Discharge chamber for a plasma processing apparatus
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This application contains subject matter related to the following co-pending U.S. design patent applications:
Application No. 29/610,995, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application No. 29/610,996, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application No. 29/610,998, filed herewith and entitled “Ring for a Plasma Processing Apparatus”; and
Application No. 29/610,999, filed herewith and entitled “Cover Ring for a Plasma Processing Apparatus”.
Claims
The ornamental design for a discharge chamber for a plasma processing apparatus, as shown and described.
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Type: Grant
Filed: Jul 18, 2017
Date of Patent: Jan 12, 2021
Assignee: Hitachi High-Tech Corporation (Tokyo)
Inventors: Nobuhide Nunomura (Tokyo), Keitarou Ogawa (Tokyo)
Primary Examiner: Ian Simmons
Assistant Examiner: Fritzgerald L Butac
Application Number: 29/611,001