (MEMS) technology.
    Type: Application
    Filed: December 9, 2013
    Publication date: October 30, 2014
    Applicant: MKS Instruments, Inc.
    Inventors: Lei Gu, Stephen F. Bart
  • Publication number: 20140318259
    Abstract: A method of manufacturing an overheat or fire alarm detection system, comprises the steps of micromachining a pressure sensor and securing a sensor tube in fluid communication with the pressure sensor. The sensor tube may comprise a hollow tube containing a material that evolves gas upon heating. The micromachining step may comprise doping at least a portion of a first layer, forming a cavity at least partially within the doped portion and forming a deformable diaphragm over the cavity.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 30, 2014
    Applicant: KIDDE TECHNOLOGIES, INC.
    Inventors: Paul Rennie, Paul D. Smith
  • Patent number: 8863579
    Abstract: A resonant sensor is disclosed which may be arranged to measure the pressure of a fluid. The resonant sensor comprises a diaphragm which may be exposed to a fluid; two supports provided on the diaphragm and a resonator having at least two beams with each beam being suspended between the two supports. The ends of each beam are attached to a corresponding support at more than one point. By attaching each end of the beams to a support at more than one point, the moments and reaction forces to which the support is subjected may be balanced so that distortion of the support and diaphragm due to vibration of the resonator beams is reduced. Consequently, the resonant sensor is able to provide more precise measurements.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: October 21, 2014
    Assignee: GE Infrastructure Sensing, Inc.
    Inventor: Peter Ken Kinnell
  • Publication number: 20140298913
    Abstract: A sensor assembly includes a first wafer having a cavity formed therein and a second wafer bonded relative to the first wafer to form a diaphragm over the cavity. A trench is formed in the second wafer in or around the diaphragm and the trench may be filled with an isolating material to help thermally and/or electrically isolate the diaphragm. The diaphragm may support one or more sense elements. The sensor assembly may be used a flow sensor, a pressure sensor, a temperature sensor, and/or any other suitable sensor, as desired.
    Type: Application
    Filed: April 9, 2013
    Publication date: October 9, 2014
    Applicant: Honeywell International Inc.
    Inventors: Carl Stewart, Scott E. Beck, Richard A. Davis, Gilberto Morales
  • Patent number: 8850895
    Abstract: The disclosed invention describes an unpowered apparatus which can wirelessly sense pressure based on microfluidics for point-of-care glaucoma diagnosis. Moreover, the disclosed invention teaches methods to construct the invention using microfabrication processing. Finally, a detailed and illustrative schematic of the wireless readout system is disclosed.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: October 7, 2014
    Inventor: John Yan
  • Patent number: 8850896
    Abstract: A physical quantity detector includes a diaphragm including a displacement part that is displaced under external pressure, a ring-shaped fixing part that holds an outer circumferential part of the diaphragm, a holding member having a projection part that projects from an inner circumference of the fixing part toward a center at one surface side of the diaphragm, a support fixed to the projection part, and a pressure-sensitive device having a first base part fixed to the displacement part, a second base part fixed to the support, and a pressure-sensitive part provided between the base parts.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: October 7, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Kenta Sato, Naoki Kitahara
  • Patent number: 8843327
    Abstract: A method and apparatus are disclosed for determining status of a canister of a topical negative pressure (TNP) system. The method includes the steps of monitoring pressure provided by a pump element of the TNP system, determining at least one characteristic associated with the monitored pressure and determining status of at least one parameter associated with a canister of the TNP system responsive to the determined characteristics.
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: September 23, 2014
    Assignee: Smith & Nephew PLC
    Inventors: Edward Vernon-Harcourt, Jake Turner, Benjamin Gordon
  • Patent number: 8820170
    Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a MEMS die for pressure measurement. The MEMS die is attached to a glass pedestal member. The pedestal member is mechanically held in place via a mounting frame that attachable to a pressure port of a fluid-containing enclosure. Techniques herein provide a strong connection of a MEMS die to a pressure sensor while decoupling thermal expansion stress from the MEMS die. With such decoupling techniques, pressure sensing reliability and accuracy can be improved. With thermal expansion stress decoupled from the MEMS die, sensor sealing materials can be selected for their robust chemical properties instead of structural properties. Such techniques provide an accurate, durable, and cost-effective pressure sensor.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 2, 2014
    Assignee: Sensata Technologies, Inc.
    Inventors: Rob Slakhorst, Gerard Klaasse, Erik Hop, Arnout van den Bos, Wico Hopman
  • Patent number: 8817483
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a connector assembly for a sensor assembly may include an electrical connector, a printed circuit board and a conductive outer housing. The electrical connector may include a mechanical connector and electrical terminals exposed at a first end and at a second end of the mechanical connector. The electrical connector, printed circuit board and conductive outer housing may all be electrically connected to one another. In some instances, a plurality of electrical connectors having different mechanically shaped second ends and similarly shaped first ends may be provided, from which one electrical connector may be chosen for use in the connector assembly.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: August 26, 2014
    Assignee: Honeywell International Inc.
    Inventors: Todd Eckhardt, Paul Rozgo, Ian Bentley, Jim Machir, Ryan Jones
  • Publication number: 20140230559
    Abstract: A structure comprising: a base; a diaphragm; a peripheral wall member of which one end surface is attached to a circumferential edge part of the diaphragm and the other end surface is attached on the top surface of the base to form an internal space together with the base and the diaphragm; a protruding part that protrudes from the top surface of the base; and a communicatively connecting path that extends from a bottom surface side of the base toward the diaphragm, and communicatively connects the internal space and the outside to each other to flow fluid, wherein on an outer lateral surface of the protruding part, an opening is formed in a part intersecting with an inner lateral surface of the communicatively connecting path, and a part of a fore end inner surface of the communicatively connecting path is formed in the protruding part.
    Type: Application
    Filed: February 18, 2014
    Publication date: August 21, 2014
    Applicant: HORIBA STEC, Co., Ltd.
    Inventors: Hidetaka Yada, Sotaro Kishida, Takehisa Hataita
  • Patent number: 8800376
    Abstract: There is disclosed a high pressure sensing header which is relatively insensitive to mounting torque. The header generally includes an outer torque isolating shell which has a “C” shaped cross section with the cylindrical shell surrounding an inner “H” section header. The inner “H” section header has a thick diaphragm and is at least partially surrounded by the torque isolating shell. In this manner, when the header is installed, the installation force is absorbed by the outer shell and there is relatively no installation force or torque exhibited by the inner “H” section which will respond only to stress due to pressure.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: August 12, 2014
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Adam Kane, Boaz Kochman, Nora Kurtz
  • Patent number: 8794075
    Abstract: Various embodiments relate to a MEMS pressure sensor including: a lower electrode; a first insulating layer over the lower electrode; a second insulating layer over the first insulating layer that forms a cavity between the first and second insulating layers; an upper electrode over the second insulating layer, wherein a portion of the cavity is between the upper and lower electrodes; and a NONON pressure membrane over the upper electrode.
    Type: Grant
    Filed: August 11, 2011
    Date of Patent: August 5, 2014
    Assignee: NXP, B.V.
    Inventor: Willem Frederik Adrianus Besling
  • Publication number: 20140196538
    Abstract: A liquid level meter includes: an exterior portion having an internal space which a liquid to be measured flows in; and a pressure sensitive portion provided inside the exterior portion and having a pressure sensitive surface; wherein the exterior has holes that it is arranged on each of a vertically lower side and a vertically upper side relative to the pressure sensitive surface, and the holes connect an inside and outside of the internal space.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 17, 2014
    Applicant: Seiko Epson Corporation
    Inventors: Kenta Sato, Kentaro Yoda, Hisao Motoyama
  • Patent number: 8773373
    Abstract: Provided herein are a display apparatus with a touch panel to which a piezoelectric actuator may readily be mounted, and a piezoelectric actuator used in such a display apparatus with a touch panel. A support structure for supporting a piezoelectric actuator 3 on a front surface of a circuit substrate 5 is constituted from a pair of electrically conductive support members 13A, 13B which are each formed of an electrically conductive foam. The piezoelectric actuator 3 may be mounted by locating the piezoelectric actuator 3 with the pair of electrically conductive support members 13A, 13B attached thereto in a predetermined position on the circuit substrate 5, and connecting the pair of electrically conductive support members 13A, 13B to the pair of output electrodes 5A, 5B of the circuit substrate 5.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: July 8, 2014
    Assignee: Hokuriku Electric Industry Co., Ltd.
    Inventors: Tatsuo Sato, Tadao Sunahara, Yasuyoshi Nabeyama
  • Patent number: 8770034
    Abstract: The present disclose relates to sensor including multiple sensor elements. In some cases, the multiple sensor elements may be mounted on a single substrate and each may be configured to sense a single parameter with different resolutions, sensitivities, and/or ranges, and/or the multiple parameters. In one example, multiple pressure sensing die may be mounted in a single package, and each may be configured as a differential pressure sensor, an absolute pressure sensor, and/or a gauge pressure sensor, as desired.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: July 8, 2014
    Assignee: Honeywell International Inc.
    Inventors: Ian Bentley, Lamar Floyd Ricks
  • Publication number: 20140174188
    Abstract: A device for measuring pressure having at least one pressure sensor with at least one active sensor surface, an oscillating and/or variable temperature counter-surface arranged opposite the at least one sensor surface, wherein the sensor surface and the counter-surface are arranged in a hollow body, and the hollow body has at least one opening, and wherein at least one alternating signal amplifier is provided.
    Type: Application
    Filed: November 21, 2013
    Publication date: June 26, 2014
    Applicant: Pfeiffer Vacuum GmbH
    Inventor: Armin Conrad
  • Publication number: 20140165735
    Abstract: Exemplary embodiments of the present invention provide a differential pressure transducer that comprises first and second diaphragms of different configurations, i.e., different diameters and/or thicknesses. The pressure transducer provides more versatility over prior art designs as the diaphragms can be of different configurations yet still maintain substantially similar back pressures. Therefore, the errors commonly associated with back pressures are eliminated because the back pressures from the diaphragms ultimately cancel out in the sensor's differential pressure measurement.
    Type: Application
    Filed: December 19, 2012
    Publication date: June 19, 2014
    Applicant: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventors: Anthony D. Kurtz, Lou DeRosa, Robert Gardner
  • Patent number: 8752433
    Abstract: A process variable transmitter for measuring a pressure of a process fluid includes a first inlet configured to couple to a first process pressure and a second inlet configured to couple to a second process pressure. A differential pressure sensor couples to the first and second inlets and provides an output related to a differential pressure between the first pressure and the second pressure. A first pressure sensor couples to the first inlet and provides an output related to the first pressure. Transmitter circuitry provides a transmitter output based upon the output from the differential pressure sensor and further provides enhanced functionality based upon the output from the first pressure sensor.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: June 17, 2014
    Assignee: Rosemount Inc.
    Inventor: Robert C. Hedtke
  • Patent number: 8752435
    Abstract: There is described a miniature fiber optic pressure sensor design where sensitivity around specific biased pressure is optimized. In an embodiment, the pressure sensor is a Fabry-Perot (FP) sensor which comprises a substrate; and a diaphragm mounted on the substrate. The diaphragm has a center and comprises: a first layer comprising a first material; and a second layer comprising a second material. The second layer forms a dot or a ring. The dot or ring is mounted on the first layer and is centered about the center of the diaphragm. The second material comprises internal pre-stresses to cause the center of the diaphragm (in the case of a dot) or the peripheral area about the center of the diaphragm (in the case of a ring) to camber away from the substrate upon relaxing the internal pre-stresses.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: June 17, 2014
    Inventors: Claude Belleville, Sebastien Lalancette, Nicolas Lessard
  • Publication number: 20140157905
    Abstract: A pressure sensor chip includes a sensor diaphragm, and first and second retaining members. The first and second retaining members face and are bonded to peripheral edge portions of a first face and another face of the sensor diaphragm, and have pressure guiding holes that guide measurement pressures to the sensor diaphragm. The first retaining member has, in an interior thereof, a non-bonded region that is continuous with a peripheral portion of the pressure guiding hole. The non-bonded region in the interior of the first retaining member is provided at a portion of a plane that is parallel to a pressure bearing surface of the sensor diaphragm. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.
    Type: Application
    Filed: November 20, 2013
    Publication date: June 12, 2014
    Applicant: AZBIL CORPORATION
    Inventors: Tomohisa TOKUDA, Yuuki SETO
  • Patent number: 8733176
    Abstract: A stress concentrating apparatus and a method for a MicroElectroMechanical System (MEMS) sensors is provided. The apparatus includes a plate having an inner region and outer region, the inner region being separated from the outer region by slits defined in the plate. A stress concentrator bridge connects the inner region to the outer region, and to mechanically amplify stress applied on the inner region of the plate. At least one stress sensor is operatively connected to the stress concentrator bridge, whereby the at least one stress sensor converts the mechanically amplified stress applied on the inner region into an electrical signal.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: May 27, 2014
    Assignee: Kontel Data System Limited
    Inventor: Ping Wai Li
  • Publication number: 20140137652
    Abstract: A pressure sensor chip includes a sensor diaphragm and first and second retaining members. In a peripheral edge portion of the first retaining member, of a region facing one face of the sensor diaphragm, a region on an outer peripheral side is a bonded region bonded to the one face of the sensor diaphragm, and a region on an inner peripheral side is a non-bonded region not bonded to the one face of the sensor diaphragm. In the peripheral edge portion of the first retaining member, a ring-shaped groove is formed protruding in a direction of a wall thickness of the first retaining member, continuous with the non-bonded region of the peripheral edge portion. The second retaining member is provided with a recessed portion that prevents excessive dislocation of the sensor diaphragm when an excessively large pressure is applied to the sensor diaphragm.
    Type: Application
    Filed: November 20, 2013
    Publication date: May 22, 2014
    Applicant: AZBIL CORPORATION
    Inventors: Tomohisa TOKUDA, Yoshiyuki ISHIKURA, Yuuki SETO
  • Publication number: 20140123765
    Abstract: This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.
    Type: Application
    Filed: January 9, 2014
    Publication date: May 8, 2014
    Applicant: Kulite Semiconductor Products, Inc.
    Inventors: Alexander A. Ned, Joseph R. VanDeWeert, Leo Geras
  • Patent number: 8714020
    Abstract: A pressure measurement member includes an insulation bottom layer, a flexible insulation top layer and at least one spacer. The insulation bottom layer has a bottom conductive element on the surface thereof. The flexible insulation top layer has a top conductive element on the surface thereof adjacent to the insulation bottom layer and opposite to the bottom conductive element. The spacer is located between the insulation bottom layer and flexible insulation top layer to separate the insulation bottom layer and flexible insulation top layer. As different pressures could result in different impedance variations on the contact area between the top conductive element and bottom conductive element, the pressure being applied can be derived from the impedance variation. The invention can measure pressure without using piezoresistive material to reduce cost.
    Type: Grant
    Filed: March 5, 2012
    Date of Patent: May 6, 2014
    Assignee: China Medical University
    Inventors: Jin-Chern Chiou, Shih-Che Lo, Yung-Jiun Lin, Hsin-Hsueh Tsai
  • Patent number: 8701496
    Abstract: Systems and methods for a pressure sensor are provided, where the pressure sensor comprises a housing having a high side input port that allows a high pressure media to enter a high side of the housing and a low side input port that allows a low pressure media to enter a low side of the housing when the housing is placed in an environment containing the high and low pressure media; a substrate mounted within the housing; a stress isolation member mounted to the substrate; a die stack having sensing circuitry bonded to the stress isolation member; a low side atomic layer deposition (ALD) applied to surfaces, of the substrate, the stress isolation member, and the die stack, exposed to the low side input port; and a high side ALD applied to surfaces, of the stress isolation member and the die stack, exposed to the high side input port.
    Type: Grant
    Filed: February 27, 2013
    Date of Patent: April 22, 2014
    Assignee: Honeywell International Inc.
    Inventor: Gregory C. Brown
  • Patent number: 8704538
    Abstract: A sensor assembly includes a housing assembly, an electrode arrangement and a diaphragm having a fixed portion secured to the housing assembly and an active portion movable relative to the electrode arrangement in response to a differential pressure applied to opposite sides of the diaphragm. The fixed portion of the diaphragm is secured at one or more locations relative to at least a portion of the housing assembly; and at least one groove is formed in the fixed portion of the diaphragm between the locations at which the diaphragm is fixed relative to the housing assembly and the active portion so as to relieve any stress on the active portion of the diaphragm. A method of making the sensor assembly is also disclosed.
    Type: Grant
    Filed: July 1, 2010
    Date of Patent: April 22, 2014
    Assignee: MKS Instruments, Inc.
    Inventor: Chrisy Grudzien
  • Publication number: 20140102206
    Abstract: A pressure measurement device adapted to measure a pressure of a liquid includes a flow channel having a flow channel resistance, a liquid containing chamber having a predetermined capacity and communicating with the flow channel, a pressure changing section adapted to change a pressure of the liquid containing chamber, a measurement section adapted to measure a period from when a pressure wave of the liquid in the liquid containing chamber becomes a predetermined value to next time the pressure wave becomes the predetermined value, the pressure wave occurring when the pressure changing section is in operation in a state in which the liquid is contained in the flow channel and the liquid containing chamber, and an acquisition section adapted to obtain the pressure based on the period measured by the measurement section.
    Type: Application
    Filed: October 15, 2013
    Publication date: April 17, 2014
    Applicant: Seiko Epson Corporation
    Inventor: Atsushi OSHIMA
  • Publication number: 20140102207
    Abstract: This disclosure provides example methods, devices and systems associated with a torque-insensitive header assembly. In one embodiment, a method comprises receiving, by a sensor, from an aperture defined by a shell, an environmental condition, wherein the sensor is coupled to a header and the header is coupled to the shell such that the sensor is isolated from a torque stress applied to the shell; measuring, by the sensor, the environmental condition to determine an environmental condition signal; and outputting, from the sensor, the environmental condition signal.
    Type: Application
    Filed: December 18, 2013
    Publication date: April 17, 2014
    Applicant: Kulite Semiconductor Products, Inc.
    Inventor: Nora Kurtz
  • Patent number: 8695431
    Abstract: Sensors used in mapping strata beneath a marine body are described, such as in a towed array. A first acoustic sensor uses a piezoelectric sensor mounted with a thin film separation layer of flexible microspheres on a rigid substrate. Additional non-acoustic sensors are optionally mounted on the rigid substrate for generation of output used to reduce noise observed by the acoustic sensors. A second sensor is a motion sensor including a conductive liquid in a chamber between a rigid tube and a piezoelectric motion film circumferentially wrapped about the tube. Combinations of acoustic, non-acoustic, and motion sensors co-located in rigid streamer housing sections are provided, which reduce noise associated with different sensor locations.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: April 15, 2014
    Assignee: Solid Seismic, LLC
    Inventor: Richard E. Pearce
  • Patent number: 8696322
    Abstract: An automatic deactivation mechanism is configured for an air bladder pump having a casing and a motor located therein to pump air into an air bladder from the atmosphere and through an air valve connected through the casing. The automatic deactivation mechanism includes a housing positioned within the casing and has defined therethrough a first aperture in fluid communication with the atmosphere through the casing and a second aperture in fluid communication with the air bladder through the casing. Included within the housing are at least two switches and a diaphragm positioned between the switches. The housing is sealed so that when a threshold pressure is reached therein, at least one switch is triggered by deflection of the diaphragm to automatically deactivate the pump by de-energizing the motor.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: April 15, 2014
    Assignee: The Coleman Company, Inc.
    Inventors: Michael F. Kehrmann, Vincent Wen, Chun Chung Tsai, Timothy F. Austen, Corey Lewison
  • Publication number: 20140076057
    Abstract: Techniques disclosed herein include systems and methods for pressure measurement of fluids including vehicular fluids. The pressure sensor includes a MEMS die for pressure measurement. The MEMS die is attached to a glass pedestal member. The pedestal member is mechanically held in place via a mounting frame that attachable to a pressure port of a fluid-containing enclosure. Techniques herein provide a strong connection of a MEMS die to a pressure sensor while decoupling thermal expansion stress from the MEMS die. With such decoupling techniques, pressure sensing reliability and accuracy can be improved. With thermal expansion stress decoupled from the MEMS die, sensor sealing materials can be selected for their robust chemical properties instead of structural properties. Such techniques provide an accurate, durable, and cost-effective pressure sensor.
    Type: Application
    Filed: September 14, 2012
    Publication date: March 20, 2014
    Applicant: SENSATA TECHNOLOGIES, INC.
    Inventors: Rob Slakhorst, Gerard Klaasse, Erik Hop, Arnout van den Bos, Wico Hopman
  • Patent number: 8671765
    Abstract: A pressure sensor comprising: a sensor chip; a differential pressure diaphragm provided in the center portion of the sensor chip; a differential pressure gauge provided in the differential pressure diaphragm; a static pressure diaphragm provided at the outer peripheral portion of the differential pressure diaphragm; a first static pressure gauge formed at an edge portion of the static pressure diaphragm; and a second static pressure gauge formed at a center portion of the static pressure diaphragm.
    Type: Grant
    Filed: April 13, 2011
    Date of Patent: March 18, 2014
    Assignee: Azbil Corporation
    Inventors: Tomohisa Tokuda, Hirofumi Tojo, Nozomi Kida
  • Patent number: 8671764
    Abstract: A semiconductor filter is provided to operate in conjunction with a differential pressure transducer. In one embodiment, a method comprises receiving, at a filter, a pressure, wherein the pressure includes a static pressure component and a dynamic pressure component; filtering, by the filter, at least the dynamic pressure component of the pressure; outputting, from the filter, a filtered pressure; receiving, at a first surface of a diaphragm, the pressure; receiving, at a second surface of the diaphragm, the filtered pressure, wherein the second surface of the diaphragm is operatively coupled to the filter; and measuring, at a sensor operatively coupled to the diaphragm, a difference between the pressure and the filtered pressure.
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: March 18, 2014
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Boaz Kochman, Tonghuo Shang