Semiconductor device

- Fuji Electric Co., Ltd.
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Description

FIG. 1 is a front view of a semiconductor device showing our new design;

FIG. 2 is a rear view of the semiconductor device of FIG. 1;

FIG. 3 is a left side view of the semiconductor device of FIG. 1;

FIG. 4 is a right side view of the semiconductor device of FIG. 1;

FIG. 5 is a top view of the semiconductor device of FIG. 1;

FIG. 6 is a bottom view of the semiconductor device of FIG. 1;

FIG. 7 is a top, front and right side perspective view of the semiconductor device of FIG. 1; and,

FIG. 8 is a top, rear and left side perspective view of the semiconductor device of FIG. 1.

The broken lines shown in the drawings represent portions of the semiconductor device that form no part of the claimed design.

Claims

The ornamental design for a semiconductor device, as shown and described.

Referenced Cited
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Other references
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Patent History
Patent number: D704670
Type: Grant
Filed: Jul 16, 2013
Date of Patent: May 13, 2014
Assignee: Fuji Electric Co., Ltd. (Kanagawa)
Inventors: Shuangching Chen (Matsumoto), Akira Iso (Matsumoto), Takashi Hyakutake (Matsumoto), Syougo Ogawa (Matsumoto), Syuuji Miyashita (Matsumoto)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/460,858