Nonvolatile semiconductor storage device and a manufacturing method thereof
Provided is a resistance change type nonvolatile semiconductor storage device including a diode capable of passing therethrough a sufficient current to a resistance changing operation even when the memory cell is miniaturized. A nonvolatile semiconductor storage device has first wires extending in X direction, second wires extending in Y direction, and memory cells disposed at intersection points of the first wires and the second wires. The memory cell includes a diode disposed over the first wire, and coupled to the first wire at one end, and a resistance change part disposed over the diode, and series-coupled to the diode at one end, and coupled to the second wire at the other end, and storing information through changes in resistance value. The diode includes a first conductivity type first semiconductor layer, and a second conductivity type second semiconductor layer extending into the inside of the first semiconductor layer.
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The disclosure of Japanese Patent Application No. 2011-127506 filed on Jun. 7, 2011 including the specification, drawings and abstract is incorporated herein by reference in its entirety.
BACKGROUNDThe present invention relates to a nonvolatile semiconductor storage device, and a manufacturing method thereof. More particularly, it relates to a resistance change type nonvolatile semiconductor storage device, and a manufacturing method thereof.
In the field of a nonvolatile memory, active studies have been made on Flash Memory, FeRAM (Ferroelectric Random Access Memory), MRAM (Magnetic Random Access Memory), OUM (Ovonic Unified Memory), PRAM (Phase change Random Access Memory; Patent Document 1), and the like.
Recently, there has been proposed a resistance change type nonvolatile memory (ReRAM: Resistance Random Access Memory) different from the nonvolatile memories (Non-Patent Document 1). In the resistance change type nonvolatile memory, information is written by changing the resistance value of the resistance change part of the memory cell by application of a voltage pulse. The resistance change type nonvolatile memory is capable of nondestructive reading of written information. In addition, the resistance change type nonvolatile memory is small in element area, and is capable of value multiplexing. For this reason, the resistance change type nonvolatile memory is regarded promising as having a possibility surpassing those of existing nonvolatile memories.
In order to perform the resistance changing operation of the resistance change type nonvolatile memory with good reproduction, it is necessary to control the current and the voltage applied to the resistance change part (Non-Patent Document 5). Thus, there is proposed a structure in which one transistor and one resistance change part are coupled in series (1T1R structure) (Patent Document 3). With this structure, by controlling the resistance of the transistor with the gate voltage, it is possible to control the current and the voltage to be applied to the resistance change part.
On the other hand, in Patent Document 2 and Patent Document 3, cross-point type PRAM and MRAM are proposed, respectively. The cross-point type memory means, for example, in the case of PRAM, a memory array in which resistance change elements (1D1R structures) each including one diode and one resistance change part coupled in series therein are coupled to respective points of intersection between a plurality of X wires and a plurality of Y wires. By implementing such a 1D1R structure, it is possible to avoid the bypass current generated when the resistance change part is sandwiched between simple grid-like wires by the diode. Further, the transistor for controlling the current and the voltage to be applied to the resistance change element may be desirably formed at each end of the memory array. Therefore, the area of the memory cell may be smaller than that of the 1T1R structure.
ReRAMs include two types of a bipolar operation type and a unipolar operation type (Non-Patent Documents 1 and 2). The unipolar operation type is capable of a unipolar operation. Therefore, the unipolar operation type is advantageous for operating the memory cell of the cross-point type memory including a diode coupled in series therein. The resistance change mechanisms are largely classified into two of the electrochemical type and the filament type. The unipolar operation type is the phenomenon observed only in the filament type ReRAM.
[Patent Document 1]
- Japanese Unexamined Patent Publication No. 2007-149170
[Patent Document 2] - Published Japanese translation of PCT application No. 2005-522045; US Patent No. 2008/0258129(A1)
[Patent Document 3] - U.S. Pat. No. 5,640,343
[Patent Document 4] - Japanese Unexamined Patent Publication No. 2010-067942; US Patent No. 2010/0038617(A1)
[Non-Patent Document 1] - W. W. Zhuang et al., “Novell Colossal Mangetoresistive Thin Film Nonvolatile Resistance Random Access Memory (RRAM)”, Electron Devices Meeting, 2002. IEDM '02. Digest. International, pp. 193-196 (2002).
[Non-Patent Document 2] - Shima et al. “Resistance switching in the metal deficient-type oxides: NiO and CoO”, Appl. Phys. Lett. 91, 012901 (2007).
[Non-Patent Document 3] - Tsunoda et al., “Low Power and High Speed Switching of Ti-doped NiO ReRAM under the Unipolar Voltage Source of less than 3V”, Electron Devices Meeting, 2007. IEDM 2007. IEEE International, pp. 767-770 (2007).
[Non-Patent Document 4] - Y. Sakotsubo et al., “A New Approach for Improving Operating Margin of Unipolar ReRAM Using Local Minimum of Reset Voltage”, 2010 Symposium on VLSI Technology Digest of Technical Papers, pp. 87-88 (2010).
[Non-Patent Document 5] - Y. Sasago et al., “Cross-point phase change memory with 4F2 cell size driven by low-contact-resistivity poly-Si diode”, 2009 Symposium on VLSI Technology Digest of Technical Papers, pp. 24-25 (2009).
[Non-Patent Document 6] - J. H. Oh. et al., “Full Integration of Highly Manufacturable 512 Mb PRAM based on 90 nm Technology”, Electron Devices Meeting, 2006. IEDM '06. International, pp. 1-4 (2006).
As described above, in order to implement the cross-point type memory, it is necessary to avoid the bypass current generated when the resistance change part is sandwiched between simple grid-like wires. To this end, the memory cell is required to be configured in a 1D1R structure. In this case, the diode and the resistance change part are coupled in series. For this reason, the current flowing through the resistance change part becomes equal to the current flowing through the diode. Therefore, essential is a diode capable of passing a current required for the resistance change part to perform a resistance changing operation.
Further, when the memory cell of the cross-point type memory is formed, a material forming the diode and a resistance-changing material forming the resistance change part are successively stacked and formed. Then, these are patterned by reactive ion etching. This results in the formation of the memory cell of a vertical structure in which the diode and the resistance change part are stacked in the vertical direction. Such a self-alignment type structure is essential for implementing the high integration of the memory array, namely, for implementing the minimum unit cell area of (2F)2=4F2, where F represents the minimum processing dimension. However, in this case, miniaturization of the memory cell results in the miniaturization of the diode. This results in the reduction of the junction area in the diode. Accordingly, the current which can be passed through the diode is also reduced.
Further, when polysilicon is used for a diode, in order to ensure the reverse biased leakage resistance of the diode, it is necessary to use a diode having a large film thickness in view of the expansion of the depletion layer, or a diode having an i layer at the pn junction interface as with a pin structure (Non-Patent Document 5). However, when such a structure is used, further, the current which can be passed through the diode is reduced.
On the other hand, the current necessary for achieving a higher resistance of the unipolar operation type resistance change part suitable for the cross-point type memory is not reduced even when the memory cell is miniaturized (Non-Patent Document 2). This is due to the following fact: the low resistance state is equal to that of the very thin conductive filament formed in an insulation film (Non-Patent Document 2). This means that the resistance value of the low resistance state does not depend upon the element area unless the element area becomes as small as the cross-sectional area of the filament.
Thus, the resistance change part has a high scalability. However, the diode has a low scalability. Therefore, the advance of miniaturization of the cross-point type memory cell does not cause a trouble in the resistance change part at all. However, the decrease in element area of the diode may make it impossible for a sufficient current to be passed through the memory cell. Then, the resistance changing operation at the resistance change part does not occur, so that the memory cell ceases to function as a memory cell. Namely, the decrease in element area of the diode with miniaturization of the cross-point type memory cell unfavorably hinders the high integration of the memory array.
Some proposals have ever been made on a diode which is of a vertical type capable of high integration, and has a large ON current and a small OFF current. For example, in Non-Patent Document 6, there is shown a 1D1R type phase change type memory using a pn junction diode formed by selective epitaxial growth. However, a sufficient current cannot be passed therethrough as a high-reliability resistance change type memory use.
The shrinkage of the cell size also has a problem in alignment precision with a structure in which the resistance change part is sandwiched between grid-like wires. When the alignment is required two times, a margin in view of the alignment precision becomes necessary. As a result, the size of the memory cell becomes larger than 4F2. In order to implement the minimum unit cell of 4F2, it is essential that a memory cell is formed in a self-aligned manner between an X wire and a Y wire.
Below, the means for solving the problem will be described using the numbers and reference numerals and signs utilized in the Detailed Description. These numbers and reference numerals and signs are shown in parentheses in order to clarify the corresponding relation between the description in the appended claims and the Detailed Description. However, these numbers and reference numerals and signs must not be used for understanding the technical scope of the invention described in the appended claims.
A nonvolatile semiconductor storage device of the present invention includes a plurality of first wires (13) extending in a first direction, a plurality of second wires (20) extending in a second direction different from the first direction, and a plurality of memory cells (10) disposed at respective points of intersection of the first wires (13) and the second wires (20). Each of the memory cells (10) includes a diode (15) disposed over the first wire (13), and coupled to the first wire (13) at one end thereof, and a resistance change part (19) disposed over the diode (15), and coupled in series to the diode (15) at one end thereof, and coupled to the second wire (20) at the other end thereof, and for storing information through a change in resistance value. The diode (15) includes a first semiconductor layer (13) of a first conductivity type (n), and a second semiconductor layer (14) of a second conductivity type (p) different from the first conductivity type (n). The second semiconductor layer (14) extends into the inside of the first semiconductor layer (13).
A method for manufacturing a nonvolatile semiconductor storage device of the present invention manufactures the following nonvolatile semiconductor storage device. The nonvolatile semiconductor storage device has a plurality of first wires (13), a plurality of second wires (20), and a plurality of memory cells (10). The memory cell (10) includes a diode (15) and a resistance change part (19). The diode (15) includes a first semiconductor layer (13) of a first conductivity type, and a second semiconductor layer (14) of a second conductivity type. The resistance change part (1) includes a top electrode (18), a resistance change layer (17), and a bottom electrode (16). The first semiconductor layer (13) is included in the first wire (13). The second semiconductor layer (14) extends into the inside of the first semiconductor layer (13). The method for manufacturing a nonvolatile semiconductor storage device includes the steps of: forming a plurality of element isolation insulation layers (12) along a first direction in a semiconductor substrate (11); etching back the tops of a plurality of semiconductor regions (11p) between the element isolation insulation layers (12); ion-implanting each of the semiconductor regions relatively deeply with the first conductivity type (n) impurities, and relatively shallowly with the second conductivity type (p) impurities, and forming a first ion implantation layer (13a) and a second ion implantation layer (14a), respectively; forming a bottom electrode film (16a) in each of the semiconductor regions in such a manner as to fill the top thereof; depositing a resistance change layer film (17a), a top electrode film (18a), and a second wiring film (20a) in this order in such a manner as to cover the element isolation insulation layers (12) and the bottom electrode films (16a); etching the second wiring film (20a), the top electrode film (18a), the resistance change layer film (17a), and the bottom electrode films (16a) with the second ion implantation layers (14a) as an etching stopper so that a plurality of second wires (20) extend in a second direction different from the first direction, and forming the second wires (20), the top electrode (18), the resistance change layer (17), and the bottom electrode (16); and ion-implanting an exposed portion of the second ion implantation layer (14a) with the first conductivity type impurities, and setting the remaining portion of the second ion implantation layer (14a) as the second semiconductor layer (14), and thereby setting the ion-implanted portion of the second ion implantation layer (14a) and the first ion implantation layer (13a) as the first wire (13) including the first semiconductor layer (13).
In accordance with the present invention, it is possible to obtain a resistance change type nonvolatile semiconductor storage device including a diode capable of passing a sufficient current for the resistance changing operation even when the memory cell is miniaturized. It is possible to implement a resistance change type nonvolatile semiconductor storage device having a high-integration cross-point type structure.
Below, a nonvolatile semiconductor storage device and a manufacturing method thereof of the present invention will be described by way of embodiments by reference to the accompanying drawings.
First Embodiment
A description will be given to a nonvolatile semiconductor storage device in accordance with a first embodiment of the present invention.
A plurality of the bit lines (first wires) 13 extend in parallel with one another in the X direction. A plurality of the bit lines 13 are buried in a substrate 11. A plurality of word lines (second wires) 20 extend in parallel with one another in the Y direction perpendicular to the X direction. A plurality of memory cells 10 are disposed at respective points of intersection between a plurality of the bit lines 13 and a plurality of the word lines 20, respectively. Each memory cell 10 is coupled to the bit line 13 at one end thereof, and coupled to the word line 20 at the other end thereof, respectively. The memory cell 10 has a diode 15 and a resistance change part 19 series-coupled to each other. Namely, it is in a 1D1R structure.
The diode 15 has a rectifying function, is disposed over the bit line 13, and includes a first semiconductor layer 13 and a second semiconductor layer 14. The first semiconductor layer 13 is formed in contact with the bit line 13. The second semiconductor layer 14 is buried in the inside of the first semiconductor layer 13, and formed in contact with the resistance change part 19. One of the first semiconductor layer 13 and the second semiconductor layer 14 is an anode, and the other is a cathode.
The resistance change part 19 stores information by a change in resistance value, is disposed over the diode 15, and includes a top electrode 18, a bottom electrode 16, and a resistance change layer 17. The top electrode 18 is coupled with the word line 20. The bottom electrode 16 is coupled with the diode 15. The resistance change layer 17 is disposed between the top electrode 18 and the bottom electrode 16, and is changed in resistance value by the voltage (current) applied to both the electrodes. The bottom electrode 16, the resistance change layer 17, the top electrode 18, and the word line 20 are stacked in this order.
Then, a description will be given to the details of the nonvolatile semiconductor storage device 1.
The substrate 11 is a second conductivity type semiconductor substrate, and is exemplified by a p type Si (silicon) substrate. The substrate 11 includes a plurality of element isolation insulation layers 12 (Shallow Trench Insulator; STI). A plurality of the element isolation insulation layers 12 extend in parallel with one another in the X direction. However, the bottom surface (−z-side surface) of the element isolation insulation layer 12 is flat. On the other hand, the top surface (+z-side surface) of the element isolation insulation layer 12 is partially removed at the top thereof, and is reduced in thickness (
A plurality of the bit lines 13 are formed in contact with the substrate 11. The bottom surface (−z-side surface) of the bit line 13 is flat. On the other hand, the top surface (+z-side surface) of the bit line 13 is at the same plane of the top surface (the surface of the element isolation insulation layer 12) of the substrate 11 at each portion without the memory cell 10 (
The first semiconductor layer 13 of the diode 15 is included in the bit line 13, and is a region including the memory cell 10 in the bit line 13 (
The second semiconductor layer 14 of the diode 15 extends from the top of the bit line 13 (first semiconductor layer 13) to the midpoint of the inside thereof (
The first semiconductor layer 13 and the second semiconductor layer 14 are preferably manufactured by using the semiconductor of the substrate 11 as it is as described later. This is because the current which can be passed through the diode 15 may be limited as already described in the case of polysilicon or selectively epitaxially grown silicon.
The diode 15 has such a configuration. As a result, the second semiconductor layer 14 can be in contact with the first semiconductor layer 13 not only at the bottom surface in the −Z direction thereof, but also at both the side surfaces in the X direction thereof. Therefore, it is possible to increase the contact area between the first semiconductor layer 13 and the second semiconductor layer 14 as compared with the case where the first semiconductor layer and the second semiconductor layer are simply stacked to be in contact with each other at a plane. The contact area corresponds to the junction area in the diode 15. Therefore, the configuration enables an increase in junction area in the diode 15. This can increase the current which can be passed through the diode 15.
The bottom electrode 16 of the resistance change part 19 is at the same plane as the top surface of the substrate 11 (the surface of the element isolation insulation layer 12) at a portion with the memory cell 10 (
The word line 20 is stacked over the resistance change layer 17 and the top electrode 18, and extends in the Y direction (
An interlayer insulation layer 21 is formed in such a manner as to cover the word line 20, the bit line 13, and the memory cell 10. The top of the interlayer insulation layer 21 is planarized.
Thus, the nonvolatile semiconductor storage device 1 of the present embodiment has the following configuration. In the substrate 11 (e.g., p type silicon substrate), the first semiconductor layer (e.g., n type silicon layer) 13 which is an n type region defined by the element isolation insulation layer 12, and the second semiconductor layer (e.g., p type silicon layer) 14 which is the top thereof are buried in the surface region thereof. This forms a buried pn junction diode 15. The n type region is a component of the diode 15, and also serves as the bit line 13. Namely, the n type region forms the buried bit line. In the substrate 11, further, a bottom electrode layer 16 is buried over the second semiconductor layer 14. Over the substrate 11 in which the bottom electrode 16 is buried evenly, the resistance change layer 17, the top electrode 18, and the word line 20 are formed in this order. The bottom electrode layer 16, the resistance change layer 17, and the top electrode 18 form the resistance change part 19. The side on which the word line 20 is formed is evenly covered with an interlayer insulation film 21.
Thus, the memory cell 10 has a 1D1R structure, and can be formed of the minimum unit cell area 4F2. As a result it is possible to achieve high integration. Further, the buried bit line 13 uses a high-concentration doped semiconductor, and hence can be reduced in resistance. Consequently, it is possible to improve the operation speed. Further, it is possible to increase the contact area between the first semiconductor layer 13 and the second semiconductor layer 14. This enables an increase in junction area in the diode 15, which can increase the current which can be passed through the diode 15.
Then, a description will be given to a method for manufacturing the nonvolatile semiconductor storage device in accordance with the first embodiment of the present invention.
First, as shown in
Then, as shown in
Subsequently, as shown in
Then, as shown in
Then, as shown in
Subsequently, as shown in
Then, as shown in
Then, as shown in
Subsequently, as shown in
Then, an interlayer insulation film (not shown) such as silicon oxide is formed in such a manner as to cover the entire surface of the substrate 11. Then, a planarization treatment is performed by CMP. As a result, it is possible to manufacture the nonvolatile semiconductor storage device 1 as shown in
As described above, in the present embodiment, the portions of the second ion implantation layer 14a except for a portion of the second ion implantation layer 14a (second conductivity type) immediately under the bottom electrode 16 and on the opposite sides thereof are changed into the first conductivity type first ion implantation layer 13a by ion implantation (
With the manufacturing method, the alignment in the structure in which the resistance change part is sandwiched between the grid-like wires requires only one cycle of the steps of
As described up to this point, in accordance with the present embodiment, it is possible to set the pn junction area in the diode 15 relatively large irrespective of the miniaturization of the memory cell 10. As a result, it is possible to pass a sufficient current through the memory cell 10 even when the memory cell 10 is miniaturized. This enables the resistance changing operation. Further, the structure of the cross-point type memory cell 10 can be formed in a self-aligned manner, and the minimum unit cell can be implemented as the memory cell. Still further, use of a high-concentration doped semiconductor can reduce the resistance of the bit line 13.
Second Embodiment
A description will be given to a nonvolatile semiconductor storage device in accordance with a second embodiment of the present invention.
The resistance change part 19 includes sidewalls 24 on both sides opposing in the X direction, which may be disposed to both side surfaces of the word line 20. The sidewalls 24 extend in the Y direction along the resistance change layer 17, the top electrode 18, and the word line 20 extending in the Y direction. The sidewalls 24 are formed of an insulator such as SiO2 (silicon oxide).
The second semiconductor layer 14 of the diode 15 is provided not only under the bottom electrode 16 but also under the sidewalls 24. Namely, the width in the x direction of the second semiconductor layer 14 is generally the total length of the width in the x direction of the bottom electrode 16 and the widths in the x direction of the two sidewalls 24. Thus, the provision of the sidewalls 24 can more increase the contact area between the first semiconductor layer 13 and the second semiconductor layer 14, i.e., the junction area in the diode 15. In addition, the provision of the sidewalls 24 results in that the sidewalls 24 and the second semiconductor layer 14 are sandwiched between the bottom electrode 16 and the first semiconductor layer 13. Therefore, it is possible to prevent the direct contact between the bottom electrode 16 and the first semiconductor layer 14, i.e., the short circuit of the diode 15.
Then, a description will be given to a method for manufacturing the nonvolatile semiconductor storage device in accordance with the second embodiment of the present invention. The method for manufacturing the nonvolatile semiconductor storage device 1A is the same as the case of the method for manufacturing the nonvolatile semiconductor storage device 1 of the first embodiment, except that the following steps are included between the steps of
The following step is carried out between the steps of
Also in the case of the present embodiment, it is possible to obtain the same effects as those in the first embodiment. In addition, the junction area in the diode 15 can be increased. As a result, a larger current can be passed through the diode 15. Further, it is possible to prevent the direct contact between the bottom electrode 16 and the first semiconductor layer 14, namely, the short circuit of the diode 15.
Then, a description will be given to a modified example of the present embodiment.
As compared with the case of the nonvolatile semiconductor storage device 1A of
The methods for manufacturing the nonvolatile semiconductor storage device 1B and the nonvolatile semiconductor storage device 1C are the same as the case of the method for manufacturing the nonvolatile semiconductor storage device 1 of the first embodiment, except that the energy for ion implantation in the steps of
Also in the present modified embodiment, it is possible to obtain the same effects as those of the nonvolatile semiconductor storage device 1A. In addition, the junction area in the diode 15 can be more increased. As a result, it is possible to pass a further larger current through the diode 15.
Third Embodiment
A description will be given to a nonvolatile semiconductor storage device in accordance with a third embodiment of the present invention.
The bit line 13 includes a silicide layer 26 disposed between the sidewalls 24 in a portion coupling the memory cells 10 adjacent to each other in the X direction. The silicide layer 26 may be only the top of the bit line 13 at the portion, or may be almost all of the bit line 13 in the direction of film thickness at the portion. The silicide layer 26 is exemplified by WSi (tungsten silicide), CoSi (cobalt silicide), NiSi (nickel silicide), and TiSi (titanium silicide).
The silicide layer 26 is disposed in the upper part of the bit line 13 between the opposing sidewalls 24, and is not present immediately under the sidewalls 24. For this reason, the silicide layer 26 is not in contact with the second semiconductor layer 14 and the bottom electrode 16. Namely, the diode 15 will not be short-circuited. Silicidation of a part of the bit line 13 can further reduce the resistance of the bit line 13.
Then, a description will be given to a method for manufacturing the nonvolatile semiconductor storage device in accordance with the third embodiment of the present invention. The method for manufacturing the nonvolatile semiconductor storage device 1D is the same as the case of the method for manufacturing the nonvolatile semiconductor storage device 1A of the second embodiment, except that the following steps are included between the steps of
Between the steps of
Also in the case of the present embodiment, it is possible to obtain the same effects as those with the second embodiment. In addition, it is possible to further reduce the resistance of the bit line 13.
Fourth Embodiment
A description will be given to a nonvolatile semiconductor storage device in accordance with a fourth embodiment of the present invention.
The memory cell 10 further includes a silicide layer 28. The silicide layer 28 is disposed between the second semiconductor layer 14 of the diode 15 and the resistance change part 19. Therefore, the silicide layer 28 extends in the X direction over the second semiconductor layer 14. The silicide layer 28 is exemplified by WSi (tungsten silicide). The provision of the silicide layer 28 between the diode 15 and the resistance change part 19 can reduce the contact resistance.
Then, a description will be given to the method for manufacturing the nonvolatile semiconductor storage device in accordance with the fourth embodiment of the present invention. As for the method for manufacturing a nonvolatile semiconductor storage device 1E, the steps from
First, the steps from
Then, as shown in
Subsequently, as shown in
Then, as shown in
Then, as shown in
Subsequently, as shown in
Then, as shown in
Then, an interlayer insulation film such as silicon oxide is formed in such a manner as to cover the entire surface of the substrate 11. Then, a planarization treatment is performed by CMP. As a result, it is possible to manufacture the nonvolatile semiconductor storage device 1 as shown in
Also in the case of the present embodiment, it is possible to obtain the same effects as those with the first embodiment. In addition, the provision of the silicide layer 28 between the diode 15 and the resistance change part 19 can reduce the contact resistance between the diode 15 and the resistance change part 19.
Fifth Embodiment
A description will be given to a nonvolatile semiconductor storage device in accordance with a fifth embodiment of the present invention.
The barrier layer 30 is disposed as a part of the word line 20 between the top electrode 18 and the word line 20. The barrier layer 30 prevents a metal such as Cu (copper) forming the word line 20 from being diffused through the top electrode 18, and being diffused into the resistance change layer 17. The barrier layer 30 is exemplified by TiN (titanium nitride) and TaN (tantalum nitride). Thus, the insertion of the barrier layer 30 prevents the metal diffusion, which can improve the reliability of the nonvolatile semiconductor storage device.
Then, a description will be given to a method for manufacturing the nonvolatile semiconductor storage device in accordance with the fifth embodiment of the present invention. A method for manufacturing a nonvolatile semiconductor storage device 1F is the same as the case of the method for manufacturing the nonvolatile semiconductor storage device 1 of the first embodiment, except that a barrier layer film is further deposited between the top electrode film 18a and the word line film 20a in the steps of
Namely, in the steps of
Also in the case of the present embodiment, it is possible to obtain the same effect as that with the first embodiment. In addition, the provision of the barrier layer 30 between the top electrode 18 and the word line 20 prevents the metal diffusion. This can improve the reliability of the nonvolatile semiconductor storage device.
Sixth Embodiment
A description will be given to a nonvolatile semiconductor storage device in accordance with a sixth embodiment of the present invention.
The electrode wiring layer 32 is obtained by integrating the top electrode 18 and the word line 20. The electrode wiring layer 32 has the function of the top electrode 18 and the function of the word line 20. For this reason, the electrode wiring layer 32 is preferably formed with a larger film thickness than that of a general top electrode 18 alone, or the film thickness of the word line 20 alone. The electrode wiring layer 32 is exemplified by thick-film W (tungsten), Al (aluminum), and Cu (copper).
Then, a description will be given to a method for manufacturing the nonvolatile semiconductor storage device in accordance with the sixth embodiment of the present invention. The method for manufacturing a nonvolatile semiconductor storage device 1G is the same as the case of the method for manufacturing the nonvolatile semiconductor storage device 1 of the first embodiment, except that an electrode wiring layer film is deposited in place of the top electrode film 18a and the word line film 20a in the steps of
Namely, in the steps of
Also in the case of the present embodiment, it is possible to obtain the same effect as that of the first embodiment. In addition, one electrode wiring layer film is used in place of the top electrode film 18a and the word line film 20a. This can simplify the manufacturing process, can reduce the manufacturing cost, and can shorten the manufacturing period.
Seventh Embodiment
A description will be given to a nonvolatile semiconductor storage device in accordance with a seventh embodiment of the present invention.
The substrate 11 includes an insulation layer 11b, and a silicon layer 11a disposed over the insulation layer 11b. It is preferable that the thickness of the silicon layer 11a is generally the same as the thickness of the element isolation insulation layer. In that case, the bottom surface of the element isolation insulation layer 12 is in contact with the insulation layer 11b. Accordingly, the silicon layer 11a in contact with the bottom surface of the bit line 13 (first semiconductor layer 13) is separated from the silicon layer 11a in contact with the bottom surface of the adjacent bit line 13 (first semiconductor layer 13). As a result, it is possible to prevent the leakage current between the bit lines 13.
Then, a description will be given to a method for manufacturing the nonvolatile semiconductor storage device in accordance with the seventh embodiment of the present invention. A method for manufacturing a nonvolatile semiconductor storage device 1H is the same as the case of the method for manufacturing the nonvolatile semiconductor storage device 1 of the first embodiment, except that a SOI substrate is used as the substrate 11.
Also in the case of the present embodiment, it is possible to obtain the same effect as that with the first embodiment. In addition, the SOI substrate is used as the substrate 11, and hence, it is possible to prevent the leakage current between the bit lines 13.
Eighth Embodiment
A description will be given to a nonvolatile semiconductor storage device in accordance with an eighth embodiment of the present invention.
The nonvolatile semiconductor storage device 1I has a configuration in which the structures of the nonvolatile semiconductor storage device 1H are stacked. The configuration for one layer is the same as that of the nonvolatile semiconductor storage device 1H. By thus stacking a plurality of layers of the nonvolatile semiconductor storage devices 1H, it is possible to improve the integration degree of the cell array.
Then, a description will be given to a method for manufacturing the nonvolatile semiconductor storage device in accordance with the eighth embodiment of the present invention. First, a plurality of the nonvolatile semiconductor storage devices 1H are manufactured. The method for manufacturing the nonvolatile semiconductor storage device 1H is as described in the seventh embodiment. Then, an insulation layer lib on the back surface side of each nonvolatile semiconductor storage device 1H is polished to a prescribed thickness. The prescribed thickness is preferably, for example, a thickness of such a degree that the nonvolatile semiconductor storage devices 1H do not electrically/magnetically affect one another. Then, they are bonded to one another, thereby to manufacture the nonvolatile semiconductor storage device 1I.
Also in the case of the present embodiment, it is possible to obtain the same effects as those of the seventh embodiment. In addition, the nonvolatile semiconductor storage devices 1H are stacked, which can improve the integration degree of the cell array.
Ninth Embodiment
A description will be given to a nonvolatile semiconductor storage device in accordance with a ninth embodiment of the present invention.
In the bit line 13, the portion coupling the memory cells 10 adjacent in the X direction is formed thinner than that of the nonvolatile semiconductor storage device 1. As a result, the word line 13 (first semiconductor layer 13) under the second semiconductor layer 14 and the word line 13 at portions coupling the adjacent memory cells 10 have the same film thickness.
Then, a description will be given to a method for manufacturing the nonvolatile semiconductor storage device in accordance with the ninth embodiment of the present invention. A method for manufacturing a nonvolatile semiconductor storage device 1J is the same as the case of the method for manufacturing the nonvolatile semiconductor storage device 1 of the first embodiment, except that the steps of
In the steps of
As described up to this point, in accordance with the present embodiment, the structure of the cross-point type memory cell 10 can be formed in a self-aligned manner, which enables the implementation of the minimum unit cell at the memory cell.
Tenth Embodiment
A description will be given to a nonvolatile semiconductor storage device in accordance with a tenth embodiment of the present invention
The Schottky diode 36 has a rectifying function, is disposed over the bit line 13, and includes the first semiconductor layer 13 and the metal layer 34. The first semiconductor layer 13 is formed in contact with the bit line 13. The metal layer 34 is disposed in contact with the first semiconductor layer 13, and is in contact with the resistance change part 19.
The first semiconductor layer 13 of the Schottky diode 36 is included in the bit line 13, and is a region including the memory cell 10 in the bit line 13. The first semiconductor layer 13 is substantially the same as the bit line 13 in the region. Namely, the bit line 13 also serves as the first semiconductor layer 13 in the region. The first semiconductor layer 13 is of the first conductivity type as with the bit line 13, and is exemplified by an n+ type Si (silicon). The metal layer 34 of the Schottky diode 36 is in contact with the top of the bit line 13 (first semiconductor layer 13). The metal layer 34 is a metal to be in Schottky contact with the first semiconductor layer 13. Examples thereof include Al (aluminum), Au (gold), W (tungsten), and Pt (platinum) when the first semiconductor layer 13 is an n type Si (silicon). Implementation of the Schottky diode 36 can increase the switching speed as compared with the PN junction diode.
Then, a description will be given to a method for manufacturing the nonvolatile semiconductor storage device in accordance with the tenth embodiment of the present invention. The method for manufacturing the nonvolatile semiconductor storage device 1K is the same as the method for manufacturing the nonvolatile semiconductor storage device 1J of the ninth embodiment, except that the steps of
In the steps of
Then, in the steps of
Then, in the steps of
Also in the present embodiment, it is possible to obtain the same effects as those of the ninth embodiment. In addition, implementation of the Schottky diode 36 can increase the switching speed as compared with a PN junction diode.
Then, a description will be given to a modified example of the present embodiment.
As compared with the case of the nonvolatile semiconductor storage device 1K of
The metal electrode layer 38 is obtained by integrating the integrated metal layer 34 and the bottom electrode 16. The metal electrode layer 38 has the function of the metal layer 34 and the function of the bottom electrode 16 in combination. For this reason, the metal electrode layer 38 is preferably formed with a larger film thickness than the film thickness of a general metal layer 34 alone, or the film thickness of the bottom electrode 16 alone. The metal electrode layer 38 is exemplified by a thick-film W (tungsten).
The method for manufacturing the nonvolatile semiconductor storage device 1L is the same as the case of the method for manufacturing the nonvolatile semiconductor storage device 1K, except that a metal electrode layer film (not shown) is deposited in place of the metal film for Schottky and the bottom electrode film in the method for manufacturing the nonvolatile semiconductor 1K.
Also in the present modified example, it is possible to obtain the same effects as those with the nonvolatile semiconductor storage device 1K. In addition, one metal electrode layer film is used in place of the metal film for Schottky and the bottom electrode film. As a result, it is possible to implement the simplification of the manufacturing process, the reduction of the manufacturing cost, and the shortage of the manufacturing period.
The respective nonvolatile semiconductor storage devices described up to this point are applicable not only to the case where the devices are used as nonvolatile memories (e.g., mass storage nonvolatile memories such as ReRAM), but also to semiconductor devices such as anti-fuses, mask ROMs (Read only Memories), FPGA (Field-Programmable Gate Arrays), memory-merged system LSI (Large Scale Integration), and logic-merged memories.
The present invention is not limited to the foregoing respective embodiments. It is apparent that an appropriate modification or change of the each embodiment may be made within the scope of the technical idea of the present invention. Further, the technologies used in each embodiment or modified example thereof are not exclusively applied to the embodiments, and are also applicable to other embodiments unless a technical contradiction occurs.
Claims
1. A nonvolatile semiconductor storage device, comprising:
- a plurality of first wires extending in a first direction;
- a plurality of second wires extending in a second direction different from the first direction; and
- a plurality of memory cells disposed at respective points of intersection of the first wires and the second wires,
- wherein each of the memory cells includes:
- a diode disposed over the first wire, and coupled to the first wire at one end thereof; and
- a resistance change part disposed over the diode, and coupled in series to the diode at one end thereof, and coupled to the second wire at the other end thereof, and for storing information through a change in resistance value,
- wherein the diode includes:
- a first semiconductor layer of a first conductivity type; and
- a second semiconductor layer of a second conductivity type different from the first conductivity type, and
- wherein the second semiconductor layer extends into the inside of the first semiconductor layer.
2. The nonvolatile semiconductor storage device according to claim 1,
- wherein the first wires are embedded in the substrate, and each include a semiconductor layer of the first conductivity type extending in the first direction, and
- wherein the first wires each include the first semiconductor layer.
3. The nonvolatile semiconductor storage device according to claim 2,
- wherein the resistance change part includes sidewalls formed of an insulator at both the side surfaces thereof opposing each other in the second direction.
4. The nonvolatile semiconductor storage device according to claim 3,
- wherein the first wire includes a first silicide layer disposed between the sidewalls, at a portion coupling the memory cells adjacent in the second direction.
5. The nonvolatile semiconductor storage device according to claim 2,
- wherein each of the memory cells further has a second silicide layer disposed between the diode and the resistance change part.
6. The nonvolatile semiconductor storage device according to claim 1,
- wherein the second wire includes a barrier layer between the resistance change part and it.
7. The nonvolatile semiconductor storage device according to claim 1,
- wherein the resistance change part includes:
- a top electrode coupled to the second wire;
- a bottom electrode coupled to the diode; and
- a resistance change layer disposed between the top electrode and the bottom electrode, and
- wherein the resistance change layer, the top electrode, and the second wire are stacked in this order, and extend in the second direction.
8. The nonvolatile semiconductor storage device according to claim 7,
- wherein the second wire is integral with the top electrode.
9. The nonvolatile semiconductor storage device according to claim 1,
- wherein the substrate comprises a SOI (Silicon on Insulator) substrate.
10. The nonvolatile semiconductor storage device according to claim 9,
- wherein the combinations of the substrate, the first wires, the second wires, and the memory cells are stacked in a plurality of layers.
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Type: Grant
Filed: May 17, 2012
Date of Patent: Apr 29, 2014
Patent Publication Number: 20120313068
Assignee: Renesas Electronics Corporation (Kawasaki-Shi, Kanagawa)
Inventor: Yukihiro Sakotsubo (Kanagawa)
Primary Examiner: Mark A Laurenzi
Application Number: 13/474,690
International Classification: H01L 29/02 (20060101);