Semiconductor device

Description

FIG. 1 is a front, top and right side perspective view of a first embodiment of a semiconductor device showing my new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof, the rear view being an identical image of FIG. 3;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side view thereof, the left side view being an identical image of FIG. 6;

FIG. 7 is a front, top and right side perspective view of a second embodiment of a semiconductor device showing my new design;

FIG. 8 is a rear, bottom and left side perspective view thereof;

FIG. 9 is a front view thereof, the rear view being an identical image of FIG. 9;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof; and,

FIG. 12 is a right side view thereof, the left side view being an identical image of FIG. 12.

The broken lines illustrate portions of the semiconductor device that form no part of the claimed design.

Claims

The ornamental design for a semiconductor device, as shown and described.