Abstract: A pressure sensor includes: a container; a pressure receiving member which forms apart of the container; a pressure sensitive element which has a pressure sensing portion and a pair of base portions connected to both ends of the pressure sensing portion, and which has a detection axis parallel to a line connecting the base portions, and in which the detection axis is parallel to a displacement direction of the pressure receiving member, and which detects pressure based on displacement of the pressure receiving member; and a gate-shaped frame which includes a pair of shock absorbing portions that interposes the pressure sensitive element and is connected to a side of the pressure receiving member close to the peripheral portion or a side of the container close to the pressure receiving member and a beam portion that connects distal ends of the shock absorbing portions.

Abstract: An enclosed, flat covered leadless pressure sensor assembly suitable for extreme environment operation including dynamic, ultra-high temperature heating, light and heat flash, and high-speed, flow-related environments. The pressure sensor assembly comprises a substrate comprising a micromachined sensing diaphragm defined on a first side. A cover is attached to the first side of the substrate such that it covers at least the sensing diaphragm. The top surface of the cover is substantially flat, thereby promoting uniformity in the distribution of stress and thermal effects across a top surface of the cover.

Abstract: The present invention relates to a pressure sensor comprising multiple flexible diaphragms to which are affixed, within which are embedded, or which themselves constitute part of transducer elements that are connected together electrically, providing greater sensitivity and allowing the diaphragms to be made smaller, thereby increasing burst pressure to operating pressure ratio. This multi-diaphragm pressure sensor can therefore be used to accurately measure small changes in dynamic pressure in a fluid of overall high static pressure, for example, in a flow inventory control system as may be used in a fire suppression system, or for control of nuclear reactor systems.

Abstract: The invention relates to a multi-component part transducer assembly for determining the pressure of a fluid of interest. One part of the assembly comprises a reusable transducer, another part a disposable component comprising a flexible membrane which is in pressure connection with the fluid of interest, and another part comprises a locking component for securing the reusable and disposable parts together.

Abstract: A disclosed pressure-responsive sensor includes a flexible element contained within an enclosure and a membrane configured to exert an electrostatic force on the flexible element to cause the flexible element to respond to pressure variations on the membrane. A disclosed pressure-sensing method includes electrostatically coupling a membrane to a flexible element contained within an enclosure to transfer a pressure response of the membrane to the flexible element. Motion of the flexible element is converted into a pressure signal.

Abstract: A pressure sensor device and its use for confirming achievement of a selected pressure in a high pressure process (HPP) for sanitizing food is disclosed. The device includes at least a base and a sheet, each of which is substantially impermeable to the working fluid of the HPP and is deformable at the selected pressure. Microcapsules interposed between flat overlapping portions of the base and sheet contain a color former and burst upon pressurization of the environment surrounding the device. Release of the color former is detected to confirm that the pressurization occurred. The device can be associated with one or more foodstuffs (e.g., a packaged food product or a group of such packages) and remain associated therewith to continuously indicate that the foodstuff(s) have been subjected to the selected pressure and are therefore sanitized.

Abstract: The invention relates to a pressure sensor (6). This pressure sensor (6) comprises a flexible membrane (11) cooperating with a transmission device (10) that enables a value representing the pressure to be supplied on the basis of the deformation of the membrane (11). The membrane (11) is made from an at least partially amorphous material in order to optimise the dimensions of the sensor (6).

Abstract: There is disclosed a high pressure sensing header which is relatively insensitive to mounting torque. The header comprises an outer torque isolating shell which surrounds an inner “H” section header. The inner “H” section header has a thick diaphragm and is surrounded by the torque isolating shell which is secured to the “H” section header at a peripheral flange of the “H” section header. In this manner when the header is installed, the installation force is absorbed by the outer shell and there is no installation force or torque exhibited by the inner “H” section which will respond only to stress due to pressure. The torque isolating shell also contains a top surface which has a counterbore that accommodates a crush ring. When the unit is installed, the crush ring is crushed against an installation wall to enable the inner header to receive pressure without experiencing significant installation force.

Abstract: A dual diaphragm pressure transducer, or sensor, with compensation for non-pressure effects is disclosed. The pressure sensor can include two pressure transducers located on separate portions of a chip. The first pressure transducer can be a differential pressure transducer, which produces a signal proportional to one or more applied pressures and includes other non-pressure effects. The second pressure transducer can be sealed in a hermetic chamber and thus can produce a signal proportional only to non-pressure effects. The signals can be combined to produce a signal proportional to the applied pressures with no non-pressure effects. The first and second pressure transducers can be physically and/or electrically isolated to improve sealing between the two pressure transducers and prevent pressure leaks therebetween.

Abstract: A novel flexible transducer structure is suitable for attaching to curved surface such as the leading edge of an aircraft wing. The structure comprises a thin flexible sheet of an insulating material with a leadless transducer secured to the sheet. The sheet is then placed over the curved surface and assumes the curvature of the surface. The transducer secured to the sheet provides an output of pressure according the pressure exerted on the sheet. The sheet basically is fabricated from a thin material such as Kapton and is flexible so as to assume the curvature of the surface with the transducer being exposed to pressure applied to the curved surface. The sensor in conjunction with the flexible sheet allows pressure to be measured without disturbing the air flow patterns of the measuring surfaces and because of its construction, is moisture resistant over a large variety of atmospheric conditions.

Abstract: A method for manufacturing a Micro-Electro-Mechanical System pressure sensor, including forming a gauge wafer including a diaphragm and a pedestal region. The method includes forming an electrical insulation layer disposed on a second surface of the diaphragm region and forming a plurality of sensing elements patterned on the electrical insulation layer disposed on the second surface in the diaphragm region, forming a cap wafer with a central recess in an inner surface and a plurality of through-wafer embedded vias made of an electrically conductive material in the cap wafer, creating a sealed cavity by coupling the inner recessed surface of the cap wafer to the gauge wafer, such that electrical connections from the sensing elements come out to an outer surface of the cap wafer through the vias, and attaching a spacer wafer with a central aperture to the pedestal region with the central aperture aligned to the diaphragm region.

Abstract: A flange for a corrosion resistant and nevertheless low cost flange for pressure measurement cells, or pressure transfer means, is composed essentially of a metal foundation of a standard material and is protected on the side facing a process medium by a there applied layer of a highly alloyed, special material.

Abstract: The present invention relates, in general, to pressure sensors capable of operating at high temperatures. The present invention further relates to a high temperature pressure sensor with an improved gage factor. The present invention still further provides a pressure sensor with a smaller sized diaphragm, which is capable of reading higher pressures. The present invention also provides a method and sensor for detecting strain using shape memory alloys.

Abstract: A process variable transmitter for measuring a pressure of a process fluid includes a sensor module, a pressure inlet formed in the sensor module, an isolation diaphragm positioned in the pressure inlet, a pressure sensor and an isolation tube containing a fill fluid to convey a process fluid related pressure from the isolation diaphragm to the pressure sensor. A hydrogen getter material is positioned in contact with the fill fluid between the isolation diaphragm and the pressure sensor to remove hydrogen from the fill fluid.

Abstract: An absolute capacitive micro pressure sensor including a pressure sensor element with a mechanically fixed electrode and a deflectable pressure sensor membrane separated from the fixed electrode by a predetermined distance. A packaging defining a chamber is formed by a cover assembled to a base plate with an opening defined therein. The chamber is filed with a fluid and/or a gas at substantially constant pressure. Within, the chamber, the pressure sensor element is mounted to the base plate to define an open cavity therebetween substantially aligned with the opening defined in the base plate. A gel is disposed in the open cavity in contact with an exposed surface of the deflectable membrane.

Abstract: A quartz resonator flow cell has a piezoelectric quartz wafer with an electrode, pads, and interconnects disposed on a first side thereof. The piezoelectric quartz wafer has a second electrode disposed on a second side thereof, the second electrode opposing the first electrode. A substrate is provided having fluid ports therein and the piezoelectric quartz wafer is mounted to the substrate such that the second side thereof faces the substrate with a cavity being formed between the substrate and the wafer. The fluid ports in the substrate are aligned with the electrode on the second side of the piezoelectric quartz wafer which is in contact with the cavity.

Abstract: An object of the present invention is to enhance the reliability of an MEMS sensor formed on a semiconductor integrated circuit device. To achieve this object, a semiconductor device of the present invention comprises: a semiconductor integrated circuit device; a lower passivation film of silicon nitride, etc. . . . formed on the semiconductor integrated circuit device and having high moisture resistance and high chemical resistance; a MEMS portion formed on the lower passivation film and including a cavity 12; and an upper passivation film 11 formed on the top surface of the MEMS portion such that the MEMS portion is hermetically sealed by the upper and lower passivation films.

Abstract: A tubular medical fluid flow set comprises a pressure sensing chamber connected in flow-through relation to fluid flow tubing of the set. The pressure sensing chamber defines a movable, flexible, impermeable diaphragm dividing the chamber into two separate compartments. The fluid flow tubing communicates with one of the compartments and is isolated from the other of the compartments. A port is carried on the chamber, the port having a seal therein, and communicating with the other of the compartments. Thus, the other of the compartments is hermetically sealed until the port is opened for connection with a pressure measuring device, to keep the flexible diaphragm in a desired, initial position prior to opening of the seal.

Abstract: A pressure sensor venting system for efficiently and accurately measuring a liquid level. The pressure sensor venting system generally includes a housing, a pressure transducer within the housing, a diaphragm, a pressure passage fluidly connecting the pressure transducer and a pressurized liquid from the diaphragm, and a first vent tube that is fluidly connected to the pressure transducer opposite of the pressure passage. The distal end of the first vent tube extends outwardly from the housing and extends a distance into a second vent tube. The second vent tube is fluidly connected to liquid resistant vent that is positioned within the interior space of the liquid container and above the liquid level.

Abstract: There is provided a semiconductor pressure sensor which improves the sensor sensitivity and is excellent in the withstand pressure characteristic and the temperature characteristic. In the semiconductor pressure sensor in which a diaphragm is formed by a cavity provided on one of top and bottom surfaces of a silicon substrate and a plurality of piezoresistors is disposed in the diaphragm edge, a recess which has a larger area than the planar shape of the diaphragm and whose entire edge is located outward from the diaphragm edge in plan view is provided in a protective film which covers the entire surface of the silicon substrate on the diaphragm side. The protective film located on the diaphragm is preferably formed of SiO2.

Abstract: A MEMS pressure sensor may be manufactured to include a backing substrate having a diaphragm backing portion and a pedestal portion. A diaphragm substrate may be manufactured to include a pedestal portion and a diaphragm that is mounted to the diaphragm backing portion of the backing substrate to form a stress isolated MEMS die. The pedestal portions of the backing and diaphragm substrates form a pedestal of the stress isolated MEMS die. The pedestal is configured for isolating the diaphragm from stresses including packaging and mounting stress imparted on the stress isolated MEMS die.

Abstract: A single pressure sensing capsule has a reference pressure ported to the rear side of a silicon sensing die. The front side of the silicon sensing die receives a main pressure at another port. The difference between the main and reference pressure results in the sensor providing an differential pressure output. The reference pressure or main pressure may be derived from a pump pressure which is being monitored. The pump pressure output is subjected to a pump ripple or a sinusoidally varying pressure. In order to compensate for pump ripple, a coiled tube or an adjustable dampening chamber comprising a spiral inlet tube and a volume cavity can be used. The tube length is selected to suppress the pump ripple as applied to the sensor die. In this manner, the pump ripple cannot cause resonance which would result in pressure amplification and which pressure amplification would destroy the sensor.

Abstract: A semiconductor pressure sensor includes a cavity disposed in one silicon substrate of a SOI substrate having two silicon substrates bonded to each other with an oxide film therebetween and a diaphragm formed from the other silicon substrate and the oxide film, wherein the oxide film, bordering the cavity, of the diaphragm includes an arc-shaped section at the boundary portion to the one silicon substrate defining the inner wall side surface of the cavity, the arc-shaped section having the same width as the width of the cavity at a desired section in the one silicon substrate and reducing the width of the cavity from the boundary portion toward the diaphragm center.

Abstract: A fuel system component may include a body arranged for use in storing or moving fuel within the fuel system, and an indicator associated with the body to provide an indication when the body is subjected to a condition outside of a threshold. The indicator may be responsive to one or more environmental or system conditions outside of a threshold. For example without limitation, the indicator may be responsive to one or more of temperature, pressure, corrosion and electrical conditions to provide an indication when at least one condition exceeds a threshold for that condition.

Abstract: A capacitive pressure sensor array is made of two conductive layers, wherein each conductive layer is formed with a plurality of elongated conductors disposed in a substantially parallel manner between an upper and a lower insulating sheet, wherein the upper and lower insulating sheets are bonded to each other between adjacent conductors.

Abstract: An elastic material for pressure measurement, containing an elastic resin composition having at least either a urethane bond or a urea bond and being obtained by reacting an isocyanate with (A) a linear polyol and then curing the obtained prepolymer with use of a curing agent having two —NH2 groups in one molecule.

Abstract: A gage having a motion detection mechanism magnetically attached to a pressure sensing diaphragm. The motion detection mechanism is magnetically coupled to a pointer rotation mechanism configured to indicate the position of the diaphragm and the corresponding pressure sensed by the diaphragm.

Abstract: A pressure sensor in contact with an aggressive fluid for a pressure measurement has a board with a pressure passage. The pressure passage is closed on one side by a sensor chip as a pressure sensing element. The board also mounts an integrated circuit and electrical contacts for electrical contacting of the pressure sensor. At least the on board arranged pressure sensing element as well as the integrated circuit are tightly enclosed by a capper made of a fluid resistant material in connection with the board, and are arranged in an encasing cavity formed by the capper and the board for fluid resistant protection.

Abstract: An electronic circuit (10) for controlling a capacitive pressure sensor (1), which capacitive pressure sensor (1) comprises a plate electrode capacitor (C) with a capacity that varies in dependence on pressure changes exerted on a deflectable diaphragm (2) forming one plate electrode of the capacitor (C), wherein the electronic circuit (10) comprises a DC voltage source (12) being adapted to generate a DC bias-voltage (UDC) to be applied across the electrodes of the capacitor (C), an AC voltage source (13) being adapted to generate an AC voltage signal (UAC) to be applied across the electrodes of the capacitor (C) and a controller (18) being adapted to receive an output signal (OUT) of the capacitor (C) and to control the DC voltage source (12) such that the DC bias-voltage (UDC) applied to the capacitor (C) adopts a value that maintains the capacity of the capacitor (C) at a desired value.

Abstract: Provided is a method of manufacturing an electromechanical transducer having a reduced variation in a breakdown strength caused by a variation in flatness of an insulating layer. In the method of manufacturing the electromechanical transducer, a first insulating layer is formed on a first substrate, a barrier wall is formed by removing a part of the first insulating layer, and a second insulating layer is formed on a region of the first substrate after the part of the first insulating layer has been removed. Next, a gap is formed by bonding a second substrate on the barrier wall, and a vibration film that is opposed to the second insulating layer via the gap is formed from the second substrate. In the forming of the barrier wall, a height on a gap side in a direction vertical to the first substrate becomes lower than a height of a center portion.

Abstract: A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.

Abstract: A pressure transducer includes a substrate, a piezoresistive element, a first conductive element, a first terminal, and a test structure. The substrate has a surface and a cavity. A diaphragm layer is formed over the cavity and over the surface of the substrate. The piezoresistive element is formed in the diaphragm layer. The first conductive element is formed in the diaphragm layer, and has a first conductivity type. The first conductive element is coupled to the piezoresistive element. The first terminal is formed over a surface of the diaphragm layer and coupled to the first conductive element. The test structure has the first conductivity type and is formed in the diaphragm layer. The test structure has an edge spaced apart from an edge of the first conductive element by a predetermined distance. A surface charge accumulation on the diaphragm layer is detected using the test structure.

Abstract: The present invention relates to a pressure detector. In a body that constitutes part of the pressure detector, a through hole is formed, which is directed upwardly from a substantially central portion of a flow passage through which a pressure fluid flows. The through hole communicates with a sensor chamber in which a pressure sensor is disposed, and a rod-shaped member is disposed displaceably in the through hole. In addition, an end of the rod-shaped member, which is exposed to the flow passage, is pressed by the pressure fluid and displaced upwardly thereby, and pressure is detected as a result of the pressure sensor being pressed by a head of the rod-shaped member.

Abstract: A pressure sensor device comprises a casing (2a, 3 a) defining a chamber (20) and an inlet passage (14a, 14b) of the chamber. Accommodated in the chamber (20) is a pressure sensor (17) having a sensor body with a cavity and a membrane capable of deformation under pressure action of a fluid present in the inlet passage (14a, 14b). The device further comprises a circuit arrangement (26, 27, 30) to which the pressure sensor (17) is electrically connected, the circuit arrangement including a circuit support at least partially accommodated in the chamber (20). The sensor body is not rigidly associated to the casing (2a, 3 a) and/or to other parts of the device (26, 27, 30, 35), i.e. it is mounted elastically or in a moveable manner with respect to the casing (2a, 3 a) and/or to said other parts (26, 27, 30, 35) inside the chamber (20).

Abstract: The invention relates to a fluid pressure sensing device comprising a pressure sensing transducer having a support structure and a diaphragm attached to said support structure, the diaphragm having a fluid facing side. A housing has a transducer receiving cavity defined by a bottom wall and a housing sidewall extending upwardly from the bottom wall. The bottom wall is formed with a fluid pressure receiving recess. A fluid pressure port is formed in the housing in communication with the recess. The diaphragm is positioned between the support structure and the fluid pressure receiving recess and a seal material around a support structure sidewall fixes the pressure sensing transducer in the housing and provides a hermetic seal.

Abstract: An implantable sensor module includes a housing having an inner shell and an outer layer formed to extend over and enclose the inner shell to form an outer wall of the housing, the inner shell having a thickness extending between an inner wall of the inner shell and an outer wall of the inner shell, the outer layer having an inner side engaged against the outer wall of the inner shell and having a thickness extending between the inner side and the outer wall of the housing, wherein the inner shell and the outer layer form a substantially flat portion. A flexible diaphragm is formed within the inner shell and extends between a first edge and a second edge, and a shoulder extends adjacent to the first edge to extend the outer layer laterally away from a central medial line extending between the first and second edges of the diaphragm.

Abstract: A liquid pressure sensing structure includes an air pressure sensing member to sense liquid, such as oil or water. A transferring unit is fitted on a sensing end of the air pressure sensing member. The transferring unit includes a diaphragm therein. The diaphragm divides the inside of the transferring unit into a first space and a second space. The first space communicates with the sensing end of the pressure sensing member and is in a seal state. An oil or water pressure source communicates with the second space of the transferring unit. The pressure is able to influence the position of the diaphragm to change the pressure of the first space so that the air pressure sensing member will get the pressure value. The present invention uses the cost-effective air pressure sensing member to sense the pressure of oil or water so as to control and lower the cost.

Abstract: In a pressure sensor that detects the pressure of liquid flowing in a main fluid flow path, a pressure measuring unit is installed by providing a pressure measuring space at a position branching from a straight-pipe portion of the main fluid flow path, and, in addition, the main fluid flow path and the pressure measuring space are connected with an inlet pipe and an outlet pipe whose pipe diameters are smaller than the main fluid flow path.

Abstract: A sensing device capable of detecting pressure using micro-electro-mechanical system (“MEMS”) capacitive pressure sensor with vertical electric feed-through is disclosed. The sensing device includes a first sensing element, a second sensing element, and a sensing circuit. In one embodiment, the first sensing element is disposed over a semiconductor die and is configured to generate a first sensing signal upon detecting pressure. The second sensing element is also disposed over the semiconductor die adjacent to the first sensing element, and is configured to generate a second sensing signal upon sensing ambient conditions. The sensing circuit is capable of generating a pressure sensing signal in response to the first sensing signal and the second sensing signal.

Abstract: A method for manufacturing an elastic deformation body made of an Al2O3 ceramic according to which a highly pure alumina having at most 2000 ppm MgO, at most 200 ppm inorganic impurities, a specific surface of at least 10 m2/g, an average grain size of at most 0.3 ?m is applied. With the alumina and additives, there is produced via aqueous processing a homogeneous mixture, from which a pressable spray granulate is produced, which is formed by means of a uniaxial pressing method to a homogeneous, green body, which is subjected to a sinter process. The resulting elastic deformation body has a bending fracture stress ?c, whose distribution F(?c) is given by the Weibull parameters ?0?800 MPa and m?24, with an average grain size of the sintered material of no more than 2 ?m, and wherein the sintered material of the deformation body has a density of not less than 3.98 g/cm3.

Abstract: A sensor system, e.g., a pressure sensor system, includes a substrate having at least one trench on a first side. The trench is provided for forming a first diaphragm region on a second side opposite from the first side. In addition, a second diaphragm region and a cavern are integrated into the material of the first diaphragm region.

Abstract: A semiconductor device includes a substrate including a cavity and a first material layer over at least a portion of sidewalls of the cavity. The semiconductor device includes an oxide layer over the substrate and at least a portion of the sidewalls of the cavity such that the oxide layer lifts off a top portion of the first material layer toward a center of the cavity.

Abstract: A pressure sensor device comprises: —a casing (2a, 3a) defining a cavity (7) with an inlet passage (8a, 8b), —a pressure sensor (30) having a body accommodated in the cavity (7), for detecting the pressure of a fluid present in the inlet passage (8a, 8b), —a circuit arrangement including a circuit support (20) at least partially accommodated in the cavity (7) according to a respective laying plane, the pressure sensor (30) being mounted on the circuit support (20). Associated to the circuit support (20) is a protection body (31) surrounding the pressure sensor (30), the protection body (31) externally defining a seat for positioning a respective seal member (35), in particular a radial seal gasket, intended to cooperate with an internal surface of the casing (2a, 3 a).

Abstract: A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.

Abstract: One embodiment relates to a pressure sensor apparatus, including a housing with a flexible member and an aperture configured to receive a fluid. The pressure sensor apparatus further includes a first member disposed on the flexible member, a second member removeably coupled to the first member configured to move in response to a pressure of the fluid and a sensor configured to detect the movement of the second member.

Abstract: A jointless pressure sensor port which includes a body portion, a flange portion integrally formed with the body portion, and a cylindrical portion integrally formed with and extending away from the flange portion. The port also includes an aperture having a first area, where the aperture is formed as part of the cylindrical portion. A channel is located along an axis and has at least one channel region. The channel at least partially extends through the cylindrical portion, the flange portion, and the body portion. A diaphragm includes a second area which is larger than the first area, the diaphragm also has a top surface and a bottom surface. A pressure sensor is disposed on the top surface, and the diaphragm is substantially perpendicular to the axis of the channel. The body portion, flange portion, and cylindrical portion form a jointless and seamless pressure sensor part.

Abstract: Tangential flow filtration device is provided wherein liners are provided between the filtration element and the top and bottom holders or manifolds. The liners incorporate the flow channels and inlet and outlet ports, as well as a sensor mount. The liners are made of an inexpensive material and therefore are disposable after a single use, making it more cost effective to dispose of them than to clean the conventional manifolds. The sensor mount accommodates a removable sensor, and isolates it from the fluid path.

Abstract: A process transmitter for measuring a process variable comprises a sensor module and a static pressure coupling. The sensor module comprises a sensor for measuring a process variable of an industrial process and for generating a sensor signal. The sensor includes a hydraulic fluid inlet within the module. The static pressure coupling is connected to the sensor module and comprises a isolator fitting, a process fluid coupling and an isolation diaphragm. The isolator fitting is inserted into the sensor module and connected to the hydraulic fluid inlet. The process fluid coupling is joined to the isolator fitting. The isolation diaphragm is positioned between the isolator fitting and the process fluid coupling outside of the sensor module.

Abstract: Disclosed is a pressure sensor, especially for measuring pressures exceeding 100 bar, with a diaphragm (1, 1?) that can be deflected and/or deformed as a result of pressurization. It has an enclosed hollow volume (6) that is disposed below the diaphragm and in particular is at least partly filled with a gas or a mixture of gas. A supporting frame (2) for the diaphragm sealingly closes the periphery of the diaphragm relative to a base member (3), and at least one pressure transducer converts the deflection and/or deformation of the diaphragm into at least one electric quantity. It uses a capacitive, piezoresistive or any other principle or at least one strain measuring strip, in which case the pressure sensor is sealingly encapsulated on all sides and has no electric contacts or lines leading to the outside.

Abstract: A physical quantity detector includes a diaphragm including a displacement part that is displaced under external pressure, a ring-shaped fixing part that holds an outer circumferential part of the diaphragm, a holding member having a projection part that projects from an inner circumference of the fixing part toward a center at one surface side of the diaphragm, a support fixed to the projection part, and a pressure-sensitive device having a first base part fixed to the displacement part, a second base part fixed to the support, and a pressure-sensitive part provided between the base parts.