Abstract: A workpiece composite includes a preform part and a gel accommodated in a recess in the preform, the recess being enclosed by at least one edge which serves as a creep barrier to prevent the gel from spreading. The at least one edge of the recess defines a termination point of at least one surface which is provided with a coating made of an oleophobic material in an area adjacent to the at least one edge.

Abstract: A force detector includes: a container which has a cylindrical external shape; a diaphragm which is disposed on an end surface of the container; a force detection element which has a force detection unit and a pair of bases connected with one and the other ends of the force detection unit, respectively, and detects a force generated by the shift of the diaphragm with the detection axis extending in the direction parallel with the line connecting the bases under the condition in which the one and the other bases are connected with the diaphragm and the container, respectively; and a flange which projects from the side surface of the container in the direction toward the outer circumferential side of the side surface such that the flange becomes concentric with the outer circumference of the side surface of the container.

Abstract: A pressure sensor can include a diaphragm plate of an electrically conductive material, the diaphragm plate including substantially planar opposed first and second surfaces. A layer of a dielectric material can be provided at the first surface of the diaphragm plate along a periphery thereof such that a flexion region of the first surface is substantially free of the dielectric material. The dielectric layer can be configured to engage a fixed structure within a housing to support the flexion region as to enable deflection thereof relative to the fixed structure that changes an electrical characteristic of the pressure sensor in response to application of force at the second surface of the diaphragm plate.

Abstract: Described herein is a housing comprising an inside and at least one sidewall, wherein the at least one sidewall comprises inner and outer surfaces. An etch stop deposit is disposed over at least a portion of the housing, and a diaphragm material deposit is disposed over at least a portion of the etch stop deposit.

Abstract: Isolation elements comprise a housing comprising a longitudinal bore formed therein and at least one recess formed in at least one longitudinally extending side of the housing. The at least one recess is in communication with the longitudinal bore. At least one diaphragm is attached proximate a periphery thereof to the housing and seals the at least one recess at the at least one longitudinally extending side of the housing. Sensor assemblies may include an isolation element including a housing and a diaphragm coupled thereto. Methods of forming an isolation element for use with a sensor comprise forming a longitudinal bore in a housing; forming at least one recess in at least one longitudinally extending side of the housing; coupling at least one diaphragm to the housing; and positioning the at least one diaphragm such that a primary direction of displacement of the at least one diaphragm extends into the at least one recess.

Abstract: A pressure sensor has a substrate with conductor tracks for contact-connecting electrical components. The pressure sensor has a measuring element for converting a mechanical measurement variable into an electrical signal and a signal converter for processing the electrical signals from the measuring element further. Furthermore, the pressure sensor has a first diaphragm which, together with the substrate, forms a first closed cavity which contains an inert filling medium. At least one side of the measuring element of the pressure sensor, which comprises an active surface, has direct contact with the filling medium in the first cavity. The signal converter is arranged on the substrate in the form of an unhoused integrated circuit.

Abstract: A manufacturing method for a micromechanical component, a corresponding composite component, and a corresponding micromechanical component are described.

Abstract: A method is described for reducing a dead volume of a microfluidic circuit that includes, in one embodiment, a reservoir, an outlet, and a microfluidic flowpath fluidly connecting the reservoir and the outlet. The method includes providing a microfluidic flow component between the reservoir and the outlet for performing a function and in fluidic communication with the microfluidic flowpath, wherein the microfluidic flow component includes a total volume including a working volume and a dead volume. The working volume is a volume necessary for the microfluidic flow component to perform the function and the dead volume is a volume unnecessary for the microfluidic flow component to perform the function. The method includes configuring at least one of the reservoir, the microfluidic flowpath, and the microfluidic flow component to reduce the dead volume, such that the working volume of the component is substantially the same as the total volume.

Abstract: Method and system for a wet/wet differential pressure sensor based on microelectronic packaging process. A top cap with a hole can be attached to a topside of a MEMS-configured pressure sense die with a pressure sensing diaphragm in order to allow sensed media to come in contact with the topside of the pressure sensing diaphragm. An optional constraint with a hole for stress relief can be attached to a backside of the pressure sense die. Adhesive and/or elastomeric seals and/or solder can be utilized to seal the pressure sense die allowing sensed media to come in contact with both sides of the pressure sensing diaphragm without coming into contact with wirebonds and other metallized surfaces. The MEMS-configured pressure sense die can also be bonded to a substrate with standard die attach materials. Such microelectronic packaging processes yield a high performance and cost effective solution thereby providing wet-wet pressure sensing capability.

Abstract: MEMS pressure sensing elements, the fabrication methods of the sensing elements, and the packaging methods using the new sensing elements are introduced to provide a way for a harsh media absolute pressure sensing and eliminating the negative effects caused by the gel used in the prior art. The invention uses vertical conductive vias to electrically connect the enclosed circuit to the outside, and uses a fusion bond method to attach a cap with the embedded conductive vias over a device die having a circuit for example a piezoresistive Wheatstone bridge to sense pressure. New packaging methods comprise a) a two-pocket housing structure and using a surface mounting method to attach a new sensing element into one pocket by a ball grid array (BGA), and b) a single pocket structure and using conventional die attach and wire bonding. Both methods can be used for harsh media pressure sensing but without the negative effects caused by the gel in prior art.

Abstract: A pressure measurement device isolates liquid, such as blood, from an intermediate fluid, such as air, by means of a diaphragm. The diaphragm is arranged between first and second chambers of respective first and second shells of a pressure pod body. The first shell has first and second ports, which are connected to the first chamber. The second shell has a measurement port with a connector in communication with the second chamber. A pressure transducer with a mating connector is directly connected to the measurement port connector to minimize the sealed volume between the diaphragm and the pressure transducer.

Abstract: Described herein is a method for integrating MEMS with submicron semiconductor electrical circuits such as CMOS to provide more complex signal processing, on-chip calibration and integration with RF technologies. A MEMS sensor is provided having an upper layer, an insulating layer into which a cavity has been formed and a handle layer. The upper layer acts as both the substrate of the semiconductor electrical circuit and as the active MEMS element. The remainder of the circuitry is fabricated either in or on the upper layer. In a preferred method of the present invention a first wafer assembly and a second wafer assembly are fabricated such that a MEMS sensor and the substrate of at least one semiconductive electrical circuit is formed.

Abstract: A pressure sensor measuring element for a pressure sensor operates to detect pressure in a combustion space of an internal combustion engine. The pressure sensor measuring element includes a separating diaphragm, a plunger for the transmission of deflections of the separating diaphragm to a force measuring element, and a sleeve which receives the plunger. The sleeve is closed by the separating diaphragm at a first end intended to face the combustion space and is designed to hold the force measuring element at the opposite second end. Accordingly, the pressure sensor measuring element can be produced more cost-effectively. Furthermore, the plunger can be produced in one piece with the separating diaphragm as a diaphragm/plunger unit, and the sleeve and the diaphragm/plunger unit can be formed from the same metal material.

Abstract: The invention relates to a sensor element for pressure measurement, having a substrate (5) and at least one mass element (1), which is arranged spaced apart from the substrate (5) and is connected in an oscillating manner to the substrate (5) and/or a support body (6) fixed relative to the substrate (5), so that a gap is formed between the mass element (1) and the substrate (5), the width of which can be varied through oscillations of the mass element (1). At least one recess and/or at least one bushing (4) is located in the surface of the substrate (5) delimiting the gap, which recess is used for reducing the damping of the oscillation of the mass element through the gas or plasma surrounding the mass element (1). The sensor element is used in particular in pressure sensors for measuring pressures in the vacuum range. Through the use of the sensor element according to the invention as a pressure sensor, maximum pressures up to the range of atmospheric air pressure can be recorded.

Abstract: The present disclosure relates generally to pressure sensors, and more particularly, to methods and apparatus for compensating pressure sensors for stress, temperature and/or other induced offsets and/or errors. In one illustrative embodiment, a pressure sensor may include a pressure sensing die mounted to a substrate of a pressure sensor package. The pressure sensor die may include on-board compensation. In some instances, the on-board compensation may include an on-board heating element and an on-board zener diode trim network, both situated on or in the pressure sensing die. The zener diode trim network may include one or more zener diodes and one or more resistive elements, where the zener diodes can be selectively activated to “trim” the resistive network to compensate for one or more offsets and/or errors of the pressure sensor.

Abstract: A pressure transmitter includes a sensor assembly having a hollow body housing a pressure sensor. The pressure transmitter also includes a support body which is made of a first material, and an interface body which is connected to the support body and which is made of a second material different from the first material. A first isolation diaphragm is fixed onto the interface body and is made of the same material of the interface body. The first isolation diaphragm is in fluid communication with the pressure sensor and is configured for interfacing with a process fluid.

Abstract: An implantable intraocular pressure sensor system has a sealed geometric shape with an internal pressure at a first value. A strain gauge wire is embedded in a surface of the sealed geometric shape. When the surface is deflected by intraocular pressure, a measured resistance of the strain gauge wire indicates the intraocular pressure. The system also has a processor coupled to a power source and memory. The processor is configured to read the measured resistance and write values corresponding to intraocular pressure to the memory.

Abstract: A sensor may include a substrate that has a cavity formed in a surface thereof. A diaphragm, having a conductive portion, may be suspended over the cavity, a selective coating may be present on a face of the diaphragm outside of the cavity, and a counterelectrode may be spaced from and in opposition to the diaphragm. The diaphragm may deform upon interaction of the selective coating with an analyte and thereby alter a capacitance of the sensor in a manner indicative of a degree of interaction.

Abstract: The invention concerns a pressure sensor (5), particularly for a depth gauge (1), capable of having a high level of precision, owing to sufficient elastic deflection amplitude of the diaphragm (or membrane), while avoiding any risk of plastic deformation. The diaphragm (12) is formed by a flat metal disc. The peripheral region (13) thereof is neither welded nor inset, but it is pre-stressed against a stop strip (25) with a closed, preferably circular contour, and can pivot on the stop strip (25) when the diaphragm bends under the effect of fluid pressure in the pressure chamber (10). The pre-stressing may be achieved via a sealing gasket (21) located opposite the stop strip (25). Between said strip and a central aperture (15), a concave stop surface (20) limits the deflection of the diaphragm (12) and prevents any plastic deformation in the event of excessive pressure. Manufacture of the diaphragm is simple, with a high level of reproducibility, assembly is easy and the seal quality is high.

Abstract: A MEMS device, including: a substrate having a first principal plane and a second principal plane opposite to the first principal plane; a through hole formed in the substrate; and a vibrating film formed over the first principal plane so as to cover the through hole. The first principal plane and the second principal plane are both a (110) crystal face; and the through hole has a substantially rhombic shape on the second principal plane.

Abstract: A pressure sensor according to the present invention comprises: a differential pressure diaphragm; a static pressure diaphragm, which is provided to an outer perimeter part of the differential pressure diaphragm; a first static pressure gauge pair that is formed in the end part of the static pressure diaphragm and comprises two static pressure gauges, which are disposed such that they sandwich the differential pressure diaphragm; and a second static pressure gauge pair that is formed in the center part of the static pressure diaphragm and comprises two static pressure gauges which are disposed such that they sandwich the differential pressure diaphragm.

Abstract: A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.

Abstract: Provided is a pressure detection device capable of easy installation and removal of a sensor in/from a diaphragm, measurement of a pressure in a wide rage, and manufacture at a low cost while reducing a size. A sensor part (A) has: a magnet (12) being applied with a load produced by pressing of a diaphragm (8); and a magnet cap (11) covering the magnet (12). The diaphragm (8) has an intra-diaphragm magnetic body (9) buried therein. The intra-diaphragm magnetic body (9) has a protrusion part protruding from the diaphragm (8) so as to be in contact with the magnet (12). The magnet cap (11) has an opening part enabling the protrusion part of the intra-diaphragm magnetic body (9) and the magnet (12) to be joined together.

Abstract: A pressure transducer is provided that has a transducer body with a rim, a diaphragm that deflects in response to pressure and a sensor bonded to the diaphragm at the rim and at a center of the diaphragm. The sensor detects deflection of the metal diaphragm. The sensor and diaphragm are made of different materials. A thermal expansion difference between the sensor and the diaphragm is accommodated by flexures in the sensor that accept relative motion in a radial direction of the metal diaphragm with little effect on a sensitivity of the silicon structure to motion in an axial direction of the diaphragm.

Abstract: A diaphragm structure for a MEMS device includes a through-hole formed so as to penetrate from an upper surface to a bottom surface of a substrate; and a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole. An opening shape of the through-hole in the upper surface of the substrate is substantially hexagonal.

Abstract: A sensor system for detecting high pressures includes a micromechanical sensor element which is situated on a support and is mounted via this support. A diaphragm is formed in the upper surface of the sensor element, the diaphragm spanning a cavern having a rear opening. The support has a passage opening and is connected to the rear side of the sensor element in such a way that the passage opening opens into the rear opening of the cavern. An annular recess is formed in the rear side of the sensor element, the annular recess being situated above the edge area of the passage opening, so that the joining surface between the sensor element and the support does not extend to the edge of the passage opening.

Abstract: A pressure sensor includes: a container; a pressure receiving member which forms apart of the container; a pressure sensitive element which has a pressure sensing portion and a pair of base portions connected to both ends of the pressure sensing portion, and which has a detection axis parallel to a line connecting the base portions, and in which the detection axis is parallel to a displacement direction of the pressure receiving member, and which detects pressure based on displacement of the pressure receiving member; and a gate-shaped frame which includes a pair of shock absorbing portions that interposes the pressure sensitive element and is connected to a side of the pressure receiving member close to the peripheral portion or a side of the container close to the pressure receiving member and a beam portion that connects distal ends of the shock absorbing portions.

Abstract: A method and apparatus are disclosed for determining status of a canister of a topical negative pressure (TNP) system. The method includes the steps of monitoring pressure provided by a pump element of the TNP system, determining at least one characteristic associated with the monitored pressure and determining status of at least one parameter associated with a canister of the TNP system responsive to the determined characteristics.

Abstract: Disclosed are capacitive pressure probes or sensors for high temperature applications. The capacitive pressure sensors of the present invention include, inter alia, a sapphire diaphragm which is disposed within an interior sensing chamber of the probe housing and has a first electrode formed on a central portion thereof. The central portion of the diaphragm and the first electrode are adapted and configured to deflect in response to pressure variations encountered within an interior sensing chamber and by the pressure sensor. A sapphire substrate which has a second electrode formed thereon is fused to the sapphire diaphragm about its periphery to form a sapphire stack and to define a reference chamber therebetween. Prior to fusing the sapphire diaphragm to the sapphire substrate, all contact surfaces are chemically treated and prepared using plasma activation, so as to create a bonding layer and to reduce the temperature required for the fusion.

Abstract: An enhanced pressure sensing system and method use an external diaphragm to address issues involved with accurate and prolonged measurement of fluid pressure, such as of blood flowing in a vascular structure. Some external diaphragms include a metallized layer or other highly impermeable layer to furnish a high degree of seal at least near to hermetic grade. As temperature of the intermediary fluid changes, the external diaphragm is able to move in a direction that minimizes differential pressure across the external diaphragm over an operational temperature range thereby reducing pressure change of the intermediary fluid due to change in temperature of the intermediary fluid. Relatively smooth hydrodynamic surfaces can be used as well as a bi-layer construction.

Abstract: A construction concept for high-pressure sensors is provided, enabling simple and economical manufacture of reliable high-pressure sensors even for pressure ranges above 2200 bar. A high-pressure sensor of this kind encompasses a sensor element for pressure sensing and a connector piece for coupling the sensor element to a measured system, a diaphragm being embodied over a blind opening in the base element of the sensor element, a pressure conduit being embodied in the base element of the connector piece, and the sensor element being mounted on the connector piece in such a way that the diaphragm can be impinged upon, through the pressure conduit that opens into the blind opening, by a measured pressure. The blind opening in the base element of the sensor element is embodied, at least in one portion, in a manner tapering conically toward the diaphragm, and that end of the pressure conduit which faces toward the sensor element is tubular in shape.

Abstract: The present disclosure relates to pressure sensors. In one illustrative embodiment, the pressure sensor may include a pressure sensor assembly having pressure ports on opposite sides of the pressure sensor assembly. The pressure sensor may include a protective housing including a first housing member and a second housing member defining a cavity for securely housing the pressure sensor assembly. The protective housing may include a first port coupled to one of the pressure ports of the pressure sensor assembly and a second port coupled to the other pressure port of the pressure sensor assembly. In some cases, the protective housing may include one or more aligning features, one or more positioning features, and a boss, which can include two or more bumps, on each side of the cavity around the pressure ports.

Abstract: A pressure transducer comprising a housing and a piezoelectric resonator in the housing, wherein the resonator is made of a piezoelectric crystal having Curie temperature greater than 1000° C. or having no Curie temperature up to its melting point greater than 1000° C., and the piezoelectric crystal has a piezoelectric constant more than two times greater than that of quartz.

Abstract: There is disclosed a high pressure sensing header which is relatively insensitive to mounting torque. The header generally includes an outer torque isolating shell which has a “C” shaped cross section with the cylindrical shell surrounding an inner “H” section header. The inner “H” section header has a thick diaphragm and is at least partially surrounded by the torque isolating shell. In this manner, when the header is installed, the installation force is absorbed by the outer shell and there is relatively no installation force or torque exhibited by the inner “H” section which will respond only to stress due to pressure.

Abstract: Circuits, methods, and systems that calibrate or account for packaging and related stress components in a pressure sensor. Further examples provide an improved sensor element or device. One example provides one or more sensing elements on the diaphragm and near the diaphragm-bulk boundary. Sensors near the diaphragm-bulk are used to estimate package-induced stress. This estimation can then be used in calibrating package stress from pressure measurements.

Abstract: A method for embossing a separating membrane of a pressure transfer means including a membrane carrier having a membrane bed. With the method, an optimal forming of the separating membrane matched to the form of the membrane bed is achievable. The method includes steps of: welding a planar, separating membrane blank onto the membrane carrier; filling with a lubricant a pressure receiving chamber enclosed by the welded, separating membrane blank and the membrane carrier; producing the separating membrane from the separating membrane blank by embossing the separating membrane blank by pressing it against the membrane bed while lubricant is present in the pressure receiving chamber.

Abstract: A pressure sensor which includes: a semiconductor substrate; a first cavity portion that spreads out approximately parallel with one surface of the semiconductor substrate in the interior of a central region thereof; a diaphragm portion of a thin plate shape that is positioned on one side of the first cavity portion; a pressure sensitive element that is disposed on the diaphragm; and a bump that is disposed in an outer edge region of the one surface of the semiconductor substrate that excludes the diaphragm portion and is electrically connected with the pressure sensitive element, wherein a second cavity portion is disposed in at least one portion of the outer edge region in the interior of the semiconductor substrate and is closed with respect to the one surface of the semiconductor substrate.

Abstract: The present invention relates, in general, to pressure sensors capable of operating at high temperatures. The present invention further relates to a high temperature pressure sensor with an improved gage factor. The present invention still further provides a pressure sensor with a smaller sized diaphragm, which is capable of reading higher pressures. The present invention also provides a method and sensor for detecting strain using shape memory alloys.

Abstract: A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.

Abstract: The present invention relates to a pressure sensor comprising multiple flexible diaphragms to which are affixed, within which are embedded, or which themselves constitute part of transducer elements that are connected together electrically, providing greater sensitivity and allowing the diaphragms to be made smaller, thereby increasing burst pressure to operating pressure ratio. This multi-diaphragm pressure sensor can therefore be used to accurately measure small changes in dynamic pressure in a fluid of overall high static pressure, for example, in a flow inventory control system as may be used in a fire suppression system, or for control of nuclear reactor systems.

Abstract: A pressure sensor module includes a pressure sensor, a bump, and a laminated substrate. The pressure sensor includes a semiconductor substrate; a cavity; a pressure-sensitive element; and a conductive section. The cavity is disposed inside the semiconductor substrate such that a thin-plate region of the semiconductor substrate is provided and the thin-plate region being defined as a diaphragm. The pressure-sensitive element is arranged at the diaphragm. The conductive section is electrically connected to the pressure-sensitive element and disposed on the face of the semiconductor substrate at a region excluding the diaphragm. The bump is electrically connected to the conductive section. The laminated substrate includes a wiring base material electrically connected to the pressure sensor via the bump. The wiring base material is disposed inside the laminated substrate. A face of the wiring base material is electrically connected to the bump and has an exposed area from the laminated substrate.

Abstract: A pressure sensing device package including a circuit substrate, a pressure sensing device, a molding compound, and a flexible protection layer is provided. The circuit substrate has an opening. The pressure sensing device is flip chip bonded to the circuit substrate and has a sensing region facing toward the opening. The molding compound encapsulates the pressure sensing device but exposes the sensing region. The flexible protection layer is disposed on the sensing region and exposed by the opening of the circuit substrate.

Abstract: The present invention relates to a pressure measurement unit to determine positive and negative fluid pressure within a disposable for medical devices. As part of the disposable, the invention consists of a rigid measurement chamber, which is covered by an elastic form part. This measurement chamber can be connected to a medical device, which is equipped with a pressure transducer. Specific shapes of the elastic form part and specific instrument interfaces ensure the connection between this elastic form part, the measurement chamber and the pressure transducer to exclude the influence of atmospheric pressure during measurements. The coupling and the sealing ability against atmospheric pressure is controllable. Such pressure measurement units can be used to measure fluid pressure in disposable to control for example fluid pumps.

Abstract: There is disclosed a transducer employing radiation hardened electronics. Essentially a sensor assembly is positioned in a front section of a housing where the sensor assembly is coupled to an electronic module via terminals which connect the sensor to the module. The electronic module assembly is surrounded by an internal tungsten housing which is formed from a first tungsten “U” shaped cross-sectional member coupled to a second tungsten “U” shaped cross-sectional enclosure. The two members are coupled together and totally surround the electronic assembly. The members as held together are positioned within the housing by outer shell members to form a complete housing assembly whereby the electronic assembly and its associated terminal pins are totally surrounded by the tungsten holder section and the tungsten enclosure section.

Abstract: A physical quantity sensor includes two substrates and a movable electrode that is disposed between the two substrates and is bonded to the two substrates. In the physical quantity sensor, the movable electrode has an elastically deformable diaphragm and one of the two substrates is an electrode substrate having a detection electrode on a detection surface opposite to the diaphragm to detect capacitance between the diaphragm and the detection electrode. In the physical quantity sensor, in a range between a room temperature and a bonding temperature when the two substrates and the movable electrode are bonded, coefficients of thermal expansion of the two substrates are smaller than that of the movable electrode and in a temperature range where the physical quantity sensor is used, a coefficient of thermal expansion of the movable electrode is between a first and second substrates.

Abstract: An electrical contact device comprising a first contact assemblage having multiple contact pads disposed in a row which are allocated to different connection types, and having a second contact assemblage having multiple contact pads disposed in a row in accordance with a predetermined sequence, which are allocated to different connection types and having bonding wire connections that electrically connect at least some of the contact pads of the first contact assemblage to contact pads of the second contact assemblage.

Abstract: A pressure sensor comprises a first pressure chamber containing fill fluid at a first pressure, a second pressure chamber containing fill fluid at a second pressure, a porous dielectric diaphragm having first and second major surfaces exposed to the first and second pressure chambers, and first and second electrodes positioned with respect to the first and second major surfaces. A method for sensing pressure is also disclosed, comprising applying first and second pressures to fill fluid in first and second pressure chambers of a pressure sensor having a porous dielectric diaphragm, and producing an output representative of a pressure differential between the pressures, as a function of surface charges on first and second major surfaces of the porous dielectric diaphragm.

Abstract: An air pressure sensor that has a first conductive membrane configured for deflection in response to pressure differences between air at a reference pressure and air at a pressure to be sensed. The sensor also has a second conductive membrane configured for deflection in response to a change in temperature to which the pressure sensor is exposed. The sensor uses a circuit in electrical communication with the first and second conductive membranes, that obtains a first signal and second signal from the first and second conductive membranes respectively. The first and second signals are indicative of the deflection of the first and second conductive membranes. The circuit adjusts the first signal by the second signal to generate an output signal indicative of the air pressure.

Abstract: A pressure sensor is provided which is suitable as an airbag sensor of a vehicle. The pressure sensor includes a pressure chamber having a small opening and a large opening, a pressure sensor element having a pressure receiving surface, and a diaphragm. The diaphragm is designed to seal the large opening. The pressure sensor element is designed to seal the small opening at least using the pressure receiving surface.

Abstract: A process fluid pressure transmitter includes a pressure sensor, transmitter electronics, and an isolation system. The pressure sensor has an electrical characteristic that changes with pressure. The transmitter electronics are coupled to the pressure sensor to sense the electrical characteristic and calculate a pressure output. The isolation system includes a base member, and isolation diaphragm, and a fill-fluid. The isolation diaphragm is mounted to the base member and interposed between the pressure sensor and a process fluid. The fill-fluid is disposed between the isolation diaphragm and the pressure sensor. The base member and the isolation diaphragm are constructed from different materials such that the coefficient of thermal expansion of the isolation diaphragm is larger than the coefficient of thermal expansion of the base member.