Power semiconductor package
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Description
Claims
The ornamental design for a power semiconductor package, as shown and described.
Referenced Cited
U.S. Patent Documents
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Patent History
Patent number: D969762
Type: Grant
Filed: Oct 11, 2021
Date of Patent: Nov 15, 2022
Assignee: Wolfspeed, Inc. (Durham, NC)
Inventor: Kuldeep Saxena (Sewickley, PA)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/811,014
Type: Grant
Filed: Oct 11, 2021
Date of Patent: Nov 15, 2022
Assignee: Wolfspeed, Inc. (Durham, NC)
Inventor: Kuldeep Saxena (Sewickley, PA)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/811,014
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)